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Global Liquid Molding Compound in Wafer Level Pakaging Market Research Report 2025
Published Date: March 2025
|
Report Code: QYRE-Auto-10S10327
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Global Liquid Molding Compound in Wafer Level Pakaging Market Research Report 2022
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Global Liquid Molding Compound in Wafer Level Pakaging Market Research Report 2025

Code: QYRE-Auto-10S10327
Report
March 2025
Pages:84
QYResearch
Buy Now with 15% Discount
DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
Nagase& Co. Ltd.
Eternal Materials
Panasonic
Henkel

Liquid Molding Compound in Wafer Level Pakaging Market

The global market for Liquid Molding Compound in Wafer Level Pakaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Liquid Molding Compound in Wafer Level Pakaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Liquid Molding Compound in Wafer Level Pakaging.
The Liquid Molding Compound in Wafer Level Pakaging market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Liquid Molding Compound in Wafer Level Pakaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Liquid Molding Compound in Wafer Level Pakaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Liquid Molding Compound in Wafer Level Pakaging Market Report

Report Metric Details
Report Name Liquid Molding Compound in Wafer Level Pakaging Market
by Type
by Application
  • IC
  • MEMS
  • LED
  • Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company NAGASE, Eternal Materials, Panasonic, Henkel
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Liquid Molding Compound in Wafer Level Pakaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Liquid Molding Compound in Wafer Level Pakaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Liquid Molding Compound in Wafer Level Pakaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

What is the Liquid Molding Compound in Wafer Level Pakaging Market share by region?

Ans: Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year.

Who are the main players in the Liquid Molding Compound in Wafer Level Pakaging Market report?

Ans: The main players in the Liquid Molding Compound in Wafer Level Pakaging Market are NAGASE, Eternal Materials, Panasonic, Henkel

What are the Application segmentation covered in the Liquid Molding Compound in Wafer Level Pakaging Market report?

Ans: The Applications covered in the Liquid Molding Compound in Wafer Level Pakaging Market report are IC, MEMS, LED, Others

What are the Type segmentation covered in the Liquid Molding Compound in Wafer Level Pakaging Market report?

Ans: The Types covered in the Liquid Molding Compound in Wafer Level Pakaging Market report are FI WLP, FO WLP

