The global market for 2.5D and 3D TSV was valued at US$ 10810 million in the year 2024 and is projected to reach a revised size of US$ 24470 million by 2031, growing at a CAGR of 12.9% during the forecast period.

2.5D and 3D TSV Market

2.5D and 3D packaging are inseparable from TSV technology, and the integration of 2.D and 3D must be achieved through TSV.

Specifically, 2.5D packaging technology uses a silicon interposer to lay out multiple chips or dies side by side with components such as high-bandwidth memory, and uses micro-bumps or micro-bumps on the interposer as efficient interconnection bridges, significantly enhancing Improves data transfer rate and overall system performance. The core of 3D packaging technology is to use TSV technology to realize vertical stacking and interconnection of chips. This innovation not only greatly reduces the chip size, improves the integration density and performance, but also effectively reduces power consumption and heat dissipation requirements, further enhancing The reliability and stability of the system.

The downstream of 2.D and 3D TSV packaging is mainly used in HPC, AR/VR, games, network switches and routers, MEMS, CIS and LED, etc. As early as 2007, Intel took the lead in introducing 2.5D packaging technology, the core concept of which is to use silicon interposers to achieve high-density interconnection between chips. Since then, TSMC, Samsung and other companies have actively participated in research and development, and jointly promoted the increasing maturity of 2.5D packaging technology. At the same time, 3D packaging technology began to emerge in the early 21st century. The key lies in the use of TSV technology to achieve vertical stacking connection of chips. In the 2010s, with the significant progress of TSV technology, 3D packaging technology was first applied in the memory field, and gradually penetrated into multiple fields such as logic chips and RF chips. In recent years, 2.5D and 3D TSV packaging technologies have gradually penetrated into the fields of artificial intelligence and 5G communications. In the future, these two fields will become the main driving force for the growth of this market.

The manufacturing process of 2.5D and 3D TSV packaging includes wafer manufacturing, which involves multiple process steps such as lithography, etching, ion implantation, and thin film deposition. Each step requires special equipment, such as TSV etching equipment and TSV deposition equipment. In this field, the core companies mainly include Applied Materials, Lam Research, TEL, Samco Inc, ULVAC, and North China Huachuang. From the perspective of market competition, Japanese and American companies have a greater competitive advantage in the TSV packaging equipment market.

In the 2.5D and 3D TSV packaging market, there are mainly IDM and packaging and testing companies. Among them, the leading representative company TSMC has rich production experience in the 2.5D and 3D packaging market. Its 2.5D/3D packaging technologies are CoWoS and SoIC respectively.

In terms of regional markets, mainland China accounts for about 23% of the 2.5D and 3D TSV packaging market. As the leader in the consumer electronics market, mainland China has shown a huge demand for high-performance and low-power semiconductor chips. This situation has greatly promoted the market application potential of 2.5D and 3D packaging technologies. At the same time, the Chinese government actively supports the semiconductor industry and implements a series of incentive policies to stimulate the R&D vitality of enterprises and promote technological innovation. In the field of semiconductor manufacturing, China has made great progress. The continuous enhancement of wafer manufacturing capabilities has provided strong support for the vigorous development of the packaging industry. It is expected that by 2030, the Chinese mainland market share will reach 25%.

This report aims to provide a comprehensive presentation of the global market for 2.5D and 3D TSV, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 2.5D and 3D TSV.

The 2.5D and 3D TSV market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global 2.5D and 3D TSV market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the 2.5D and 3D TSV companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of 2.5D and 3D TSV Market Report

Report Metric	Details
Report Name	2.5D and 3D TSV Market
Accounted market size in year	US$ 10810 million
Forecasted market size in 2031	US$ 24470 million
CAGR	12.9%
Base Year	year
Forecasted years	2025 - 2031
Segment by Type	2.5D TSV 3D TSV
Segment by Application	Memory CIS SoC MEMS Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	TSMC, Samsung, Intel, ASE Group, Amkor Technology, SPIL, Powertech Technology, JCET Group, GlobalFoundries Inc, Tezzaron Semiconductor
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 2.5D and 3D TSV company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is 2.5D and 3D TSV Market growing?

