Wafer Level Packaging Market By Technology (Fan in wafer level packaging, Fan out wafer level packaging), By Type (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, Others), By End User (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, Others): Global Opportunity Analysis and Industry Forecast, 2020-2030

Wafer Level Packaging Market

Asia-Pacific is expected to be the leading contributor toward the wafer level packaging market during the forecast period, followed by LAMEA and Europe.

WLP is used for interconnecting semiconductor devices such as micro sensors, microscopic devices, microprocessors, and others to external circuitry while utilizing deposited solder bumps onto the chip pads. It allows integration of wafer fab, packaging, burn-in, and test at wafer level to streamline the manufacturing process undertaken by a device.

Growth of the global wafer level packaging industry is anticipated to be driven by factors such as rising adoption of high-speed, compact size, and less expensive electronic products. In addition, wafer level packaging’s technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices boost the wafer level packaging market growth. However, complexities in manufacturing process acts as a major restraint for the market. On the contrary, rise in use of wafers in the automotive industry is expected to fuel the market growth during the forecast period.

Moreover, developing nations tend to witness high penetration of wafer level packaging products, especially in healthcare segment, which is anticipated to augment the market growth. Factors such as technological advancements and innovations in wafer level packaging products accelerate the market growth. Also, In semiconductor advance packaging sector wlcsp package, wlcsp process flow, and wafer chip scale package are in the latest trends.

The global wafer level packaging industry is segmented on the basis of technology, type, end user, and region. By technology, the market is classified into fan in wafer level packaging, and fan out wafer level packaging. Depending on type, it is categorized into 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and others. On the basis of end user, market is divided into consumer electronics, IT and telecommunication, automotive, healthcare, and others. Also, the report provides a detailed Wafer level packaging market Analysis based on competitive intensity and how the competition will take shape in coming years.

Region wise, the wafer level packaging market trends have been analyzed across North America, Europe, Asia-Pacific, and LAMEA. Asia-Pacific contributed maximum revenue in 2020. Also, between 2020 and 2030, the wafer level packaging market in Asia-Pacific is expected to grow at a faster rate as compared to other regions. This is attributed to increase in demand from emerging economical countries such as India, China, and South Korea.

KEY FINDINGS OF THE STUDY

The fan in wafer level packaging segment is projected to be the major technology, followed by fan out wafer level packaging.

Asia-Pacific and North America collectively accounted for more than 75% of the wafer level packaging market share in 2020.

India is anticipated to witness highest growth rate during the forecast period.

U.S. was the major shareholder in the North America wafer level packaging market, accounting for approximately 69% share in 2020.

Depending on type, the consumer electronics segment generated the highest revenue in 2020. However, the others segment is expected to witness the highest growth rate in the future.

Region wise, the wafer level packaging market was dominated by Asia-Pacific. Also, Asia-Pacific is expected to witness significant growth in the coming years.

The key players profiled in the report include Amkor Technology Inc, Applied Materials Inc, ASML Holding N.V, Deca Technologies, Fujitsu, Jiangsu Changjiang Electronics Technology Co Ltd, Lam Research Corporation, Qualcomm Technologies Inc, Tokyo Electron Ltd, and Toshiba Corporation. These players have adopted various strategies such as partnership, acquisition, and product launch to strengthen their foothold in the industry.   

Overview

The global wafer level packaging market size was valued at $4.54 billion in 2020, and is projected to reach $23.56 billion by 2030, registering a CAGR of 18.8% from 2021 to 2030. Wafer-level packaging (WLP) is a technology of packaging an integrated circuit (IC) where all of the packaging process steps are carried out at the wafer level. The components used in assembly (such as bumps) are applied to the wafer pre-dicing in wafer level packaging. However, wafers are diced into independent dies and then combined into a semiconductor package in traditional semiconductor fabrication. WLP provides various benefits such as reduced testing time & cost, easier inventory management, among others.

Growth of the global wafer level packaging market is anticipated to be driven by factors such as rising adoption of high-speed, compact size, and less expensive electronic products. In addition, wafer level packaging’s technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices boost the market growth. However, complexities in manufacturing process acts as a major restraint for the market. On the contrary, rise in use of wafers in the automotive industry is expected to fuel the market growth during the forecast period.

