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Global Packaging Materials for IGBT and SiC Modules Market Research Report 2025

Published Date: June 2025

Report Code: QYRE-Auto-10P16886

Global Packaging Materials for IGBT and SiC Modules Market Research Report 2024

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Global Packaging Materials for IGBT and SiC Modules Market Research Report 2025

Code: QYRE-Auto-10P16886

Report

June 2025

Pages:97

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Rogers Corporation

MacDermid Alpha

DOW

Indium Corporation

Heraeus

Henkel

Ferrotec

Kyocera

NGK Electronics Devices

DOWA

Denka

Tanaka

Resonac

BYD

Toshiba Materials

KCC

Shengda Tech

Nanjing Zhongjiang New Material Science &Technology

Packaging Materials for IGBT and SiC Modules Market Size

The global market for Packaging Materials for IGBT and SiC Modules was valued at US$ 2485 million in the year 2024 and is projected to reach a revised size of US$ 3863 million by 2031, growing at a CAGR of 6.6% during the forecast period.

Packaging Materials for IGBT and SiC Modules Market

This report studies the Power Module Packaging Materials, include Encapsulation (Silicone Gel and Epoxy), Die Attach (soldering, sintering), ceramic substrates (DBC and AMB), Baseplate (copper, ALSiC, Thermal Interface Materials (crease, PCM), Electrical Interconnection (aluminum-based and copper-based).

North American market for Packaging Materials for IGBT and SiC Modules is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

Asia-Pacific market for Packaging Materials for IGBT and SiC Modules is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

The global market for Packaging Materials for IGBT and SiC Modules in Automotive is estimated to increase from $ million in 2024 to $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

The major global companies of Packaging Materials for IGBT and SiC Modules include Rogers Corporation, MacDermid Alpha, 3M, Dow, Indium Corporation, Heraeus, Henkel, Ferrotec, Kyocera, NGK Electronics Devices, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

This report aims to provide a comprehensive presentation of the global market for Packaging Materials for IGBT and SiC Modules, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Packaging Materials for IGBT and SiC Modules.

The Packaging Materials for IGBT and SiC Modules market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Packaging Materials for IGBT and SiC Modules market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Packaging Materials for IGBT and SiC Modules companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Packaging Materials for IGBT and SiC Modules Market Report

Report Metric	Details
Report Name	Packaging Materials for IGBT and SiC Modules Market
Accounted market size in year	US$ 2485 million
Forecasted market size in 2031	US$ 3863 million
CAGR	6.6%
Base Year	year
Forecasted years	2025 - 2031
Segment by Type	Encapsulation (Silicone Gel and Epoxy) Die Bonding Materials Ceramic Substrate Thermal Interface Materials Electrical Interconnection Others
Segment by Application	Automotive Traction & Railway PV, Wind Power & Power Grid Industrial Motor Home Appliances USP Other
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Rogers Corporation, MacDermid Alpha, 3M, Dow, Indium Corporation, Heraeus, Henkel, Ferrotec, Kyocera, NGK Electronics Devices, Dowa, Denka, Tanaka, Resonac, BYD, Toshiba Materials, KCC, Shengda Tech, Nanjing Zhongjiang New Material Science & Technology
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Packaging Materials for IGBT and SiC Modules company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Packaging Materials for IGBT and SiC Modules Market growing?

Ans: The Packaging Materials for IGBT and SiC Modules Market witnessing a CAGR of 6.6% during the forecast period 2025-2031.

What is the Packaging Materials for IGBT and SiC Modules Market size in 2031?

Ans: The Packaging Materials for IGBT and SiC Modules Market size in 2031 will be US$ 3863 million.

Who are the main players in the Packaging Materials for IGBT and SiC Modules Market report?

Ans: The main players in the Packaging Materials for IGBT and SiC Modules Market are Rogers Corporation, MacDermid Alpha, 3M, Dow, Indium Corporation, Heraeus, Henkel, Ferrotec, Kyocera, NGK Electronics Devices, Dowa, Denka, Tanaka, Resonac, BYD, Toshiba Materials, KCC, Shengda Tech, Nanjing Zhongjiang New Material Science & Technology

What are the Application segmentation covered in the Packaging Materials for IGBT and SiC Modules Market report?

