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Key Developments in the Taiwan Semiconductor Industry, 3Q 2023 and Beyond
Published Date: December 2023
|
Report Code: MICR-Semi-0L23
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Key Developments in the Taiwan Semiconductor Industry 3Q 2023 and Beyond
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Key Developments in the Taiwan Semiconductor Industry, 3Q 2023 and Beyond

Code: MICR-Semi-0L23
Report
December 2023
Pages:9
Market Intelligence and Consulting Institute
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TABLE OF CONTENT
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Key Developments in the Taiwan Semiconductor Industry, 3Q 2023 and Beyond

In the second quarter of 2023, the overall shipment value of Taiwan's semiconductor industry reached US$29.23 billion, representing a 0.4% decline compared to the first quarter of 2023 and a significant negative growth of 23.7% compared to the second quarter of 2022. This report provides an in-depth analysis of key developments in Taiwan's semiconductor industry, including IC design, IC manufacturing, and packaging and testing industry sectors; offers insights into the fourth quarter of 2023 and beyond.

Table of Contents

1.Development of the Semiconductor Industry

1.1 IC Design

1.1.1 Peak Season Performance Fails to Meet Expectations in 2H23

1.1.2 IC Design Firms Diversify into Multiple Applications amid Continued AI Boom

1.2 IC Manufacturing

1.2.1 Wafer Foundry Outlook Cautious due to Low Order Visibility

1.2.2 Memory Supply and Demand Expected to Stabilize during 4Q23 to 1H24

1.3 IC Packaging and Testing

1.3.1 Peak Season Effect Depending on Consumer Market Momentum Pickups

1.3.2 Emerging Trends in HPC and AI Applications Continue to Drive Demand for Advanced Packaging and Testing

Appendix

List of Companies

 

Table of Contents

1.Development of the Semiconductor Industry

1.1 IC Design

1.1.1 Peak Season Performance Fails to Meet Expectations in 2H23

1.1.2 IC Design Firms Diversify into Multiple Applications amid Continued AI Boom

1.2 IC Manufacturing

1.2.1 Wafer Foundry Outlook Cautious due to Low Order Visibility

1.2.2 Memory Supply and Demand Expected to Stabilize during 4Q23 to 1H24

1.3 IC Packaging and Testing

1.3.1 Peak Season Effect Depending on Consumer Market Momentum Pickups

1.3.2 Emerging Trends in HPC and AI Applications Continue to Drive Demand for Advanced Packaging and Testing

Appendix

List of Companies

 

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