The global wafer level packaging market is segmented on the basis of technology, type, end user, and region. By technology, the market is classified into fan in wafer level packaging, and fan out wafer level packaging. Depending on type, it is categorized into 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and others. On the basis of end user, market is divided into consumer electronics, IT and telecommunication, automotive, healthcare, and others.

Region wise, the wafer level packaging market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific dominated the wafer level packaging market in 2020, and is projected to register significant growth rate during the forecast period, owing to growth in the automotive segment. Also, Asia-Pacific is expected to witnesses significant growth by the end of the forecast period, followed by LAMEA. The key players operating in the market include Amkor Technology Inc, Applied Materials Inc, ASML Holding N.V, Deca Technologies, Fujitsu, Jiangsu Changjiang Electronics Technology Co Ltd, Lam Research Corporation, Qualcomm Technologies Inc, Tokyo Electron Ltd, and Toshiba Corporation.

KEY BENEFITS FOR STAKEHOLDERS

This study comprises analytical depiction of the global wafer level packaging market size along with current trends and future estimations to depict imminent investment pockets.

The overall wafer level packaging market analysis is determined to understand the profitable trends to gain a stronger foothold.

The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.

The current wafer level packaging market forecast is quantitatively analyzed from 2020 to 2030 to benchmark the financial competency.

Porter’s five forces analysis illustrates the potency of the buyers and the wafer level packaging market share of key vendors.

The report includes the market trends and the market share of key vendors.

 