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1 Liquid Molding Compound in Wafer Level Pakaging Market Overview
1.1 Product Definition
1.2 Liquid Molding Compound in Wafer Level Pakaging by Type
1.2.1 Global Liquid Molding Compound in Wafer Level Pakaging Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 FI WLP
1.2.3 FO WLP
1.3 Liquid Molding Compound in Wafer Level Pakaging by Application
1.3.1 Global Liquid Molding Compound in Wafer Level Pakaging Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 IC
1.3.3 MEMS
1.3.4 LED
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Liquid Molding Compound in Wafer Level Pakaging Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Liquid Molding Compound in Wafer Level Pakaging Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Liquid Molding Compound in Wafer Level Pakaging Production Estimates and Forecasts (2020-2031)
1.4.4 Global Liquid Molding Compound in Wafer Level Pakaging Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share by Manufacturers (2020-2025)
2.2 Global Liquid Molding Compound in Wafer Level Pakaging Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Liquid Molding Compound in Wafer Level Pakaging, Industry Ranking, 2023 VS 2024
2.4 Global Liquid Molding Compound in Wafer Level Pakaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Liquid Molding Compound in Wafer Level Pakaging Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Liquid Molding Compound in Wafer Level Pakaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Liquid Molding Compound in Wafer Level Pakaging, Product Offered and Application
2.8 Global Key Manufacturers of Liquid Molding Compound in Wafer Level Pakaging, Date of Enter into This Industry
2.9 Liquid Molding Compound in Wafer Level Pakaging Market Competitive Situation and Trends
2.9.1 Liquid Molding Compound in Wafer Level Pakaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Liquid Molding Compound in Wafer Level Pakaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Liquid Molding Compound in Wafer Level Pakaging Production by Region
3.1 Global Liquid Molding Compound in Wafer Level Pakaging Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Region (2020-2031)
3.2.1 Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Liquid Molding Compound in Wafer Level Pakaging by Region (2026-2031)
3.3 Global Liquid Molding Compound in Wafer Level Pakaging Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Liquid Molding Compound in Wafer Level Pakaging Production Volume by Region (2020-2031)
3.4.1 Global Liquid Molding Compound in Wafer Level Pakaging Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Liquid Molding Compound in Wafer Level Pakaging by Region (2026-2031)
3.5 Global Liquid Molding Compound in Wafer Level Pakaging Market Price Analysis by Region (2020-2025)
3.6 Global Liquid Molding Compound in Wafer Level Pakaging Production and Value, Year-over-Year Growth
3.6.1 North America Liquid Molding Compound in Wafer Level Pakaging Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Liquid Molding Compound in Wafer Level Pakaging Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Liquid Molding Compound in Wafer Level Pakaging Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Liquid Molding Compound in Wafer Level Pakaging Production Value Estimates and Forecasts (2020-2031)
4 Liquid Molding Compound in Wafer Level Pakaging Consumption by Region
4.1 Global Liquid Molding Compound in Wafer Level Pakaging Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Liquid Molding Compound in Wafer Level Pakaging Consumption by Region (2020-2031)
4.2.1 Global Liquid Molding Compound in Wafer Level Pakaging Consumption by Region (2020-2025)
4.2.2 Global Liquid Molding Compound in Wafer Level Pakaging Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Liquid Molding Compound in Wafer Level Pakaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Liquid Molding Compound in Wafer Level Pakaging Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Liquid Molding Compound in Wafer Level Pakaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Liquid Molding Compound in Wafer Level Pakaging Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Liquid Molding Compound in Wafer Level Pakaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Liquid Molding Compound in Wafer Level Pakaging Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Liquid Molding Compound in Wafer Level Pakaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Liquid Molding Compound in Wafer Level Pakaging Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Liquid Molding Compound in Wafer Level Pakaging Production by Type (2020-2031)
5.1.1 Global Liquid Molding Compound in Wafer Level Pakaging Production by Type (2020-2025)
5.1.2 Global Liquid Molding Compound in Wafer Level Pakaging Production by Type (2026-2031)
5.1.3 Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share by Type (2020-2031)
5.2 Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Type (2020-2031)
5.2.1 Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Type (2020-2025)
5.2.2 Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Type (2026-2031)
5.2.3 Global Liquid Molding Compound in Wafer Level Pakaging Production Value Market Share by Type (2020-2031)
5.3 Global Liquid Molding Compound in Wafer Level Pakaging Price by Type (2020-2031)
6 Segment by Application
6.1 Global Liquid Molding Compound in Wafer Level Pakaging Production by Application (2020-2031)
6.1.1 Global Liquid Molding Compound in Wafer Level Pakaging Production by Application (2020-2025)
6.1.2 Global Liquid Molding Compound in Wafer Level Pakaging Production by Application (2026-2031)
