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Global 3D IC and 2.5D IC Packaging Market Research Report 2025
Published Date: July 2025
|
Report Code: QYRE-Auto-1M7293
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Global 3D IC and 2 5D IC Packaging Market Insights and Forecast to 2028
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Global 3D IC and 2.5D IC Packaging Market Research Report 2025

Code: QYRE-Auto-1M7293
Report
July 2025
Pages:83
QYResearch
Buy Now with 15% Discount
DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
Taiwan Semiconductor

3D IC and 2.5D IC Packaging Market Size

The global market for 3D IC and 2.5D IC Packaging was valued at US$ 131680 million in the year 2024 and is projected to reach a revised size of US$ 345490 million by 2031, growing at a CAGR of 15.0% during the forecast period.

3D IC and 2.5D IC Packaging Market

3D IC and 2.5D IC Packaging Market

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

Report Scope

This report aims to provide a comprehensive presentation of the global market for 3D IC and 2.5D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC and 2.5D IC Packaging.
The 3D IC and 2.5D IC Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global 3D IC and 2.5D IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D IC and 2.5D IC Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of 3D IC and 2.5D IC Packaging Market Report

Report Metric Details
Report Name 3D IC and 2.5D IC Packaging Market
Accounted market size in year US$ 131680 million
Forecasted market size in 2031 US$ 345490 million
CAGR 15.0%
Base Year year
Forecasted years 2025 - 2031
by Type
  • 3D Wafer-level Chip-scale Packaging
  • 3D TSV
  • 2.5D
by Application
  • Logic
  • Imaging & Optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Power
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Taiwan Semiconductor, Samsung Electronics, Toshiba Corp, Advanced Semiconductor Engineering, Amkor Technology
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of 3D IC and 2.5D IC Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of 3D IC and 2.5D IC Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of 3D IC and 2.5D IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is 3D IC and 2.5D IC Packaging Market growing?

Ans: The 3D IC and 2.5D IC Packaging Market witnessing a CAGR of 15.0% during the forecast period 2025-2031.

What is the 3D IC and 2.5D IC Packaging Market size in 2031?

Ans: The 3D IC and 2.5D IC Packaging Market size in 2031 will be US$ 345490 million.

What is the 3D IC and 2.5D IC Packaging Market share by region?

Ans: Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year.

Who are the main players in the 3D IC and 2.5D IC Packaging Market report?

Ans: The main players in the 3D IC and 2.5D IC Packaging Market are Taiwan Semiconductor, Samsung Electronics, Toshiba Corp, Advanced Semiconductor Engineering, Amkor Technology

What are the Application segmentation covered in the 3D IC and 2.5D IC Packaging Market report?

Ans: The Applications covered in the 3D IC and 2.5D IC Packaging Market report are Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power

What are the Type segmentation covered in the 3D IC and 2.5D IC Packaging Market report?

Ans: The Types covered in the 3D IC and 2.5D IC Packaging Market report are 3D Wafer-level Chip-scale Packaging, 3D TSV, 2.5D