Ans: The Applications covered in the Packaging Materials for IGBT and SiC Modules Market report are Automotive, Traction & Railway, PV, Wind Power & Power Grid, Industrial Motor, Home Appliances, USP, Other

What are the Type segmentation covered in the Packaging Materials for IGBT and SiC Modules Market report?

Ans: The Types covered in the Packaging Materials for IGBT and SiC Modules Market report are Encapsulation (Silicone Gel and Epoxy), Die Bonding Materials, Ceramic Substrate, Thermal Interface Materials, Electrical Interconnection, Others

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Packaging Materials for IGBT and SiC Modules Market Size Growth Rate by Type: 2020 VS 2024 VS 2031

1.2.2 Encapsulation (Silicone Gel and Epoxy)

1.2.3 Die Bonding Materials

1.2.4 Ceramic Substrate

1.2.5 Thermal Interface Materials

1.2.6 Electrical Interconnection

1.2.7 Others

1.3 Market by Application

1.3.1 Global Packaging Materials for IGBT and SiC Modules Market Growth by Application: 2020 VS 2024 VS 2031

1.3.2 Automotive

1.3.3 Traction & Railway

1.3.4 PV, Wind Power & Power Grid

1.3.5 Industrial Motor

1.3.6 Home Appliances

1.3.7 USP

1.3.8 Other

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global Packaging Materials for IGBT and SiC Modules Market Perspective (2020-2031)

2.2 Global Packaging Materials for IGBT and SiC Modules Growth Trends by Region

2.2.1 Global Packaging Materials for IGBT and SiC Modules Market Size by Region: 2020 VS 2024 VS 2031

2.2.2 Packaging Materials for IGBT and SiC Modules Historic Market Size by Region (2020-2025)

2.2.3 Packaging Materials for IGBT and SiC Modules Forecasted Market Size by Region (2026-2031)

2.3 Packaging Materials for IGBT and SiC Modules Market Dynamics

2.3.1 Packaging Materials for IGBT and SiC Modules Industry Trends

2.3.2 Packaging Materials for IGBT and SiC Modules Market Drivers

2.3.3 Packaging Materials for IGBT and SiC Modules Market Challenges

2.3.4 Packaging Materials for IGBT and SiC Modules Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Packaging Materials for IGBT and SiC Modules Players by Revenue

3.1.1 Global Top Packaging Materials for IGBT and SiC Modules Players by Revenue (2020-2025)

3.1.2 Global Packaging Materials for IGBT and SiC Modules Revenue Market Share by Players (2020-2025)

3.2 Global Packaging Materials for IGBT and SiC Modules Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by Packaging Materials for IGBT and SiC Modules Revenue

3.4 Global Packaging Materials for IGBT and SiC Modules Market Concentration Ratio

3.4.1 Global Packaging Materials for IGBT and SiC Modules Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Packaging Materials for IGBT and SiC Modules Revenue in 2024

3.5 Global Key Players of Packaging Materials for IGBT and SiC Modules Head office and Area Served

3.6 Global Key Players of Packaging Materials for IGBT and SiC Modules, Product and Application

3.7 Global Key Players of Packaging Materials for IGBT and SiC Modules, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 Packaging Materials for IGBT and SiC Modules Breakdown Data by Type

4.1 Global Packaging Materials for IGBT and SiC Modules Historic Market Size by Type (2020-2025)

4.2 Global Packaging Materials for IGBT and SiC Modules Forecasted Market Size by Type (2026-2031)

5 Packaging Materials for IGBT and SiC Modules Breakdown Data by Application

5.1 Global Packaging Materials for IGBT and SiC Modules Historic Market Size by Application (2020-2025)

5.2 Global Packaging Materials for IGBT and SiC Modules Forecasted Market Size by Application (2026-2031)

6 North America

6.1 North America Packaging Materials for IGBT and SiC Modules Market Size (2020-2031)

6.2 North America Packaging Materials for IGBT and SiC Modules Market Growth Rate by Country: 2020 VS 2024 VS 2031

6.3 North America Packaging Materials for IGBT and SiC Modules Market Size by Country (2020-2025)

6.4 North America Packaging Materials for IGBT and SiC Modules Market Size by Country (2026-2031)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Packaging Materials for IGBT and SiC Modules Market Size (2020-2031)