6.1.3 Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share by Application (2020-2031)
6.2 Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Application (2020-2031)
6.2.1 Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Application (2020-2025)
6.2.2 Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Application (2026-2031)
6.2.3 Global Liquid Molding Compound in Wafer Level Pakaging Production Value Market Share by Application (2020-2031)
6.3 Global Liquid Molding Compound in Wafer Level Pakaging Price by Application (2020-2031)
7 Key Companies Profiled
7.1 NAGASE
7.1.1 NAGASE Liquid Molding Compound in Wafer Level Pakaging Company Information
7.1.2 NAGASE Liquid Molding Compound in Wafer Level Pakaging Product Portfolio
7.1.3 NAGASE Liquid Molding Compound in Wafer Level Pakaging Production, Value, Price and Gross Margin (2020-2025)
7.1.4 NAGASE Main Business and Markets Served
7.1.5 NAGASE Recent Developments/Updates
7.2 Eternal Materials
7.2.1 Eternal Materials Liquid Molding Compound in Wafer Level Pakaging Company Information
7.2.2 Eternal Materials Liquid Molding Compound in Wafer Level Pakaging Product Portfolio
7.2.3 Eternal Materials Liquid Molding Compound in Wafer Level Pakaging Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Eternal Materials Main Business and Markets Served
7.2.5 Eternal Materials Recent Developments/Updates
7.3 Panasonic
7.3.1 Panasonic Liquid Molding Compound in Wafer Level Pakaging Company Information
7.3.2 Panasonic Liquid Molding Compound in Wafer Level Pakaging Product Portfolio
7.3.3 Panasonic Liquid Molding Compound in Wafer Level Pakaging Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Panasonic Main Business and Markets Served
7.3.5 Panasonic Recent Developments/Updates
7.4 Henkel
7.4.1 Henkel Liquid Molding Compound in Wafer Level Pakaging Company Information
7.4.2 Henkel Liquid Molding Compound in Wafer Level Pakaging Product Portfolio
7.4.3 Henkel Liquid Molding Compound in Wafer Level Pakaging Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Henkel Main Business and Markets Served
7.4.5 Henkel Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Liquid Molding Compound in Wafer Level Pakaging Industry Chain Analysis
8.2 Liquid Molding Compound in Wafer Level Pakaging Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Liquid Molding Compound in Wafer Level Pakaging Production Mode & Process Analysis
8.4 Liquid Molding Compound in Wafer Level Pakaging Sales and Marketing
8.4.1 Liquid Molding Compound in Wafer Level Pakaging Sales Channels
8.4.2 Liquid Molding Compound in Wafer Level Pakaging Distributors
8.5 Liquid Molding Compound in Wafer Level Pakaging Customer Analysis
9 Liquid Molding Compound in Wafer Level Pakaging Market Dynamics
9.1 Liquid Molding Compound in Wafer Level Pakaging Industry Trends
9.2 Liquid Molding Compound in Wafer Level Pakaging Market Drivers
9.3 Liquid Molding Compound in Wafer Level Pakaging Market Challenges
9.4 Liquid Molding Compound in Wafer Level Pakaging Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
Nagase& Co. Ltd.
Eternal Materials
Panasonic
Henkel
List of Tables
 Table 1. Global Liquid Molding Compound in Wafer Level Pakaging Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Liquid Molding Compound in Wafer Level Pakaging Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Liquid Molding Compound in Wafer Level Pakaging Production Capacity (Tons) by Manufacturers in 2024
 Table 4. Global Liquid Molding Compound in Wafer Level Pakaging Production by Manufacturers (2020-2025) & (Tons)
 Table 5. Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Liquid Molding Compound in Wafer Level Pakaging Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Liquid Molding Compound in Wafer Level Pakaging, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Liquid Molding Compound in Wafer Level Pakaging as of 2024)
 Table 10. Global Market Liquid Molding Compound in Wafer Level Pakaging Average Price by Manufacturers (US$/Ton) & (2020-2025)
 Table 11. Global Key Manufacturers of Liquid Molding Compound in Wafer Level Pakaging, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Liquid Molding Compound in Wafer Level Pakaging, Product Offered and Application
 Table 13. Global Key Manufacturers of Liquid Molding Compound in Wafer Level Pakaging, Date of Enter into This Industry
 Table 14. Global Liquid Molding Compound in Wafer Level Pakaging Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Liquid Molding Compound in Wafer Level Pakaging Production Value Market Share by Region (2020-2025)
 Table 19. Global Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Liquid Molding Compound in Wafer Level Pakaging Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Liquid Molding Compound in Wafer Level Pakaging Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
 Table 22. Global Liquid Molding Compound in Wafer Level Pakaging Production (Tons) by Region (2020-2025)
 Table 23. Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share by Region (2020-2025)
 Table 24. Global Liquid Molding Compound in Wafer Level Pakaging Production (Tons) Forecast by Region (2026-2031)
 Table 25. Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Liquid Molding Compound in Wafer Level Pakaging Market Average Price (US$/Ton) by Region (2020-2025)
 Table 27. Global Liquid Molding Compound in Wafer Level Pakaging Market Average Price (US$/Ton) by Region (2026-2031)
 Table 28. Global Liquid Molding Compound in Wafer Level Pakaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
 Table 29. Global Liquid Molding Compound in Wafer Level Pakaging Consumption by Region (2020-2025) & (Tons)
 Table 30. Global Liquid Molding Compound in Wafer Level Pakaging Consumption Market Share by Region (2020-2025)
