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Taiwanese IC Packaging & Testing Industry, 2Q 2017
Published Date: March 2019
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Report Code: MICR-Semi-26
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Taiwanese IC Packaging Testing Industry 2Q 2017

Taiwanese IC Packaging & Testing Industry, 2Q 2017

Code: MICR-Semi-26
Report
March 2019
15 Pages
Market Intelligence and Consulting Institute
Region: Global,
Description
Table of Content
Tables & Figures

The report finds that Taiwanese IC packaging and testing industry still manged to grow year-on-year but declined sequentially in the first quarter of 2017, the traditionally weak season. Shipment value of the industry in the first quarter stood at approximately USD 3.25 billion. Affected by the deferred demand in the second quarter in anticipation of the new iPhone rollout, it is the industry is forecast to start to pick up momentum in the third quarter of 2017.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2015 - 3Q 2017
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 4Q 2014 - 3Q 2017
Taiwanese IC Packaging Industry Shipment Value , 1Q 2015 - 3Q 2017
Taiwanese IC Testing Industry Shipment Value , 1Q 2015 - 3Q 2017
Taiwanese IC Packaging Industry's Shipment Value Rankings, 1Q 2015 - 1Q 2017
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2015 - 1Q 2017
Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2015 - 1Q 2017
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2015 - 1Q 2017
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 1Q 2015 - 1Q 2017
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 4Q 2014 - 1Q 2017
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 4Q 2014 - 1Q 2017
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 4Q 2014 - 1Q 2017
Exchange Rate, 4Q 2014 - 1Q 2017
Research Scope & Definitions

List of topics:

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
The content of this report is based on primary data obtained from interviews, and publicly available information.

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