7.2 Europe Packaging Materials for IGBT and SiC Modules Market Growth Rate by Country: 2020 VS 2024 VS 2031

7.3 Europe Packaging Materials for IGBT and SiC Modules Market Size by Country (2020-2025)

7.4 Europe Packaging Materials for IGBT and SiC Modules Market Size by Country (2026-2031)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Packaging Materials for IGBT and SiC Modules Market Size (2020-2031)

8.2 Asia-Pacific Packaging Materials for IGBT and SiC Modules Market Growth Rate by Region: 2020 VS 2024 VS 2031

8.3 Asia-Pacific Packaging Materials for IGBT and SiC Modules Market Size by Region (2020-2025)

8.4 Asia-Pacific Packaging Materials for IGBT and SiC Modules Market Size by Region (2026-2031)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Packaging Materials for IGBT and SiC Modules Market Size (2020-2031)

9.2 Latin America Packaging Materials for IGBT and SiC Modules Market Growth Rate by Country: 2020 VS 2024 VS 2031

9.3 Latin America Packaging Materials for IGBT and SiC Modules Market Size by Country (2020-2025)

9.4 Latin America Packaging Materials for IGBT and SiC Modules Market Size by Country (2026-2031)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Packaging Materials for IGBT and SiC Modules Market Size (2020-2031)

10.2 Middle East & Africa Packaging Materials for IGBT and SiC Modules Market Growth Rate by Country: 2020 VS 2024 VS 2031

10.3 Middle East & Africa Packaging Materials for IGBT and SiC Modules Market Size by Country (2020-2025)

10.4 Middle East & Africa Packaging Materials for IGBT and SiC Modules Market Size by Country (2026-2031)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 Rogers Corporation

11.1.1 Rogers Corporation Company Details

11.1.2 Rogers Corporation Business Overview

11.1.3 Rogers Corporation Packaging Materials for IGBT and SiC Modules Introduction

11.1.4 Rogers Corporation Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.1.5 Rogers Corporation Recent Development

11.2 MacDermid Alpha

11.2.1 MacDermid Alpha Company Details

11.2.2 MacDermid Alpha Business Overview

11.2.3 MacDermid Alpha Packaging Materials for IGBT and SiC Modules Introduction

11.2.4 MacDermid Alpha Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.2.5 MacDermid Alpha Recent Development

11.3 3M

11.3.1 3M Company Details

11.3.2 3M Business Overview

11.3.3 3M Packaging Materials for IGBT and SiC Modules Introduction

11.3.4 3M Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.3.5 3M Recent Development

11.4 Dow

11.4.1 Dow Company Details

11.4.2 Dow Business Overview

11.4.3 Dow Packaging Materials for IGBT and SiC Modules Introduction

11.4.4 Dow Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.4.5 Dow Recent Development

11.5 Indium Corporation

11.5.1 Indium Corporation Company Details

11.5.2 Indium Corporation Business Overview

11.5.3 Indium Corporation Packaging Materials for IGBT and SiC Modules Introduction

11.5.4 Indium Corporation Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.5.5 Indium Corporation Recent Development

11.6 Heraeus

11.6.1 Heraeus Company Details

11.6.2 Heraeus Business Overview

11.6.3 Heraeus Packaging Materials for IGBT and SiC Modules Introduction

11.6.4 Heraeus Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.6.5 Heraeus Recent Development

11.7 Henkel

11.7.1 Henkel Company Details

11.7.2 Henkel Business Overview

11.7.3 Henkel Packaging Materials for IGBT and SiC Modules Introduction

11.7.4 Henkel Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.7.5 Henkel Recent Development

11.8 Ferrotec

11.8.1 Ferrotec Company Details

11.8.2 Ferrotec Business Overview

11.8.3 Ferrotec Packaging Materials for IGBT and SiC Modules Introduction

11.8.4 Ferrotec Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.8.5 Ferrotec Recent Development

11.9 Kyocera

11.9.1 Kyocera Company Details

11.9.2 Kyocera Business Overview

11.9.3 Kyocera Packaging Materials for IGBT and SiC Modules Introduction

11.9.4 Kyocera Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.9.5 Kyocera Recent Development

11.10 NGK Electronics Devices

11.10.1 NGK Electronics Devices Company Details

11.10.2 NGK Electronics Devices Business Overview

11.10.3 NGK Electronics Devices Packaging Materials for IGBT and SiC Modules Introduction

11.10.4 NGK Electronics Devices Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.10.5 NGK Electronics Devices Recent Development