Ans: The 2.5D and 3D TSV Market witnessing a CAGR of 12.9% during the forecast period 2025-2031.

What is the 2.5D and 3D TSV Market size in 2031?

Ans: The 2.5D and 3D TSV Market size in 2031 will be US$ 24470 million.

Who are the main players in the 2.5D and 3D TSV Market report?

Ans: The main players in the 2.5D and 3D TSV Market are TSMC, Samsung, Intel, ASE Group, Amkor Technology, SPIL, Powertech Technology, JCET Group, GlobalFoundries Inc, Tezzaron Semiconductor

What are the Application segmentation covered in the 2.5D and 3D TSV Market report?

Ans: The Applications covered in the 2.5D and 3D TSV Market report are Memory, CIS, SoC, MEMS, Others

What are the Type segmentation covered in the 2.5D and 3D TSV Market report?

Ans: The Types covered in the 2.5D and 3D TSV Market report are 2.5D TSV, 3D TSV

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global 2.5D and 3D TSV Market Size Growth Rate by Type: 2020 VS 2024 VS 2031

1.2.2 2.5D TSV

1.2.3 3D TSV

1.3 Market by Application

1.3.1 Global 2.5D and 3D TSV Market Growth by Application: 2020 VS 2024 VS 2031

1.3.2 Memory

1.3.3 CIS

1.3.4 SoC

1.3.5 MEMS

1.3.6 Others

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global 2.5D and 3D TSV Market Perspective (2020-2031)

2.2 Global 2.5D and 3D TSV Growth Trends by Region

2.2.1 Global 2.5D and 3D TSV Market Size by Region: 2020 VS 2024 VS 2031

2.2.2 2.5D and 3D TSV Historic Market Size by Region (2020-2025)

2.2.3 2.5D and 3D TSV Forecasted Market Size by Region (2026-2031)

2.3 2.5D and 3D TSV Market Dynamics

2.3.1 2.5D and 3D TSV Industry Trends

2.3.2 2.5D and 3D TSV Market Drivers

2.3.3 2.5D and 3D TSV Market Challenges

2.3.4 2.5D and 3D TSV Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top 2.5D and 3D TSV Players by Revenue

3.1.1 Global Top 2.5D and 3D TSV Players by Revenue (2020-2025)

3.1.2 Global 2.5D and 3D TSV Revenue Market Share by Players (2020-2025)

3.2 Global Top 2.5D and 3D TSV Players by Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by 2.5D and 3D TSV Revenue

3.4 Global 2.5D and 3D TSV Market Concentration Ratio

3.4.1 Global 2.5D and 3D TSV Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by 2.5D and 3D TSV Revenue in 2024

3.5 Global Key Players of 2.5D and 3D TSV Head office and Area Served

3.6 Global Key Players of 2.5D and 3D TSV, Product and Application

3.7 Global Key Players of 2.5D and 3D TSV, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 2.5D and 3D TSV Breakdown Data by Type

4.1 Global 2.5D and 3D TSV Historic Market Size by Type (2020-2025)

4.2 Global 2.5D and 3D TSV Forecasted Market Size by Type (2026-2031)

5 2.5D and 3D TSV Breakdown Data by Application

5.1 Global 2.5D and 3D TSV Historic Market Size by Application (2020-2025)

5.2 Global 2.5D and 3D TSV Forecasted Market Size by Application (2026-2031)

6 North America

6.1 North America 2.5D and 3D TSV Market Size (2020-2031)

6.2 North America 2.5D and 3D TSV Market Growth Rate by Country: 2020 VS 2024 VS 2031

6.3 North America 2.5D and 3D TSV Market Size by Country (2020-2025)

6.4 North America 2.5D and 3D TSV Market Size by Country (2026-2031)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe 2.5D and 3D TSV Market Size (2020-2031)

7.2 Europe 2.5D and 3D TSV Market Growth Rate by Country: 2020 VS 2024 VS 2031

7.3 Europe 2.5D and 3D TSV Market Size by Country (2020-2025)

7.4 Europe 2.5D and 3D TSV Market Size by Country (2026-2031)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific 2.5D and 3D TSV Market Size (2020-2031)

