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Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Research Report 2025
Published Date: April 2025
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Report Code: QYRE-Auto-12R14617
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Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Research Report 2025

Code: QYRE-Auto-12R14617
Report
April 2025
Pages:114
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Size

The global market for Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing was valued at US$ 320 million in the year 2024 and is projected to reach a revised size of US$ 447 million by 2031, growing at a CAGR of 5.0% during the forecast period.

Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market

Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market

North American market for Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing include JX Nippon Mining & Metals Corporation, Materion, TANAKA, Hitachi Metals, Plansee SE, Luoyang Sifon Electronic Materials, Sumitomo Chemical, Konfoong Materials International, Linde, TOSOH, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing.
The Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Report

Report Metric Details
Report Name Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market
Accounted market size in year US$ 320 million
Forecasted market size in 2031 US$ 447 million
CAGR 5.0%
Base Year year
Forecasted years 2025 - 2031
by Type
  • 5N
  • 5N5
  • 6N
  • Others
by Application
  • IDM
  • OSAT
Production by Region
  • North America
  • Europe
  • China
  • Japan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company JX Nippon Mining & Metals Corporation, Materion, TANAKA, Hitachi Metals, Plansee SE, Luoyang Sifon Electronic Materials, Sumitomo Chemical, Konfoong Materials International, Linde, TOSOH, Honeywell, ULVAC, Advantec, Fujian Acetron New Materials, Changzhou Sujing Electronic Material, GRIKIN Advanced Material, Umicore, Angstrom Sciences, HC Starck Solutions
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market growing?

Ans: The Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market witnessing a CAGR of 5.0% during the forecast period 2025-2031.

What is the Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market size in 2031?

Ans: The Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market size in 2031 will be US$ 447 million.

Who are the main players in the Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market report?

Ans: The main players in the Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market are JX Nippon Mining & Metals Corporation, Materion, TANAKA, Hitachi Metals, Plansee SE, Luoyang Sifon Electronic Materials, Sumitomo Chemical, Konfoong Materials International, Linde, TOSOH, Honeywell, ULVAC, Advantec, Fujian Acetron New Materials, Changzhou Sujing Electronic Material, GRIKIN Advanced Material, Umicore, Angstrom Sciences, HC Starck Solutions

What are the Application segmentation covered in the Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market report?

Ans: The Applications covered in the Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market report are IDM, OSAT

What are the Type segmentation covered in the Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market report?

Ans: The Types covered in the Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market report are 5N, 5N5, 6N, Others