Key Market Segments

Lam Research Corporatio

Scope of Wafer Level Packaging Market Report

1.1.Report description

1.2.Key market segments

1.3.Key benefits to the stakeholders

1.4.Research Methodology

1.4.1.Secondary research

1.4.2.Primary research

1.4.3.Analyst tools and models

2.1.Key findings of the study

2.2.CXO Perspective

3.1.Market definition and scope

3.2.Key findings

3.2.1.Top investment pockets

3.3.Porter’s five forces analysis

3.4.Top player positioning

3.5.Market dynamics

3.5.1.Drivers

3.5.2.Restraints

3.5.3.Opportunities

3.6.COVID-19 Impact Analysis on the market

4.1 Overview

4.1.1 Market size and forecast

4.2 Fan in wafer level packaging

4.2.1 Key market trends, growth factors and opportunities

4.2.2 Market size and forecast, by region

4.2.3 Market analysis by country

4.3 Fan out wafer level packaging

4.3.1 Key market trends, growth factors and opportunities

4.3.2 Market size and forecast, by region

4.3.3 Market analysis by country

5.1 Overview

5.1.1 Market size and forecast

5.2 3D TSV WLP

5.2.1 Key market trends, growth factors and opportunities

5.2.2 Market size and forecast, by region

5.2.3 Market analysis by country

5.3 2.5D TSV WLP

5.3.1 Key market trends, growth factors and opportunities

5.3.2 Market size and forecast, by region

5.3.3 Market analysis by country

5.4 WLCSP

5.4.1 Key market trends, growth factors and opportunities

5.4.2 Market size and forecast, by region

5.4.3 Market analysis by country

5.5 Nano WLP

5.5.1 Key market trends, growth factors and opportunities

5.5.2 Market size and forecast, by region

5.5.3 Market analysis by country

5.6 Others

5.6.1 Key market trends, growth factors and opportunities

5.6.2 Market size and forecast, by region

5.6.3 Market analysis by country

6.1 Overview

6.1.1 Market size and forecast

6.2 Consumer Electronics

6.2.1 Key market trends, growth factors and opportunities

6.2.2 Market size and forecast, by region

6.2.3 Market analysis by country

6.3 IT and Telecommunication

6.3.1 Key market trends, growth factors and opportunities

6.3.2 Market size and forecast, by region

6.3.3 Market analysis by country

6.4 Automotive

6.4.1 Key market trends, growth factors and opportunities

6.4.2 Market size and forecast, by region

6.4.3 Market analysis by country

6.5 Healthcare

6.5.1 Key market trends, growth factors and opportunities

6.5.2 Market size and forecast, by region

6.5.3 Market analysis by country

6.6 Others

6.6.1 Key market trends, growth factors and opportunities

6.6.2 Market size and forecast, by region

6.6.3 Market analysis by country

7.1 Overview

7.1.1 Market size and forecast

7.2 North America

7.2.1 Key trends and opportunities

7.2.2 North America Market size and forecast, by Technology

7.2.3 North America Market size and forecast, by Type

7.2.4 North America Market size and forecast, by End User

7.2.5 North America Market size and forecast, by country

7.2.5.1 U.S.

7.2.5.1.1 Market size and forecast, by Technology

7.2.5.1.2 Market size and forecast, by Type

7.2.5.1.3 Market size and forecast, by End User

7.2.5.2 Canada

7.2.5.2.1 Market size and forecast, by Technology

7.2.5.2.2 Market size and forecast, by Type

7.2.5.2.3 Market size and forecast, by End User

7.2.5.3 Mexico

7.2.5.3.1 Market size and forecast, by Technology

7.2.5.3.2 Market size and forecast, by Type

7.2.5.3.3 Market size and forecast, by End User

7.3 Europe

7.3.1 Key trends and opportunities

7.3.2 Europe Market size and forecast, by Technology

7.3.3 Europe Market size and forecast, by Type

7.3.4 Europe Market size and forecast, by End User

7.3.5 Europe Market size and forecast, by country

7.3.5.1 U.K.

7.3.5.1.1 Market size and forecast, by Technology

7.3.5.1.2 Market size and forecast, by Type

7.3.5.1.3 Market size and forecast, by End User

7.3.5.2 Germany

7.3.5.2.1 Market size and forecast, by Technology

7.3.5.2.2 Market size and forecast, by Type

7.3.5.2.3 Market size and forecast, by End User

7.3.5.3 France

7.3.5.3.1 Market size and forecast, by Technology

7.3.5.3.2 Market size and forecast, by Type

7.3.5.3.3 Market size and forecast, by End User

7.3.5.4 Rest of Europe

7.3.5.4.1 Market size and forecast, by Technology

7.3.5.4.2 Market size and forecast, by Type

7.3.5.4.3 Market size and forecast, by End User

7.4 Asia-Pacific

7.4.1 Key trends and opportunities

7.4.2 Asia-Pacific Market size and forecast, by Technology

7.4.3 Asia-Pacific Market size and forecast, by Type

7.4.4 Asia-Pacific Market size and forecast, by End User

7.4.5 Asia-Pacific Market size and forecast, by country

7.4.5.1 China

7.4.5.1.1 Market size and forecast, by Technology

7.4.5.1.2 Market size and forecast, by Type

7.4.5.1.3 Market size and forecast, by End User

