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Global Wafer Blade Cutting Machine Market Research Report 2025

Published Date: February 2025

Report Code: QYRE-Auto-1P12810

Global Wafer Blade Cutting Machine Market Research Report 2022

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Global Wafer Blade Cutting Machine Market Research Report 2025

Code: QYRE-Auto-1P12810

Report

February 2025

Pages:91

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Disco

Tokyo Seimitsu

GL Tech Co Ltd

ASM

CETC Electronics Equipment Group Co., Ltd.

Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.

Hi-TESI

TENSUN

Shenyang Heyan Technology Co., Ltd.

Synova

Wafer Blade Cutting Machine Market

The global market for Wafer Blade Cutting Machine was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Wafer Blade Cutting Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Blade Cutting Machine.

The Wafer Blade Cutting Machine market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer Blade Cutting Machine market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Wafer Blade Cutting Machine manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Wafer Blade Cutting Machine Market Report

Report Metric	Details
Report Name	Wafer Blade Cutting Machine Market
by Type	150mm Wafer 200mm Wafer 300mm Wafer
by Application	Pure Foundry IDM OSAT LED Photovoltaic
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd., Hi-TESI, Tensun
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Blade Cutting Machine manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Blade Cutting Machine by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Blade Cutting Machine in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

What is the Wafer Blade Cutting Machine Market share by region?

Ans: North America, Europe and Japan, have a combined market share of 23%.

Who are the main players in the Wafer Blade Cutting Machine Market report?

Ans: The main players in the Wafer Blade Cutting Machine Market are DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd., Hi-TESI, Tensun

What are the Application segmentation covered in the Wafer Blade Cutting Machine Market report?

Ans: The Applications covered in the Wafer Blade Cutting Machine Market report are Pure Foundry, IDM, OSAT, LED, Photovoltaic

What are the Type segmentation covered in the Wafer Blade Cutting Machine Market report?

Ans: The Types covered in the Wafer Blade Cutting Machine Market report are 150mm Wafer, 200mm Wafer, 300mm Wafer

1 Wafer Blade Cutting Machine Market Overview

1.1 Product Definition

1.2 Wafer Blade Cutting Machine by Type

1.2.1 Global Wafer Blade Cutting Machine Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 150mm Wafer

1.2.3 200mm Wafer

1.2.4 300mm Wafer

1.3 Wafer Blade Cutting Machine by Application

1.3.1 Global Wafer Blade Cutting Machine Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 Pure Foundry

1.3.3 IDM

1.3.4 OSAT

1.3.5 LED

1.3.6 Photovoltaic

1.4 Global Market Growth Prospects

1.4.1 Global Wafer Blade Cutting Machine Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Wafer Blade Cutting Machine Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Wafer Blade Cutting Machine Production Estimates and Forecasts (2020-2031)

1.4.4 Global Wafer Blade Cutting Machine Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Wafer Blade Cutting Machine Production Market Share by Manufacturers (2020-2025)

2.2 Global Wafer Blade Cutting Machine Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Wafer Blade Cutting Machine, Industry Ranking, 2023 VS 2024

2.4 Global Wafer Blade Cutting Machine Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Wafer Blade Cutting Machine Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Wafer Blade Cutting Machine, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Wafer Blade Cutting Machine, Product Offered and Application

2.8 Global Key Manufacturers of Wafer Blade Cutting Machine, Date of Enter into This Industry

2.9 Wafer Blade Cutting Machine Market Competitive Situation and Trends

2.9.1 Wafer Blade Cutting Machine Market Concentration Rate

2.9.2 Global 5 and 10 Largest Wafer Blade Cutting Machine Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Wafer Blade Cutting Machine Production by Region

3.1 Global Wafer Blade Cutting Machine Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Wafer Blade Cutting Machine Production Value by Region (2020-2031)

3.2.1 Global Wafer Blade Cutting Machine Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Wafer Blade Cutting Machine by Region (2026-2031)

3.3 Global Wafer Blade Cutting Machine Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Wafer Blade Cutting Machine Production Volume by Region (2020-2031)

3.4.1 Global Wafer Blade Cutting Machine Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Wafer Blade Cutting Machine by Region (2026-2031)

3.5 Global Wafer Blade Cutting Machine Market Price Analysis by Region (2020-2025)

3.6 Global Wafer Blade Cutting Machine Production and Value, Year-over-Year Growth

3.6.1 North America Wafer Blade Cutting Machine Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe Wafer Blade Cutting Machine Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Wafer Blade Cutting Machine Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan Wafer Blade Cutting Machine Production Value Estimates and Forecasts (2020-2031)