1 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Overview
1.1 Product Definition
1.2 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing by Type
1.2.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 5N
1.2.3 5N5
1.2.4 6N
1.2.5 Others
1.3 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing by Application
1.3.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 IDM
1.3.3 OSAT
1.4 Global Market Growth Prospects
1.4.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Estimates and Forecasts (2020-2031)
1.4.4 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share by Manufacturers (2020-2025)
2.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing, Industry Ranking, 2023 VS 2024
2.4 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing, Product Offered and Application
2.8 Global Key Manufacturers of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing, Date of Enter into This Industry
2.9 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Competitive Situation and Trends
2.9.1 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Concentration Rate
2.9.2 Global 5 and 10 Largest Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production by Region
3.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Region (2020-2031)
3.2.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing by Region (2026-2031)
3.3 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Volume by Region (2020-2031)
3.4.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing by Region (2026-2031)
3.5 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Price Analysis by Region (2020-2025)
3.6 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production and Value, Year-over-Year Growth
3.6.1 North America Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Estimates and Forecasts (2020-2031)
4 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Region
4.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Region (2020-2031)
4.2.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Region (2020-2025)
4.2.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production by Type (2020-2031)
5.1.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production by Type (2020-2025)
5.1.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production by Type (2026-2031)
5.1.3 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share by Type (2020-2031)
5.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Type (2020-2031)
5.2.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Type (2020-2025)
5.2.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Type (2026-2031)
5.2.3 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Market Share by Type (2020-2031)
5.3 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Price by Type (2020-2031)
6 Segment by Application
6.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production by Application (2020-2031)
6.1.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production by Application (2020-2025)
6.1.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production by Application (2026-2031)
6.1.3 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share by Application (2020-2031)
6.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Application (2020-2031)
6.2.1 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Application (2020-2025)
6.2.2 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Application (2026-2031)
6.2.3 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Market Share by Application (2020-2031)
6.3 Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Price by Application (2020-2031)
7 Key Companies Profiled
7.1 JX Nippon Mining & Metals Corporation
7.1.1 JX Nippon Mining & Metals Corporation Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.1.2 JX Nippon Mining & Metals Corporation Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.1.3 JX Nippon Mining & Metals Corporation Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.1.4 JX Nippon Mining & Metals Corporation Main Business and Markets Served
7.1.5 JX Nippon Mining & Metals Corporation Recent Developments/Updates
7.2 Materion
7.2.1 Materion Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.2.2 Materion Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.2.3 Materion Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Materion Main Business and Markets Served
7.2.5 Materion Recent Developments/Updates
7.3 TANAKA
7.3.1 TANAKA Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.3.2 TANAKA Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.3.3 TANAKA Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.3.4 TANAKA Main Business and Markets Served
7.3.5 TANAKA Recent Developments/Updates
7.4 Hitachi Metals
7.4.1 Hitachi Metals Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.4.2 Hitachi Metals Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.4.3 Hitachi Metals Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Hitachi Metals Main Business and Markets Served
7.4.5 Hitachi Metals Recent Developments/Updates
7.5 Plansee SE
7.5.1 Plansee SE Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.5.2 Plansee SE Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.5.3 Plansee SE Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Plansee SE Main Business and Markets Served
7.5.5 Plansee SE Recent Developments/Updates
7.6 Luoyang Sifon Electronic Materials
7.6.1 Luoyang Sifon Electronic Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.6.2 Luoyang Sifon Electronic Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.6.3 Luoyang Sifon Electronic Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Luoyang Sifon Electronic Materials Main Business and Markets Served
7.6.5 Luoyang Sifon Electronic Materials Recent Developments/Updates
7.7 Sumitomo Chemical
7.7.1 Sumitomo Chemical Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.7.2 Sumitomo Chemical Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.7.3 Sumitomo Chemical Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Sumitomo Chemical Main Business and Markets Served
7.7.5 Sumitomo Chemical Recent Developments/Updates
7.8 Konfoong Materials International
7.8.1 Konfoong Materials International Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.8.2 Konfoong Materials International Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.8.3 Konfoong Materials International Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Konfoong Materials International Main Business and Markets Served
7.8.5 Konfoong Materials International Recent Developments/Updates
7.9 Linde
7.9.1 Linde Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.9.2 Linde Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.9.3 Linde Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Linde Main Business and Markets Served
7.9.5 Linde Recent Developments/Updates
7.10 TOSOH