8.2 Asia-Pacific 2.5D and 3D TSV Market Growth Rate by Region: 2020 VS 2024 VS 2031

8.3 Asia-Pacific 2.5D and 3D TSV Market Size by Region (2020-2025)

8.4 Asia-Pacific 2.5D and 3D TSV Market Size by Region (2026-2031)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America 2.5D and 3D TSV Market Size (2020-2031)

9.2 Latin America 2.5D and 3D TSV Market Growth Rate by Country: 2020 VS 2024 VS 2031

9.3 Latin America 2.5D and 3D TSV Market Size by Country (2020-2025)

9.4 Latin America 2.5D and 3D TSV Market Size by Country (2026-2031)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa 2.5D and 3D TSV Market Size (2020-2031)

10.2 Middle East & Africa 2.5D and 3D TSV Market Growth Rate by Country: 2020 VS 2024 VS 2031

10.3 Middle East & Africa 2.5D and 3D TSV Market Size by Country (2020-2025)

10.4 Middle East & Africa 2.5D and 3D TSV Market Size by Country (2026-2031)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 TSMC

11.1.1 TSMC Company Details

11.1.2 TSMC Business Overview

11.1.3 TSMC 2.5D and 3D TSV Introduction

11.1.4 TSMC Revenue in 2.5D and 3D TSV Business (2020-2025)

11.1.5 TSMC Recent Development

11.2 Samsung

11.2.1 Samsung Company Details

11.2.2 Samsung Business Overview

11.2.3 Samsung 2.5D and 3D TSV Introduction

11.2.4 Samsung Revenue in 2.5D and 3D TSV Business (2020-2025)

11.2.5 Samsung Recent Development

11.3 Intel

11.3.1 Intel Company Details

11.3.2 Intel Business Overview

11.3.3 Intel 2.5D and 3D TSV Introduction

11.3.4 Intel Revenue in 2.5D and 3D TSV Business (2020-2025)

11.3.5 Intel Recent Development

11.4 ASE Group

11.4.1 ASE Group Company Details

11.4.2 ASE Group Business Overview

11.4.3 ASE Group 2.5D and 3D TSV Introduction

11.4.4 ASE Group Revenue in 2.5D and 3D TSV Business (2020-2025)

11.4.5 ASE Group Recent Development

11.5 Amkor Technology

11.5.1 Amkor Technology Company Details

11.5.2 Amkor Technology Business Overview

11.5.3 Amkor Technology 2.5D and 3D TSV Introduction

11.5.4 Amkor Technology Revenue in 2.5D and 3D TSV Business (2020-2025)

11.5.5 Amkor Technology Recent Development

11.6 SPIL

11.6.1 SPIL Company Details

11.6.2 SPIL Business Overview

11.6.3 SPIL 2.5D and 3D TSV Introduction

11.6.4 SPIL Revenue in 2.5D and 3D TSV Business (2020-2025)

11.6.5 SPIL Recent Development

11.7 Powertech Technology

11.7.1 Powertech Technology Company Details

11.7.2 Powertech Technology Business Overview

11.7.3 Powertech Technology 2.5D and 3D TSV Introduction

11.7.4 Powertech Technology Revenue in 2.5D and 3D TSV Business (2020-2025)

11.7.5 Powertech Technology Recent Development

11.8 JCET Group

11.8.1 JCET Group Company Details

11.8.2 JCET Group Business Overview

11.8.3 JCET Group 2.5D and 3D TSV Introduction

11.8.4 JCET Group Revenue in 2.5D and 3D TSV Business (2020-2025)

11.8.5 JCET Group Recent Development

11.9 GlobalFoundries Inc

11.9.1 GlobalFoundries Inc Company Details

11.9.2 GlobalFoundries Inc Business Overview

11.9.3 GlobalFoundries Inc 2.5D and 3D TSV Introduction

11.9.4 GlobalFoundries Inc Revenue in 2.5D and 3D TSV Business (2020-2025)

11.9.5 GlobalFoundries Inc Recent Development

11.10 Tezzaron Semiconductor

11.10.1 Tezzaron Semiconductor Company Details

11.10.2 Tezzaron Semiconductor Business Overview

11.10.3 Tezzaron Semiconductor 2.5D and 3D TSV Introduction

11.10.4 Tezzaron Semiconductor Revenue in 2.5D and 3D TSV Business (2020-2025)

11.10.5 Tezzaron Semiconductor Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

Tezzaron Semiconductor

List of Tables

Table 1. Global 2.5D and 3D TSV Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031

