The global market for Bonder was valued at US$ 2553 million in the year 2024 and is projected to reach a revised size of US$ 3557 million by 2031, growing at a CAGR of 4.7% during the forecast period.

Bonder Market

Wire Bonder, Die Bonder, and FC Bonder are specialized types of bonding machines used in the semiconductor industry for the assembly of integrated circuits (ICs) and other electronic components. Each serves a specific purpose in the manufacturing process:

Wire Bonder:

A wire bonder is a machine used to create wire bonds, which are electrical connections between the leads of a semiconductor device and the conductive pads on the die. This process is critical in packaging semiconductor devices. The wire bonder uses a fine wire (often gold or aluminum) to form a connection by creating a ball or wedge at the end of the wire, which is then pressed onto the pad on the die. There are two primary types of wire bonding:

Ball Bonder: This machine forms a ball at the end of the wire and uses it to make the first bond (the ball bond) on the die pad. The wire is then stretched to the lead and another bond (the stitch bond) is formed.

Wedge Bonder: This machine uses a wedge-shaped tool to bond the wire to the die pad and the lead.

Die Bonder:

A die bonder is a machine that attaches semiconductor dice (the individual chips or integrated circuits) to their packages. This is typically done using an adhesive, solder, or eutectic bonding. The die bonder positions the die with precision and applies the necessary force and heat to create a secure bond between the die and the package substrate. This process is essential for ensuring the mechanical and electrical integrity of the final semiconductor device.

FC Bonder (Flip Chip Bonder):

FC bonding, also known as flip chip bonding, is a technique where the die is mounted face-down onto a substrate, with the bond pads on the die's active surface directly connecting to the pads on the substrate. An FC bonder is designed to perform this process. The bonder can use various methods to attach the die, including soldering, conductive adhesive, or ultrasonic bonding. Flip chip technology is often used in high-performance applications due to its smaller footprint and better heat dissipation.

All these bonding machines are precision instruments that must maintain tight tolerances to ensure the reliability and performance of the electronic components they are used to assemble. They are equipped with advanced vision systems and control software to achieve the high accuracy required for these delicate operations.

Market DriversSemiconductor

Industry Growth: Rapid development in areas such as 5G, AI, IoT, automotive electronics, etc. is driving the demand for advanced packaging technologies, which in turn is increasing the demand for bonding machines.

Advanced Packaging Technologies: Popularity of technologies such as wafer level packaging (WLP), 3D packaging, and heterogeneous integration is driving the demand for high-precision bonding machines.

MEMS and Sensor Applications: Widespread use of MEMS and sensors in consumer electronics, automotive, medical, and other fields has increased the demand for bonding machines.

Miniaturisation and high performance trends: electronic devices are developing towards smaller, lighter and higher performance, requiring more precise bonding technology.

Emerging application fields: the development of emerging fields such as flexible electronics, wearable devices, AR/VR, etc. provides new growth points for the bonding machine market.

Market ChallengesHigh

Technical Threshold: The development and production of high-precision bonding machines requires a high level of technical accumulation, which restricts new entrants.

Cost pressure: High-end bonding machines are expensive, and small and medium-sized enterprises may face procurement pressure.

Supply Chain Risk: Uncertainty in the global supply chain may affect the production and delivery of bonding machines.

Market Trends

High Precision and Multifunctionality: As packaging technology becomes more complex, the market demand for high-precision and multifunctional bonding machines increases.

Automation and Intelligence: The application of automated bonding machines and intelligent production lines is gradually gaining popularity, improving production efficiency and consistency.

New bonding technologies: The development of new technologies such as laser bonding and low-temperature bonding has brought new opportunities to the bonding machine market.

Environmental protection and energy saving: the demand for environmentally friendly bonding machines and energy saving technologies is gradually increasing.

Regionalised production: In order to reduce supply chain risks, the production of bonding machines is gradually developing in the direction of regionalisation and localisation.

Regional Market Analysis

Asia-Pacific: The global centre of semiconductor and electronics manufacturing, especially China, South Korea, Japan and Taiwan, has the highest market demand.