4 Wafer Blade Cutting Machine Consumption by Region

4.1 Global Wafer Blade Cutting Machine Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Wafer Blade Cutting Machine Consumption by Region (2020-2031)

4.2.1 Global Wafer Blade Cutting Machine Consumption by Region (2020-2025)

4.2.2 Global Wafer Blade Cutting Machine Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Wafer Blade Cutting Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Wafer Blade Cutting Machine Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Wafer Blade Cutting Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Wafer Blade Cutting Machine Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Wafer Blade Cutting Machine Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Wafer Blade Cutting Machine Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Wafer Blade Cutting Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Wafer Blade Cutting Machine Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global Wafer Blade Cutting Machine Production by Type (2020-2031)

5.1.1 Global Wafer Blade Cutting Machine Production by Type (2020-2025)

5.1.2 Global Wafer Blade Cutting Machine Production by Type (2026-2031)

5.1.3 Global Wafer Blade Cutting Machine Production Market Share by Type (2020-2031)

5.2 Global Wafer Blade Cutting Machine Production Value by Type (2020-2031)

5.2.1 Global Wafer Blade Cutting Machine Production Value by Type (2020-2025)

5.2.2 Global Wafer Blade Cutting Machine Production Value by Type (2026-2031)

5.2.3 Global Wafer Blade Cutting Machine Production Value Market Share by Type (2020-2031)

5.3 Global Wafer Blade Cutting Machine Price by Type (2020-2031)

6 Segment by Application

6.1 Global Wafer Blade Cutting Machine Production by Application (2020-2031)

6.1.1 Global Wafer Blade Cutting Machine Production by Application (2020-2025)

6.1.2 Global Wafer Blade Cutting Machine Production by Application (2026-2031)

6.1.3 Global Wafer Blade Cutting Machine Production Market Share by Application (2020-2031)

6.2 Global Wafer Blade Cutting Machine Production Value by Application (2020-2031)

6.2.1 Global Wafer Blade Cutting Machine Production Value by Application (2020-2025)

6.2.2 Global Wafer Blade Cutting Machine Production Value by Application (2026-2031)

6.2.3 Global Wafer Blade Cutting Machine Production Value Market Share by Application (2020-2031)

6.3 Global Wafer Blade Cutting Machine Price by Application (2020-2031)

7 Key Companies Profiled

7.1 DISCO

7.1.1 DISCO Wafer Blade Cutting Machine Company Information

7.1.2 DISCO Wafer Blade Cutting Machine Product Portfolio

7.1.3 DISCO Wafer Blade Cutting Machine Production, Value, Price and Gross Margin (2020-2025)

7.1.4 DISCO Main Business and Markets Served

7.1.5 DISCO Recent Developments/Updates

7.2 Tokyo Seimitsu

7.2.1 Tokyo Seimitsu Wafer Blade Cutting Machine Company Information

7.2.2 Tokyo Seimitsu Wafer Blade Cutting Machine Product Portfolio

7.2.3 Tokyo Seimitsu Wafer Blade Cutting Machine Production, Value, Price and Gross Margin (2020-2025)

7.2.4 Tokyo Seimitsu Main Business and Markets Served

7.2.5 Tokyo Seimitsu Recent Developments/Updates

7.3 GL Tech Co Ltd

7.3.1 GL Tech Co Ltd Wafer Blade Cutting Machine Company Information

7.3.2 GL Tech Co Ltd Wafer Blade Cutting Machine Product Portfolio

7.3.3 GL Tech Co Ltd Wafer Blade Cutting Machine Production, Value, Price and Gross Margin (2020-2025)

7.3.4 GL Tech Co Ltd Main Business and Markets Served

7.3.5 GL Tech Co Ltd Recent Developments/Updates

7.4 ASM

7.4.1 ASM Wafer Blade Cutting Machine Company Information

7.4.2 ASM Wafer Blade Cutting Machine Product Portfolio

7.4.3 ASM Wafer Blade Cutting Machine Production, Value, Price and Gross Margin (2020-2025)

7.4.4 ASM Main Business and Markets Served

7.4.5 ASM Recent Developments/Updates

7.5 Synova

7.5.1 Synova Wafer Blade Cutting Machine Company Information

7.5.2 Synova Wafer Blade Cutting Machine Product Portfolio

7.5.3 Synova Wafer Blade Cutting Machine Production, Value, Price and Gross Margin (2020-2025)

7.5.4 Synova Main Business and Markets Served

7.5.5 Synova Recent Developments/Updates

7.6 CETC Electronics Equipment Group Co., Ltd.

