Global Photonic Integrated Circuit (PIC) Market Research Report 2025

Photonic Integrated Circuit (PIC) Market Size

The photonic integrated circuit market advances rapidly as data-intensive industries embrace light-based transmission for speed and efficiency. Cloud computing, quantum communication, and high-speed networking depend on PICs to reduce energy loss and latency. Foundries and fabless players collaborate to scale production using silicon photonics. Integrated optical transceivers dominate data center upgrades, while LiDAR and biosensors expand PIC applications beyond telecom. Government-backed initiatives in quantum and photonics research fuel investment across continents. The ability to miniaturize optical components into a single chip positions PICs as the foundation for next-generation communication infrastructure.

Co-packaged optics (CPO) gains traction as chipmakers integrate optical and electrical I/O into unified modules. Packaging innovation improves coupling efficiency between fibers and on-chip waveguides. AI-driven design tools accelerate optimization of complex optical pathways. Material diversification, including indium phosphide and silicon nitride, expands wavelength versatility. Foundry standardization through PDKs enhances scalability and interoperability. Hybrid bonding techniques enable dense multi-layer photonic-electronic integration.

Emerging applications include quantum sensors, optical neural networks, and diagnostic systems requiring ultra-fast and precise signal processing. Europe pioneers quantum-safe communication networks, while North America leads in optical data center deployments. Asia-Pacific strengthens photonic manufacturing and packaging infrastructure. Cost reduction initiatives focus on wafer-scale testing and assembly automation. As photonics intersect with AI and quantum technologies, cross-sector collaboration defines new commercial opportunities.

• Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
• Chapter 2: Detailed analysis of Photonic Integrated Circuit (PIC) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
• Chapter 3: Production/output, value of Photonic Integrated Circuit (PIC) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
• Chapter 4: Consumption of Photonic Integrated Circuit (PIC) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
• Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
• Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
• Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
• Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
• Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
• Chapter 10: The main points and conclusions of the report.

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