Table 2. Key Players of 2.5D TSV

Table 3. Key Players of 3D TSV

Table 4. Global 2.5D and 3D TSV Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031

Table 5. Global 2.5D and 3D TSV Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Table 6. Global 2.5D and 3D TSV Market Size by Region (2020-2025) & (US$ Million)

Table 7. Global 2.5D and 3D TSV Market Share by Region (2020-2025)

Table 8. Global 2.5D and 3D TSV Forecasted Market Size by Region (2026-2031) & (US$ Million)

Table 9. Global 2.5D and 3D TSV Market Share by Region (2026-2031)

Table 10. 2.5D and 3D TSV Market Trends

Table 11. 2.5D and 3D TSV Market Drivers

Table 12. 2.5D and 3D TSV Market Challenges

Table 13. 2.5D and 3D TSV Market Restraints

Table 14. Global 2.5D and 3D TSV Revenue by Players (2020-2025) & (US$ Million)

Table 15. Global 2.5D and 3D TSV Market Share by Players (2020-2025)

Table 16. Global Top 2.5D and 3D TSV Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 2.5D and 3D TSV as of 2024)

Table 17. Ranking of Global Top 2.5D and 3D TSV Companies by Revenue (US$ Million) in 2024

Table 18. Global 5 Largest Players Market Share by 2.5D and 3D TSV Revenue (CR5 and HHI) & (2020-2025)

Table 19. Global Key Players of 2.5D and 3D TSV, Headquarters and Area Served

Table 20. Global Key Players of 2.5D and 3D TSV, Product and Application

Table 21. Global Key Players of 2.5D and 3D TSV, Date of Enter into This Industry

Table 22. Mergers & Acquisitions, Expansion Plans

Table 23. Global 2.5D and 3D TSV Market Size by Type (2020-2025) & (US$ Million)

Table 24. Global 2.5D and 3D TSV Revenue Market Share by Type (2020-2025)

Table 25. Global 2.5D and 3D TSV Forecasted Market Size by Type (2026-2031) & (US$ Million)

Table 26. Global 2.5D and 3D TSV Revenue Market Share by Type (2026-2031)

Table 27. Global 2.5D and 3D TSV Market Size by Application (2020-2025) & (US$ Million)

Table 28. Global 2.5D and 3D TSV Revenue Market Share by Application (2020-2025)

Table 29. Global 2.5D and 3D TSV Forecasted Market Size by Application (2026-2031) & (US$ Million)

Table 30. Global 2.5D and 3D TSV Revenue Market Share by Application (2026-2031)

Table 31. North America 2.5D and 3D TSV Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 32. North America 2.5D and 3D TSV Market Size by Country (2020-2025) & (US$ Million)

Table 33. North America 2.5D and 3D TSV Market Size by Country (2026-2031) & (US$ Million)

Table 34. Europe 2.5D and 3D TSV Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 35. Europe 2.5D and 3D TSV Market Size by Country (2020-2025) & (US$ Million)

Table 36. Europe 2.5D and 3D TSV Market Size by Country (2026-2031) & (US$ Million)

Table 37. Asia-Pacific 2.5D and 3D TSV Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031

Table 38. Asia-Pacific 2.5D and 3D TSV Market Size by Region (2020-2025) & (US$ Million)

Table 39. Asia-Pacific 2.5D and 3D TSV Market Size by Region (2026-2031) & (US$ Million)

Table 40. Latin America 2.5D and 3D TSV Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 41. Latin America 2.5D and 3D TSV Market Size by Country (2020-2025) & (US$ Million)

