Taiwanese IC Packaging & Testing Industry, 4Q 2019

The report finds that the shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High-Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectory. The industry is expected to have continued growth momentum in the fourth quarter, reaching US$4.2 billion.

Table of Contents

Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2017 - 1Q 2020
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2017 - 1Q 2020
Taiwanese IC Packaging Industry Shipment Value, 1Q 2017 - 1Q 2020
Taiwanese IC Testing Industry Shipment Value, 1Q 2017 - 1Q 2020
Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2017 - 3Q 2019
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 1Q 2017 - 3Q 2019
Taiwanese IC Testing Industry’s Shipment Value Rankings, 1Q 2017 - 3Q 2019
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 1Q 2017 - 3Q 2019
Taiwanese IC Packaging Industry Shipment Value by Customers' Origin, 1Q 2017 - 3Q 2019
Taiwanese IC Packaging Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 3Q 2019
Taiwanese IC Testing Industry Shipment Value by Customers' Origin, 1Q 2017 - 3Q 2019
Taiwanese IC Testing Industry Shipment Value Share by Customers' Origin, 1Q 2017 - 3Q 2019
Exchange Rate, 2Q 2017 - 3Q 2019
Research Scope & Definitions

This research report presents shipment value forecast and recent quarter review of the Taiwanese semiconductor manufacturing industry.

Companies surveyed in this research are those owning facilities to make MOS (Metal Oxide Semiconductor) wafers in Taiwan, including foundries, DRAM (Dynamic Random Access Memory) makers, flash memory makers, and IDMs (Integrated Device Manufacturers).

The content of this report is based on primary data obtained from interviews and publicly available information.