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2018-2019 Recap and 2020 Forecast for the Semiconductor Industry
Published Date: June 2020
|
Report Code: MICR-Semi-2C16
Home | Category |Computers & Electronics
2018 to 2019 Recap and 2020 Forecast for the Semiconductor Industry

2018-2019 Recap and 2020 Forecast for the Semiconductor Industry

Code: MICR-Semi-2C16
Report
June 2020
74 Pages
Market Intelligence and Consulting Institute
Region:
Description
Table of Content
Tables & Figures

Amid COVID-19 outbreak, global semiconductor market growth remained robust in the first quarter of 2020. Therefore, it is anticipated global semiconductor market value will reach USD 417.2 billion in 2020, up 1.2% year-on-year.

In the same year, shipment value of the Taiwanese semiconductor industry is forecast to grow 1.7% year-on-year and arrive at NTD2.45 trillion (USD 83.1 billion), higher than the global average. This is attributed mainly to Taiwan's advancements in advanced semiconductor manufacturing processes and the benefits of acquisitions and mergers. This report provides an overview of the development of the global semiconductor market and Taiwanese semiconductor industry - comprising of fabless IC, semiconductor manufacturing, and OSAT (Outsourced Semiconductor Assembly and Test) - between 2018 and April 2020; examines the development of major players and explores key trends and opportunities.

