Taiwanese Semiconductor Manufacturing Industry, 3Q 2019

The report finds that shipment value of the Taiwanese semiconductor manufacturing industry - comprising mainly of foundry, DRAM, flash memory, and IDM sectors - reached US$ 9.8 billion, growing sequentially but declined year-on-year in the second quarter of 2019. The decline in the first half of the year was mainly attributed to relatively high inventory levels. As the inventory levels have reached the optimal level and TSMC’s advanced processes have been implemented at the industrial scale, the industry’s shipment performance in the second half of 2019 is expected to witness year-on-year growth. Despite so, the market demand is anticipated to regain momentum in the second half of 2020 on the surging demand for 5G applications and 8K TVs.

Table of Contents:

• Taiwanese Semiconductor Manufacturing Industry Shipment Value, 1Q 2016 - 4Q 2019
• Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2016 - 4Q 2019
• Taiwanese Semiconductor Manufacturing Industry 8""-equivalent Wafer Shipment Volume and Utilization Rate, 1Q 2016 - 4Q 2019
• Taiwanese Semiconductor Manufacturing Industry Wafer Shipment Volume by Wafer Dimension, 1Q 2016 - 4Q 2019
• Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume and Utilization Rate, 1Q 2016 - 2Q 2019
• Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume by Business Type, 1Q 2016 - 2Q 2019
• Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume and Utilization Rate, 1Q 2016 - 2Q 2019
• Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2016 - 2Q 2019
• Taiwanese Foundry Industry Shipment Value Ranking, 1Q 2016 - 2Q 2019
• Taiwanese Foundry Industry Shipment Value by Process Technology, 1Q 2016 - 2Q 2019
• Taiwanese Foundry Industry Shipment Value Share by Process Technology, 1Q 2016 - 2Q 2019
• Taiwanese DRAM Industry's Shipment Value Ranking, 1Q 2016 - 2Q 2019
• Taiwanese DRAM Industry's Wafwer Shipment Volume by Process, 1Q 2016 - 2Q 2019
• Taiwanese DRAM Industry's Wafwer Shipment Volume by Process, 1Q 2016 - 2Q 2019
• Exchange Rate, 1Q 2016 - 2Q 2019
• Research Scope & Definitions

Table of Contents:

• Taiwanese Semiconductor Manufacturing Industry Shipment Value, 1Q 2016 - 4Q 2019
• Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2016 - 4Q 2019
• Taiwanese Semiconductor Manufacturing Industry 8""-equivalent Wafer Shipment Volume and Utilization Rate, 1Q 2016 - 4Q 2019
• Taiwanese Semiconductor Manufacturing Industry Wafer Shipment Volume by Wafer Dimension, 1Q 2016 - 4Q 2019
• Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume and Utilization Rate, 1Q 2016 - 2Q 2019
• Taiwanese Semiconductor Manufacturing Industry 12-inch Wafer Shipment Volume by Business Type, 1Q 2016 - 2Q 2019
• Taiwanese Semiconductor Manufacturing Industry 8-inch and below Wafer Shipment Volume and Utilization Rate, 1Q 2016 - 2Q 2019
• Taiwanese Semiconductor Manufacturing Industry Shipment Value by Business Type, 1Q 2016 - 2Q 2019
• Taiwanese Foundry Industry Shipment Value Ranking, 1Q 2016 - 2Q 2019
• Taiwanese Foundry Industry Shipment Value by Process Technology, 1Q 2016 - 2Q 2019
• Taiwanese Foundry Industry Shipment Value Share by Process Technology, 1Q 2016 - 2Q 2019
• Taiwanese DRAM Industry's Shipment Value Ranking, 1Q 2016 - 2Q 2019
• Taiwanese DRAM Industry's Wafwer Shipment Volume by Process, 1Q 2016 - 2Q 2019
• Taiwanese DRAM Industry's Wafwer Shipment Volume by Process, 1Q 2016 - 2Q 2019
• Exchange Rate, 1Q 2016 - 2Q 2019
• Research Scope & Definitions

This research report presents shipment value forecast and recent quarter review of the Taiwanese semiconductor manufacturing industry.

Companies surveyed in this research are those owning facilities to make MOS (Metal Oxide Semiconductor) wafers in Taiwan, including foundries, DRAM (Dynamic Random Access Memory) makers, flash memory makers, and IDMs (Integrated Device Manufacturers).

The content of this report is based on primary data obtained from interviews and publicly available information.