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Taiwanese IC Packaging & Testing Industry, 4Q 2016
Published Date: March 2019
|
Report Code: MICR-Semi-34
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Taiwanese IC Packaging  Testing Industry 4Q 2016

Taiwanese IC Packaging & Testing Industry, 4Q 2016

Code: MICR-Semi-34
Report
March 2019
15 Pages
Market Intelligence and Consulting Institute
Region: Global,
Description
Table of Content
Tables & Figures

The report finds that shipment value of the Taiwanese IC packaging and testing industry grew 10.4% sequentially to approximately US$3.5 billion in the third quarter of 2016, thanks to the growing demand for chips used in IoT microcontrollers, smart car sensors, and graphic cards, virtual reality headsets, and wearable devices. The industry's shipment value is expected to have grown 2.5% sequentially and 16.3% year-on-year in the fourth quarter fo 2016.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2014 - 1Q 2017
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 2Q 2014 - 1Q 2017
Taiwanese IC Packaging Industry Shipment Value , 2Q 2014 - 1Q 2017
Taiwanese IC Testing Industry Shipment Value , 2Q 2014 - 1Q 2017
Taiwanese IC Packaging Industry's Shipment Value Rankings, 2Q 2014 - 3Q 2016
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 2Q 2014 - 3Q 2016
Taiwanese IC Testing Industry's Shipment Value Rankings, 2Q 2014 - 3Q 2016
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 2Q 2014 - 3Q 2016
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 2Q 2014 - 3Q 2016
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 2Q 2014 - 3Q 2016
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 2Q 2014 - 3Q 2016
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 2Q 2014 - 3Q 2016
Exchange Rate, 2Q 2014 - 3Q 2016
Research Scope & Definitions

List of topics:

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained from interviews, and publicly available information such as corporate financial statements.

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