7.4.5.2 Japan

7.4.5.2.1 Market size and forecast, by Technology

7.4.5.2.2 Market size and forecast, by Type

7.4.5.2.3 Market size and forecast, by End User

7.4.5.3 Taiwan

7.4.5.3.1 Market size and forecast, by Technology

7.4.5.3.2 Market size and forecast, by Type

7.4.5.3.3 Market size and forecast, by End User

7.4.5.4 India

7.4.5.4.1 Market size and forecast, by Technology

7.4.5.4.2 Market size and forecast, by Type

7.4.5.4.3 Market size and forecast, by End User

7.4.5.5 South Korea

7.4.5.5.1 Market size and forecast, by Technology

7.4.5.5.2 Market size and forecast, by Type

7.4.5.5.3 Market size and forecast, by End User

7.4.5.6 Rest of Asia-Pacific

7.4.5.6.1 Market size and forecast, by Technology

7.4.5.6.2 Market size and forecast, by Type

7.4.5.6.3 Market size and forecast, by End User

7.5 LAMEA

7.5.1 Key trends and opportunities

7.5.2 LAMEA Market size and forecast, by Technology

7.5.3 LAMEA Market size and forecast, by Type

7.5.4 LAMEA Market size and forecast, by End User

7.5.5 LAMEA Market size and forecast, by country

7.5.5.1 Latin America

7.5.5.1.1 Market size and forecast, by Technology

7.5.5.1.2 Market size and forecast, by Type

7.5.5.1.3 Market size and forecast, by End User

7.5.5.2 Middle East

7.5.5.2.1 Market size and forecast, by Technology

7.5.5.2.2 Market size and forecast, by Type

7.5.5.2.3 Market size and forecast, by End User

7.5.5.3 Africa

7.5.5.3.1 Market size and forecast, by Technology

7.5.5.3.2 Market size and forecast, by Type

7.5.5.3.3 Market size and forecast, by End User

8.1. Introduction

8.2. Top winning strategies

8.3. Product Mapping of Top 10 Player

8.4. Competitive Dashboard

8.5. Competitive Heatmap

8.6. Key developments

9.1 Amkor Technology, Inc.

9.1.1 Company overview

9.1.2 Company snapshot

9.1.3 Operating business segments

9.1.4 Product portfolio

9.1.5 Business performance

9.1.6 Key strategic moves and developments

9.2 Fujitsu

9.2.1 Company overview

9.2.2 Company snapshot

9.2.3 Operating business segments

9.2.4 Product portfolio

9.2.5 Business performance

9.2.6 Key strategic moves and developments

9.3 Jiangsu Changjiang Electronics Technology Co. Ltd

9.3.1 Company overview

9.3.2 Company snapshot

9.3.3 Operating business segments

9.3.4 Product portfolio

9.3.5 Business performance

9.3.6 Key strategic moves and developments

9.4 Deca Technologies

9.4.1 Company overview

9.4.2 Company snapshot

9.4.3 Operating business segments

9.4.4 Product portfolio

9.4.5 Business performance

9.4.6 Key strategic moves and developments

9.5 Qualcomm Technologies, Inc.

9.5.1 Company overview

9.5.2 Company snapshot

9.5.3 Operating business segments

9.5.4 Product portfolio

9.5.5 Business performance

9.5.6 Key strategic moves and developments

9.6 Toshiba Corporation

9.6.1 Company overview

9.6.2 Company snapshot

9.6.3 Operating business segments

9.6.4 Product portfolio

9.6.5 Business performance

9.6.6 Key strategic moves and developments

9.7 Tokyo Electron Ltd.

9.7.1 Company overview

9.7.2 Company snapshot

9.7.3 Operating business segments

9.7.4 Product portfolio

9.7.5 Business performance

9.7.6 Key strategic moves and developments

9.8 Applied Materials, Inc.

9.8.1 Company overview

9.8.2 Company snapshot

9.8.3 Operating business segments

9.8.4 Product portfolio

9.8.5 Business performance

9.8.6 Key strategic moves and developments

9.9 ASML Holding N.V

9.9.1 Company overview

9.9.2 Company snapshot

9.9.3 Operating business segments

9.9.4 Product portfolio

9.9.5 Business performance

9.9.6 Key strategic moves and developments

9.10 Lam Research Corporation

9.10.1 Company overview

9.10.2 Company snapshot

9.10.3 Operating business segments

9.10.4 Product portfolio

9.10.5 Business performance

9.10.6 Key strategic moves and development

LIST OF TABLES

TABLE 1. GLOBAL WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)

TABLE 2. WAFER LEVEL PACKAGING MARKET REVENUE, FOR FAN IN WAFER LEVEL PACKAGING, BY REGION , 2020-2030,($MILLION)

TABLE 3. WAFER LEVEL PACKAGING MARKET FAN IN WAFER LEVEL PACKAGING BY COUNTRY, 2020-2030,($MILLION)

TABLE 4. WAFER LEVEL PACKAGING MARKET REVENUE, FOR FAN OUT WAFER LEVEL PACKAGING, BY REGION , 2020-2030,($MILLION)

TABLE 5. WAFER LEVEL PACKAGING MARKET FAN OUT WAFER LEVEL PACKAGING BY COUNTRY, 2020-2030,($MILLION)

TABLE 6. GLOBAL WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)

TABLE 7. WAFER LEVEL PACKAGING MARKET REVENUE, FOR 3D TSV WLP, BY REGION , 2020-2030,($MILLION)

TABLE 8. WAFER LEVEL PACKAGING MARKET 3D TSV WLP BY COUNTRY, 2020-2030,($MILLION)

TABLE 9. WAFER LEVEL PACKAGING MARKET REVENUE, FOR 2.5D TSV WLP, BY REGION , 2020-2030,($MILLION)

TABLE 10. WAFER LEVEL PACKAGING MARKET 2.5D TSV WLP BY COUNTRY, 2020-2030,($MILLION)