 Table 31. Global Liquid Molding Compound in Wafer Level Pakaging Forecasted Consumption by Region (2026-2031) & (Tons)
 Table 32. Global Liquid Molding Compound in Wafer Level Pakaging Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Liquid Molding Compound in Wafer Level Pakaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
 Table 34. North America Liquid Molding Compound in Wafer Level Pakaging Consumption by Country (2020-2025) & (Tons)
 Table 35. North America Liquid Molding Compound in Wafer Level Pakaging Consumption by Country (2026-2031) & (Tons)
 Table 36. Europe Liquid Molding Compound in Wafer Level Pakaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
 Table 37. Europe Liquid Molding Compound in Wafer Level Pakaging Consumption by Country (2020-2025) & (Tons)
 Table 38. Europe Liquid Molding Compound in Wafer Level Pakaging Consumption by Country (2026-2031) & (Tons)
 Table 39. Asia Pacific Liquid Molding Compound in Wafer Level Pakaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
 Table 40. Asia Pacific Liquid Molding Compound in Wafer Level Pakaging Consumption by Region (2020-2025) & (Tons)
 Table 41. Asia Pacific Liquid Molding Compound in Wafer Level Pakaging Consumption by Region (2026-2031) & (Tons)
 Table 42. Latin America, Middle East & Africa Liquid Molding Compound in Wafer Level Pakaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
 Table 43. Latin America, Middle East & Africa Liquid Molding Compound in Wafer Level Pakaging Consumption by Country (2020-2025) & (Tons)
 Table 44. Latin America, Middle East & Africa Liquid Molding Compound in Wafer Level Pakaging Consumption by Country (2026-2031) & (Tons)
 Table 45. Global Liquid Molding Compound in Wafer Level Pakaging Production (Tons) by Type (2020-2025)
 Table 46. Global Liquid Molding Compound in Wafer Level Pakaging Production (Tons) by Type (2026-2031)
 Table 47. Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share by Type (2020-2025)
 Table 48. Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share by Type (2026-2031)
 Table 49. Global Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Liquid Molding Compound in Wafer Level Pakaging Production Value Market Share by Type (2020-2025)
 Table 52. Global Liquid Molding Compound in Wafer Level Pakaging Production Value Market Share by Type (2026-2031)
 Table 53. Global Liquid Molding Compound in Wafer Level Pakaging Price (US$/Ton) by Type (2020-2025)
 Table 54. Global Liquid Molding Compound in Wafer Level Pakaging Price (US$/Ton) by Type (2026-2031)
 Table 55. Global Liquid Molding Compound in Wafer Level Pakaging Production (Tons) by Application (2020-2025)
 Table 56. Global Liquid Molding Compound in Wafer Level Pakaging Production (Tons) by Application (2026-2031)
 Table 57. Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share by Application (2020-2025)
 Table 58. Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share by Application (2026-2031)
 Table 59. Global Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Liquid Molding Compound in Wafer Level Pakaging Production Value Market Share by Application (2020-2025)
 Table 62. Global Liquid Molding Compound in Wafer Level Pakaging Production Value Market Share by Application (2026-2031)
 Table 63. Global Liquid Molding Compound in Wafer Level Pakaging Price (US$/Ton) by Application (2020-2025)
 Table 64. Global Liquid Molding Compound in Wafer Level Pakaging Price (US$/Ton) by Application (2026-2031)
 Table 65. NAGASE Liquid Molding Compound in Wafer Level Pakaging Company Information
 Table 66. NAGASE Liquid Molding Compound in Wafer Level Pakaging Specification and Application
 Table 67. NAGASE Liquid Molding Compound in Wafer Level Pakaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 68. NAGASE Main Business and Markets Served
 Table 69. NAGASE Recent Developments/Updates
 Table 70. Eternal Materials Liquid Molding Compound in Wafer Level Pakaging Company Information
 Table 71. Eternal Materials Liquid Molding Compound in Wafer Level Pakaging Specification and Application
 Table 72. Eternal Materials Liquid Molding Compound in Wafer Level Pakaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 73. Eternal Materials Main Business and Markets Served
 Table 74. Eternal Materials Recent Developments/Updates
 Table 75. Panasonic Liquid Molding Compound in Wafer Level Pakaging Company Information
 Table 76. Panasonic Liquid Molding Compound in Wafer Level Pakaging Specification and Application
 Table 77. Panasonic Liquid Molding Compound in Wafer Level Pakaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 78. Panasonic Main Business and Markets Served
 Table 79. Panasonic Recent Developments/Updates
 Table 80. Henkel Liquid Molding Compound in Wafer Level Pakaging Company Information
 Table 81. Henkel Liquid Molding Compound in Wafer Level Pakaging Specification and Application
 Table 82. Henkel Liquid Molding Compound in Wafer Level Pakaging Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 83. Henkel Main Business and Markets Served
 Table 84. Henkel Recent Developments/Updates
 Table 85. Key Raw Materials Lists
 Table 86. Raw Materials Key Suppliers Lists
 Table 87. Liquid Molding Compound in Wafer Level Pakaging Distributors List
 Table 88. Liquid Molding Compound in Wafer Level Pakaging Customers List
 Table 89. Liquid Molding Compound in Wafer Level Pakaging Market Trends
 Table 90. Liquid Molding Compound in Wafer Level Pakaging Market Drivers
 Table 91. Liquid Molding Compound in Wafer Level Pakaging Market Challenges
 Table 92. Liquid Molding Compound in Wafer Level Pakaging Market Restraints
