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Global Thermal Pad for Board-Level Packaging Market Research Report 2024
Published Date: November 2024
|
Report Code: QYRE-Auto-17R18707
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Global Thermal Pad for Board Level Packaging Market Research Report 2024
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Global Thermal Pad for Board-Level Packaging Market Research Report 2024

Code: QYRE-Auto-17R18707
Report
November 2024
Pages:98
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Thermal Pad for Board-Level Packaging Market

Thermal pads for board-level packaging are specially designed thermal conductive materials that are used between PCB and packaged electronic components to help heat conduction effectively to prevent overheating of electronic components that may affect performance or shorten life. They are usually made of soft thermally conductive silicone, thermally conductive ceramic powder and other materials, and have good thermal conductivity and electrical insulation, making them suitable for dual functions of heat conduction and buffering in electronic packaging.
The global Thermal Pad for Board-Level Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Thermal Pad for Board-Level Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Thermal Pad for Board-Level Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Thermal Pad for Board-Level Packaging include Henkel Adhesives, DuPont, 3M, Rogers Corporation, Shin-Etsu Chemical, Fujipoly, Dow, Honeywell, Zhsio, Darbond, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Thermal Pad for Board-Level Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thermal Pad for Board-Level Packaging.
The Thermal Pad for Board-Level Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Thermal Pad for Board-Level Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Thermal Pad for Board-Level Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Thermal Pad for Board-Level Packaging Market Report

Report Metric Details
Report Name Thermal Pad for Board-Level Packaging Market
by Type
by Application
  • PCB
  • LED
  • Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Henkel Adhesives, DuPont, 3M, Rogers Corporation, Shin-Etsu Chemical, Fujipoly, Dow, Honeywell, Zhsio, Darbond, Goldlink Tongda Electronics, Cybrid Technologies, Aok Technologies, Bornsun Composite Materials
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Thermal Pad for Board-Level Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Thermal Pad for Board-Level Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Thermal Pad for Board-Level Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the Thermal Pad for Board-Level Packaging Market report?

Ans: The main players in the Thermal Pad for Board-Level Packaging Market are Henkel Adhesives, DuPont, 3M, Rogers Corporation, Shin-Etsu Chemical, Fujipoly, Dow, Honeywell, Zhsio, Darbond, Goldlink Tongda Electronics, Cybrid Technologies, Aok Technologies, Bornsun Composite Materials

What are the Application segmentation covered in the Thermal Pad for Board-Level Packaging Market report?

Ans: The Applications covered in the Thermal Pad for Board-Level Packaging Market report are PCB, LED, Others

What are the Type segmentation covered in the Thermal Pad for Board-Level Packaging Market report?

Ans: The Types covered in the Thermal Pad for Board-Level Packaging Market report are Silicone Thermal Pad, Ceramic Thermal Pad

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1 Thermal Pad for Board-Level Packaging Market Overview
1.1 Product Definition
1.2 Thermal Pad for Board-Level Packaging by Type
1.2.1 Global Thermal Pad for Board-Level Packaging Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 Silicone Thermal Pad
1.2.3 Ceramic Thermal Pad
1.3 Thermal Pad for Board-Level Packaging by Application
1.3.1 Global Thermal Pad for Board-Level Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 PCB
1.3.3 LED
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Thermal Pad for Board-Level Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Thermal Pad for Board-Level Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Thermal Pad for Board-Level Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global Thermal Pad for Board-Level Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Thermal Pad for Board-Level Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global Thermal Pad for Board-Level Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Thermal Pad for Board-Level Packaging, Industry Ranking, 2022 VS 2023