Table of Contents

1. Overview

1.1 Global Semiconductor Development

1.2 Taiwanese Semiconductor Development

2 Global IC Design Industry Development

2.1 Global Industry Value Witness Growth in 2018

2.2. The Fabless IC Design Industry by Region

2.2.1 Chinese IC Design Industry’s Global Share is Increasing Constantly

2.3 Development of Major IC Design Companies

2.3.1 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

3.Taiwanese IC Design Industry Development

3.1 Shipment Value of the Taiwanese Fabless IC Design Industry

3.2 Product Mix Analysis

3.2.1 Fabless ICs for Computing, Communication, and Consumer Applications

3.2.2 Communication ICs Remain Mainstream

3.3 Major Taiwan IC Design Companies

3.4 Industry Development Trends

3.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones

3.4.2 New Products and Applications to Drive Future Opportunity

4. Opportunities and Challenges

4.1 Impact of the US-China Trade Fight

4.1.1 Fabless IC Design is China’s Key Investment Focus

4.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China

4.1.3 Uncertainties Lead to New Industry Reorganization

4.2 AI Edge Computing Changing the IC Design Industry’s Business Model

4. Outlook for the Taiwanese IC Design Industry

4.1 Taiwan's IC Design Industry Will Slow Down Significantly in 2020

5. MIC Perspective

5.1 Seeking New Export Opportunities from Trade Fight

5.2 Emerging Technologies Make More Applications Possible

6. Development of the Global Semiconductor Manufacturing Industry

6.1 Global Foundry Growth Stays Stable

6.2 TSMC Continues to be The World’s Largest Foundry

7. Industry Development Trends

7.1 EUV Lithography Ready to Extend the Life of Moore’s Law

7.2 Strategies Focus on Advanced Nanotechnology Processes and Mature Process Applications

8. Development of Major Players

8.1 TSMC

8.2 Samsung

8.3 GlobalFoundries

8.4 UMC

8.5 SMIC

9.Outlook for the Taiwanese Semiconductor Manufacturing Industry

9.1 Momentum from High-speed Computing Applications Continues but from Communications Applications Fall Sharply

9.2 COVID Has Short-term Impact While Excessive Inventory to Affect Shipments in 2H 2020

9.3 COVID-19 Affects End-consumer Market Demand and Memory Prices are Falling

10.MIC Perspective

10.1 Inventory Clearance and Economic Uncertainty Affect 2019 Performance

10.2 Influence of US-China Trade War on Global Economy Continues

11.Development of the Worldwide OSAT Industry

11.1 Steady Growth in 2018

11.1.1 OSAT Companies’ Market Share Struck by Trade War

11.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018

11.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China

11.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing

11.2.2 Taiwanese IC Packaging and Testing Industry Posts Higher-than-Global-Average Growth at 8.4% in 2018

12.Development of Leading International OSAT Companies

12.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics

12.2 JECT’s M&A Continues to Deliver Synergy, Boosting High-end Packaging Share

12.3 Tianshui Huatian Technology Did Not Live Up to Expectations in 2018

12.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers

13. Development of Leading Taiwanese OSAT Companies

13.1 ASE Benefits from M&A Synergy with Focus on SiP Technology

13.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs

13.2 PTI Strives for Product Diversification by Expanding Non-Memory Business

13.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and ChipMOS Revenues

14. Outlook for theTaiwanese OSAT industry

14.1 Ongoing COVID-19 Affect OSAT Industry

14.2 Demand for True Wireless Stereo as Key Growth Factor

15. MIC Perspective

15.1 A Significant Slowdown in Worldwide IC Packaging and Testing Industry Growth in 2019

15.2 SiP and Heterogeneous Integration as Key Driving Force for Growth

15.3 Trade Restrictions Put Stability of Supply Chain to Test

Appendix

List of Companies



List of Tables

Table 1 Global Top 10 IC Design Companies in 2018

Table 2 China’s Top 10 Fabless IC Design Companies in 2018

Table 3 Taiwan’s Top 10 IC Design Companies by Revenue in 2019

Table 4 Global Semiconductor Manufacturer Production Value Rankings

Table 5 Taiwan’s Top 10 Foundries by Revenue in 2019

Table 6 M&A of Leading OSAT Companies, 2014-2019

Table 7 Taiwan’s Top 10 OSAT Companies by Revenue in 2019

Table 8 Milestones of ASE-SPIL Merger

List of Figures

Figure 1 Global Semiconductor Market Value, 2011-2021

Figure 2 Taiwanese Semiconductor Industry Shipment Value, 2011-2020

Figure 3 Global IC Design Industry Shipment Value, 2013-2019

Figure 4 Global IC Design Industry Market Share by Production Base, 2015 - 2018

Figure 5 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019

Figure 6 Taiwan IC Design Industry Shipment Share by Application

Figure 7 Taiwan IC Design Industry Shipment Share by Product Mix

Figure 8 Global Semiconductor Manufacturing Industry Shipment Value, 2015-2019

Figure 9 Shipment Value of the Taiwanese Semiconductor Manufacturing Industry, 2016-2019

Figure 10 Taiwanese Semiconductor Manufacturing Shipment Value Share by Process Technology, 3Q17 - 4Q19

Figure 11 Global Major IC Manufacturers’ Development Roadmap

Figure 12 Benchmarking of TSMC, UMC, and SMIC Production Value Share by Process Technology

Figure 13 GlobalFoundries Process Development Roadmap

Figure 14 SMIC Revenue and Net Profit, 2015-2018

Figure 15 Worldwide OSAT Industry Shipment Value and Growth Rates, 2016-2019

Figure 16 World’s Top Ten OSAT Companies by Revenue in 2019

Figure 17 Taiwanese OSAT Industry Shipment Value and Growth Rates, 2016-2019

 