11.11 Dowa

11.11.1 Dowa Company Details

11.11.2 Dowa Business Overview

11.11.3 Dowa Packaging Materials for IGBT and SiC Modules Introduction

11.11.4 Dowa Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.11.5 Dowa Recent Development

11.12 Denka

11.12.1 Denka Company Details

11.12.2 Denka Business Overview

11.12.3 Denka Packaging Materials for IGBT and SiC Modules Introduction

11.12.4 Denka Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.12.5 Denka Recent Development

11.13 Tanaka

11.13.1 Tanaka Company Details

11.13.2 Tanaka Business Overview

11.13.3 Tanaka Packaging Materials for IGBT and SiC Modules Introduction

11.13.4 Tanaka Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.13.5 Tanaka Recent Development

11.14 Resonac

11.14.1 Resonac Company Details

11.14.2 Resonac Business Overview

11.14.3 Resonac Packaging Materials for IGBT and SiC Modules Introduction

11.14.4 Resonac Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.14.5 Resonac Recent Development

11.15 BYD

11.15.1 BYD Company Details

11.15.2 BYD Business Overview

11.15.3 BYD Packaging Materials for IGBT and SiC Modules Introduction

11.15.4 BYD Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.15.5 BYD Recent Development

11.16 Toshiba Materials

11.16.1 Toshiba Materials Company Details

11.16.2 Toshiba Materials Business Overview

11.16.3 Toshiba Materials Packaging Materials for IGBT and SiC Modules Introduction

11.16.4 Toshiba Materials Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.16.5 Toshiba Materials Recent Development

11.17 KCC

11.17.1 KCC Company Details

11.17.2 KCC Business Overview

11.17.3 KCC Packaging Materials for IGBT and SiC Modules Introduction

11.17.4 KCC Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.17.5 KCC Recent Development

11.18 Shengda Tech

11.18.1 Shengda Tech Company Details

11.18.2 Shengda Tech Business Overview

11.18.3 Shengda Tech Packaging Materials for IGBT and SiC Modules Introduction

11.18.4 Shengda Tech Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.18.5 Shengda Tech Recent Development

11.19 Nanjing Zhongjiang New Material Science & Technology

11.19.1 Nanjing Zhongjiang New Material Science & Technology Company Details

11.19.2 Nanjing Zhongjiang New Material Science & Technology Business Overview

11.19.3 Nanjing Zhongjiang New Material Science & Technology Packaging Materials for IGBT and SiC Modules Introduction

11.19.4 Nanjing Zhongjiang New Material Science & Technology Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

11.19.5 Nanjing Zhongjiang New Material Science & Technology Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

Rogers Corporation

MacDermid Alpha

DOW

Indium Corporation

Heraeus

Henkel

Ferrotec

Kyocera

NGK Electronics Devices

DOWA

Denka

Tanaka

Resonac

BYD

Toshiba Materials

KCC

Shengda Tech

Nanjing Zhongjiang New Material Science &Technology

List of Tables

Table 1. Global Packaging Materials for IGBT and SiC Modules Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031

Table 2. Key Players of Encapsulation (Silicone Gel and Epoxy)

Table 3. Key Players of Die Bonding Materials

Table 4. Key Players of Ceramic Substrate

Table 5. Key Players of Thermal Interface Materials

Table 6. Key Players of Electrical Interconnection

Table 7. Key Players of Others

Table 8. Global Packaging Materials for IGBT and SiC Modules Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031

Table 9. Global Packaging Materials for IGBT and SiC Modules Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Table 10. Global Packaging Materials for IGBT and SiC Modules Market Size by Region (2020-2025) & (US$ Million)

Table 11. Global Packaging Materials for IGBT and SiC Modules Market Share by Region (2020-2025)

Table 12. Global Packaging Materials for IGBT and SiC Modules Forecasted Market Size by Region (2026-2031) & (US$ Million)

Table 13. Global Packaging Materials for IGBT and SiC Modules Market Share by Region (2026-2031)