1 3D IC and 2.5D IC Packaging Market Overview
1.1 Product Definition
1.2 3D IC and 2.5D IC Packaging by Type
1.2.1 Global 3D IC and 2.5D IC Packaging Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 3D Wafer-level Chip-scale Packaging
1.2.3 3D TSV
1.2.4 2.5D
1.3 3D IC and 2.5D IC Packaging by Application
1.3.1 Global 3D IC and 2.5D IC Packaging Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Logic
1.3.3 Imaging & Optoelectronics
1.3.4 Memory
1.3.5 MEMS/Sensors
1.3.6 LED
1.3.7 Power
1.4 Global Market Growth Prospects
1.4.1 Global 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global 3D IC and 2.5D IC Packaging Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global 3D IC and 2.5D IC Packaging Production Estimates and Forecasts (2020-2031)
1.4.4 Global 3D IC and 2.5D IC Packaging Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global 3D IC and 2.5D IC Packaging Production Market Share by Manufacturers (2020-2025)
2.2 Global 3D IC and 2.5D IC Packaging Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of 3D IC and 2.5D IC Packaging, Industry Ranking, 2023 VS 2024
2.4 Global 3D IC and 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global 3D IC and 2.5D IC Packaging Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Product Offered and Application
2.8 Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Date of Enter into This Industry
2.9 3D IC and 2.5D IC Packaging Market Competitive Situation and Trends
2.9.1 3D IC and 2.5D IC Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest 3D IC and 2.5D IC Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 3D IC and 2.5D IC Packaging Production by Region
3.1 Global 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global 3D IC and 2.5D IC Packaging Production Value by Region (2020-2031)
3.2.1 Global 3D IC and 2.5D IC Packaging Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of 3D IC and 2.5D IC Packaging by Region (2026-2031)
3.3 Global 3D IC and 2.5D IC Packaging Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global 3D IC and 2.5D IC Packaging Production Volume by Region (2020-2031)
3.4.1 Global 3D IC and 2.5D IC Packaging Production by Region (2020-2025)
3.4.2 Global Forecasted Production of 3D IC and 2.5D IC Packaging by Region (2026-2031)
3.5 Global 3D IC and 2.5D IC Packaging Market Price Analysis by Region (2020-2025)
3.6 Global 3D IC and 2.5D IC Packaging Production and Value, Year-over-Year Growth
3.6.1 North America 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.3 China 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2020-2031)
4 3D IC and 2.5D IC Packaging Consumption by Region
4.1 Global 3D IC and 2.5D IC Packaging Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global 3D IC and 2.5D IC Packaging Consumption by Region (2020-2031)
4.2.1 Global 3D IC and 2.5D IC Packaging Consumption by Region (2020-2025)
4.2.2 Global 3D IC and 2.5D IC Packaging Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America 3D IC and 2.5D IC Packaging Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe 3D IC and 2.5D IC Packaging Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific 3D IC and 2.5D IC Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global 3D IC and 2.5D IC Packaging Production by Type (2020-2031)
5.1.1 Global 3D IC and 2.5D IC Packaging Production by Type (2020-2025)
5.1.2 Global 3D IC and 2.5D IC Packaging Production by Type (2026-2031)
5.1.3 Global 3D IC and 2.5D IC Packaging Production Market Share by Type (2020-2031)
5.2 Global 3D IC and 2.5D IC Packaging Production Value by Type (2020-2031)
5.2.1 Global 3D IC and 2.5D IC Packaging Production Value by Type (2020-2025)
5.2.2 Global 3D IC and 2.5D IC Packaging Production Value by Type (2026-2031)
5.2.3 Global 3D IC and 2.5D IC Packaging Production Value Market Share by Type (2020-2031)
5.3 Global 3D IC and 2.5D IC Packaging Price by Type (2020-2031)
6 Segment by Application
6.1 Global 3D IC and 2.5D IC Packaging Production by Application (2020-2031)
6.1.1 Global 3D IC and 2.5D IC Packaging Production by Application (2020-2025)
6.1.2 Global 3D IC and 2.5D IC Packaging Production by Application (2026-2031)
6.1.3 Global 3D IC and 2.5D IC Packaging Production Market Share by Application (2020-2031)
6.2 Global 3D IC and 2.5D IC Packaging Production Value by Application (2020-2031)
6.2.1 Global 3D IC and 2.5D IC Packaging Production Value by Application (2020-2025)
6.2.2 Global 3D IC and 2.5D IC Packaging Production Value by Application (2026-2031)
6.2.3 Global 3D IC and 2.5D IC Packaging Production Value Market Share by Application (2020-2031)
6.3 Global 3D IC and 2.5D IC Packaging Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Taiwan Semiconductor
7.1.1 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Company Information
7.1.2 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product Portfolio
