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Data centers and liquid in the same sentence. Now that is an odd pair but the data centers around the world are gradually shifting to liquid cooling solutions for meeting the increasing demand for high-performance computing. The advent of AI, IoT, and cloud computing is creating the need to generate and store huge amounts of data. Heavy process-driven work has taken the center stage with racks consuming greater energy and producing more heat. In such a case Data Center Liquid Cooling is crucial as dipping the servers in water and other liquid solutions can prove to be a game-changer in discharging excessive heat.
Air systems do not have the efficient thermal transfer property in comparison to liquid. The latest versions of CPUs and GPUs have higher power densities than previous generations. Current systems are unable to provide cooling air to several high-performance servers in a rack. Moreover, compact components are driving rack capacities to immeasurable heights. Liquid cooling is playing a key role. The process is typically carried out via many methods. We will discuss each below-
This is a mass-adopted and mature technology. The liquid and the rack do not come in direct contact with each other. Liquid heat exchangers are placed in the rear doors of equipment racks. It is designed in such a way that the fans push the heated air through the adjacent coil. The coil then absorbs the heat and releases the air to the servers. The in-built fans absorb the heat and pass the air to greater rack density. The technique is used generally in combination with air cooling systems to offer a hybrid and systematic cooling option for varying rack sizes and densities.
Cold plates sit upon the heat-generating components like the CPUs, GPUs, and memory chips. The heat is systematically absorbed through single-phase plates and two-phase evaporation units. The single-phase method is done through a cooling fluid mixed into the plate by a CDU for capturing heat from the server components. The fluid is transferred outside the rack for removing the heated elements. It is an efficient liquid cooling solution performed by the CDU by balancing out the thermal capture properties and viscosity of the fluid. The typical liquid used is water added with glycol to improve the pumping efficiency. The dielectric fluid prevents damage from leakages. Similarly, a two-phase heat removal process is done through a low-pressure dielectric liquid that flows into the evaporators. The resultant heat is released from the evaporator as vapor and is transferred outside the rack for heat rejection. Many companies have started offering direct-to-chip cooling plates as the process is highly effective than using passive heat exchangers. It works optimally on a flat surface.
This process involves dipping the servers or components in an electrical fluid that is thermally conductive. The biggest advantage is that there is no need for retrofitting fans or air cooling systems. The servers are deployed vertically in the fluid and heat is transferred directly to the coolant. The liquid cooling system consists of micro immersion tanks that integrate the CDU with the tank to provide a complete self-reliant cooling solution. The single-phase method is more environmentally friendly as the fluid does not require regular maintenance. The dielectric fluid reduces energy consumption and moves the heat outside for complete rejection.
Air cooling is easier to install than the liquid system. However, a fluid-based cooler consists of only two hoses that pump the coolant and the radiator along with the water block. The radiator, fans, and the water block is attached in such a way so that the heated air leaves the PC effectively. The apparatus is self-contained with minimal requirement for additional maintenance. The complex custom loops provide much-needed customization and flexibility in terms of varied sizes of GPUs. The initial process is time-consuming but the end result is far more satisfying than the air cooling process.
Liquid coolers come with an all-in-one solution with extra space for the coolant tubes, water block, and radiator. Whereas air coolers are bulky and limited to a single area with no scope for equal distribution.
The sound is less in liquid cooling than the attached fan on a CPU heatsink. This is usually the case as the fans are smaller and properly insulated and the radiator fans run on low RPM( revolutions per minute).
Additionally, air coolers are not suitable for the cooling of heavy process rendering CPUs or GPUs. The distribution is uneven and heat is dispersed in the case which raises the overall temperature of the system. On the other hand, liquid cooling effectively disperses the heat outside the system in a noise-free way. The radiators are quieter and produce less noise.
The transition to fluid-based cooling is expanding at an unprecedented rate. Dedicated infrastructure is being deployed to create the requisite cooling loop for efficient heat exchange and thermal conductivity. The critical part is handling the configuration for precise temperature control of the liquid and the ability to respond to sudden HPC load. Coolant distribution units are set up for creating isolated secondary loops. It is separate from the chilled water supply and allows stringent control of the liquid cooling system. Different capacity ranges are available for supporting larger deployments and greater electrical densities. Furthermore, a modular indoor chiller provides reliable backhand support for fluctuating load and internal controls. It also helps in maintaining the water temperature and retrofitting newer parts for data center designs. Finally, the immersion tanks and heat rejection systems mount the vertical servers for insinuating heat rejection across an even surface.
The market is poised for considerable growth as the overall benefits lead to a large-scale shift towards liquid cooling. The system allows densely packed IT hardware to perform at maximum voltage and clock frequency while preventing overheating. The higher thermal dissipation properties of the liquid provide enhanced energy efficiency as the attached pumps consume very less energy. The fans scatter the cooling effect around the entire data center. Processing intensive edge applications become easier in limited physical space. These positive developments will expand the CAGR of the market significantly.