7.6.1 CETC Electronics Equipment Group Co., Ltd. Wafer Blade Cutting Machine Company Information

7.6.2 CETC Electronics Equipment Group Co., Ltd. Wafer Blade Cutting Machine Product Portfolio

7.6.3 CETC Electronics Equipment Group Co., Ltd. Wafer Blade Cutting Machine Production, Value, Price and Gross Margin (2020-2025)

7.6.4 CETC Electronics Equipment Group Co., Ltd. Main Business and Markets Served

7.6.5 CETC Electronics Equipment Group Co., Ltd. Recent Developments/Updates

7.7 Shenyang Heyan Technology Co., Ltd.

7.7.1 Shenyang Heyan Technology Co., Ltd. Wafer Blade Cutting Machine Company Information

7.7.2 Shenyang Heyan Technology Co., Ltd. Wafer Blade Cutting Machine Product Portfolio

7.7.3 Shenyang Heyan Technology Co., Ltd. Wafer Blade Cutting Machine Production, Value, Price and Gross Margin (2020-2025)

7.7.4 Shenyang Heyan Technology Co., Ltd. Main Business and Markets Served

7.7.5 Shenyang Heyan Technology Co., Ltd. Recent Developments/Updates

7.8 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.

7.8.1 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Blade Cutting Machine Company Information

7.8.2 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Blade Cutting Machine Product Portfolio

7.8.3 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Blade Cutting Machine Production, Value, Price and Gross Margin (2020-2025)

7.8.4 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Main Business and Markets Served

7.8.5 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Recent Developments/Updates

7.9 Hi-TESI

7.9.1 Hi-TESI Wafer Blade Cutting Machine Company Information

7.9.2 Hi-TESI Wafer Blade Cutting Machine Product Portfolio

7.9.3 Hi-TESI Wafer Blade Cutting Machine Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Hi-TESI Main Business and Markets Served

7.9.5 Hi-TESI Recent Developments/Updates

7.10 Tensun

7.10.1 Tensun Wafer Blade Cutting Machine Company Information

7.10.2 Tensun Wafer Blade Cutting Machine Product Portfolio

7.10.3 Tensun Wafer Blade Cutting Machine Production, Value, Price and Gross Margin (2020-2025)

7.10.4 Tensun Main Business and Markets Served

7.10.5 Tensun Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Wafer Blade Cutting Machine Industry Chain Analysis

8.2 Wafer Blade Cutting Machine Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Wafer Blade Cutting Machine Production Mode & Process Analysis

8.4 Wafer Blade Cutting Machine Sales and Marketing

8.4.1 Wafer Blade Cutting Machine Sales Channels

8.4.2 Wafer Blade Cutting Machine Distributors

8.5 Wafer Blade Cutting Machine Customer Analysis

9 Wafer Blade Cutting Machine Market Dynamics

9.1 Wafer Blade Cutting Machine Industry Trends

9.2 Wafer Blade Cutting Machine Market Drivers

9.3 Wafer Blade Cutting Machine Market Challenges

9.4 Wafer Blade Cutting Machine Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

Disco

Tokyo Seimitsu

GL Tech Co Ltd

ASM

CETC Electronics Equipment Group Co., Ltd.

Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.

Hi-TESI

TENSUN

Shenyang Heyan Technology Co., Ltd.

Synova

List of Tables

Table 1. Global Wafer Blade Cutting Machine Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Wafer Blade Cutting Machine Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Wafer Blade Cutting Machine Production Capacity (K Units) by Manufacturers in 2024

Table 4. Global Wafer Blade Cutting Machine Production by Manufacturers (2020-2025) & (K Units)

Table 5. Global Wafer Blade Cutting Machine Production Market Share by Manufacturers (2020-2025)

Table 6. Global Wafer Blade Cutting Machine Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Wafer Blade Cutting Machine Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Wafer Blade Cutting Machine, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Wafer Blade Cutting Machine as of 2024)

Table 10. Global Market Wafer Blade Cutting Machine Average Price by Manufacturers (US$/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of Wafer Blade Cutting Machine, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Wafer Blade Cutting Machine, Product Offered and Application