 Table 93. Research Programs/Design for This Report
 Table 94. Key Data Information from Secondary Sources
 Table 95. Key Data Information from Primary Sources
 Table 96. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Liquid Molding Compound in Wafer Level Pakaging
 Figure 2. Global Liquid Molding Compound in Wafer Level Pakaging Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Liquid Molding Compound in Wafer Level Pakaging Market Share by Type: 2024 VS 2031
 Figure 4. FI WLP Product Picture
 Figure 5. FO WLP Product Picture
 Figure 6. Global Liquid Molding Compound in Wafer Level Pakaging Market Value by Application, (US$ Million) & (2020-2031)
 Figure 7. Global Liquid Molding Compound in Wafer Level Pakaging Market Share by Application: 2024 VS 2031
 Figure 8. IC
 Figure 9. MEMS
 Figure 10. LED
 Figure 11. Others
 Figure 12. Global Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 13. Global Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) & (2020-2031)
 Figure 14. Global Liquid Molding Compound in Wafer Level Pakaging Production Capacity (Tons) & (2020-2031)
 Figure 15. Global Liquid Molding Compound in Wafer Level Pakaging Production (Tons) & (2020-2031)
 Figure 16. Global Liquid Molding Compound in Wafer Level Pakaging Average Price (US$/Ton) & (2020-2031)
 Figure 17. Liquid Molding Compound in Wafer Level Pakaging Report Years Considered
 Figure 18. Liquid Molding Compound in Wafer Level Pakaging Production Share by Manufacturers in 2024
 Figure 19. Global Liquid Molding Compound in Wafer Level Pakaging Production Value Share by Manufacturers (2024)
 Figure 20. Liquid Molding Compound in Wafer Level Pakaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 21. The Global 5 and 10 Largest Players: Market Share by Liquid Molding Compound in Wafer Level Pakaging Revenue in 2024
 Figure 22. Global Liquid Molding Compound in Wafer Level Pakaging Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 23. Global Liquid Molding Compound in Wafer Level Pakaging Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 24. Global Liquid Molding Compound in Wafer Level Pakaging Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
 Figure 25. Global Liquid Molding Compound in Wafer Level Pakaging Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 26. North America Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 27. Europe Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. China Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Japan Liquid Molding Compound in Wafer Level Pakaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Global Liquid Molding Compound in Wafer Level Pakaging Consumption by Region: 2020 VS 2024 VS 2031 (Tons)
 Figure 31. Global Liquid Molding Compound in Wafer Level Pakaging Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 32. North America Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 33. North America Liquid Molding Compound in Wafer Level Pakaging Consumption Market Share by Country (2020-2031)
 Figure 34. U.S. Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 35. Canada Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 36. Europe Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 37. Europe Liquid Molding Compound in Wafer Level Pakaging Consumption Market Share by Country (2020-2031)
 Figure 38. Germany Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 39. France Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 40. U.K. Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 41. Italy Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 42. Russia Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 43. Asia Pacific Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 44. Asia Pacific Liquid Molding Compound in Wafer Level Pakaging Consumption Market Share by Region (2020-2031)
 Figure 45. China Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 46. Japan Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 47. South Korea Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 48. China Taiwan Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 49. Southeast Asia Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 50. India Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 51. Latin America, Middle East & Africa Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 52. Latin America, Middle East & Africa Liquid Molding Compound in Wafer Level Pakaging Consumption Market Share by Country (2020-2031)
 Figure 53. Mexico Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 54. Brazil Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 55. Turkey Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 56. GCC Countries Liquid Molding Compound in Wafer Level Pakaging Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 57. Global Production Market Share of Liquid Molding Compound in Wafer Level Pakaging by Type (2020-2031)
 Figure 58. Global Production Value Market Share of Liquid Molding Compound in Wafer Level Pakaging by Type (2020-2031)
 Figure 59. Global Liquid Molding Compound in Wafer Level Pakaging Price (US$/Ton) by Type (2020-2031)
 Figure 60. Global Production Market Share of Liquid Molding Compound in Wafer Level Pakaging by Application (2020-2031)
 Figure 61. Global Production Value Market Share of Liquid Molding Compound in Wafer Level Pakaging by Application (2020-2031)
 Figure 62. Global Liquid Molding Compound in Wafer Level Pakaging Price (US$/Ton) by Application (2020-2031)
 Figure 63. Liquid Molding Compound in Wafer Level Pakaging Value Chain
 Figure 64. Channels of Distribution (Direct Vs Distribution)
 Figure 65. Bottom-up and Top-down Approaches for This Report
 Figure 66. Data Triangulation
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