1. Overview

1.1 Global Semiconductor Development

1.2 Taiwanese Semiconductor Development

2 Global IC Design Industry Development

2.1 Global Industry Value Witness Growth in 2018

2.2. The Fabless IC Design Industry by Region

2.2.1 Chinese IC Design Industry’s Global Share is Increasing Constantly

2.3 Development of Major IC Design Companies

2.3.1 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

3.Taiwanese IC Design Industry Development

3.1 Shipment Value of the Taiwanese Fabless IC Design Industry

3.2 Product Mix Analysis

3.2.1 Fabless ICs for Computing, Communication, and Consumer Applications

3.2.2 Communication ICs Remain Mainstream

3.3 Major Taiwan IC Design Companies

3.4 Industry Development Trends

3.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones

3.4.2 New Products and Applications to Drive Future Opportunity

4. Opportunities and Challenges

4.1 Impact of the US-China Trade Fight

4.1.1 Fabless IC Design is China’s Key Investment Focus

4.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China

4.1.3 Uncertainties Lead to New Industry Reorganization

4.2 AI Edge Computing Changing the IC Design Industry’s Business Model

4. Outlook for the Taiwanese IC Design Industry

4.1 Taiwan's IC Design Industry Will Slow Down Significantly in 2020

5. MIC Perspective

5.1 Seeking New Export Opportunities from Trade Fight

5.2 Emerging Technologies Make More Applications Possible

6. Development of the Global Semiconductor Manufacturing Industry

6.1 Global Foundry Growth Stays Stable

6.2 TSMC Continues to be The World’s Largest Foundry

7. Industry Development Trends

7.1 EUV Lithography Ready to Extend the Life of Moore’s Law

7.2 Strategies Focus on Advanced Nanotechnology Processes and Mature Process Applications

8. Development of Major Players

8.1 TSMC

8.2 Samsung

8.3 GlobalFoundries

8.4 UMC

8.5 SMIC

9.Outlook for the Taiwanese Semiconductor Manufacturing Industry

9.1 Momentum from High-speed Computing Applications Continues but from Communications Applications Fall Sharply

9.2 COVID Has Short-term Impact While Excessive Inventory to Affect Shipments in 2H 2020

9.3 COVID-19 Affects End-consumer Market Demand and Memory Prices are Falling

10.MIC Perspective

10.1 Inventory Clearance and Economic Uncertainty Affect 2019 Performance

10.2 Influence of US-China Trade War on Global Economy Continues

11.Development of the Worldwide OSAT Industry

11.1 Steady Growth in 2018

11.1.1 OSAT Companies’ Market Share Struck by Trade War

11.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018

11.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China

11.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing

11.2.2 Taiwanese IC Packaging and Testing Industry Posts Higher-than-Global-Average Growth at 8.4% in 2018

12.Development of Leading International OSAT Companies

12.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics

12.2 JECT’s M&A Continues to Deliver Synergy, Boosting High-end Packaging Share

12.3 Tianshui Huatian Technology Did Not Live Up to Expectations in 2018

12.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers

13. Development of Leading Taiwanese OSAT Companies

13.1 ASE Benefits from M&A Synergy with Focus on SiP Technology

13.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs

13.2 PTI Strives for Product Diversification by Expanding Non-Memory Business

13.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and ChipMOS Revenues

14. Outlook for theTaiwanese OSAT industry

14.1 Ongoing COVID-19 Affect OSAT Industry

14.2 Demand for True Wireless Stereo as Key Growth Factor

15. MIC Perspective

15.1 A Significant Slowdown in Worldwide IC Packaging and Testing Industry Growth in 2019

15.2 SiP and Heterogeneous Integration as Key Driving Force for Growth

15.3 Trade Restrictions Put Stability of Supply Chain to Test

Appendix

List of Companies

List of Tables

Table 1 Global Top 10 IC Design Companies in 2018

Table 2 China’s Top 10 Fabless IC Design Companies in 2018

Table 3 Taiwan’s Top 10 IC Design Companies by Revenue in 2019

Table 4 Global Semiconductor Manufacturer Production Value Rankings

Table 5 Taiwan’s Top 10 Foundries by Revenue in 2019

Table 6 M&A of Leading OSAT Companies, 2014-2019

Table 7 Taiwan’s Top 10 OSAT Companies by Revenue in 2019

Table 8 Milestones of ASE-SPIL Merger

List of Figures

Figure 1 Global Semiconductor Market Value, 2011-2021

Figure 2 Taiwanese Semiconductor Industry Shipment Value, 2011-2020

Figure 3 Global IC Design Industry Shipment Value, 2013-2019

Figure 4 Global IC Design Industry Market Share by Production Base, 2015 - 2018

Figure 5 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019

Figure 6 Taiwan IC Design Industry Shipment Share by Application

Figure 7 Taiwan IC Design Industry Shipment Share by Product Mix

Figure 8 Global Semiconductor Manufacturing Industry Shipment Value, 2015-2019

Figure 9 Shipment Value of the Taiwanese Semiconductor Manufacturing Industry, 2016-2019

Figure 10 Taiwanese Semiconductor Manufacturing Shipment Value Share by Process Technology, 3Q17 - 4Q19

Figure 11 Global Major IC Manufacturers’ Development Roadmap

Figure 12 Benchmarking of TSMC, UMC, and SMIC Production Value Share by Process Technology

Figure 13 GlobalFoundries Process Development Roadmap

Figure 14 SMIC Revenue and Net Profit, 2015-2018

Figure 15 Worldwide OSAT Industry Shipment Value and Growth Rates, 2016-2019

Figure 16 World’s Top Ten OSAT Companies by Revenue in 2019

Figure 17 Taiwanese OSAT Industry Shipment Value and Growth Rates, 2016-2019

 

Amid COVID-19 outbreak, global semiconductor market growth remained robust in the first quarter of 2020. Therefore, it is anticipated global semiconductor market value will reach USD 417.2 billion in 2020, up 1.2% year-on-year.