North America: technological innovation and high-end manufacturing to drive market demand.

Europe: Strong demand in automotive and industrial electronics.

Other regions: the market is in the development stage with high potential.

Future OutlookWith

the continued development of semiconductor, MEMS, sensors and other fields, the bonding machine market will maintain rapid growth. High precision, automation, intelligence and the application of new bonding technology will become the main direction of future development.

Bonding machine market prospects, technological progress and industry demand is the main driving force. In the future, high precision, automation, intelligence and new bonding technology will become the mainstream of the market.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Bonder, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Bonder.

The Bonder market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Bonder market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Bonder manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Bonder Market Report

Report Metric	Details
Report Name	Bonder Market
Accounted market size in year	US$ 2553 million
Forecasted market size in 2031	US$ 3557 million
CAGR	4.7%
Base Year	year
Forecasted years	2025 - 2031
by Type	Wire Bonder Die Bonder FC Bonder
by Application	Integrated device manufacturer (IDMs) Outsourced semiconductor assembly and test (OSATs)
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	Besi, ASMPT Ltd, Kulicke & Soffa, Shibaura, Shinkawa Ltd., Fasford Technology, SUSS MicroTec, Hanmi, Palomar Technologies, Panasonic, Toray Engineering, Ultrasonic Engineering, Hesse GmbH, SET, F&K Delvotec, WestBond, Inc., Hybond, DIAS Automation
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Bonder manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Bonder by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Bonder in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Bonder Market growing?

Ans: The Bonder Market witnessing a CAGR of 4.7% during the forecast period 2025-2031.

What is the Bonder Market size in 2031?

Ans: The Bonder Market size in 2031 will be US$ 3557 million.

Who are the main players in the Bonder Market report?

Ans: The main players in the Bonder Market are Besi, ASMPT Ltd, Kulicke & Soffa, Shibaura, Shinkawa Ltd., Fasford Technology, SUSS MicroTec, Hanmi, Palomar Technologies, Panasonic, Toray Engineering, Ultrasonic Engineering, Hesse GmbH, SET, F&K Delvotec, WestBond, Inc., Hybond, DIAS Automation

What are the Application segmentation covered in the Bonder Market report?

Ans: The Applications covered in the Bonder Market report are Integrated device manufacturer (IDMs), Outsourced semiconductor assembly and test (OSATs)

What are the Type segmentation covered in the Bonder Market report?

Ans: The Types covered in the Bonder Market report are Wire Bonder, Die Bonder, FC Bonder

1 Bonder Market Overview

1.1 Product Definition

1.2 Bonder by Type

1.2.1 Global Bonder Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Wire Bonder

1.2.3 Die Bonder

1.2.4 FC Bonder

1.3 Bonder by Application

1.3.1 Global Bonder Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 Integrated device manufacturer (IDMs)

1.3.3 Outsourced semiconductor assembly and test (OSATs)

1.4 Global Market Growth Prospects

1.4.1 Global Bonder Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Bonder Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Bonder Production Estimates and Forecasts (2020-2031)

1.4.4 Global Bonder Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Bonder Production Market Share by Manufacturers (2020-2025)

2.2 Global Bonder Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Bonder, Industry Ranking, 2023 VS 2024

2.4 Global Bonder Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Bonder Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Bonder, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Bonder, Product Offered and Application

2.8 Global Key Manufacturers of Bonder, Date of Enter into This Industry

2.9 Bonder Market Competitive Situation and Trends

2.9.1 Bonder Market Concentration Rate

2.9.2 Global 5 and 10 Largest Bonder Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Bonder Production by Region

3.1 Global Bonder Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Bonder Production Value by Region (2020-2031)

3.2.1 Global Bonder Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Bonder by Region (2026-2031)

3.3 Global Bonder Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Bonder Production Volume by Region (2020-2031)

3.4.1 Global Bonder Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Bonder by Region (2026-2031)

3.5 Global Bonder Market Price Analysis by Region (2020-2025)

3.6 Global Bonder Production and Value, Year-over-Year Growth

3.6.1 North America Bonder Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe Bonder Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Bonder Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan Bonder Production Value Estimates and Forecasts (2020-2031)