Table 14. Packaging Materials for IGBT and SiC Modules Market Trends

Table 15. Packaging Materials for IGBT and SiC Modules Market Drivers

Table 16. Packaging Materials for IGBT and SiC Modules Market Challenges

Table 17. Packaging Materials for IGBT and SiC Modules Market Restraints

Table 18. Global Packaging Materials for IGBT and SiC Modules Revenue by Players (2020-2025) & (US$ Million)

Table 19. Global Packaging Materials for IGBT and SiC Modules Market Share by Players (2020-2025)

Table 20. Global Top Packaging Materials for IGBT and SiC Modules Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Packaging Materials for IGBT and SiC Modules as of 2024)

Table 21. Ranking of Global Top Packaging Materials for IGBT and SiC Modules Companies by Revenue (US$ Million) in 2024

Table 22. Global 5 Largest Players Market Share by Packaging Materials for IGBT and SiC Modules Revenue (CR5 and HHI) & (2020-2025)

Table 23. Global Key Players of Packaging Materials for IGBT and SiC Modules, Headquarters and Area Served

Table 24. Global Key Players of Packaging Materials for IGBT and SiC Modules, Product and Application

Table 25. Global Key Players of Packaging Materials for IGBT and SiC Modules, Date of Enter into This Industry

Table 26. Mergers & Acquisitions, Expansion Plans

Table 27. Global Packaging Materials for IGBT and SiC Modules Market Size by Type (2020-2025) & (US$ Million)

Table 28. Global Packaging Materials for IGBT and SiC Modules Revenue Market Share by Type (2020-2025)

Table 29. Global Packaging Materials for IGBT and SiC Modules Forecasted Market Size by Type (2026-2031) & (US$ Million)

Table 30. Global Packaging Materials for IGBT and SiC Modules Revenue Market Share by Type (2026-2031)

Table 31. Global Packaging Materials for IGBT and SiC Modules Market Size by Application (2020-2025) & (US$ Million)

Table 32. Global Packaging Materials for IGBT and SiC Modules Revenue Market Share by Application (2020-2025)

Table 33. Global Packaging Materials for IGBT and SiC Modules Forecasted Market Size by Application (2026-2031) & (US$ Million)

Table 34. Global Packaging Materials for IGBT and SiC Modules Revenue Market Share by Application (2026-2031)

Table 35. North America Packaging Materials for IGBT and SiC Modules Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 36. North America Packaging Materials for IGBT and SiC Modules Market Size by Country (2020-2025) & (US$ Million)

Table 37. North America Packaging Materials for IGBT and SiC Modules Market Size by Country (2026-2031) & (US$ Million)

Table 38. Europe Packaging Materials for IGBT and SiC Modules Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 39. Europe Packaging Materials for IGBT and SiC Modules Market Size by Country (2020-2025) & (US$ Million)

Table 40. Europe Packaging Materials for IGBT and SiC Modules Market Size by Country (2026-2031) & (US$ Million)

Table 41. Asia-Pacific Packaging Materials for IGBT and SiC Modules Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031

Table 42. Asia-Pacific Packaging Materials for IGBT and SiC Modules Market Size by Region (2020-2025) & (US$ Million)

Table 43. Asia-Pacific Packaging Materials for IGBT and SiC Modules Market Size by Region (2026-2031) & (US$ Million)

Table 44. Latin America Packaging Materials for IGBT and SiC Modules Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 45. Latin America Packaging Materials for IGBT and SiC Modules Market Size by Country (2020-2025) & (US$ Million)

Table 46. Latin America Packaging Materials for IGBT and SiC Modules Market Size by Country (2026-2031) & (US$ Million)

Table 47. Middle East & Africa Packaging Materials for IGBT and SiC Modules Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 48. Middle East & Africa Packaging Materials for IGBT and SiC Modules Market Size by Country (2020-2025) & (US$ Million)

Table 49. Middle East & Africa Packaging Materials for IGBT and SiC Modules Market Size by Country (2026-2031) & (US$ Million)

Table 50. Rogers Corporation Company Details

Table 51. Rogers Corporation Business Overview

Table 52. Rogers Corporation Packaging Materials for IGBT and SiC Modules Product