In the same year, shipment value of the Taiwanese semiconductor industry is forecast to grow 1.7% year-on-year and arrive at NTD2.45 trillion (USD 83.1 billion), higher than the global average. This is attributed mainly to Taiwan's advancements in advanced semiconductor manufacturing processes and the benefits of acquisitions and mergers. This report provides an overview of the development of the global semiconductor market and Taiwanese semiconductor industry - comprising of fabless IC, semiconductor manufacturing, and OSAT (Outsourced Semiconductor Assembly and Test) - between 2018 and April 2020; examines the development of major players and explores key trends and opportunities.

Table of Contents

1. Overview

1.1 Global Semiconductor Development

1.2 Taiwanese Semiconductor Development

2 Global IC Design Industry Development

2.1 Global Industry Value Witness Growth in 2018

2.2. The Fabless IC Design Industry by Region

2.2.1 Chinese IC Design Industry’s Global Share is Increasing Constantly

2.3 Development of Major IC Design Companies

2.3.1 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

3.Taiwanese IC Design Industry Development

3.1 Shipment Value of the Taiwanese Fabless IC Design Industry

3.2 Product Mix Analysis

3.2.1 Fabless ICs for Computing, Communication, and Consumer Applications

3.2.2 Communication ICs Remain Mainstream

3.3 Major Taiwan IC Design Companies

3.4 Industry Development Trends

3.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones

3.4.2 New Products and Applications to Drive Future Opportunity

4. Opportunities and Challenges

4.1 Impact of the US-China Trade Fight

4.1.1 Fabless IC Design is China’s Key Investment Focus

4.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China

4.1.3 Uncertainties Lead to New Industry Reorganization

4.2 AI Edge Computing Changing the IC Design Industry’s Business Model

4. Outlook for the Taiwanese IC Design Industry

4.1 Taiwan's IC Design Industry Will Slow Down Significantly in 2020

5. MIC Perspective

5.1 Seeking New Export Opportunities from Trade Fight

5.2 Emerging Technologies Make More Applications Possible

6. Development of the Global Semiconductor Manufacturing Industry

6.1 Global Foundry Growth Stays Stable

6.2 TSMC Continues to be The World’s Largest Foundry

7. Industry Development Trends

7.1 EUV Lithography Ready to Extend the Life of Moore’s Law

7.2 Strategies Focus on Advanced Nanotechnology Processes and Mature Process Applications

8. Development of Major Players

8.1 TSMC

8.2 Samsung

8.3 GlobalFoundries

8.4 UMC

8.5 SMIC

9.Outlook for the Taiwanese Semiconductor Manufacturing Industry

9.1 Momentum from High-speed Computing Applications Continues but from Communications Applications Fall Sharply

9.2 COVID Has Short-term Impact While Excessive Inventory to Affect Shipments in 2H 2020

9.3 COVID-19 Affects End-consumer Market Demand and Memory Prices are Falling

10.MIC Perspective

10.1 Inventory Clearance and Economic Uncertainty Affect 2019 Performance

10.2 Influence of US-China Trade War on Global Economy Continues

11.Development of the Worldwide OSAT Industry