4 Bonder Consumption by Region

4.1 Global Bonder Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Bonder Consumption by Region (2020-2031)

4.2.1 Global Bonder Consumption by Region (2020-2025)

4.2.2 Global Bonder Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Bonder Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Bonder Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Bonder Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Bonder Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Bonder Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Israel

5 Segment by Type

5.1 Global Bonder Production by Type (2020-2031)

5.1.1 Global Bonder Production by Type (2020-2025)

5.1.2 Global Bonder Production by Type (2026-2031)

5.1.3 Global Bonder Production Market Share by Type (2020-2031)

5.2 Global Bonder Production Value by Type (2020-2031)

5.2.1 Global Bonder Production Value by Type (2020-2025)

5.2.2 Global Bonder Production Value by Type (2026-2031)

5.2.3 Global Bonder Production Value Market Share by Type (2020-2031)

5.3 Global Bonder Price by Type (2020-2031)

6 Segment by Application

6.1 Global Bonder Production by Application (2020-2031)

6.1.1 Global Bonder Production by Application (2020-2025)

6.1.2 Global Bonder Production by Application (2026-2031)

6.1.3 Global Bonder Production Market Share by Application (2020-2031)

6.2 Global Bonder Production Value by Application (2020-2031)

6.2.1 Global Bonder Production Value by Application (2020-2025)

6.2.2 Global Bonder Production Value by Application (2026-2031)

6.2.3 Global Bonder Production Value Market Share by Application (2020-2031)

6.3 Global Bonder Price by Application (2020-2031)

7 Key Companies Profiled

7.1 Besi

7.1.1 Besi Bonder Company Information

7.1.2 Besi Bonder Product Portfolio

7.1.3 Besi Bonder Production, Value, Price and Gross Margin (2020-2025)

7.1.4 Besi Main Business and Markets Served

7.1.5 Besi Recent Developments/Updates

7.2 ASMPT Ltd

7.2.1 ASMPT Ltd Bonder Company Information

7.2.2 ASMPT Ltd Bonder Product Portfolio

7.2.3 ASMPT Ltd Bonder Production, Value, Price and Gross Margin (2020-2025)

7.2.4 ASMPT Ltd Main Business and Markets Served

7.2.5 ASMPT Ltd Recent Developments/Updates

7.3 Kulicke & Soffa

7.3.1 Kulicke & Soffa Bonder Company Information

7.3.2 Kulicke & Soffa Bonder Product Portfolio

7.3.3 Kulicke & Soffa Bonder Production, Value, Price and Gross Margin (2020-2025)

7.3.4 Kulicke & Soffa Main Business and Markets Served

7.3.5 Kulicke & Soffa Recent Developments/Updates

7.4 Shibaura

7.4.1 Shibaura Bonder Company Information

7.4.2 Shibaura Bonder Product Portfolio

7.4.3 Shibaura Bonder Production, Value, Price and Gross Margin (2020-2025)

7.4.4 Shibaura Main Business and Markets Served

7.4.5 Shibaura Recent Developments/Updates

7.5 Shinkawa Ltd.

7.5.1 Shinkawa Ltd. Bonder Company Information

7.5.2 Shinkawa Ltd. Bonder Product Portfolio

7.5.3 Shinkawa Ltd. Bonder Production, Value, Price and Gross Margin (2020-2025)

7.5.4 Shinkawa Ltd. Main Business and Markets Served

7.5.5 Shinkawa Ltd. Recent Developments/Updates

7.6 Fasford Technology

7.6.1 Fasford Technology Bonder Company Information

7.6.2 Fasford Technology Bonder Product Portfolio

7.6.3 Fasford Technology Bonder Production, Value, Price and Gross Margin (2020-2025)

7.6.4 Fasford Technology Main Business and Markets Served

7.6.5 Fasford Technology Recent Developments/Updates

7.7 SUSS MicroTec

7.7.1 SUSS MicroTec Bonder Company Information

7.7.2 SUSS MicroTec Bonder Product Portfolio

7.7.3 SUSS MicroTec Bonder Production, Value, Price and Gross Margin (2020-2025)

7.7.4 SUSS MicroTec Main Business and Markets Served

7.7.5 SUSS MicroTec Recent Developments/Updates

7.8 Hanmi

7.8.1 Hanmi Bonder Company Information

7.8.2 Hanmi Bonder Product Portfolio