2.4 Global Thermal Pad for Board-Level Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Thermal Pad for Board-Level Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Thermal Pad for Board-Level Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Thermal Pad for Board-Level Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Thermal Pad for Board-Level Packaging, Date of Enter into This Industry
2.9 Thermal Pad for Board-Level Packaging Market Competitive Situation and Trends
2.9.1 Thermal Pad for Board-Level Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Thermal Pad for Board-Level Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Thermal Pad for Board-Level Packaging Production by Region
3.1 Global Thermal Pad for Board-Level Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Thermal Pad for Board-Level Packaging Production Value by Region (2019-2030)
3.2.1 Global Thermal Pad for Board-Level Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Thermal Pad for Board-Level Packaging by Region (2025-2030)
3.3 Global Thermal Pad for Board-Level Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Thermal Pad for Board-Level Packaging Production by Region (2019-2030)
3.4.1 Global Thermal Pad for Board-Level Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Thermal Pad for Board-Level Packaging by Region (2025-2030)
3.5 Global Thermal Pad for Board-Level Packaging Market Price Analysis by Region (2019-2024)
3.6 Global Thermal Pad for Board-Level Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Thermal Pad for Board-Level Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Thermal Pad for Board-Level Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Thermal Pad for Board-Level Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Thermal Pad for Board-Level Packaging Production Value Estimates and Forecasts (2019-2030)
4 Thermal Pad for Board-Level Packaging Consumption by Region
4.1 Global Thermal Pad for Board-Level Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Thermal Pad for Board-Level Packaging Consumption by Region (2019-2030)
4.2.1 Global Thermal Pad for Board-Level Packaging Consumption by Region (2019-2030)
4.2.2 Global Thermal Pad for Board-Level Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Thermal Pad for Board-Level Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Thermal Pad for Board-Level Packaging Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Thermal Pad for Board-Level Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Thermal Pad for Board-Level Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Thermal Pad for Board-Level Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Thermal Pad for Board-Level Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Thermal Pad for Board-Level Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Thermal Pad for Board-Level Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Thermal Pad for Board-Level Packaging Production by Type (2019-2030)
5.1.1 Global Thermal Pad for Board-Level Packaging Production by Type (2019-2024)
5.1.2 Global Thermal Pad for Board-Level Packaging Production by Type (2025-2030)
5.1.3 Global Thermal Pad for Board-Level Packaging Production Market Share by Type (2019-2030)
5.2 Global Thermal Pad for Board-Level Packaging Production Value by Type (2019-2030)
5.2.1 Global Thermal Pad for Board-Level Packaging Production Value by Type (2019-2024)
5.2.2 Global Thermal Pad for Board-Level Packaging Production Value by Type (2025-2030)
5.2.3 Global Thermal Pad for Board-Level Packaging Production Value Market Share by Type (2019-2030)
5.3 Global Thermal Pad for Board-Level Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global Thermal Pad for Board-Level Packaging Production by Application (2019-2030)
6.1.1 Global Thermal Pad for Board-Level Packaging Production by Application (2019-2024)
6.1.2 Global Thermal Pad for Board-Level Packaging Production by Application (2025-2030)
6.1.3 Global Thermal Pad for Board-Level Packaging Production Market Share by Application (2019-2030)
6.2 Global Thermal Pad for Board-Level Packaging Production Value by Application (2019-2030)
6.2.1 Global Thermal Pad for Board-Level Packaging Production Value by Application (2019-2024)
6.2.2 Global Thermal Pad for Board-Level Packaging Production Value by Application (2025-2030)
6.2.3 Global Thermal Pad for Board-Level Packaging Production Value Market Share by Application (2019-2030)
6.3 Global Thermal Pad for Board-Level Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Henkel Adhesives
7.1.1 Henkel Adhesives Thermal Pad for Board-Level Packaging Company Information
7.1.2 Henkel Adhesives Thermal Pad for Board-Level Packaging Product Portfolio
