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Taiwanese IC Packaging & Testing Industry, 4Q 2018
Published Date: March 2019
|
Report Code: MICR-Semi-01
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Taiwanese IC Packaging and Testing Industry 4Q 2018

Taiwanese IC Packaging & Testing Industry, 4Q 2018

Code: MICR-Semi-01
Report
March 2019
18 Pages
Market Intelligence and Consulting Institute
Region: Global,
Description
Table of Content
Tables & Figures

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.1 billion in the third quarter of 2018, up both year-on-year and sequentially. The growth is mainly attributed to the strong shipments of memory ICs. The industry is forecast to have enjoyed both year-on-year and sequential growth in the fourth quarter. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand and thus the industry is anticipated to have grown about 11% year-on-year in 2018.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2016 - 1Q 2019
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2016 - 1Q 2019
Taiwanese IC Packaging Industry Shipment Value , 2Q 2016 - 1Q 2019
Taiwanese IC Testing Industry Shipment Value , 2Q 2016 - 1Q 2019
Taiwanese IC Packaging Industry Shipment Value Rankings, 2Q 2016 - 3Q 2018
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 2Q 2016 - 3Q 2018
Taiwanese IC Testing Industry’s Shipment Value Rankings, 2Q 2016 - 3Q 2018
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 2Q 2016 - 3Q 2018
Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 2Q 2016 - 3Q 2018
Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 2Q 2016 - 3Q 2018
Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 2Q 2016 - 3Q 2018
Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 2Q 2016 - 3Q 2018
Exchange Rate, 2Q 2016 - 3Q 2018
Research Scope & Definitions

List of Topics:-

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained from interviews, and publicly available information.

The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.1 billion in the third quarter of 2018, up both year-on-year and sequentially. The growth is mainly attributed to the strong shipments of memory ICs. The industry is forecast to have enjoyed both year-on-year and sequential growth in the fourth quarter. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand and thus the industry is anticipated to have grown about 11% year-on-year in 2018.

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Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2016 - 1Q 2019
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2016 - 1Q 2019
Taiwanese IC Packaging Industry Shipment Value , 2Q 2016 - 1Q 2019
Taiwanese IC Testing Industry Shipment Value , 2Q 2016 - 1Q 2019
Taiwanese IC Packaging Industry Shipment Value Rankings, 2Q 2016 - 3Q 2018
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 2Q 2016 - 3Q 2018
Taiwanese IC Testing Industry’s Shipment Value Rankings, 2Q 2016 - 3Q 2018
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 2Q 2016 - 3Q 2018
Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 2Q 2016 - 3Q 2018
Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 2Q 2016 - 3Q 2018
Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 2Q 2016 - 3Q 2018
Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 2Q 2016 - 3Q 2018
Exchange Rate, 2Q 2016 - 3Q 2018
Research Scope & Definitions

Read More

List of Topics:-

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained from interviews, and publicly available information.

Read More
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