TABLE 11. WAFER LEVEL PACKAGING MARKET REVENUE, FOR WLCSP, BY REGION , 2020-2030,($MILLION)

TABLE 12. WAFER LEVEL PACKAGING MARKET WLCSP BY COUNTRY, 2020-2030,($MILLION)

TABLE 13. WAFER LEVEL PACKAGING MARKET REVENUE, FOR NANO WLP, BY REGION , 2020-2030,($MILLION)

TABLE 14. WAFER LEVEL PACKAGING MARKET NANO WLP BY COUNTRY, 2020-2030,($MILLION)

TABLE 15. WAFER LEVEL PACKAGING MARKET REVENUE, FOR OTHERS, BY REGION , 2020-2030,($MILLION)

TABLE 16. WAFER LEVEL PACKAGING MARKET OTHERS BY COUNTRY, 2020-2030,($MILLION)

TABLE 17. GLOBAL WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)

TABLE 18. WAFER LEVEL PACKAGING MARKET REVENUE, FOR CONSUMER ELECTRONICS, BY REGION , 2020-2030,($MILLION)

TABLE 19. WAFER LEVEL PACKAGING MARKET CONSUMER ELECTRONICS BY COUNTRY, 2020-2030,($MILLION)

TABLE 20. WAFER LEVEL PACKAGING MARKET REVENUE, FOR IT AND TELECOMMUNICATION, BY REGION , 2020-2030,($MILLION)

TABLE 21. WAFER LEVEL PACKAGING MARKET IT AND TELECOMMUNICATION BY COUNTRY, 2020-2030,($MILLION)

TABLE 22. WAFER LEVEL PACKAGING MARKET REVENUE, FOR AUTOMOTIVE, BY REGION , 2020-2030,($MILLION)

TABLE 23. WAFER LEVEL PACKAGING MARKET AUTOMOTIVE BY COUNTRY, 2020-2030,($MILLION)

TABLE 24. WAFER LEVEL PACKAGING MARKET REVENUE, FOR HEALTHCARE, BY REGION , 2020-2030,($MILLION)

TABLE 25. WAFER LEVEL PACKAGING MARKET HEALTHCARE BY COUNTRY, 2020-2030,($MILLION)

TABLE 26. WAFER LEVEL PACKAGING MARKET REVENUE, FOR OTHERS, BY REGION , 2020-2030,($MILLION)

TABLE 27. WAFER LEVEL PACKAGING MARKET OTHERS BY COUNTRY, 2020-2030,($MILLION)

TABLE 28. WAFER LEVEL PACKAGING MARKET, BY REGION, 2020-2030,($MILLION)

TABLE 29. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)

TABLE 30. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)

TABLE 31. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)

TABLE 32. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)

TABLE 33. U.S. WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 34. U.S. WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 35. U.S. WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 36. CANADA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 37. CANADA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 38. CANADA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 39. MEXICO WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 40. MEXICO WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 41. MEXICO WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 42. EUROPE WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)

TABLE 43. EUROPE WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)

TABLE 44. EUROPE WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)

TABLE 45. EUROPE WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)

TABLE 46. U.K. WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 47. U.K. WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 48. U.K. WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 49. GERMANY WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 50. GERMANY WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 51. GERMANY WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 52. FRANCE WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 53. FRANCE WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 54. FRANCE WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 55. REST OF EUROPE WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 56. REST OF EUROPE WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 57. REST OF EUROPE WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 58. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)

TABLE 59. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)

TABLE 60. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)

TABLE 61. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)

TABLE 62. CHINA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 63. CHINA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 64. CHINA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 65. JAPAN WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 66. JAPAN WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 67. JAPAN WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 68. TAIWAN WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 69. TAIWAN WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 70. TAIWAN WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 71. INDIA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 72. INDIA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 73. INDIA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 74. SOUTH KOREA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 75. SOUTH KOREA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 76. SOUTH KOREA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 77. REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 78. REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 79. REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 80. LAMEA WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)

TABLE 81. LAMEA WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)

TABLE 82. LAMEA WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)

TABLE 83. LAMEA WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)