7.1.3 Henkel Adhesives Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Henkel Adhesives Main Business and Markets Served
7.1.5 Henkel Adhesives Recent Developments/Updates
7.2 DuPont
7.2.1 DuPont Thermal Pad for Board-Level Packaging Company Information
7.2.2 DuPont Thermal Pad for Board-Level Packaging Product Portfolio
7.2.3 DuPont Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 DuPont Main Business and Markets Served
7.2.5 DuPont Recent Developments/Updates
7.3 3M
7.3.1 3M Thermal Pad for Board-Level Packaging Company Information
7.3.2 3M Thermal Pad for Board-Level Packaging Product Portfolio
7.3.3 3M Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 3M Main Business and Markets Served
7.3.5 3M Recent Developments/Updates
7.4 Rogers Corporation
7.4.1 Rogers Corporation Thermal Pad for Board-Level Packaging Company Information
7.4.2 Rogers Corporation Thermal Pad for Board-Level Packaging Product Portfolio
7.4.3 Rogers Corporation Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Rogers Corporation Main Business and Markets Served
7.4.5 Rogers Corporation Recent Developments/Updates
7.5 Shin-Etsu Chemical
7.5.1 Shin-Etsu Chemical Thermal Pad for Board-Level Packaging Company Information
7.5.2 Shin-Etsu Chemical Thermal Pad for Board-Level Packaging Product Portfolio
7.5.3 Shin-Etsu Chemical Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Shin-Etsu Chemical Main Business and Markets Served
7.5.5 Shin-Etsu Chemical Recent Developments/Updates
7.6 Fujipoly
7.6.1 Fujipoly Thermal Pad for Board-Level Packaging Company Information
7.6.2 Fujipoly Thermal Pad for Board-Level Packaging Product Portfolio
7.6.3 Fujipoly Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Fujipoly Main Business and Markets Served
7.6.5 Fujipoly Recent Developments/Updates
7.7 Dow
7.7.1 Dow Thermal Pad for Board-Level Packaging Company Information
7.7.2 Dow Thermal Pad for Board-Level Packaging Product Portfolio
7.7.3 Dow Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Dow Main Business and Markets Served
7.7.5 Dow Recent Developments/Updates
7.8 Honeywell
7.8.1 Honeywell Thermal Pad for Board-Level Packaging Company Information
7.8.2 Honeywell Thermal Pad for Board-Level Packaging Product Portfolio
7.8.3 Honeywell Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Honeywell Main Business and Markets Served
7.8.5 Honeywell Recent Developments/Updates
7.9 Zhsio
7.9.1 Zhsio Thermal Pad for Board-Level Packaging Company Information
7.9.2 Zhsio Thermal Pad for Board-Level Packaging Product Portfolio
7.9.3 Zhsio Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Zhsio Main Business and Markets Served
7.9.5 Zhsio Recent Developments/Updates
7.10 Darbond
7.10.1 Darbond Thermal Pad for Board-Level Packaging Company Information
7.10.2 Darbond Thermal Pad for Board-Level Packaging Product Portfolio
7.10.3 Darbond Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Darbond Main Business and Markets Served
7.10.5 Darbond Recent Developments/Updates
7.11 Goldlink Tongda Electronics
7.11.1 Goldlink Tongda Electronics Thermal Pad for Board-Level Packaging Company Information
7.11.2 Goldlink Tongda Electronics Thermal Pad for Board-Level Packaging Product Portfolio
7.11.3 Goldlink Tongda Electronics Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Goldlink Tongda Electronics Main Business and Markets Served
7.11.5 Goldlink Tongda Electronics Recent Developments/Updates
7.12 Cybrid Technologies
7.12.1 Cybrid Technologies Thermal Pad for Board-Level Packaging Company Information
7.12.2 Cybrid Technologies Thermal Pad for Board-Level Packaging Product Portfolio
7.12.3 Cybrid Technologies Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Cybrid Technologies Main Business and Markets Served
7.12.5 Cybrid Technologies Recent Developments/Updates
7.13 Aok Technologies
7.13.1 Aok Technologies Thermal Pad for Board-Level Packaging Company Information
7.13.2 Aok Technologies Thermal Pad for Board-Level Packaging Product Portfolio
7.13.3 Aok Technologies Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Aok Technologies Main Business and Markets Served
7.13.5 Aok Technologies Recent Developments/Updates
7.14 Bornsun Composite Materials
7.14.1 Bornsun Composite Materials Thermal Pad for Board-Level Packaging Company Information
7.14.2 Bornsun Composite Materials Thermal Pad for Board-Level Packaging Product Portfolio
7.14.3 Bornsun Composite Materials Thermal Pad for Board-Level Packaging Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Bornsun Composite Materials Main Business and Markets Served
7.14.5 Bornsun Composite Materials Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Thermal Pad for Board-Level Packaging Industry Chain Analysis