Table 13. Global Key Manufacturers of Wafer Blade Cutting Machine, Date of Enter into This Industry

Table 14. Global Wafer Blade Cutting Machine Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Wafer Blade Cutting Machine Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Wafer Blade Cutting Machine Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Wafer Blade Cutting Machine Production Value Market Share by Region (2020-2025)

Table 19. Global Wafer Blade Cutting Machine Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Wafer Blade Cutting Machine Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Wafer Blade Cutting Machine Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)

Table 22. Global Wafer Blade Cutting Machine Production (K Units) by Region (2020-2025)

Table 23. Global Wafer Blade Cutting Machine Production Market Share by Region (2020-2025)

Table 24. Global Wafer Blade Cutting Machine Production (K Units) Forecast by Region (2026-2031)

Table 25. Global Wafer Blade Cutting Machine Production Market Share Forecast by Region (2026-2031)

Table 26. Global Wafer Blade Cutting Machine Market Average Price (US$/Unit) by Region (2020-2025)

Table 27. Global Wafer Blade Cutting Machine Market Average Price (US$/Unit) by Region (2026-2031)

Table 28. Global Wafer Blade Cutting Machine Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)

Table 29. Global Wafer Blade Cutting Machine Consumption by Region (2020-2025) & (K Units)

Table 30. Global Wafer Blade Cutting Machine Consumption Market Share by Region (2020-2025)

Table 31. Global Wafer Blade Cutting Machine Forecasted Consumption by Region (2026-2031) & (K Units)

Table 32. Global Wafer Blade Cutting Machine Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Wafer Blade Cutting Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 34. North America Wafer Blade Cutting Machine Consumption by Country (2020-2025) & (K Units)

Table 35. North America Wafer Blade Cutting Machine Consumption by Country (2026-2031) & (K Units)

Table 36. Europe Wafer Blade Cutting Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 37. Europe Wafer Blade Cutting Machine Consumption by Country (2020-2025) & (K Units)

Table 38. Europe Wafer Blade Cutting Machine Consumption by Country (2026-2031) & (K Units)

Table 39. Asia Pacific Wafer Blade Cutting Machine Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)

Table 40. Asia Pacific Wafer Blade Cutting Machine Consumption by Region (2020-2025) & (K Units)

Table 41. Asia Pacific Wafer Blade Cutting Machine Consumption by Region (2026-2031) & (K Units)

Table 42. Latin America, Middle East & Africa Wafer Blade Cutting Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 43. Latin America, Middle East & Africa Wafer Blade Cutting Machine Consumption by Country (2020-2025) & (K Units)

Table 44. Latin America, Middle East & Africa Wafer Blade Cutting Machine Consumption by Country (2026-2031) & (K Units)

Table 45. Global Wafer Blade Cutting Machine Production (K Units) by Type (2020-2025)

Table 46. Global Wafer Blade Cutting Machine Production (K Units) by Type (2026-2031)

Table 47. Global Wafer Blade Cutting Machine Production Market Share by Type (2020-2025)

Table 48. Global Wafer Blade Cutting Machine Production Market Share by Type (2026-2031)

Table 49. Global Wafer Blade Cutting Machine Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Wafer Blade Cutting Machine Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Wafer Blade Cutting Machine Production Value Market Share by Type (2020-2025)

Table 52. Global Wafer Blade Cutting Machine Production Value Market Share by Type (2026-2031)

Table 53. Global Wafer Blade Cutting Machine Price (US$/Unit) by Type (2020-2025)

Table 54. Global Wafer Blade Cutting Machine Price (US$/Unit) by Type (2026-2031)

Table 55. Global Wafer Blade Cutting Machine Production (K Units) by Application (2020-2025)

Table 56. Global Wafer Blade Cutting Machine Production (K Units) by Application (2026-2031)

Table 57. Global Wafer Blade Cutting Machine Production Market Share by Application (2020-2025)

Table 58. Global Wafer Blade Cutting Machine Production Market Share by Application (2026-2031)

Table 59. Global Wafer Blade Cutting Machine Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Wafer Blade Cutting Machine Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Wafer Blade Cutting Machine Production Value Market Share by Application (2020-2025)

Table 62. Global Wafer Blade Cutting Machine Production Value Market Share by Application (2026-2031)