7.10.1 TOSOH Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.10.2 TOSOH Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.10.3 TOSOH Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.10.4 TOSOH Main Business and Markets Served
7.10.5 TOSOH Recent Developments/Updates
7.11 Honeywell
7.11.1 Honeywell Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.11.2 Honeywell Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.11.3 Honeywell Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Honeywell Main Business and Markets Served
7.11.5 Honeywell Recent Developments/Updates
7.12 ULVAC
7.12.1 ULVAC Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.12.2 ULVAC Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.12.3 ULVAC Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.12.4 ULVAC Main Business and Markets Served
7.12.5 ULVAC Recent Developments/Updates
7.13 Advantec
7.13.1 Advantec Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.13.2 Advantec Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.13.3 Advantec Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Advantec Main Business and Markets Served
7.13.5 Advantec Recent Developments/Updates
7.14 Fujian Acetron New Materials
7.14.1 Fujian Acetron New Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.14.2 Fujian Acetron New Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.14.3 Fujian Acetron New Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Fujian Acetron New Materials Main Business and Markets Served
7.14.5 Fujian Acetron New Materials Recent Developments/Updates
7.15 Changzhou Sujing Electronic Material
7.15.1 Changzhou Sujing Electronic Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.15.2 Changzhou Sujing Electronic Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.15.3 Changzhou Sujing Electronic Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Changzhou Sujing Electronic Material Main Business and Markets Served
7.15.5 Changzhou Sujing Electronic Material Recent Developments/Updates
7.16 GRIKIN Advanced Material
7.16.1 GRIKIN Advanced Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.16.2 GRIKIN Advanced Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.16.3 GRIKIN Advanced Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.16.4 GRIKIN Advanced Material Main Business and Markets Served
7.16.5 GRIKIN Advanced Material Recent Developments/Updates
7.17 Umicore
7.17.1 Umicore Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.17.2 Umicore Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.17.3 Umicore Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.17.4 Umicore Main Business and Markets Served
7.17.5 Umicore Recent Developments/Updates
7.18 Angstrom Sciences
7.18.1 Angstrom Sciences Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.18.2 Angstrom Sciences Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.18.3 Angstrom Sciences Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Angstrom Sciences Main Business and Markets Served
7.18.5 Angstrom Sciences Recent Developments/Updates
7.19 HC Starck Solutions
7.19.1 HC Starck Solutions Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
7.19.2 HC Starck Solutions Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Product Portfolio
7.19.3 HC Starck Solutions Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production, Value, Price and Gross Margin (2020-2025)
7.19.4 HC Starck Solutions Main Business and Markets Served
7.19.5 HC Starck Solutions Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Industry Chain Analysis
8.2 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Mode & Process Analysis
8.4 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Sales and Marketing
8.4.1 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Sales Channels
8.4.2 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Distributors
8.5 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Customer Analysis
9 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Dynamics
9.1 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Industry Trends
9.2 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Drivers
9.3 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Challenges
9.4 Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Capacity (Tons) by Manufacturers in 2024
 Table 4. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production by Manufacturers (2020-2025) & (Tons)
 Table 5. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing as of 2024)
 Table 10. Global Market Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Average Price by Manufacturers (US$/Ton) & (2020-2025)
 Table 11. Global Key Manufacturers of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing, Product Offered and Application
 Table 13. Global Key Manufacturers of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing, Date of Enter into This Industry
 Table 14. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Market Share by Region (2020-2025)
 Table 19. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
 Table 22. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons) by Region (2020-2025)
 Table 23. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share by Region (2020-2025)
 Table 24. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons) Forecast by Region (2026-2031)
 Table 25. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Average Price (US$/Ton) by Region (2020-2025)
 Table 27. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Average Price (US$/Ton) by Region (2026-2031)
 Table 28. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
 Table 29. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Region (2020-2025) & (Tons)
 Table 30. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Market Share by Region (2020-2025)
 Table 31. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Forecasted Consumption by Region (2026-2031) & (Tons)
 Table 32. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
 Table 34. North America Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Country (2020-2025) & (Tons)
 Table 35. North America Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Country (2026-2031) & (Tons)
 Table 36. Europe Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
 Table 37. Europe Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Country (2020-2025) & (Tons)
 Table 38. Europe Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Country (2026-2031) & (Tons)
 Table 39. Asia Pacific Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Tons)
 Table 40. Asia Pacific Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Region (2020-2025) & (Tons)
 Table 41. Asia Pacific Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Region (2026-2031) & (Tons)
 Table 42. Latin America, Middle East & Africa Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Tons)
 Table 43. Latin America, Middle East & Africa Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Country (2020-2025) & (Tons)
 Table 44. Latin America, Middle East & Africa Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Country (2026-2031) & (Tons)