8.2 Thermal Pad for Board-Level Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Thermal Pad for Board-Level Packaging Production Mode & Process
8.4 Thermal Pad for Board-Level Packaging Sales and Marketing
8.4.1 Thermal Pad for Board-Level Packaging Sales Channels
8.4.2 Thermal Pad for Board-Level Packaging Distributors
8.5 Thermal Pad for Board-Level Packaging Customers
9 Thermal Pad for Board-Level Packaging Market Dynamics
9.1 Thermal Pad for Board-Level Packaging Industry Trends
9.2 Thermal Pad for Board-Level Packaging Market Drivers
9.3 Thermal Pad for Board-Level Packaging Market Challenges
9.4 Thermal Pad for Board-Level Packaging Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Thermal Pad for Board-Level Packaging Market Value by Type, (US$ Million) & (2023 VS 2030)
 Table 2. Global Thermal Pad for Board-Level Packaging Market Value by Application, (US$ Million) & (2023 VS 2030)
 Table 3. Global Thermal Pad for Board-Level Packaging Production Capacity (K Sqm) by Manufacturers in 2023
 Table 4. Global Thermal Pad for Board-Level Packaging Production by Manufacturers (2019-2024) & (K Sqm)
 Table 5. Global Thermal Pad for Board-Level Packaging Production Market Share by Manufacturers (2019-2024)
 Table 6. Global Thermal Pad for Board-Level Packaging Production Value by Manufacturers (2019-2024) & (US$ Million)
 Table 7. Global Thermal Pad for Board-Level Packaging Production Value Share by Manufacturers (2019-2024)
 Table 8. Global Key Players of Thermal Pad for Board-Level Packaging, Industry Ranking, 2022 VS 2023
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Thermal Pad for Board-Level Packaging as of 2023)
 Table 10. Global Market Thermal Pad for Board-Level Packaging Average Price by Manufacturers (US$/Sq m) & (2019-2024)
 Table 11. Global Key Manufacturers of Thermal Pad for Board-Level Packaging, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Thermal Pad for Board-Level Packaging, Product Offered and Application
 Table 13. Global Key Manufacturers of Thermal Pad for Board-Level Packaging, Date of Enter into This Industry
 Table 14. Global Thermal Pad for Board-Level Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Thermal Pad for Board-Level Packaging Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
 Table 17. Global Thermal Pad for Board-Level Packaging Production Value (US$ Million) by Region (2019-2024)
 Table 18. Global Thermal Pad for Board-Level Packaging Production Value Market Share by Region (2019-2024)
 Table 19. Global Thermal Pad for Board-Level Packaging Production Value (US$ Million) Forecast by Region (2025-2030)
 Table 20. Global Thermal Pad for Board-Level Packaging Production Value Market Share Forecast by Region (2025-2030)
 Table 21. Global Thermal Pad for Board-Level Packaging Production Comparison by Region: 2019 VS 2023 VS 2030 (K Sqm)
 Table 22. Global Thermal Pad for Board-Level Packaging Production (K Sqm) by Region (2019-2024)
 Table 23. Global Thermal Pad for Board-Level Packaging Production Market Share by Region (2019-2024)
 Table 24. Global Thermal Pad for Board-Level Packaging Production (K Sqm) Forecast by Region (2025-2030)
 Table 25. Global Thermal Pad for Board-Level Packaging Production Market Share Forecast by Region (2025-2030)
 Table 26. Global Thermal Pad for Board-Level Packaging Market Average Price (US$/Sq m) by Region (2019-2024)
 Table 27. Global Thermal Pad for Board-Level Packaging Market Average Price (US$/Sq m) by Region (2025-2030)
 Table 28. Global Thermal Pad for Board-Level Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K Sqm)
 Table 29. Global Thermal Pad for Board-Level Packaging Consumption by Region (2019-2024) & (K Sqm)
 Table 30. Global Thermal Pad for Board-Level Packaging Consumption Market Share by Region (2019-2024)
 Table 31. Global Thermal Pad for Board-Level Packaging Forecasted Consumption by Region (2025-2030) & (K Sqm)
 Table 32. Global Thermal Pad for Board-Level Packaging Forecasted Consumption Market Share by Region (2019-2024)
 Table 33. North America Thermal Pad for Board-Level Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Sqm)
 Table 34. North America Thermal Pad for Board-Level Packaging Consumption by Country (2019-2024) & (K Sqm)
 Table 35. North America Thermal Pad for Board-Level Packaging Consumption by Country (2025-2030) & (K Sqm)
 Table 36. Europe Thermal Pad for Board-Level Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Sqm)
 Table 37. Europe Thermal Pad for Board-Level Packaging Consumption by Country (2019-2024) & (K Sqm)
 Table 38. Europe Thermal Pad for Board-Level Packaging Consumption by Country (2025-2030) & (K Sqm)