TABLE 84. LATIN AMERICA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 85. LATIN AMERICA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 86. LATIN AMERICA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 87. MIDDLE EAST WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 88. MIDDLE EAST WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 89. MIDDLE EAST WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 90. AFRICA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)

TABLE 91. AFRICA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)

TABLE 92. AFRICA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)

TABLE 93.AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT

TABLE 94.AMKOR TECHNOLOGY, INC.: OPERATING SEGMENTS

TABLE 95.AMKOR TECHNOLOGY, INC.: PRODUCT PORTFOLIO

TABLE 96.AMKOR TECHNOLOGY, INC.: NET SALES,

TABLE 97.AMKOR TECHNOLOGY, INC.: KEY STRATERGIES

TABLE 98.FUJITSU: COMPANY SNAPSHOT

TABLE 99.FUJITSU: OPERATING SEGMENTS

TABLE 100.FUJITSU: PRODUCT PORTFOLIO

TABLE 101.FUJITSU: NET SALES,

TABLE 102.FUJITSU: KEY STRATERGIES

TABLE 103.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: COMPANY SNAPSHOT

TABLE 104.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: OPERATING SEGMENTS

TABLE 105.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: PRODUCT PORTFOLIO

TABLE 106.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: NET SALES,

TABLE 107.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: KEY STRATERGIES

TABLE 108.DECA TECHNOLOGIES: COMPANY SNAPSHOT

TABLE 109.DECA TECHNOLOGIES: OPERATING SEGMENTS

TABLE 110.DECA TECHNOLOGIES: PRODUCT PORTFOLIO

TABLE 111.DECA TECHNOLOGIES: NET SALES,

TABLE 112.DECA TECHNOLOGIES: KEY STRATERGIES

TABLE 113.QUALCOMM TECHNOLOGIES, INC.: COMPANY SNAPSHOT

TABLE 114.QUALCOMM TECHNOLOGIES, INC.: OPERATING SEGMENTS

TABLE 115.QUALCOMM TECHNOLOGIES, INC.: PRODUCT PORTFOLIO

TABLE 116.QUALCOMM TECHNOLOGIES, INC.: NET SALES,

TABLE 117.QUALCOMM TECHNOLOGIES, INC.: KEY STRATERGIES

TABLE 118.TOSHIBA CORPORATION: COMPANY SNAPSHOT

TABLE 119.TOSHIBA CORPORATION: OPERATING SEGMENTS

TABLE 120.TOSHIBA CORPORATION: PRODUCT PORTFOLIO

TABLE 121.TOSHIBA CORPORATION: NET SALES,

TABLE 122.TOSHIBA CORPORATION: KEY STRATERGIES

TABLE 123.TOKYO ELECTRON LTD.: COMPANY SNAPSHOT

TABLE 124.TOKYO ELECTRON LTD.: OPERATING SEGMENTS

TABLE 125.TOKYO ELECTRON LTD.: PRODUCT PORTFOLIO

TABLE 126.TOKYO ELECTRON LTD.: NET SALES,

TABLE 127.TOKYO ELECTRON LTD.: KEY STRATERGIES

TABLE 128.APPLIED MATERIALS, INC.: COMPANY SNAPSHOT

TABLE 129.APPLIED MATERIALS, INC.: OPERATING SEGMENTS

TABLE 130.APPLIED MATERIALS, INC.: PRODUCT PORTFOLIO

TABLE 131.APPLIED MATERIALS, INC.: NET SALES,

TABLE 132.APPLIED MATERIALS, INC.: KEY STRATERGIES

TABLE 133.ASML HOLDING N.V: COMPANY SNAPSHOT

TABLE 134.ASML HOLDING N.V: OPERATING SEGMENTS

TABLE 135.ASML HOLDING N.V: PRODUCT PORTFOLIO

TABLE 136.ASML HOLDING N.V: NET SALES,

TABLE 137.ASML HOLDING N.V: KEY STRATERGIES

TABLE 138.LAM RESEARCH CORPORATION: COMPANY SNAPSHOT

TABLE 139.LAM RESEARCH CORPORATION: OPERATING SEGMENTS

TABLE 140.LAM RESEARCH CORPORATION: PRODUCT PORTFOLIO

TABLE 141.LAM RESEARCH CORPORATION: NET SALES,

TABLE 142.LAM RESEARCH CORPORATION: KEY STRATERGIES LIST OF FIGURES

FIGURE 1.WAFER LEVEL PACKAGING MARKET SEGMENTATION

FIGURE 2.WAFER LEVEL PACKAGING MARKET,2020-2030

FIGURE 3.WAFER LEVEL PACKAGING MARKET,2020-2030

FIGURE 4. TOP INVESTMENT POCKETS, BY REGION

FIGURE 5.PORTER FIVE-1

FIGURE 6.PORTER FIVE-2

FIGURE 7.PORTER FIVE-3