7.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Taiwan Semiconductor Main Business and Markets Served
7.1.5 Taiwan Semiconductor Recent Developments/Updates
7.2 Samsung Electronics
7.2.1 Samsung Electronics 3D IC and 2.5D IC Packaging Company Information
7.2.2 Samsung Electronics 3D IC and 2.5D IC Packaging Product Portfolio
7.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Samsung Electronics Main Business and Markets Served
7.2.5 Samsung Electronics Recent Developments/Updates
7.3 Toshiba Corp
7.3.1 Toshiba Corp 3D IC and 2.5D IC Packaging Company Information
7.3.2 Toshiba Corp 3D IC and 2.5D IC Packaging Product Portfolio
7.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Toshiba Corp Main Business and Markets Served
7.3.5 Toshiba Corp Recent Developments/Updates
7.4 Advanced Semiconductor Engineering
7.4.1 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Company Information
7.4.2 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product Portfolio
7.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Advanced Semiconductor Engineering Main Business and Markets Served
7.4.5 Advanced Semiconductor Engineering Recent Developments/Updates
7.5 Amkor Technology
7.5.1 Amkor Technology 3D IC and 2.5D IC Packaging Company Information
7.5.2 Amkor Technology 3D IC and 2.5D IC Packaging Product Portfolio
7.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Amkor Technology Main Business and Markets Served
7.5.5 Amkor Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 3D IC and 2.5D IC Packaging Industry Chain Analysis
8.2 3D IC and 2.5D IC Packaging Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 3D IC and 2.5D IC Packaging Production Mode & Process Analysis
8.4 3D IC and 2.5D IC Packaging Sales and Marketing
8.4.1 3D IC and 2.5D IC Packaging Sales Channels
8.4.2 3D IC and 2.5D IC Packaging Distributors
8.5 3D IC and 2.5D IC Packaging Customer Analysis
9 3D IC and 2.5D IC Packaging Market Dynamics
9.1 3D IC and 2.5D IC Packaging Industry Trends
9.2 3D IC and 2.5D IC Packaging Market Drivers
9.3 3D IC and 2.5D IC Packaging Market Challenges
9.4 3D IC and 2.5D IC Packaging Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
Taiwan Semiconductor
List of Tables
 Table 1. Global 3D IC and 2.5D IC Packaging Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global 3D IC and 2.5D IC Packaging Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global 3D IC and 2.5D IC Packaging Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global 3D IC and 2.5D IC Packaging Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global 3D IC and 2.5D IC Packaging Production Market Share by Manufacturers (2020-2025)
 Table 6. Global 3D IC and 2.5D IC Packaging Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global 3D IC and 2.5D IC Packaging Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of 3D IC and 2.5D IC Packaging, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in 3D IC and 2.5D IC Packaging as of 2024)
 Table 10. Global Market 3D IC and 2.5D IC Packaging Average Price by Manufacturers (K USD/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Product Offered and Application
 Table 13. Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Date of Enter into This Industry
 Table 14. Global 3D IC and 2.5D IC Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global 3D IC and 2.5D IC Packaging Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global 3D IC and 2.5D IC Packaging Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global 3D IC and 2.5D IC Packaging Production Value Market Share by Region (2020-2025)
 Table 19. Global 3D IC and 2.5D IC Packaging Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global 3D IC and 2.5D IC Packaging Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global 3D IC and 2.5D IC Packaging Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global 3D IC and 2.5D IC Packaging Production (K Units) by Region (2020-2025)
 Table 23. Global 3D IC and 2.5D IC Packaging Production Market Share by Region (2020-2025)
 Table 24. Global 3D IC and 2.5D IC Packaging Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global 3D IC and 2.5D IC Packaging Production Market Share Forecast by Region (2026-2031)
 Table 26. Global 3D IC and 2.5D IC Packaging Market Average Price (K USD/Unit) by Region (2020-2025)
 Table 27. Global 3D IC and 2.5D IC Packaging Market Average Price (K USD/Unit) by Region (2026-2031)
 Table 28. Global 3D IC and 2.5D IC Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global 3D IC and 2.5D IC Packaging Consumption by Region (2020-2025) & (K Units)
 Table 30. Global 3D IC and 2.5D IC Packaging Consumption Market Share by Region (2020-2025)
 Table 31. Global 3D IC and 2.5D IC Packaging Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global 3D IC and 2.5D IC Packaging Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America 3D IC and 2.5D IC Packaging Consumption by Country (2020-2025) & (K Units)