 Table 39. Asia Pacific Thermal Pad for Board-Level Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Sqm)
 Table 40. Asia Pacific Thermal Pad for Board-Level Packaging Consumption by Region (2019-2024) & (K Sqm)
 Table 41. Asia Pacific Thermal Pad for Board-Level Packaging Consumption by Region (2025-2030) & (K Sqm)
 Table 42. Latin America, Middle East & Africa Thermal Pad for Board-Level Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Sqm)
 Table 43. Latin America, Middle East & Africa Thermal Pad for Board-Level Packaging Consumption by Country (2019-2024) & (K Sqm)
 Table 44. Latin America, Middle East & Africa Thermal Pad for Board-Level Packaging Consumption by Country (2025-2030) & (K Sqm)
 Table 45. Global Thermal Pad for Board-Level Packaging Production (K Sqm) by Type (2019-2024)
 Table 46. Global Thermal Pad for Board-Level Packaging Production (K Sqm) by Type (2025-2030)
 Table 47. Global Thermal Pad for Board-Level Packaging Production Market Share by Type (2019-2024)
 Table 48. Global Thermal Pad for Board-Level Packaging Production Market Share by Type (2025-2030)
 Table 49. Global Thermal Pad for Board-Level Packaging Production Value (US$ Million) by Type (2019-2024)
 Table 50. Global Thermal Pad for Board-Level Packaging Production Value (US$ Million) by Type (2025-2030)
 Table 51. Global Thermal Pad for Board-Level Packaging Production Value Market Share by Type (2019-2024)
 Table 52. Global Thermal Pad for Board-Level Packaging Production Value Market Share by Type (2025-2030)
 Table 53. Global Thermal Pad for Board-Level Packaging Price (US$/Sq m) by Type (2019-2024)
 Table 54. Global Thermal Pad for Board-Level Packaging Price (US$/Sq m) by Type (2025-2030)
 Table 55. Global Thermal Pad for Board-Level Packaging Production (K Sqm) by Application (2019-2024)
 Table 56. Global Thermal Pad for Board-Level Packaging Production (K Sqm) by Application (2025-2030)
 Table 57. Global Thermal Pad for Board-Level Packaging Production Market Share by Application (2019-2024)
 Table 58. Global Thermal Pad for Board-Level Packaging Production Market Share by Application (2025-2030)
 Table 59. Global Thermal Pad for Board-Level Packaging Production Value (US$ Million) by Application (2019-2024)
 Table 60. Global Thermal Pad for Board-Level Packaging Production Value (US$ Million) by Application (2025-2030)
 Table 61. Global Thermal Pad for Board-Level Packaging Production Value Market Share by Application (2019-2024)
 Table 62. Global Thermal Pad for Board-Level Packaging Production Value Market Share by Application (2025-2030)
 Table 63. Global Thermal Pad for Board-Level Packaging Price (US$/Sq m) by Application (2019-2024)
 Table 64. Global Thermal Pad for Board-Level Packaging Price (US$/Sq m) by Application (2025-2030)
 Table 65. Henkel Adhesives Thermal Pad for Board-Level Packaging Company Information
 Table 66. Henkel Adhesives Thermal Pad for Board-Level Packaging Specification and Application
 Table 67. Henkel Adhesives Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 68. Henkel Adhesives Main Business and Markets Served
 Table 69. Henkel Adhesives Recent Developments/Updates
 Table 70. DuPont Thermal Pad for Board-Level Packaging Company Information
 Table 71. DuPont Thermal Pad for Board-Level Packaging Specification and Application
 Table 72. DuPont Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 73. DuPont Main Business and Markets Served
 Table 74. DuPont Recent Developments/Updates
 Table 75. 3M Thermal Pad for Board-Level Packaging Company Information
 Table 76. 3M Thermal Pad for Board-Level Packaging Specification and Application
 Table 77. 3M Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 78. 3M Main Business and Markets Served
 Table 79. 3M Recent Developments/Updates
 Table 80. Rogers Corporation Thermal Pad for Board-Level Packaging Company Information
 Table 81. Rogers Corporation Thermal Pad for Board-Level Packaging Specification and Application
 Table 82. Rogers Corporation Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 83. Rogers Corporation Main Business and Markets Served
 Table 84. Rogers Corporation Recent Developments/Updates
 Table 85. Shin-Etsu Chemical Thermal Pad for Board-Level Packaging Company Information
 Table 86. Shin-Etsu Chemical Thermal Pad for Board-Level Packaging Specification and Application
 Table 87. Shin-Etsu Chemical Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 88. Shin-Etsu Chemical Main Business and Markets Served
 Table 89. Shin-Etsu Chemical Recent Developments/Updates
 Table 90. Fujipoly Thermal Pad for Board-Level Packaging Company Information
 Table 91. Fujipoly Thermal Pad for Board-Level Packaging Specification and Application