Table 42. Latin America 2.5D and 3D TSV Market Size by Country (2026-2031) & (US$ Million)

Table 43. Middle East & Africa 2.5D and 3D TSV Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 44. Middle East & Africa 2.5D and 3D TSV Market Size by Country (2020-2025) & (US$ Million)

Table 45. Middle East & Africa 2.5D and 3D TSV Market Size by Country (2026-2031) & (US$ Million)

Table 46. TSMC Company Details

Table 47. TSMC Business Overview

Table 48. TSMC 2.5D and 3D TSV Product

Table 49. TSMC Revenue in 2.5D and 3D TSV Business (2020-2025) & (US$ Million)

Table 50. TSMC Recent Development

Table 51. Samsung Company Details

Table 52. Samsung Business Overview

Table 53. Samsung 2.5D and 3D TSV Product

Table 54. Samsung Revenue in 2.5D and 3D TSV Business (2020-2025) & (US$ Million)

Table 55. Samsung Recent Development

Table 56. Intel Company Details

Table 57. Intel Business Overview

Table 58. Intel 2.5D and 3D TSV Product

Table 59. Intel Revenue in 2.5D and 3D TSV Business (2020-2025) & (US$ Million)

Table 60. Intel Recent Development

Table 61. ASE Group Company Details

Table 62. ASE Group Business Overview

Table 63. ASE Group 2.5D and 3D TSV Product

Table 64. ASE Group Revenue in 2.5D and 3D TSV Business (2020-2025) & (US$ Million)

Table 65. ASE Group Recent Development

Table 66. Amkor Technology Company Details

Table 67. Amkor Technology Business Overview

Table 68. Amkor Technology 2.5D and 3D TSV Product

Table 69. Amkor Technology Revenue in 2.5D and 3D TSV Business (2020-2025) & (US$ Million)

Table 70. Amkor Technology Recent Development

Table 71. SPIL Company Details

Table 72. SPIL Business Overview

Table 73. SPIL 2.5D and 3D TSV Product

Table 74. SPIL Revenue in 2.5D and 3D TSV Business (2020-2025) & (US$ Million)

Table 75. SPIL Recent Development

Table 76. Powertech Technology Company Details

Table 77. Powertech Technology Business Overview

Table 78. Powertech Technology 2.5D and 3D TSV Product

Table 79. Powertech Technology Revenue in 2.5D and 3D TSV Business (2020-2025) & (US$ Million)

Table 80. Powertech Technology Recent Development

Table 81. JCET Group Company Details

Table 82. JCET Group Business Overview

Table 83. JCET Group 2.5D and 3D TSV Product

Table 84. JCET Group Revenue in 2.5D and 3D TSV Business (2020-2025) & (US$ Million)

Table 85. JCET Group Recent Development

Table 86. GlobalFoundries Inc Company Details

Table 87. GlobalFoundries Inc Business Overview

Table 88. GlobalFoundries Inc 2.5D and 3D TSV Product

Table 89. GlobalFoundries Inc Revenue in 2.5D and 3D TSV Business (2020-2025) & (US$ Million)

Table 90. GlobalFoundries Inc Recent Development

Table 91. Tezzaron Semiconductor Company Details

Table 92. Tezzaron Semiconductor Business Overview

Table 93. Tezzaron Semiconductor 2.5D and 3D TSV Product

Table 94. Tezzaron Semiconductor Revenue in 2.5D and 3D TSV Business (2020-2025) & (US$ Million)

Table 95. Tezzaron Semiconductor Recent Development

Table 96. Research Programs/Design for This Report

Table 97. Key Data Information from Secondary Sources

Table 98. Key Data Information from Primary Sources

Table 99. Authors List of This Report

List of Figures

Figure 1. 2.5D and 3D TSV Picture

Figure 2. Global 2.5D and 3D TSV Market Size Comparison by Type (2020-2031) & (US$ Million)

Figure 3. Global 2.5D and 3D TSV Market Share by Type: 2024 VS 2031

Figure 4. 2.5D TSV Features

Figure 5. 3D TSV Features

Figure 6. Global 2.5D and 3D TSV Market Size by Application (2020-2031) & (US$ Million)

