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Recap and Outlook for Global and Taiwanese IC Design Industries in 2019
Published Date: November 2019
|
Report Code: MICR-Semi-3B10
Home | Category |Computers & Electronics |Electronics & Electrical
Recap and Outlook for Global and Taiwanese IC Design Industries in 2019

Recap and Outlook for Global and Taiwanese IC Design Industries in 2019

Code: MICR-Semi-3B10
Report
November 2019
30 Pages
Market Intelligence and Consulting Institute
Region: Global,
Description
Table of Content
Tables & Figures

In 2018, the global IC design demand was affected by the slowdown of the smartphone market and seven consecutive years of declines in personal computers. Despite so, the global fabless IC design industry was still able to continue growth in 2018, driven mainly by the rise of emerging applications involved large-size high-resolution panels, AI (Artificial Intelligence), and 5G technology, which are shaping the industry trend from high computing efficiency toward high quality. In 2019, the continued demand for driver ICs and high-efficiency computing power is expected to slow the decline of the global fabless IC industry, ushering in a new development stage of China’s fabless IC design industry. This report recaps the fabless IC industry development in 2018 from global and Taiwan perspectives, and analyzes key trends in 2019 and beyond.

Companies:

  • AMD
  • Apple
  • Beijing Horizon Robotics Technology
  • Beijing ISSI
  • Beijing Smartchip Microelectronics
  • Broadcom
  • Cambrian
  • China Electronics Corporation
  • DeePhi Technology
  • Elite
  • GalaxyCore
  • Giga Solution
  • Global Unichip
  • Hikvision
  • Himax
  • HiSilicon
  • Huawei
  • Huiding Technology
  • Marvell
  • MediaTek
  • Nokia
  • Novatek Microelectronics
  • NVidia
  • OmniVision
  • OnePlus
  • Oppo
  • Phison
  • Qualcomm
  • Raydium
  • Realtek
  • Rockchip
  • Samsung
  • Silicon Motion
  • Sitronix
  • TSMC
  • Unisoc
  • Vivo
  • Xiaomi
  • Xilinx
  • Zhejiang Dahua
  • ZTE
  • ZTE Microelectronic
  • Others

List of Tables:

Overview

1.1 Global Semiconductor Market Development

1.2 Development of the Global IC Design Industry

1.2.1 Global Industry Value Witness Growth in 2018

1.3 The Fabless IC Design Industry by Region

1.3.1 Chinese IC Design Industry’s Global Share is Increasing Constantly

1.4 Development of Major IC Design Companies

1.5 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

2.Taiwan IC Design Industry Development

2.1 Shipment Value of the Taiwanese Fabless IC Design Industry

2.2 Product Mix Analysis

2.2.1 Fabless ICs for Computing, Communication, and Consumer Applications

2.2.2 Communication ICs Remain Mainstream

2.3 Major Taiwan IC Design Companies

2.4 IC Design Industry Development

2.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones

2.4.2 New Products and Applications to Drive Future Opportunity

3. Opportunities and Challenges

3.1 Impact of the China-US Trade Fight

3.1.1 Fabless IC Design is China’s Key Investment Focus

3.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China

3.1.3 Uncertainties Lead to New Industry Reorganization

3.2 AI Edge Computing Changing the IC Design Industry’s Business Model

4. MIC Perspective

Appendix

Glossary of Terms

List of Companies

Table 1 Global Top 10 IC Design Companies

Table 2 China Top 10 Fabless IC Design Companies

Table 3 Taiwan Top 10 IC Design Companies in 2018

List of Tables:

Overview

1.1 Global Semiconductor Market Development

1.2 Development of the Global IC Design Industry

1.2.1 Global Industry Value Witness Growth in 2018

1.3 The Fabless IC Design Industry by Region

1.3.1 Chinese IC Design Industry’s Global Share is Increasing Constantly

1.4 Development of Major IC Design Companies

1.5 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

2.Taiwan IC Design Industry Development

2.1 Shipment Value of the Taiwanese Fabless IC Design Industry

2.2 Product Mix Analysis

2.2.1 Fabless ICs for Computing, Communication, and Consumer Applications

2.2.2 Communication ICs Remain Mainstream

2.3 Major Taiwan IC Design Companies

2.4 IC Design Industry Development

2.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones

2.4.2 New Products and Applications to Drive Future Opportunity

3. Opportunities and Challenges

3.1 Impact of the China-US Trade Fight

3.1.1 Fabless IC Design is China’s Key Investment Focus

3.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China

3.1.3 Uncertainties Lead to New Industry Reorganization

3.2 AI Edge Computing Changing the IC Design Industry’s Business Model

4. MIC Perspective

Appendix

Glossary of Terms

List of Companies

Table 1 Global Top 10 IC Design Companies

Table 2 China Top 10 Fabless IC Design Companies

Table 3 Taiwan Top 10 IC Design Companies in 2018

List of Figures

Figure 1 Global Semiconductor Market Value, 2013-2019

Figure 2 Global IC Design Industry Shipment Value, 2013-2019

Figure 3 Global IC Design Industry Market Share by Production Base, 2015 - 2019

Figure 4 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019

Figure 5 Taiwan IC Design Industry Shipment Share by Application

Figure 6 Taiwan IC Design Industry Shipment Share by Product Mix

 