 Table 92. Fujipoly Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 93. Fujipoly Main Business and Markets Served
 Table 94. Fujipoly Recent Developments/Updates
 Table 95. Dow Thermal Pad for Board-Level Packaging Company Information
 Table 96. Dow Thermal Pad for Board-Level Packaging Specification and Application
 Table 97. Dow Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 98. Dow Main Business and Markets Served
 Table 99. Dow Recent Developments/Updates
 Table 100. Honeywell Thermal Pad for Board-Level Packaging Company Information
 Table 101. Honeywell Thermal Pad for Board-Level Packaging Specification and Application
 Table 102. Honeywell Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 103. Honeywell Main Business and Markets Served
 Table 104. Honeywell Recent Developments/Updates
 Table 105. Zhsio Thermal Pad for Board-Level Packaging Company Information
 Table 106. Zhsio Thermal Pad for Board-Level Packaging Specification and Application
 Table 107. Zhsio Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 108. Zhsio Main Business and Markets Served
 Table 109. Zhsio Recent Developments/Updates
 Table 110. Darbond Thermal Pad for Board-Level Packaging Company Information
 Table 111. Darbond Thermal Pad for Board-Level Packaging Specification and Application
 Table 112. Darbond Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 113. Darbond Main Business and Markets Served
 Table 114. Darbond Recent Developments/Updates
 Table 115. Goldlink Tongda Electronics Thermal Pad for Board-Level Packaging Company Information
 Table 116. Goldlink Tongda Electronics Thermal Pad for Board-Level Packaging Specification and Application
 Table 117. Goldlink Tongda Electronics Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 118. Goldlink Tongda Electronics Main Business and Markets Served
 Table 119. Goldlink Tongda Electronics Recent Developments/Updates
 Table 120. Cybrid Technologies Thermal Pad for Board-Level Packaging Company Information
 Table 121. Cybrid Technologies Thermal Pad for Board-Level Packaging Specification and Application
 Table 122. Cybrid Technologies Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 123. Cybrid Technologies Main Business and Markets Served
 Table 124. Cybrid Technologies Recent Developments/Updates
 Table 125. Aok Technologies Thermal Pad for Board-Level Packaging Company Information
 Table 126. Aok Technologies Thermal Pad for Board-Level Packaging Specification and Application
 Table 127. Aok Technologies Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 128. Aok Technologies Main Business and Markets Served
 Table 129. Aok Technologies Recent Developments/Updates
 Table 130. Bornsun Composite Materials Thermal Pad for Board-Level Packaging Company Information
 Table 131. Bornsun Composite Materials Thermal Pad for Board-Level Packaging Specification and Application
 Table 132. Bornsun Composite Materials Thermal Pad for Board-Level Packaging Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2019-2024)
 Table 133. Bornsun Composite Materials Main Business and Markets Served
 Table 134. Bornsun Composite Materials Recent Developments/Updates
 Table 135. Key Raw Materials Lists
 Table 136. Raw Materials Key Suppliers Lists
 Table 137. Thermal Pad for Board-Level Packaging Distributors List
 Table 138. Thermal Pad for Board-Level Packaging Customers List
 Table 139. Thermal Pad for Board-Level Packaging Market Trends
 Table 140. Thermal Pad for Board-Level Packaging Market Drivers
 Table 141. Thermal Pad for Board-Level Packaging Market Challenges
 Table 142. Thermal Pad for Board-Level Packaging Market Restraints
 Table 143. Research Programs/Design for This Report
 Table 144. Key Data Information from Secondary Sources
 Table 145. Key Data Information from Primary Sources
 Table 146. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Thermal Pad for Board-Level Packaging
 Figure 2. Global Thermal Pad for Board-Level Packaging Market Value by Type, (US$ Million) & (2023 VS 2030)
 Figure 3. Global Thermal Pad for Board-Level Packaging Market Share by Type: 2023 VS 2030
 Figure 4. Silicone Thermal Pad Product Picture
 Figure 5. Ceramic Thermal Pad Product Picture
 Figure 6. Global Thermal Pad for Board-Level Packaging Market Value by Application, (US$ Million) & (2023 VS 2030)
 Figure 7. Global Thermal Pad for Board-Level Packaging Market Share by Application: 2023 VS 2030
 Figure 8. PCB
 Figure 9. LED
 Figure 10. Others
 Figure 11. Global Thermal Pad for Board-Level Packaging Production Value (US$ Million), 2019 VS 2023 VS 2030
 Figure 12. Global Thermal Pad for Board-Level Packaging Production Value (US$ Million) & (2019-2030)