FIGURE 8.PORTER FIVE-4

FIGURE 9.PORTER FIVE-5

FIGURE 10.TOP PLAYER POSITIONING

FIGURE 11.WAFER LEVEL PACKAGING MARKET:DRIVERS, RESTRAINTS AND OPPORTUNITIES

FIGURE 12.WAFER LEVEL PACKAGING MARKET,BY TECHNOLOGY,2020(%)

FIGURE 13.COMPARATIVE SHARE ANALYSIS OF FAN IN WAFER LEVEL PACKAGING WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 14.COMPARATIVE SHARE ANALYSIS OF FAN OUT WAFER LEVEL PACKAGING WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 15.WAFER LEVEL PACKAGING MARKET,BY TYPE,2020(%)

FIGURE 16.COMPARATIVE SHARE ANALYSIS OF 3D TSV WLP WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 17.COMPARATIVE SHARE ANALYSIS OF 2.5D TSV WLP WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 18.COMPARATIVE SHARE ANALYSIS OF WLCSP WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 19.COMPARATIVE SHARE ANALYSIS OF NANO WLP WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 20.COMPARATIVE SHARE ANALYSIS OF OTHERS WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 21.WAFER LEVEL PACKAGING MARKET,BY END USER,2020(%)

FIGURE 22.COMPARATIVE SHARE ANALYSIS OF CONSUMER ELECTRONICS WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 23.COMPARATIVE SHARE ANALYSIS OF IT AND TELECOMMUNICATION WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 24.COMPARATIVE SHARE ANALYSIS OF AUTOMOTIVE WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 25.COMPARATIVE SHARE ANALYSIS OF HEALTHCARE WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 26.COMPARATIVE SHARE ANALYSIS OF OTHERS WAFER LEVEL PACKAGING MARKET,2020-2030(%)

FIGURE 27.WAFER LEVEL PACKAGING MARKET BY REGION,2020

FIGURE 28.U.S. WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 29.CANADA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 30.MEXICO WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 31.U.K. WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 32.GERMANY WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 33.FRANCE WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 34.REST OF EUROPE WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 35.CHINA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 36.JAPAN WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 37.TAIWAN WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 38.INDIA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 39.SOUTH KOREA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 40.REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 41.LATIN AMERICA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 42.MIDDLE EAST WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 43.AFRICA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)

FIGURE 44. TOP WINNING STRATEGIES, BY YEAR

FIGURE 45. TOP WINNING STRATEGIES, BY DEVELOPMENT

FIGURE 46. TOP WINNING STRATEGIES, BY COMPANY

FIGURE 47.PRODUCT MAPPING OF TOP 10 PLAYERS

FIGURE 48.COMPETITIVE DASHBOARD

FIGURE 49.COMPETITIVE HEATMAP OF TOP 10 KEY PLAYERS

FIGURE 50.AMKOR TECHNOLOGY, INC..: NET SALES ,($MILLION)

FIGURE 51.FUJITSU.: NET SALES ,($MILLION)

FIGURE 52.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD.: NET SALES ,($MILLION)

FIGURE 53.DECA TECHNOLOGIES.: NET SALES ,($MILLION)

FIGURE 54.QUALCOMM TECHNOLOGIES, INC..: NET SALES ,($MILLION)

FIGURE 55.TOSHIBA CORPORATION.: NET SALES ,($MILLION)

FIGURE 56.TOKYO ELECTRON LTD..: NET SALES ,($MILLION)

FIGURE 57.APPLIED MATERIALS, INC..: NET SALES ,($MILLION)

FIGURE 58.ASML HOLDING N.V.: NET SALES ,($MILLION)

FIGURE 59.LAM RESEARCH CORPORATION.: NET SALES ,($MILLION