 Table 45. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons) by Type (2020-2025)
 Table 46. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons) by Type (2026-2031)
 Table 47. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share by Type (2020-2025)
 Table 48. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share by Type (2026-2031)
 Table 49. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Market Share by Type (2020-2025)
 Table 52. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Market Share by Type (2026-2031)
 Table 53. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Price (US$/Ton) by Type (2020-2025)
 Table 54. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Price (US$/Ton) by Type (2026-2031)
 Table 55. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons) by Application (2020-2025)
 Table 56. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons) by Application (2026-2031)
 Table 57. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share by Application (2020-2025)
 Table 58. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share by Application (2026-2031)
 Table 59. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Market Share by Application (2020-2025)
 Table 62. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Market Share by Application (2026-2031)
 Table 63. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Price (US$/Ton) by Application (2020-2025)
 Table 64. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Price (US$/Ton) by Application (2026-2031)
 Table 65. JX Nippon Mining & Metals Corporation Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 66. JX Nippon Mining & Metals Corporation Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 67. JX Nippon Mining & Metals Corporation Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 68. JX Nippon Mining & Metals Corporation Main Business and Markets Served
 Table 69. JX Nippon Mining & Metals Corporation Recent Developments/Updates
 Table 70. Materion Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 71. Materion Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 72. Materion Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 73. Materion Main Business and Markets Served
 Table 74. Materion Recent Developments/Updates
 Table 75. TANAKA Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 76. TANAKA Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 77. TANAKA Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 78. TANAKA Main Business and Markets Served
 Table 79. TANAKA Recent Developments/Updates
 Table 80. Hitachi Metals Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 81. Hitachi Metals Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 82. Hitachi Metals Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 83. Hitachi Metals Main Business and Markets Served
 Table 84. Hitachi Metals Recent Developments/Updates
 Table 85. Plansee SE Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 86. Plansee SE Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 87. Plansee SE Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 88. Plansee SE Main Business and Markets Served
 Table 89. Plansee SE Recent Developments/Updates
 Table 90. Luoyang Sifon Electronic Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 91. Luoyang Sifon Electronic Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 92. Luoyang Sifon Electronic Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 93. Luoyang Sifon Electronic Materials Main Business and Markets Served
 Table 94. Luoyang Sifon Electronic Materials Recent Developments/Updates
 Table 95. Sumitomo Chemical Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 96. Sumitomo Chemical Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 97. Sumitomo Chemical Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 98. Sumitomo Chemical Main Business and Markets Served
 Table 99. Sumitomo Chemical Recent Developments/Updates
 Table 100. Konfoong Materials International Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 101. Konfoong Materials International Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 102. Konfoong Materials International Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 103. Konfoong Materials International Main Business and Markets Served
 Table 104. Konfoong Materials International Recent Developments/Updates
 Table 105. Linde Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 106. Linde Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 107. Linde Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 108. Linde Main Business and Markets Served
 Table 109. Linde Recent Developments/Updates
 Table 110. TOSOH Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 111. TOSOH Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 112. TOSOH Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 113. TOSOH Main Business and Markets Served
 Table 114. TOSOH Recent Developments/Updates
 Table 115. Honeywell Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 116. Honeywell Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 117. Honeywell Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 118. Honeywell Main Business and Markets Served
 Table 119. Honeywell Recent Developments/Updates
 Table 120. ULVAC Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 121. ULVAC Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 122. ULVAC Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 123. ULVAC Main Business and Markets Served
 Table 124. ULVAC Recent Developments/Updates
 Table 125. Advantec Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 126. Advantec Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 127. Advantec Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 128. Advantec Main Business and Markets Served
 Table 129. Advantec Recent Developments/Updates
 Table 130. Fujian Acetron New Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 131. Fujian Acetron New Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 132. Fujian Acetron New Materials Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 133. Fujian Acetron New Materials Main Business and Markets Served
 Table 134. Fujian Acetron New Materials Recent Developments/Updates
 Table 135. Changzhou Sujing Electronic Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 136. Changzhou Sujing Electronic Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 137. Changzhou Sujing Electronic Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 138. Changzhou Sujing Electronic Material Main Business and Markets Served
 Table 139. Changzhou Sujing Electronic Material Recent Developments/Updates
 Table 140. GRIKIN Advanced Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 141. GRIKIN Advanced Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 142. GRIKIN Advanced Material Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 143. GRIKIN Advanced Material Main Business and Markets Served