7.8.3 Hanmi Bonder Production, Value, Price and Gross Margin (2020-2025)

7.8.4 Hanmi Main Business and Markets Served

7.8.5 Hanmi Recent Developments/Updates

7.9 Palomar Technologies

7.9.1 Palomar Technologies Bonder Company Information

7.9.2 Palomar Technologies Bonder Product Portfolio

7.9.3 Palomar Technologies Bonder Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Palomar Technologies Main Business and Markets Served

7.9.5 Palomar Technologies Recent Developments/Updates

7.10 Panasonic

7.10.1 Panasonic Bonder Company Information

7.10.2 Panasonic Bonder Product Portfolio

7.10.3 Panasonic Bonder Production, Value, Price and Gross Margin (2020-2025)

7.10.4 Panasonic Main Business and Markets Served

7.10.5 Panasonic Recent Developments/Updates

7.11 Toray Engineering

7.11.1 Toray Engineering Bonder Company Information

7.11.2 Toray Engineering Bonder Product Portfolio

7.11.3 Toray Engineering Bonder Production, Value, Price and Gross Margin (2020-2025)

7.11.4 Toray Engineering Main Business and Markets Served

7.11.5 Toray Engineering Recent Developments/Updates

7.12 Ultrasonic Engineering

7.12.1 Ultrasonic Engineering Bonder Company Information

7.12.2 Ultrasonic Engineering Bonder Product Portfolio

7.12.3 Ultrasonic Engineering Bonder Production, Value, Price and Gross Margin (2020-2025)

7.12.4 Ultrasonic Engineering Main Business and Markets Served

7.12.5 Ultrasonic Engineering Recent Developments/Updates

7.13 Hesse GmbH

7.13.1 Hesse GmbH Bonder Company Information

7.13.2 Hesse GmbH Bonder Product Portfolio

7.13.3 Hesse GmbH Bonder Production, Value, Price and Gross Margin (2020-2025)

7.13.4 Hesse GmbH Main Business and Markets Served

7.13.5 Hesse GmbH Recent Developments/Updates

7.14 SET

7.14.1 SET Bonder Company Information

7.14.2 SET Bonder Product Portfolio

7.14.3 SET Bonder Production, Value, Price and Gross Margin (2020-2025)

7.14.4 SET Main Business and Markets Served

7.14.5 SET Recent Developments/Updates

7.15 F&K Delvotec

7.15.1 F&K Delvotec Bonder Company Information

7.15.2 F&K Delvotec Bonder Product Portfolio

7.15.3 F&K Delvotec Bonder Production, Value, Price and Gross Margin (2020-2025)

7.15.4 F&K Delvotec Main Business and Markets Served

7.15.5 F&K Delvotec Recent Developments/Updates

7.16 WestBond, Inc.

7.16.1 WestBond, Inc. Bonder Company Information

7.16.2 WestBond, Inc. Bonder Product Portfolio

7.16.3 WestBond, Inc. Bonder Production, Value, Price and Gross Margin (2020-2025)

7.16.4 WestBond, Inc. Main Business and Markets Served

7.16.5 WestBond, Inc. Recent Developments/Updates

7.17 Hybond

7.17.1 Hybond Bonder Company Information

7.17.2 Hybond Bonder Product Portfolio

7.17.3 Hybond Bonder Production, Value, Price and Gross Margin (2020-2025)

7.17.4 Hybond Main Business and Markets Served

7.17.5 Hybond Recent Developments/Updates

7.18 DIAS Automation

7.18.1 DIAS Automation Bonder Company Information

7.18.2 DIAS Automation Bonder Product Portfolio

7.18.3 DIAS Automation Bonder Production, Value, Price and Gross Margin (2020-2025)

7.18.4 DIAS Automation Main Business and Markets Served

7.18.5 DIAS Automation Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Bonder Industry Chain Analysis

8.2 Bonder Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Bonder Production Mode & Process Analysis

8.4 Bonder Sales and Marketing

8.4.1 Bonder Sales Channels

8.4.2 Bonder Distributors

8.5 Bonder Customer Analysis

9 Bonder Market Dynamics

9.1 Bonder Industry Trends

9.2 Bonder Market Drivers

9.3 Bonder Market Challenges

9.4 Bonder Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

Ultrasonic Engineering

SET

F&K Delvotec

WestBond

List of Tables

Table 1. Global Bonder Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Bonder Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Bonder Production Capacity (Units) by Manufacturers in 2024