11.1 Steady Growth in 2018

11.1.1 OSAT Companies’ Market Share Struck by Trade War

11.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018

11.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China

11.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing

11.2.2 Taiwanese IC Packaging and Testing Industry Posts Higher-than-Global-Average Growth at 8.4% in 2018

12.Development of Leading International OSAT Companies

12.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics

12.2 JECT’s M&A Continues to Deliver Synergy, Boosting High-end Packaging Share

12.3 Tianshui Huatian Technology Did Not Live Up to Expectations in 2018

12.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers

13. Development of Leading Taiwanese OSAT Companies

13.1 ASE Benefits from M&A Synergy with Focus on SiP Technology

13.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs

13.2 PTI Strives for Product Diversification by Expanding Non-Memory Business

13.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and ChipMOS Revenues

14. Outlook for theTaiwanese OSAT industry

14.1 Ongoing COVID-19 Affect OSAT Industry

14.2 Demand for True Wireless Stereo as Key Growth Factor

15. MIC Perspective

15.1 A Significant Slowdown in Worldwide IC Packaging and Testing Industry Growth in 2019

15.2 SiP and Heterogeneous Integration as Key Driving Force for Growth

15.3 Trade Restrictions Put Stability of Supply Chain to Test

Appendix

List of Companies



List of Tables

Table 1 Global Top 10 IC Design Companies in 2018

Table 2 China’s Top 10 Fabless IC Design Companies in 2018

Table 3 Taiwan’s Top 10 IC Design Companies by Revenue in 2019

Table 4 Global Semiconductor Manufacturer Production Value Rankings

Table 5 Taiwan’s Top 10 Foundries by Revenue in 2019

Table 6 M&A of Leading OSAT Companies, 2014-2019

Table 7 Taiwan’s Top 10 OSAT Companies by Revenue in 2019

Table 8 Milestones of ASE-SPIL Merger

List of Figures

Figure 1 Global Semiconductor Market Value, 2011-2021

Figure 2 Taiwanese Semiconductor Industry Shipment Value, 2011-2020

Figure 3 Global IC Design Industry Shipment Value, 2013-2019

Figure 4 Global IC Design Industry Market Share by Production Base, 2015 - 2018

Figure 5 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019

Figure 6 Taiwan IC Design Industry Shipment Share by Application

Figure 7 Taiwan IC Design Industry Shipment Share by Product Mix

Figure 8 Global Semiconductor Manufacturing Industry Shipment Value, 2015-2019

Figure 9 Shipment Value of the Taiwanese Semiconductor Manufacturing Industry, 2016-2019

Figure 10 Taiwanese Semiconductor Manufacturing Shipment Value Share by Process Technology, 3Q17 - 4Q19

Figure 11 Global Major IC Manufacturers’ Development Roadmap

Figure 12 Benchmarking of TSMC, UMC, and SMIC Production Value Share by Process Technology

Figure 13 GlobalFoundries Process Development Roadmap

Figure 14 SMIC Revenue and Net Profit, 2015-2018

Figure 15 Worldwide OSAT Industry Shipment Value and Growth Rates, 2016-2019

Figure 16 World’s Top Ten OSAT Companies by Revenue in 2019

Figure 17 Taiwanese OSAT Industry Shipment Value and Growth Rates, 2016-2019

 

