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Taiwanese IC Packaging and Testing Industry 4Q 2017
Published Date: March 2019
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Report Code: MICR-Semi-17
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Taiwanese IC Packaging and Testing Industry 4Q 2017

Taiwanese IC Packaging and Testing Industry 4Q 2017

Code: MICR-Semi-17
Report
March 2019
15 Pages
Market Intelligence and Consulting Institute
Region: Global,
Description
Table of Content
Tables & Figures

The report finds that shipment value of the Taiwanese IC packaging and testing industry enjoyed both year-on-year and sequential growth in the third quarter of 2017, to nearly USD 3.7 billion. The industry is forecast to have continued growing year-on-year in the fourth quarter of 2017. Overall, the industry still managed to grow over 8% in 2017 compared to last year.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2015 - 1Q 2018
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2015 - 1Q 2018
Taiwanese IC Packaging Industry Shipment Value , 2Q 2015 - 1Q 2018
Taiwanese IC Testing Industry Shipment Value , 2Q 2015 - 1Q 2018
Taiwanese IC Packaging Industry's Shipment Value Rankings, 2Q 2015 - 3Q 2017
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 2Q 2015 - 3Q 2017
Taiwanese IC Testing Industry's Shipment Value Rankings, 2Q 2015 - 3Q 2017
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 2Q 2015 - 3Q 2017
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 2Q 2015 - 3Q 2017
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 2Q 2015 - 3Q 2017
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 2Q 2015 - 3Q 2017
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 2Q 2015 - 3Q 2017
Exchange Rate, 2Q 2015 - 3Q 2017
Research Scope & Definitions

List of topics:

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained from interviews, and publicly available information.

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