 Table 35. North America 3D IC and 2.5D IC Packaging Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe 3D IC and 2.5D IC Packaging Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe 3D IC and 2.5D IC Packaging Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific 3D IC and 2.5D IC Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption by Country (2026-2031) & (K Units)
 Table 45. Global 3D IC and 2.5D IC Packaging Production (K Units) by Type (2020-2025)
 Table 46. Global 3D IC and 2.5D IC Packaging Production (K Units) by Type (2026-2031)
 Table 47. Global 3D IC and 2.5D IC Packaging Production Market Share by Type (2020-2025)
 Table 48. Global 3D IC and 2.5D IC Packaging Production Market Share by Type (2026-2031)
 Table 49. Global 3D IC and 2.5D IC Packaging Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global 3D IC and 2.5D IC Packaging Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global 3D IC and 2.5D IC Packaging Production Value Market Share by Type (2020-2025)
 Table 52. Global 3D IC and 2.5D IC Packaging Production Value Market Share by Type (2026-2031)
 Table 53. Global 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Type (2020-2025)
 Table 54. Global 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Type (2026-2031)
 Table 55. Global 3D IC and 2.5D IC Packaging Production (K Units) by Application (2020-2025)
 Table 56. Global 3D IC and 2.5D IC Packaging Production (K Units) by Application (2026-2031)
 Table 57. Global 3D IC and 2.5D IC Packaging Production Market Share by Application (2020-2025)
 Table 58. Global 3D IC and 2.5D IC Packaging Production Market Share by Application (2026-2031)
 Table 59. Global 3D IC and 2.5D IC Packaging Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global 3D IC and 2.5D IC Packaging Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global 3D IC and 2.5D IC Packaging Production Value Market Share by Application (2020-2025)
 Table 62. Global 3D IC and 2.5D IC Packaging Production Value Market Share by Application (2026-2031)
 Table 63. Global 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Application (2020-2025)
 Table 64. Global 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Application (2026-2031)
 Table 65. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Company Information
 Table 66. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Specification and Application
 Table 67. Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production (K Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 68. Taiwan Semiconductor Main Business and Markets Served
 Table 69. Taiwan Semiconductor Recent Developments/Updates
 Table 70. Samsung Electronics 3D IC and 2.5D IC Packaging Company Information
 Table 71. Samsung Electronics 3D IC and 2.5D IC Packaging Specification and Application
 Table 72. Samsung Electronics 3D IC and 2.5D IC Packaging Production (K Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 73. Samsung Electronics Main Business and Markets Served
 Table 74. Samsung Electronics Recent Developments/Updates
 Table 75. Toshiba Corp 3D IC and 2.5D IC Packaging Company Information
 Table 76. Toshiba Corp 3D IC and 2.5D IC Packaging Specification and Application
 Table 77. Toshiba Corp 3D IC and 2.5D IC Packaging Production (K Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 78. Toshiba Corp Main Business and Markets Served
 Table 79. Toshiba Corp Recent Developments/Updates
 Table 80. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Company Information
 Table 81. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Specification and Application
 Table 82. Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production (K Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 83. Advanced Semiconductor Engineering Main Business and Markets Served
 Table 84. Advanced Semiconductor Engineering Recent Developments/Updates
 Table 85. Amkor Technology 3D IC and 2.5D IC Packaging Company Information
 Table 86. Amkor Technology 3D IC and 2.5D IC Packaging Specification and Application
 Table 87. Amkor Technology 3D IC and 2.5D IC Packaging Production (K Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 88. Amkor Technology Main Business and Markets Served
 Table 89. Amkor Technology Recent Developments/Updates
 Table 90. Key Raw Materials Lists
 Table 91. Raw Materials Key Suppliers Lists
 Table 92. 3D IC and 2.5D IC Packaging Distributors List
 Table 93. 3D IC and 2.5D IC Packaging Customers List
 Table 94. 3D IC and 2.5D IC Packaging Market Trends
 Table 95. 3D IC and 2.5D IC Packaging Market Drivers
 Table 96. 3D IC and 2.5D IC Packaging Market Challenges
 Table 97. 3D IC and 2.5D IC Packaging Market Restraints
 Table 98. Research Programs/Design for This Report
 Table 99. Key Data Information from Secondary Sources
 Table 100. Key Data Information from Primary Sources
 Table 101. Authors List of This Report