Table 4. Global Bonder Production by Manufacturers (2020-2025) & (Units)

Table 5. Global Bonder Production Market Share by Manufacturers (2020-2025)

Table 6. Global Bonder Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Bonder Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Bonder, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Bonder as of 2024)

Table 10. Global Market Bonder Average Price by Manufacturers (K USD/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of Bonder, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Bonder, Product Offered and Application

Table 13. Global Key Manufacturers of Bonder, Date of Enter into This Industry

Table 14. Global Bonder Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Bonder Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Bonder Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Bonder Production Value Market Share by Region (2020-2025)

Table 19. Global Bonder Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Bonder Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Bonder Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Table 22. Global Bonder Production (Units) by Region (2020-2025)

Table 23. Global Bonder Production Market Share by Region (2020-2025)

Table 24. Global Bonder Production (Units) Forecast by Region (2026-2031)

Table 25. Global Bonder Production Market Share Forecast by Region (2026-2031)

Table 26. Global Bonder Market Average Price (K USD/Unit) by Region (2020-2025)

Table 27. Global Bonder Market Average Price (K USD/Unit) by Region (2026-2031)

Table 28. Global Bonder Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 29. Global Bonder Consumption by Region (2020-2025) & (Units)

Table 30. Global Bonder Consumption Market Share by Region (2020-2025)

Table 31. Global Bonder Forecasted Consumption by Region (2026-2031) & (Units)

Table 32. Global Bonder Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 34. North America Bonder Consumption by Country (2020-2025) & (Units)

Table 35. North America Bonder Consumption by Country (2026-2031) & (Units)

Table 36. Europe Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 37. Europe Bonder Consumption by Country (2020-2025) & (Units)

Table 38. Europe Bonder Consumption by Country (2026-2031) & (Units)

Table 39. Asia Pacific Bonder Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 40. Asia Pacific Bonder Consumption by Region (2020-2025) & (Units)

Table 41. Asia Pacific Bonder Consumption by Region (2026-2031) & (Units)

Table 42. Latin America, Middle East & Africa Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 43. Latin America, Middle East & Africa Bonder Consumption by Country (2020-2025) & (Units)

Table 44. Latin America, Middle East & Africa Bonder Consumption by Country (2026-2031) & (Units)

Table 45. Global Bonder Production (Units) by Type (2020-2025)

Table 46. Global Bonder Production (Units) by Type (2026-2031)

Table 47. Global Bonder Production Market Share by Type (2020-2025)

Table 48. Global Bonder Production Market Share by Type (2026-2031)

Table 49. Global Bonder Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Bonder Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Bonder Production Value Market Share by Type (2020-2025)

Table 52. Global Bonder Production Value Market Share by Type (2026-2031)

Table 53. Global Bonder Price (K USD/Unit) by Type (2020-2025)

Table 54. Global Bonder Price (K USD/Unit) by Type (2026-2031)

Table 55. Global Bonder Production (Units) by Application (2020-2025)

Table 56. Global Bonder Production (Units) by Application (2026-2031)

Table 57. Global Bonder Production Market Share by Application (2020-2025)

Table 58. Global Bonder Production Market Share by Application (2026-2031)

Table 59. Global Bonder Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Bonder Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Bonder Production Value Market Share by Application (2020-2025)

Table 62. Global Bonder Production Value Market Share by Application (2026-2031)

Table 63. Global Bonder Price (K USD/Unit) by Application (2020-2025)

Table 64. Global Bonder Price (K USD/Unit) by Application (2026-2031)

