Development Trends of TWS Application Chips (pre-order)

As Bluetooth technology advances and smartphone brands sequentially remove the 3.5-mm headphone jack from their phones, the TWS (True Wireless Stereo) market has continued to grow. With market competition heating up, application IC vendors for TWS have constantly upgraded their technology. Eying on the growth potential of TWS, IC design houses have tapped into this market. This report begins with the current development of the TWS market, followed by an analysis of the trends in the TWS application IC industry, and examines some leading IC design houses deployment in the TWS market.

• "Development of TWS (True Wireless Stereo), touching on their development roadmap, functional blocks, and Bluetooth technology adoption
• Development trends of TWS application IC industry, touching on five major trends and major TWS application IC suppliers
• Development of major TWS application IC suppliers, including Airoha, Realtek, PixArt Imaging"

• AAC Technologies
• Actions Semiconductor
• Airoha Technology
• Amazon
• Anker
• Apple
• Beats Electronics
• Bestechnic
• Bestechnic
• Bluetrum
• Broadcom
• Edifier Technology
• Goertek
• Google
• Havit
• HiVi Acoustics Technology
• Holtek
• Huawei
• Injoinic Technology
• JBL
• JLab LLC
• Joway
• Koss
• Lenovo
• Macronix
• Master & Dynamic
• MediaTek
• Nakamichi
• Nuvoton Technology
• NXP
• Oppo
• Origin International
• Philips
• PixArtImaging
• PXI
• QCY
• Qualcomm
• Razer
• Realtek
• Samsung
• SG Micro
• Sitronix
• Sony
• Spreadtrum Communications
• STMicroelectronics
• Texas Instrument
• Tontek
• Toshiba
• Tozo
• Will Semiconductor
• Winbond Electronics
• Xiaomi
• Zilltek Technology

Table of Contents

1.Development of TWS

1.1 Trends towards Wireless Connectivity and Smart Functions
1.2 Enhanced Bluetooth Technology and Removal of 3.5mm Jack from Smartphones Drives TWS Development
1.3 Heated TWS Market Competition Pushes Leading Brands to Upgrade Services

2.Trends of the TWS Application IC Industry

2.1 Bluetooth SoC and MCU as Key Components in TWS Systems
2.2 Major Development Trends of TWS

2.2.1 Trend #1: Leading Chipmakers Develop In-house Bluetooth Solutions
2.2.2 Trend #2: Focus on Low Latency Technology
2.2.3 Trend #3: Bluetooth SoC with ANC Becoming a Must-have in Mid-range and High-end TWS
2.2.4 Trend #4: Noise Cancellation and Voice Assistant Boost Demand for MEMS Microphones
2.2.5 Trend #5: Increased Adoption of SiP Technology in Mid-range and High-end TWS

3.Application IC Suppliers’ Deployment in TWS

3.1 Most IC Suppliers Already Extend Reach to TWS
3.2 Leading Bluetooth IC Suppliers Tap into Chinese Customers’ Supply Chains

3.2.1 Airoha Technology’s Bluetooth Technology Favored by Chinese Customers
3.2.2 Realtek Taps into Mid-range and High-end Market Segments with Low Power Consumption Feature
3.2.3 PixArt Imaging Launches Wireless Audio SoC for Chinese Customers through Subsidiary Audiowise Technology

3.3 Majority of Taiwanese MCUs and Sensors Supplied to Chinese Brands
3. MIC Perspective

Appendix

List of Companies

List of Tables

Table1 Top 5 TWS Brands New Products in 2020
Table 2 Latency of Major Bluetooth SoCs
Table 3 Application IC Suppliers for TWS
Table 4 Airoha Technology and Bluetooth ICs for TWS
Table 5 Realtek and Bluetooth ICs for TWS
Table 6 PixArt Imaging and Bluetooth ICs for TWS

List of Figures

Figure 1 Evolution of Headphones
Figure 2 Functional Blocks of TWS
Figure 3 Leading Chipmakers and Bluetooth Technology Used for TWS