In 2018, the global IC design demand was affected by the slowdown of the smartphone market and seven consecutive years of declines in personal computers. Despite so, the global fabless IC design industry was still able to continue growth in 2018, driven mainly by the rise of emerging applications involved large-size high-resolution panels, AI (Artificial Intelligence), and 5G technology, which are shaping the industry trend from high computing efficiency toward high quality. In 2019, the continued demand for driver ICs and high-efficiency computing power is expected to slow the decline of the global fabless IC industry, ushering in a new development stage of China’s fabless IC design industry. This report recaps the fabless IC industry development in 2018 from global and Taiwan perspectives, and analyzes key trends in 2019 and beyond.

Companies:

  • AMD
  • Apple
  • Beijing Horizon Robotics Technology
  • Beijing ISSI
  • Beijing Smartchip Microelectronics
  • Broadcom
  • Cambrian
  • China Electronics Corporation
  • DeePhi Technology
  • Elite
  • GalaxyCore
  • Giga Solution
  • Global Unichip
  • Hikvision
  • Himax
  • HiSilicon
  • Huawei
  • Huiding Technology
  • Marvell
  • MediaTek
  • Nokia
  • Novatek Microelectronics
  • NVidia
  • OmniVision
  • OnePlus
  • Oppo
  • Phison
  • Qualcomm
  • Raydium
  • Realtek
  • Rockchip
  • Samsung
  • Silicon Motion
  • Sitronix
  • TSMC
  • Unisoc
  • Vivo
  • Xiaomi
  • Xilinx
  • Zhejiang Dahua
  • ZTE
  • ZTE Microelectronic
  • Others

List of Tables:

Overview

1.1 Global Semiconductor Market Development

1.2 Development of the Global IC Design Industry

1.2.1 Global Industry Value Witness Growth in 2018

1.3 The Fabless IC Design Industry by Region

1.3.1 Chinese IC Design Industry’s Global Share is Increasing Constantly

1.4 Development of Major IC Design Companies

1.5 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

2.Taiwan IC Design Industry Development

2.1 Shipment Value of the Taiwanese Fabless IC Design Industry

2.2 Product Mix Analysis

2.2.1 Fabless ICs for Computing, Communication, and Consumer Applications

2.2.2 Communication ICs Remain Mainstream

2.3 Major Taiwan IC Design Companies

2.4 IC Design Industry Development

2.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones

2.4.2 New Products and Applications to Drive Future Opportunity

3. Opportunities and Challenges

3.1 Impact of the China-US Trade Fight

3.1.1 Fabless IC Design is China’s Key Investment Focus

3.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China

3.1.3 Uncertainties Lead to New Industry Reorganization

3.2 AI Edge Computing Changing the IC Design Industry’s Business Model

4. MIC Perspective

Appendix

Glossary of Terms

List of Companies

Table 1 Global Top 10 IC Design Companies

Table 2 China Top 10 Fabless IC Design Companies

Table 3 Taiwan Top 10 IC Design Companies in 2018

Read More

List of Tables:

Overview

1.1 Global Semiconductor Market Development

1.2 Development of the Global IC Design Industry

1.2.1 Global Industry Value Witness Growth in 2018

1.3 The Fabless IC Design Industry by Region

1.3.1 Chinese IC Design Industry’s Global Share is Increasing Constantly

1.4 Development of Major IC Design Companies

1.5 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

2.Taiwan IC Design Industry Development

2.1 Shipment Value of the Taiwanese Fabless IC Design Industry

2.2 Product Mix Analysis

2.2.1 Fabless ICs for Computing, Communication, and Consumer Applications

2.2.2 Communication ICs Remain Mainstream

2.3 Major Taiwan IC Design Companies

2.4 IC Design Industry Development

2.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones

2.4.2 New Products and Applications to Drive Future Opportunity

3. Opportunities and Challenges

3.1 Impact of the China-US Trade Fight

3.1.1 Fabless IC Design is China’s Key Investment Focus

3.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China

3.1.3 Uncertainties Lead to New Industry Reorganization

3.2 AI Edge Computing Changing the IC Design Industry’s Business Model

4. MIC Perspective

Appendix

Glossary of Terms

List of Companies

Table 1 Global Top 10 IC Design Companies

Table 2 China Top 10 Fabless IC Design Companies

Table 3 Taiwan Top 10 IC Design Companies in 2018

Read More

List of Figures

Figure 1 Global Semiconductor Market Value, 2013-2019

Figure 2 Global IC Design Industry Shipment Value, 2013-2019

Figure 3 Global IC Design Industry Market Share by Production Base, 2015 - 2019

Figure 4 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019

Figure 5 Taiwan IC Design Industry Shipment Share by Application

Figure 6 Taiwan IC Design Industry Shipment Share by Product Mix

 

Read More
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