Table 65. Besi Bonder Company Information

Table 66. Besi Bonder Specification and Application

Table 67. Besi Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 68. Besi Main Business and Markets Served

Table 69. Besi Recent Developments/Updates

Table 70. ASMPT Ltd Bonder Company Information

Table 71. ASMPT Ltd Bonder Specification and Application

Table 72. ASMPT Ltd Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 73. ASMPT Ltd Main Business and Markets Served

Table 74. ASMPT Ltd Recent Developments/Updates

Table 75. Kulicke & Soffa Bonder Company Information

Table 76. Kulicke & Soffa Bonder Specification and Application

Table 77. Kulicke & Soffa Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 78. Kulicke & Soffa Main Business and Markets Served

Table 79. Kulicke & Soffa Recent Developments/Updates

Table 80. Shibaura Bonder Company Information

Table 81. Shibaura Bonder Specification and Application

Table 82. Shibaura Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 83. Shibaura Main Business and Markets Served

Table 84. Shibaura Recent Developments/Updates

Table 85. Shinkawa Ltd. Bonder Company Information

Table 86. Shinkawa Ltd. Bonder Specification and Application

Table 87. Shinkawa Ltd. Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 88. Shinkawa Ltd. Main Business and Markets Served

Table 89. Shinkawa Ltd. Recent Developments/Updates

Table 90. Fasford Technology Bonder Company Information

Table 91. Fasford Technology Bonder Specification and Application

Table 92. Fasford Technology Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 93. Fasford Technology Main Business and Markets Served

Table 94. Fasford Technology Recent Developments/Updates

Table 95. SUSS MicroTec Bonder Company Information

Table 96. SUSS MicroTec Bonder Specification and Application

Table 97. SUSS MicroTec Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 98. SUSS MicroTec Main Business and Markets Served

Table 99. SUSS MicroTec Recent Developments/Updates

Table 100. Hanmi Bonder Company Information

Table 101. Hanmi Bonder Specification and Application

Table 102. Hanmi Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 103. Hanmi Main Business and Markets Served

Table 104. Hanmi Recent Developments/Updates

Table 105. Palomar Technologies Bonder Company Information

Table 106. Palomar Technologies Bonder Specification and Application

Table 107. Palomar Technologies Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 108. Palomar Technologies Main Business and Markets Served

Table 109. Palomar Technologies Recent Developments/Updates

Table 110. Panasonic Bonder Company Information

Table 111. Panasonic Bonder Specification and Application

Table 112. Panasonic Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 113. Panasonic Main Business and Markets Served

Table 114. Panasonic Recent Developments/Updates

Table 115. Toray Engineering Bonder Company Information

Table 116. Toray Engineering Bonder Specification and Application

Table 117. Toray Engineering Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 118. Toray Engineering Main Business and Markets Served

Table 119. Toray Engineering Recent Developments/Updates

Table 120. Ultrasonic Engineering Bonder Company Information

Table 121. Ultrasonic Engineering Bonder Specification and Application

Table 122. Ultrasonic Engineering Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 123. Ultrasonic Engineering Main Business and Markets Served

Table 124. Ultrasonic Engineering Recent Developments/Updates

Table 125. Hesse GmbH Bonder Company Information

Table 126. Hesse GmbH Bonder Specification and Application

Table 127. Hesse GmbH Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 128. Hesse GmbH Main Business and Markets Served

Table 129. Hesse GmbH Recent Developments/Updates

Table 130. SET Bonder Company Information

Table 131. SET Bonder Specification and Application

Table 132. SET Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 133. SET Main Business and Markets Served

Table 134. SET Recent Developments/Updates

Table 135. F&K Delvotec Bonder Company Information

Table 136. F&K Delvotec Bonder Specification and Application

Table 137. F&K Delvotec Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 138. F&K Delvotec Main Business and Markets Served

Table 139. F&K Delvotec Recent Developments/Updates

Table 140. WestBond, Inc. Bonder Company Information

Table 141. WestBond, Inc. Bonder Specification and Application

Table 142. WestBond, Inc. Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 143. WestBond, Inc. Main Business and Markets Served