 Table 144. GRIKIN Advanced Material Recent Developments/Updates
 Table 145. Umicore Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 146. Umicore Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 147. Umicore Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 148. Umicore Main Business and Markets Served
 Table 149. Umicore Recent Developments/Updates
 Table 150. Angstrom Sciences Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 151. Angstrom Sciences Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 152. Angstrom Sciences Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 153. Angstrom Sciences Main Business and Markets Served
 Table 154. Angstrom Sciences Recent Developments/Updates
 Table 155. HC Starck Solutions Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Company Information
 Table 156. HC Starck Solutions Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Specification and Application
 Table 157. HC Starck Solutions Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)
 Table 158. HC Starck Solutions Main Business and Markets Served
 Table 159. HC Starck Solutions Recent Developments/Updates
 Table 160. Key Raw Materials Lists
 Table 161. Raw Materials Key Suppliers Lists
 Table 162. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Distributors List
 Table 163. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Customers List
 Table 164. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Trends
 Table 165. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Drivers
 Table 166. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Challenges
 Table 167. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Restraints
 Table 168. Research Programs/Design for This Report
 Table 169. Key Data Information from Secondary Sources
 Table 170. Key Data Information from Primary Sources
 Table 171. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing
 Figure 2. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Share by Type: 2024 VS 2031
 Figure 4. 5N Product Picture
 Figure 5. 5N5 Product Picture
 Figure 6. 6N Product Picture
 Figure 7. Others Product Picture
 Figure 8. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Value by Application, (US$ Million) & (2020-2031)
 Figure 9. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Share by Application: 2024 VS 2031
 Figure 10. IDM
 Figure 11. OSAT
 Figure 12. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 13. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) & (2020-2031)
 Figure 14. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Capacity (Tons) & (2020-2031)
 Figure 15. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production (Tons) & (2020-2031)
 Figure 16. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Average Price (US$/Ton) & (2020-2031)
 Figure 17. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Report Years Considered
 Figure 18. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Share by Manufacturers in 2024
 Figure 19. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Share by Manufacturers (2024)
 Figure 20. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 21. The Global 5 and 10 Largest Players: Market Share by Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Revenue in 2024
 Figure 22. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 23. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 24. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Comparison by Region: 2020 VS 2024 VS 2031 (Tons)
 Figure 25. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 26. North America Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 27. Europe Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. China Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Japan Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption by Region: 2020 VS 2024 VS 2031 (Tons)
 Figure 31. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 32. North America Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 33. North America Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Market Share by Country (2020-2031)
 Figure 34. U.S. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 35. Canada Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 36. Europe Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 37. Europe Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Market Share by Country (2020-2031)
 Figure 38. Germany Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 39. France Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 40. U.K. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 41. Italy Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 42. Russia Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 43. Asia Pacific Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 44. Asia Pacific Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Market Share by Region (2020-2031)
 Figure 45. China Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 46. Japan Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 47. South Korea Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 48. China Taiwan Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 49. Southeast Asia Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 50. India Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 51. Latin America, Middle East & Africa Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 52. Latin America, Middle East & Africa Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption Market Share by Country (2020-2031)
 Figure 53. Mexico Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 54. Brazil Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 55. Turkey Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 56. GCC Countries Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Consumption and Growth Rate (2020-2031) & (Tons)
 Figure 57. Global Production Market Share of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing by Type (2020-2031)
 Figure 58. Global Production Value Market Share of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing by Type (2020-2031)
 Figure 59. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Price (US$/Ton) by Type (2020-2031)
 Figure 60. Global Production Market Share of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing by Application (2020-2031)
 Figure 61. Global Production Value Market Share of Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing by Application (2020-2031)
 Figure 62. Global Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Price (US$/Ton) by Application (2020-2031)
 Figure 63. Ultra-high Purity Metal Sputtering Targets for IC Assembly and Testing Value Chain
 Figure 64. Channels of Distribution (Direct Vs Distribution)
 Figure 65. Bottom-up and Top-down Approaches for This Report
 Figure 66. Data Triangulation
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