Table 63. Global Wafer Blade Cutting Machine Price (US$/Unit) by Application (2020-2025)

Table 64. Global Wafer Blade Cutting Machine Price (US$/Unit) by Application (2026-2031)

Table 65. DISCO Wafer Blade Cutting Machine Company Information

Table 66. DISCO Wafer Blade Cutting Machine Specification and Application

Table 67. DISCO Wafer Blade Cutting Machine Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 68. DISCO Main Business and Markets Served

Table 69. DISCO Recent Developments/Updates

Table 70. Tokyo Seimitsu Wafer Blade Cutting Machine Company Information

Table 71. Tokyo Seimitsu Wafer Blade Cutting Machine Specification and Application

Table 72. Tokyo Seimitsu Wafer Blade Cutting Machine Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 73. Tokyo Seimitsu Main Business and Markets Served

Table 74. Tokyo Seimitsu Recent Developments/Updates

Table 75. GL Tech Co Ltd Wafer Blade Cutting Machine Company Information

Table 76. GL Tech Co Ltd Wafer Blade Cutting Machine Specification and Application

Table 77. GL Tech Co Ltd Wafer Blade Cutting Machine Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 78. GL Tech Co Ltd Main Business and Markets Served

Table 79. GL Tech Co Ltd Recent Developments/Updates

Table 80. ASM Wafer Blade Cutting Machine Company Information

Table 81. ASM Wafer Blade Cutting Machine Specification and Application

Table 82. ASM Wafer Blade Cutting Machine Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 83. ASM Main Business and Markets Served

Table 84. ASM Recent Developments/Updates

Table 85. Synova Wafer Blade Cutting Machine Company Information

Table 86. Synova Wafer Blade Cutting Machine Specification and Application

Table 87. Synova Wafer Blade Cutting Machine Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 88. Synova Main Business and Markets Served

Table 89. Synova Recent Developments/Updates

Table 90. CETC Electronics Equipment Group Co., Ltd. Wafer Blade Cutting Machine Company Information

Table 91. CETC Electronics Equipment Group Co., Ltd. Wafer Blade Cutting Machine Specification and Application

Table 92. CETC Electronics Equipment Group Co., Ltd. Wafer Blade Cutting Machine Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 93. CETC Electronics Equipment Group Co., Ltd. Main Business and Markets Served

Table 94. CETC Electronics Equipment Group Co., Ltd. Recent Developments/Updates

Table 95. Shenyang Heyan Technology Co., Ltd. Wafer Blade Cutting Machine Company Information

Table 96. Shenyang Heyan Technology Co., Ltd. Wafer Blade Cutting Machine Specification and Application

Table 97. Shenyang Heyan Technology Co., Ltd. Wafer Blade Cutting Machine Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 98. Shenyang Heyan Technology Co., Ltd. Main Business and Markets Served

Table 99. Shenyang Heyan Technology Co., Ltd. Recent Developments/Updates

Table 100. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Blade Cutting Machine Company Information

Table 101. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Blade Cutting Machine Specification and Application

Table 102. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Blade Cutting Machine Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 103. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Main Business and Markets Served

Table 104. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Recent Developments/Updates

Table 105. Hi-TESI Wafer Blade Cutting Machine Company Information

Table 106. Hi-TESI Wafer Blade Cutting Machine Specification and Application

Table 107. Hi-TESI Wafer Blade Cutting Machine Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 108. Hi-TESI Main Business and Markets Served

Table 109. Hi-TESI Recent Developments/Updates

Table 110. Tensun Wafer Blade Cutting Machine Company Information

Table 111. Tensun Wafer Blade Cutting Machine Specification and Application

Table 112. Tensun Wafer Blade Cutting Machine Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 113. Tensun Main Business and Markets Served

Table 114. Tensun Recent Developments/Updates

Table 115. Key Raw Materials Lists

Table 116. Raw Materials Key Suppliers Lists

Table 117. Wafer Blade Cutting Machine Distributors List

Table 118. Wafer Blade Cutting Machine Customers List

Table 119. Wafer Blade Cutting Machine Market Trends

Table 120. Wafer Blade Cutting Machine Market Drivers

Table 121. Wafer Blade Cutting Machine Market Challenges

Table 122. Wafer Blade Cutting Machine Market Restraints

Table 123. Research Programs/Design for This Report

Table 124. Key Data Information from Secondary Sources

Table 125. Key Data Information from Primary Sources

Table 126. Authors List of This Report

List of Figures

Figure 1. Product Picture of Wafer Blade Cutting Machine

Figure 2. Global Wafer Blade Cutting Machine Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Wafer Blade Cutting Machine Market Share by Type: 2024 VS 2031

