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The Taiwanese Fabless IC Industry, 4Q 2018
Published Date: March 2019
|
Report Code: MICR-Semi-32
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The Taiwanese Fabless IC Industry 4Q 2018

The Taiwanese Fabless IC Industry, 4Q 2018

Code: MICR-Semi-32
Report
March 2019
10 Pages
Market Intelligence and Consulting Institute
Region: Global,
Description
Table of Content
Tables & Figures

The report finds that the Taiwanese fabless IC industry's shipment value continued to witness both sequential and year-on-year growth in the third quarter of 2018. Looking forward, in anticipation of the increasingly stable shipment of smartphone ICs and continued steady IoT-related applications that drive the demand for wireless communications ICs, the industry's shipment value is anticipated to reach NTD 579.8 billion (USD 19.3 billion; USD1 = NTD30.0) in 2018, up 6.2% year-on-year.

Table of Contents
Taiwanese Fabless IC Shipment Value, 3Q 2013 - 1Q 2017
Taiwanese Fabless IC Shipment Value by Application Category, 3Q 2013 - 3Q 2016
Taiwanese Fabless IC Shipment Value Share by Application Category, 3Q 2013 - 3Q 2016
Taiwanese Fabless IC Shipment Value by Product Category, 3Q 2013 - 3Q 2016
Taiwanese Fabless IC Shipment Value Share by Product Category, 3Q 2013 - 3Q 2016
Taiwanese Fabless IC Shipment Value Ranking, 3Q 2013 - 3Q 2016
Taiwanese Fabless IC Shipment Value by Tier, 3Q 2013 - 3Q 2016
Research Scope & Definitions

List of topics:-

This research report presents shipment value forecast and recent quarter review of the Taiwanese fabless IC industry. The analysis of fabless IC shipment value, product mix, and application mix and includes major vendors' latest shipment value ranking. The content of this report is based on primary data obtained from interviews with Taiwanese fabless IC design houses and publicly available information such as annual reports and financial statements of individual companies covered in this report.

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