Table 53. Rogers Corporation Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 54. Rogers Corporation Recent Development

Table 55. MacDermid Alpha Company Details

Table 56. MacDermid Alpha Business Overview

Table 57. MacDermid Alpha Packaging Materials for IGBT and SiC Modules Product

Table 58. MacDermid Alpha Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 59. MacDermid Alpha Recent Development

Table 60. 3M Company Details

Table 61. 3M Business Overview

Table 62. 3M Packaging Materials for IGBT and SiC Modules Product

Table 63. 3M Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 64. 3M Recent Development

Table 65. Dow Company Details

Table 66. Dow Business Overview

Table 67. Dow Packaging Materials for IGBT and SiC Modules Product

Table 68. Dow Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 69. Dow Recent Development

Table 70. Indium Corporation Company Details

Table 71. Indium Corporation Business Overview

Table 72. Indium Corporation Packaging Materials for IGBT and SiC Modules Product

Table 73. Indium Corporation Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 74. Indium Corporation Recent Development

Table 75. Heraeus Company Details

Table 76. Heraeus Business Overview

Table 77. Heraeus Packaging Materials for IGBT and SiC Modules Product

Table 78. Heraeus Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 79. Heraeus Recent Development

Table 80. Henkel Company Details

Table 81. Henkel Business Overview

Table 82. Henkel Packaging Materials for IGBT and SiC Modules Product

Table 83. Henkel Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 84. Henkel Recent Development

Table 85. Ferrotec Company Details

Table 86. Ferrotec Business Overview

Table 87. Ferrotec Packaging Materials for IGBT and SiC Modules Product

Table 88. Ferrotec Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 89. Ferrotec Recent Development

Table 90. Kyocera Company Details

Table 91. Kyocera Business Overview

Table 92. Kyocera Packaging Materials for IGBT and SiC Modules Product

Table 93. Kyocera Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 94. Kyocera Recent Development

Table 95. NGK Electronics Devices Company Details

Table 96. NGK Electronics Devices Business Overview

Table 97. NGK Electronics Devices Packaging Materials for IGBT and SiC Modules Product

Table 98. NGK Electronics Devices Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 99. NGK Electronics Devices Recent Development

Table 100. Dowa Company Details

Table 101. Dowa Business Overview

Table 102. Dowa Packaging Materials for IGBT and SiC Modules Product

Table 103. Dowa Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 104. Dowa Recent Development

Table 105. Denka Company Details

Table 106. Denka Business Overview

Table 107. Denka Packaging Materials for IGBT and SiC Modules Product

Table 108. Denka Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 109. Denka Recent Development

Table 110. Tanaka Company Details

Table 111. Tanaka Business Overview

Table 112. Tanaka Packaging Materials for IGBT and SiC Modules Product

Table 113. Tanaka Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 114. Tanaka Recent Development

Table 115. Resonac Company Details

Table 116. Resonac Business Overview

Table 117. Resonac Packaging Materials for IGBT and SiC Modules Product

Table 118. Resonac Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 119. Resonac Recent Development

Table 120. BYD Company Details

Table 121. BYD Business Overview

Table 122. BYD Packaging Materials for IGBT and SiC Modules Product

Table 123. BYD Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 124. BYD Recent Development

Table 125. Toshiba Materials Company Details

Table 126. Toshiba Materials Business Overview

Table 127. Toshiba Materials Packaging Materials for IGBT and SiC Modules Product

Table 128. Toshiba Materials Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 129. Toshiba Materials Recent Development

Table 130. KCC Company Details

Table 131. KCC Business Overview

Table 132. KCC Packaging Materials for IGBT and SiC Modules Product

Table 133. KCC Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 134. KCC Recent Development

Table 135. Shengda Tech Company Details

Table 136. Shengda Tech Business Overview

Table 137. Shengda Tech Packaging Materials for IGBT and SiC Modules Product

Table 138. Shengda Tech Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 139. Shengda Tech Recent Development

Table 140. Nanjing Zhongjiang New Material Science & Technology Company Details

Table 141. Nanjing Zhongjiang New Material Science & Technology Business Overview

Table 142. Nanjing Zhongjiang New Material Science & Technology Packaging Materials for IGBT and SiC Modules Product