Figure 4. 150mm Wafer Product Picture

Figure 5. 200mm Wafer Product Picture

Figure 6. 300mm Wafer Product Picture

Figure 7. Global Wafer Blade Cutting Machine Market Value by Application, (US$ Million) & (2020-2031)

Figure 8. Global Wafer Blade Cutting Machine Market Share by Application: 2024 VS 2031

Figure 9. Pure Foundry

Figure 10. IDM

Figure 11. OSAT

Figure 12. LED

Figure 13. Photovoltaic

Figure 14. Global Wafer Blade Cutting Machine Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 15. Global Wafer Blade Cutting Machine Production Value (US$ Million) & (2020-2031)

Figure 16. Global Wafer Blade Cutting Machine Production Capacity (K Units) & (2020-2031)

Figure 17. Global Wafer Blade Cutting Machine Production (K Units) & (2020-2031)

Figure 18. Global Wafer Blade Cutting Machine Average Price (US$/Unit) & (2020-2031)

Figure 19. Wafer Blade Cutting Machine Report Years Considered

Figure 20. Wafer Blade Cutting Machine Production Share by Manufacturers in 2024

Figure 21. Global Wafer Blade Cutting Machine Production Value Share by Manufacturers (2024)

Figure 22. Wafer Blade Cutting Machine Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 23. The Global 5 and 10 Largest Players: Market Share by Wafer Blade Cutting Machine Revenue in 2024

Figure 24. Global Wafer Blade Cutting Machine Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 25. Global Wafer Blade Cutting Machine Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 26. Global Wafer Blade Cutting Machine Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)

Figure 27. Global Wafer Blade Cutting Machine Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 28. North America Wafer Blade Cutting Machine Production Value (US$ Million) Growth Rate (2020-2031)

Figure 29. Europe Wafer Blade Cutting Machine Production Value (US$ Million) Growth Rate (2020-2031)

Figure 30. China Wafer Blade Cutting Machine Production Value (US$ Million) Growth Rate (2020-2031)

Figure 31. Japan Wafer Blade Cutting Machine Production Value (US$ Million) Growth Rate (2020-2031)

Figure 32. Global Wafer Blade Cutting Machine Consumption by Region: 2020 VS 2024 VS 2031 (K Units)

Figure 33. Global Wafer Blade Cutting Machine Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 34. North America Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 35. North America Wafer Blade Cutting Machine Consumption Market Share by Country (2020-2031)

Figure 36. U.S. Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 37. Canada Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 38. Europe Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 39. Europe Wafer Blade Cutting Machine Consumption Market Share by Country (2020-2031)

Figure 40. Germany Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 41. France Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 42. U.K. Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 43. Italy Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 44. Netherlands Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 45. Asia Pacific Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 46. Asia Pacific Wafer Blade Cutting Machine Consumption Market Share by Region (2020-2031)

Figure 47. China Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 48. Japan Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 49. South Korea Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 50. China Taiwan Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 51. Southeast Asia Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 52. India Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 53. Latin America, Middle East & Africa Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 54. Latin America, Middle East & Africa Wafer Blade Cutting Machine Consumption Market Share by Country (2020-2031)

Figure 55. Mexico Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 56. Brazil Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 57. Turkey Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 58. GCC Countries Wafer Blade Cutting Machine Consumption and Growth Rate (2020-2031) & (K Units)

Figure 59. Global Production Market Share of Wafer Blade Cutting Machine by Type (2020-2031)

Figure 60. Global Production Value Market Share of Wafer Blade Cutting Machine by Type (2020-2031)

Figure 61. Global Wafer Blade Cutting Machine Price (US$/Unit) by Type (2020-2031)

Figure 62. Global Production Market Share of Wafer Blade Cutting Machine by Application (2020-2031)

Figure 63. Global Production Value Market Share of Wafer Blade Cutting Machine by Application (2020-2031)

Figure 64. Global Wafer Blade Cutting Machine Price (US$/Unit) by Application (2020-2031)

Figure 65. Wafer Blade Cutting Machine Value Chain

Figure 66. Channels of Distribution (Direct Vs Distribution)

Figure 67. Bottom-up and Top-down Approaches for This Report

Figure 68. Data Triangulation

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