Table 144. WestBond, Inc. Recent Developments/Updates

Table 145. Hybond Bonder Company Information

Table 146. Hybond Bonder Specification and Application

Table 147. Hybond Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 148. Hybond Main Business and Markets Served

Table 149. Hybond Recent Developments/Updates

Table 150. DIAS Automation Bonder Company Information

Table 151. DIAS Automation Bonder Specification and Application

Table 152. DIAS Automation Bonder Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 153. DIAS Automation Main Business and Markets Served

Table 154. DIAS Automation Recent Developments/Updates

Table 155. Key Raw Materials Lists

Table 156. Raw Materials Key Suppliers Lists

Table 157. Bonder Distributors List

Table 158. Bonder Customers List

Table 159. Bonder Market Trends

Table 160. Bonder Market Drivers

Table 161. Bonder Market Challenges

Table 162. Bonder Market Restraints

Table 163. Research Programs/Design for This Report

Table 164. Key Data Information from Secondary Sources

Table 165. Key Data Information from Primary Sources

Table 166. Authors List of This Report

List of Figures

Figure 1. Product Picture of Bonder

Figure 2. Global Bonder Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Bonder Market Share by Type: 2024 VS 2031

Figure 4. Wire Bonder Product Picture

Figure 5. Die Bonder Product Picture

Figure 6. FC Bonder Product Picture

Figure 7. Global Bonder Market Value by Application, (US$ Million) & (2020-2031)

Figure 8. Global Bonder Market Share by Application: 2024 VS 2031

Figure 9. Integrated device manufacturer (IDMs)

Figure 10. Outsourced semiconductor assembly and test (OSATs)

Figure 11. Global Bonder Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 12. Global Bonder Production Value (US$ Million) & (2020-2031)

Figure 13. Global Bonder Production Capacity (Units) & (2020-2031)

Figure 14. Global Bonder Production (Units) & (2020-2031)

Figure 15. Global Bonder Average Price (K USD/Unit) & (2020-2031)

Figure 16. Bonder Report Years Considered

Figure 17. Bonder Production Share by Manufacturers in 2024

Figure 18. Global Bonder Production Value Share by Manufacturers (2024)

Figure 19. Bonder Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 20. The Global 5 and 10 Largest Players: Market Share by Bonder Revenue in 2024

Figure 21. Global Bonder Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 22. Global Bonder Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 23. Global Bonder Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Figure 24. Global Bonder Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 25. North America Bonder Production Value (US$ Million) Growth Rate (2020-2031)

Figure 26. Europe Bonder Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. China Bonder Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Japan Bonder Production Value (US$ Million) Growth Rate (2020-2031)

Figure 29. Global Bonder Consumption by Region: 2020 VS 2024 VS 2031 (Units)

Figure 30. Global Bonder Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 31. North America Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 32. North America Bonder Consumption Market Share by Country (2020-2031)

Figure 33. U.S. Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 34. Canada Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 35. Europe Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 36. Europe Bonder Consumption Market Share by Country (2020-2031)

Figure 37. Germany Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 38. France Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 39. U.K. Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 40. Italy Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 41. Netherlands Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 42. Asia Pacific Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 43. Asia Pacific Bonder Consumption Market Share by Region (2020-2031)

Figure 44. China Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 45. Japan Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 46. South Korea Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 47. China Taiwan Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 48. Southeast Asia Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 49. India Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 50. Latin America, Middle East & Africa Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 51. Latin America, Middle East & Africa Bonder Consumption Market Share by Country (2020-2031)

Figure 52. Mexico Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 53. Brazil Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 54. Israel Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 55. Global Production Market Share of Bonder by Type (2020-2031)

Figure 56. Global Production Value Market Share of Bonder by Type (2020-2031)

Figure 57. Global Bonder Price (K USD/Unit) by Type (2020-2031)

Figure 58. Global Production Market Share of Bonder by Application (2020-2031)

Figure 59. Global Production Value Market Share of Bonder by Application (2020-2031)

Figure 60. Global Bonder Price (K USD/Unit) by Application (2020-2031)

Figure 61. Bonder Value Chain

Figure 62. Channels of Distribution (Direct Vs Distribution)

Figure 63. Bottom-up and Top-down Approaches for This Report

Figure 64. Data Triangulation

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