Table 143. Nanjing Zhongjiang New Material Science & Technology Revenue in Packaging Materials for IGBT and SiC Modules Business (2020-2025) & (US$ Million)

Table 144. Nanjing Zhongjiang New Material Science & Technology Recent Development

Table 145. Research Programs/Design for This Report

Table 146. Key Data Information from Secondary Sources

Table 147. Key Data Information from Primary Sources

Table 148. Authors List of This Report

List of Figures

Figure 1. Packaging Materials for IGBT and SiC Modules Picture

Figure 2. Global Packaging Materials for IGBT and SiC Modules Market Size Comparison by Type (2020-2031) & (US$ Million)

Figure 3. Global Packaging Materials for IGBT and SiC Modules Market Share by Type: 2024 VS 2031

Figure 4. Encapsulation (Silicone Gel and Epoxy) Features

Figure 5. Die Bonding Materials Features

Figure 6. Ceramic Substrate Features

Figure 7. Thermal Interface Materials Features

Figure 8. Electrical Interconnection Features

Figure 9. Others Features

Figure 10. Global Packaging Materials for IGBT and SiC Modules Market Size by Application (2020-2031) & (US$ Million)

Figure 11. Global Packaging Materials for IGBT and SiC Modules Market Share by Application: 2024 VS 2031

Figure 12. Automotive Case Studies

Figure 13. Traction & Railway Case Studies

Figure 14. PV, Wind Power & Power Grid Case Studies

Figure 15. Industrial Motor Case Studies

Figure 16. Home Appliances Case Studies

Figure 17. USP Case Studies

Figure 18. Other Case Studies

Figure 19. Packaging Materials for IGBT and SiC Modules Report Years Considered

Figure 20. Global Packaging Materials for IGBT and SiC Modules Market Size (US$ Million), Year-over-Year: 2020-2031

Figure 21. Global Packaging Materials for IGBT and SiC Modules Market Size, (US$ Million), 2020 VS 2024 VS 2031

Figure 22. Global Packaging Materials for IGBT and SiC Modules Market Share by Region: 2024 VS 2031

Figure 23. Global Packaging Materials for IGBT and SiC Modules Market Share by Players in 2024

Figure 24. Global Top Packaging Materials for IGBT and SiC Modules Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Packaging Materials for IGBT and SiC Modules as of 2024)

Figure 25. The Top 10 and 5 Players Market Share by Packaging Materials for IGBT and SiC Modules Revenue in 2024

Figure 26. North America Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 27. North America Packaging Materials for IGBT and SiC Modules Market Share by Country (2020-2031)

Figure 28. United States Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 29. Canada Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 30. Europe Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 31. Europe Packaging Materials for IGBT and SiC Modules Market Share by Country (2020-2031)

Figure 32. Germany Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 33. France Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 34. U.K. Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 35. Italy Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 36. Russia Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 37. Nordic Countries Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 38. Asia-Pacific Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 39. Asia-Pacific Packaging Materials for IGBT and SiC Modules Market Share by Region (2020-2031)

Figure 40. China Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 41. Japan Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 42. South Korea Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 43. Southeast Asia Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 44. India Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 45. Australia Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 46. Latin America Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 47. Latin America Packaging Materials for IGBT and SiC Modules Market Share by Country (2020-2031)

Figure 48. Mexico Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 49. Brazil Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 50. Middle East & Africa Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 51. Middle East & Africa Packaging Materials for IGBT and SiC Modules Market Share by Country (2020-2031)

Figure 52. Turkey Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 53. Saudi Arabia Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 54. UAE Packaging Materials for IGBT and SiC Modules Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 55. Rogers Corporation Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 56. MacDermid Alpha Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 57. 3M Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 58. Dow Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 59. Indium Corporation Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 60. Heraeus Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 61. Henkel Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 62. Ferrotec Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 63. Kyocera Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 64. NGK Electronics Devices Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 65. Dowa Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 66. Denka Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 67. Tanaka Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 68. Resonac Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 69. BYD Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 70. Toshiba Materials Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 71. KCC Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 72. Shengda Tech Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 73. Nanjing Zhongjiang New Material Science & Technology Revenue Growth Rate in Packaging Materials for IGBT and SiC Modules Business (2020-2025)

Figure 74. Bottom-up and Top-down Approaches for This Report

Figure 75. Data Triangulation

Figure 76. Key Executives Interviewed

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