Figure 7. Global 2.5D and 3D TSV Market Share by Application: 2024 VS 2031

Figure 8. Memory Case Studies

Figure 9. CIS Case Studies

Figure 10. SoC Case Studies

Figure 11. MEMS Case Studies

Figure 12. Others Case Studies

Figure 13. 2.5D and 3D TSV Report Years Considered

Figure 14. Global 2.5D and 3D TSV Market Size (US$ Million), Year-over-Year: 2020-2031

Figure 15. Global 2.5D and 3D TSV Market Size, (US$ Million), 2020 VS 2024 VS 2031

Figure 16. Global 2.5D and 3D TSV Market Share by Region: 2024 VS 2031

Figure 17. Global 2.5D and 3D TSV Market Share by Players in 2024

Figure 18. Global 2.5D and 3D TSV Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

Figure 19. The Top 10 and 5 Players Market Share by 2.5D and 3D TSV Revenue in 2024

Figure 20. North America 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 21. North America 2.5D and 3D TSV Market Share by Country (2020-2031)

Figure 22. United States 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 23. Canada 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 24. Europe 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 25. Europe 2.5D and 3D TSV Market Share by Country (2020-2031)

Figure 26. Germany 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 27. France 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 28. U.K. 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 29. Italy 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 30. Russia 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 31. Nordic Countries 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 32. Asia-Pacific 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 33. Asia-Pacific 2.5D and 3D TSV Market Share by Region (2020-2031)

Figure 34. China 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 35. Japan 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 36. South Korea 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 37. Southeast Asia 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 38. India 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 39. Australia 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 40. Latin America 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 41. Latin America 2.5D and 3D TSV Market Share by Country (2020-2031)

Figure 42. Mexico 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 43. Brazil 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 44. Middle East & Africa 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 45. Middle East & Africa 2.5D and 3D TSV Market Share by Country (2020-2031)

Figure 46. Turkey 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 47. Saudi Arabia 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 48. UAE 2.5D and 3D TSV Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 49. TSMC Revenue Growth Rate in 2.5D and 3D TSV Business (2020-2025)

Figure 50. Samsung Revenue Growth Rate in 2.5D and 3D TSV Business (2020-2025)

Figure 51. Intel Revenue Growth Rate in 2.5D and 3D TSV Business (2020-2025)

Figure 52. ASE Group Revenue Growth Rate in 2.5D and 3D TSV Business (2020-2025)

Figure 53. Amkor Technology Revenue Growth Rate in 2.5D and 3D TSV Business (2020-2025)

Figure 54. SPIL Revenue Growth Rate in 2.5D and 3D TSV Business (2020-2025)

Figure 55. Powertech Technology Revenue Growth Rate in 2.5D and 3D TSV Business (2020-2025)

Figure 56. JCET Group Revenue Growth Rate in 2.5D and 3D TSV Business (2020-2025)

Figure 57. GlobalFoundries Inc Revenue Growth Rate in 2.5D and 3D TSV Business (2020-2025)

Figure 58. Tezzaron Semiconductor Revenue Growth Rate in 2.5D and 3D TSV Business (2020-2025)

Figure 59. Bottom-up and Top-down Approaches for This Report

Figure 60. Data Triangulation

Figure 61. Key Executives Interviewed

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Global 2.5D and 3D TSV Market Research Report 2025

Published Date: June 2025

Report Code: QYRE-Auto-20G9981

Global 2.5D and 3D TSV Market Research Report 2025

FEATURED COMPANIES

2.5D and 3D TSV Market Size

2.5D and 3D TSV Market

Scope of 2.5D and 3D TSV Market Report

Chapter Outline

FAQ for this report

How fast is 2.5D and 3D TSV Market growing?

What is the 2.5D and 3D TSV Market size in 2031?

Who are the main players in the 2.5D and 3D TSV Market report?

What are the Application segmentation covered in the 2.5D and 3D TSV Market report?

What are the Type segmentation covered in the 2.5D and 3D TSV Market report?

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