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Taiwanese IC Packaging & Testing Industry, 3Q 2017
Published Date: March 2019
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Report Code: MICR-Semi-37
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Taiwanese IC Packaging  Testing Industry 3Q 2017

Taiwanese IC Packaging & Testing Industry, 3Q 2017

Code: MICR-Semi-37
Report
March 2019
15 Pages
Market Intelligence and Consulting Institute
Region: Global,
Description
Table of Content
Tables & Figures

The report finds that shipment value of the Taiwanese IC packaging and testing industry enjoyed 10% year-on-year and nearly 8% sequential growth in the second quarter of 2017, to nearly USD 3.5 billion. The growth in the second quarter was attributed mainly to the strong shipment value from the IC testing industry. The upward growth trend is anticipated to have continued into the third quarter of 2017, with a shipment value of over USD3.5 billion.

Table of Contents
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2015 - 4Q 2017
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2015 - 4Q 2017
Taiwanese IC Packaging Industry Shipment Value , 1Q 2015 - 4Q 2017
Taiwanese IC Testing Industry Shipment Value , 1Q 2015 - 4Q 2017
Taiwanese IC Packaging Industry's Shipment Value Rankings, 1Q 2015 - 2Q 2017
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2015 - 2Q 2017
Taiwanese IC Testing Industry's Shipment Value Rankings, 1Q 2015 - 2Q 2017
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2015 - 2Q 2017
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 1Q 2015 - 2Q 2017
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 1Q 2015 - 2Q 2017
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 1Q 2015 - 2Q 2017
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 1Q 2015 - 2Q 2017
Exchange Rate, 1Q 2015 - 2Q 2017
Research Scope & Definitions

List of topics:

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
The content of this report is based on primary data obtained from interviews, and publicly available information.

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