List of Figures
 Figure 1. Product Picture of 3D IC and 2.5D IC Packaging
 Figure 2. Global 3D IC and 2.5D IC Packaging Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global 3D IC and 2.5D IC Packaging Market Share by Type: 2024 VS 2031
 Figure 4. 3D Wafer-level Chip-scale Packaging Product Picture
 Figure 5. 3D TSV Product Picture
 Figure 6. 2.5D Product Picture
 Figure 7. Global 3D IC and 2.5D IC Packaging Market Value by Application, (US$ Million) & (2020-2031)
 Figure 8. Global 3D IC and 2.5D IC Packaging Market Share by Application: 2024 VS 2031
 Figure 9. Logic
 Figure 10. Imaging & Optoelectronics
 Figure 11. Memory
 Figure 12. MEMS/Sensors
 Figure 13. LED
 Figure 14. Power
 Figure 15. Global 3D IC and 2.5D IC Packaging Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 16. Global 3D IC and 2.5D IC Packaging Production Value (US$ Million) & (2020-2031)
 Figure 17. Global 3D IC and 2.5D IC Packaging Production Capacity (K Units) & (2020-2031)
 Figure 18. Global 3D IC and 2.5D IC Packaging Production (K Units) & (2020-2031)
 Figure 19. Global 3D IC and 2.5D IC Packaging Average Price (K USD/Unit) & (2020-2031)
 Figure 20. 3D IC and 2.5D IC Packaging Report Years Considered
 Figure 21. 3D IC and 2.5D IC Packaging Production Share by Manufacturers in 2024
 Figure 22. Global 3D IC and 2.5D IC Packaging Production Value Share by Manufacturers (2024)
 Figure 23. 3D IC and 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 24. The Global 5 and 10 Largest Players: Market Share by 3D IC and 2.5D IC Packaging Revenue in 2024
 Figure 25. Global 3D IC and 2.5D IC Packaging Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 26. Global 3D IC and 2.5D IC Packaging Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 27. Global 3D IC and 2.5D IC Packaging Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 28. Global 3D IC and 2.5D IC Packaging Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 29. North America 3D IC and 2.5D IC Packaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Europe 3D IC and 2.5D IC Packaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. China 3D IC and 2.5D IC Packaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. Japan 3D IC and 2.5D IC Packaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 33. South Korea 3D IC and 2.5D IC Packaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 34. Global 3D IC and 2.5D IC Packaging Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 35. Global 3D IC and 2.5D IC Packaging Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 36. North America 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 37. North America 3D IC and 2.5D IC Packaging Consumption Market Share by Country (2020-2031)
 Figure 38. U.S. 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 39. Canada 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 40. Europe 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 41. Europe 3D IC and 2.5D IC Packaging Consumption Market Share by Country (2020-2031)
 Figure 42. Germany 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. France 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. U.K. 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. Italy 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 46. Netherlands 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Asia Pacific 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 48. Asia Pacific 3D IC and 2.5D IC Packaging Consumption Market Share by Region (2020-2031)
 Figure 49. China 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. Japan 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 51. South Korea 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. China Taiwan 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. Southeast Asia 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 54. India 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 56. Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption Market Share by Country (2020-2031)
 Figure 57. Mexico 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 58. Brazil 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 59. Israel 3D IC and 2.5D IC Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 60. Global Production Market Share of 3D IC and 2.5D IC Packaging by Type (2020-2031)
 Figure 61. Global Production Value Market Share of 3D IC and 2.5D IC Packaging by Type (2020-2031)
 Figure 62. Global 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Type (2020-2031)
 Figure 63. Global Production Market Share of 3D IC and 2.5D IC Packaging by Application (2020-2031)
 Figure 64. Global Production Value Market Share of 3D IC and 2.5D IC Packaging by Application (2020-2031)
 Figure 65. Global 3D IC and 2.5D IC Packaging Price (K USD/Unit) by Application (2020-2031)
 Figure 66. 3D IC and 2.5D IC Packaging Value Chain
 Figure 67. Channels of Distribution (Direct Vs Distribution)
 Figure 68. Bottom-up and Top-down Approaches for This Report
 Figure 69. Data Triangulation
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