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The Taiwanese Fabless IC Industry 4Q 2017
Published Date: March 2019
|
Report Code: MICR-Semi-06
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The Taiwanese Fabless IC Industry 4Q 2017

The Taiwanese Fabless IC Industry 4Q 2017

Code: MICR-Semi-06
Report
March 2019
10 Pages
Market Intelligence and Consulting Institute
Region: Global,
Description
Table of Content
Tables & Figures

The report finds that the Taiwanese semiconductor manufacturing industry comprising mainly of foundry, DRAM, flash memory, and IDM sectors grew sequentially but declined year-on-year in the third quarter of 2017. The share of high-end memory ICs manufactured using advanced process technology reached approximately 50% in the third quarter. The industry's shipment value is projected to have totaled approximately USD41.5 billion in 2017, up 7.9% year-on-year.

Table of Contents
Taiwanese Fabless IC Shipment Value, 1Q 2015 -1Q 2018
Taiwanese Fabless IC Shipment Value by Application Category, 1Q 2015 - 3Q 2017
Taiwanese Fabless IC Shipment Value Share by Application Category, 1Q 2015 - 3Q 2017
Taiwanese Fabless IC Shipment Value by Product Category, 1Q 2015 - 3Q 2017
Taiwanese Fabless IC Shipment Value Share by Product Category, 1Q 2015 - 3Q 2017
Taiwanese Fabless IC Shipment Value Ranking, 1Q 2015 - 3Q 2017
Taiwanese Fabless IC Shipment Value by Tier, 1Q 2015 - 3Q 2017
Research Scope & Definitions

List of topics:-

This research report presents shipment value forecast and recent quarter review of the Taiwanese fabless IC industry. The analysis of fabless IC shipment value, product mix, and application mix and includes major vendors' latest shipment value ranking The content of this report is based on primary data obtained from interviews with Taiwanese fabless IC design houses and publicly available information such as annual reports and financial statements.

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