 Figure 13. Global Thermal Pad for Board-Level Packaging Production Capacity (K Sqm) & (2019-2030)
 Figure 14. Global Thermal Pad for Board-Level Packaging Production (K Sqm) & (2019-2030)
 Figure 15. Global Thermal Pad for Board-Level Packaging Average Price (US$/Sq m) & (2019-2030)
 Figure 16. Thermal Pad for Board-Level Packaging Report Years Considered
 Figure 17. Thermal Pad for Board-Level Packaging Production Share by Manufacturers in 2023
 Figure 18. Thermal Pad for Board-Level Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
 Figure 19. The Global 5 and 10 Largest Players: Market Share by Thermal Pad for Board-Level Packaging Revenue in 2023
 Figure 20. Global Thermal Pad for Board-Level Packaging Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
 Figure 21. Global Thermal Pad for Board-Level Packaging Production Value Market Share by Region: 2019 VS 2023 VS 2030
 Figure 22. Global Thermal Pad for Board-Level Packaging Production Comparison by Region: 2019 VS 2023 VS 2030 (K Sqm)
 Figure 23. Global Thermal Pad for Board-Level Packaging Production Market Share by Region: 2019 VS 2023 VS 2030
 Figure 24. North America Thermal Pad for Board-Level Packaging Production Value (US$ Million) Growth Rate (2019-2030)
 Figure 25. Europe Thermal Pad for Board-Level Packaging Production Value (US$ Million) Growth Rate (2019-2030)
 Figure 26. China Thermal Pad for Board-Level Packaging Production Value (US$ Million) Growth Rate (2019-2030)
 Figure 27. Japan Thermal Pad for Board-Level Packaging Production Value (US$ Million) Growth Rate (2019-2030)
 Figure 28. Global Thermal Pad for Board-Level Packaging Consumption by Region: 2019 VS 2023 VS 2030 (K Sqm)
 Figure 29. Global Thermal Pad for Board-Level Packaging Consumption Market Share by Region: 2019 VS 2023 VS 2030
 Figure 30. North America Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 31. North America Thermal Pad for Board-Level Packaging Consumption Market Share by Country (2019-2030)
 Figure 32. U.S. Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 33. Canada Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 34. Europe Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 35. Europe Thermal Pad for Board-Level Packaging Consumption Market Share by Country (2019-2030)
 Figure 36. Germany Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 37. France Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 38. U.K. Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 39. Italy Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 40. Russia Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 41. Asia Pacific Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 42. Asia Pacific Thermal Pad for Board-Level Packaging Consumption Market Share by Region (2025-2030)
 Figure 43. China Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 44. Japan Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 45. South Korea Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 46. China Taiwan Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 47. Southeast Asia Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 48. India Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 49. Latin America, Middle East & Africa Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 50. Latin America, Middle East & Africa Thermal Pad for Board-Level Packaging Consumption Market Share by Country (2019-2030)
 Figure 51. Mexico Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 52. Brazil Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 53. Turkey Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 54. GCC Countries Thermal Pad for Board-Level Packaging Consumption and Growth Rate (2019-2030) & (K Sqm)
 Figure 55. Global Production Market Share of Thermal Pad for Board-Level Packaging by Type (2019-2030)
 Figure 56. Global Production Value Market Share of Thermal Pad for Board-Level Packaging by Type (2019-2030)
 Figure 57. Global Thermal Pad for Board-Level Packaging Price (US$/Sq m) by Type (2019-2030)
 Figure 58. Global Production Market Share of Thermal Pad for Board-Level Packaging by Application (2019-2030)
 Figure 59. Global Production Value Market Share of Thermal Pad for Board-Level Packaging by Application (2019-2030)
 Figure 60. Global Thermal Pad for Board-Level Packaging Price (US$/Sq m) by Application (2019-2030)
 Figure 61. Thermal Pad for Board-Level Packaging Value Chain
 Figure 62. Thermal Pad for Board-Level Packaging Production Process
 Figure 63. Channels of Distribution (Direct Vs Distribution)
 Figure 64. Bottom-up and Top-down Approaches for This Report
 Figure 65. Data Triangulation
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