Read More

1. Overview

1.1 Global Semiconductor Development

1.2 Taiwanese Semiconductor Development

2 Global IC Design Industry Development

2.1 Global Industry Value Witness Growth in 2018

2.2. The Fabless IC Design Industry by Region

2.2.1 Chinese IC Design Industry’s Global Share is Increasing Constantly

2.3 Development of Major IC Design Companies

2.3.1 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

3.Taiwanese IC Design Industry Development

3.1 Shipment Value of the Taiwanese Fabless IC Design Industry

3.2 Product Mix Analysis

3.2.1 Fabless ICs for Computing, Communication, and Consumer Applications

3.2.2 Communication ICs Remain Mainstream

3.3 Major Taiwan IC Design Companies

3.4 Industry Development Trends

3.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones

3.4.2 New Products and Applications to Drive Future Opportunity

4. Opportunities and Challenges

4.1 Impact of the US-China Trade Fight

4.1.1 Fabless IC Design is China’s Key Investment Focus

4.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China

4.1.3 Uncertainties Lead to New Industry Reorganization

4.2 AI Edge Computing Changing the IC Design Industry’s Business Model

4. Outlook for the Taiwanese IC Design Industry

4.1 Taiwan's IC Design Industry Will Slow Down Significantly in 2020

5. MIC Perspective

5.1 Seeking New Export Opportunities from Trade Fight

5.2 Emerging Technologies Make More Applications Possible

6. Development of the Global Semiconductor Manufacturing Industry

6.1 Global Foundry Growth Stays Stable

6.2 TSMC Continues to be The World’s Largest Foundry

7. Industry Development Trends

7.1 EUV Lithography Ready to Extend the Life of Moore’s Law

7.2 Strategies Focus on Advanced Nanotechnology Processes and Mature Process Applications

8. Development of Major Players

8.1 TSMC

8.2 Samsung

8.3 GlobalFoundries

8.4 UMC

8.5 SMIC

9.Outlook for the Taiwanese Semiconductor Manufacturing Industry

9.1 Momentum from High-speed Computing Applications Continues but from Communications Applications Fall Sharply

9.2 COVID Has Short-term Impact While Excessive Inventory to Affect Shipments in 2H 2020

9.3 COVID-19 Affects End-consumer Market Demand and Memory Prices are Falling

10.MIC Perspective

10.1 Inventory Clearance and Economic Uncertainty Affect 2019 Performance

10.2 Influence of US-China Trade War on Global Economy Continues

11.Development of the Worldwide OSAT Industry

11.1 Steady Growth in 2018

11.1.1 OSAT Companies’ Market Share Struck by Trade War

11.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018

11.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China

11.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing

11.2.2 Taiwanese IC Packaging and Testing Industry Posts Higher-than-Global-Average Growth at 8.4% in 2018

12.Development of Leading International OSAT Companies

12.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics

12.2 JECT’s M&A Continues to Deliver Synergy, Boosting High-end Packaging Share

12.3 Tianshui Huatian Technology Did Not Live Up to Expectations in 2018

12.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers

13. Development of Leading Taiwanese OSAT Companies

13.1 ASE Benefits from M&A Synergy with Focus on SiP Technology

13.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs

13.2 PTI Strives for Product Diversification by Expanding Non-Memory Business

13.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and ChipMOS Revenues

14. Outlook for theTaiwanese OSAT industry

14.1 Ongoing COVID-19 Affect OSAT Industry

14.2 Demand for True Wireless Stereo as Key Growth Factor

15. MIC Perspective

15.1 A Significant Slowdown in Worldwide IC Packaging and Testing Industry Growth in 2019

15.2 SiP and Heterogeneous Integration as Key Driving Force for Growth

15.3 Trade Restrictions Put Stability of Supply Chain to Test

Appendix

List of Companies

Read More

List of Tables

Table 1 Global Top 10 IC Design Companies in 2018

Table 2 China’s Top 10 Fabless IC Design Companies in 2018

Table 3 Taiwan’s Top 10 IC Design Companies by Revenue in 2019

Table 4 Global Semiconductor Manufacturer Production Value Rankings

Table 5 Taiwan’s Top 10 Foundries by Revenue in 2019

Table 6 M&A of Leading OSAT Companies, 2014-2019

Table 7 Taiwan’s Top 10 OSAT Companies by Revenue in 2019

Table 8 Milestones of ASE-SPIL Merger

List of Figures

Figure 1 Global Semiconductor Market Value, 2011-2021

Figure 2 Taiwanese Semiconductor Industry Shipment Value, 2011-2020

Figure 3 Global IC Design Industry Shipment Value, 2013-2019

Figure 4 Global IC Design Industry Market Share by Production Base, 2015 - 2018

Figure 5 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019

Figure 6 Taiwan IC Design Industry Shipment Share by Application

Figure 7 Taiwan IC Design Industry Shipment Share by Product Mix

Figure 8 Global Semiconductor Manufacturing Industry Shipment Value, 2015-2019

Figure 9 Shipment Value of the Taiwanese Semiconductor Manufacturing Industry, 2016-2019

Figure 10 Taiwanese Semiconductor Manufacturing Shipment Value Share by Process Technology, 3Q17 - 4Q19

Figure 11 Global Major IC Manufacturers’ Development Roadmap

Figure 12 Benchmarking of TSMC, UMC, and SMIC Production Value Share by Process Technology

Figure 13 GlobalFoundries Process Development Roadmap

Figure 14 SMIC Revenue and Net Profit, 2015-2018

Figure 15 Worldwide OSAT Industry Shipment Value and Growth Rates, 2016-2019

Figure 16 World’s Top Ten OSAT Companies by Revenue in 2019

Figure 17 Taiwanese OSAT Industry Shipment Value and Growth Rates, 2016-2019

 

Read More
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