The global Discrete Device Die Bonder market was valued at US$ 312 million in 2023 and is anticipated to reach US$ 486 million by 2030, witnessing a CAGR of 6.3% during the forecast period 2024-2030.

Discrete Device Die Bonder Market

The die bonder is the core equipment of the die attach process in the packaging and testing process, and plays a vital role. It is responsible for accurately grabbing the chip on the cut wafer and placing it securely on the corresponding die flag position of the substrate, and achieving a firm bond between the chip and the substrate through silver glue (Epoxy). The die bonder, with its high-speed and high-precision performance, completes a series of key steps such as positioning, alignment, flip-chip and continuous mounting during the component placement process.

The main types of die bonders are IC die bonders, discrete device die bonders, and LED die bonders. Discrete device die bonders are equipment specifically used for IGBT modules and silicon carbide power devices.

North American market for Discrete Device Die Bonder is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

Asia-Pacific market for Discrete Device Die Bonder is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

The major global manufacturers of Discrete Device Die Bonder include ASMPT, BESI, Canon Machinery, Quick Intelligent Equipment, Shenzhen Liande Automatic Equipment, Notting Intelligent Technology, Shenzhen Xinyichang Technology, Shenzhen S-king Intelligent Equipment, Shenzhen Microview, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Discrete Device Die Bonder, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Discrete Device Die Bonder.

The Discrete Device Die Bonder market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Discrete Device Die Bonder market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Discrete Device Die Bonder manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Discrete Device Die Bonder Market Report

Report Metric	Details
Report Name	Discrete Device Die Bonder Market
Accounted market size in 2023	US$ 312 million
Forecasted market size in 2030	US$ 486 million
CAGR	6.3%
Base Year	2023
Forecasted years	2024 - 2030
by Type	Fully-automatic Semi-automatic
by Application	IGBT Module SiC Power Device Others
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	ASMPT, BESI, Canon Machinery, Quick Intelligent Equipment, Shenzhen Liande Automatic Equipment, Notting Intelligent Technology, Shenzhen Xinyichang Technology, Shenzhen S-king Intelligent Equipment, Shenzhen Microview
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Discrete Device Die Bonder manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Discrete Device Die Bonder by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Discrete Device Die Bonder in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Discrete Device Die Bonder Market growing?

Ans: The Discrete Device Die Bonder Market witnessing a CAGR of 6.3% during the forecast period 2024-2030.

What is the Discrete Device Die Bonder Market size in 2030?

Ans: The Discrete Device Die Bonder Market size in 2030 will be US$ 486 million.

Who are the main players in the Discrete Device Die Bonder Market report?

Ans: The main players in the Discrete Device Die Bonder Market are ASMPT, BESI, Canon Machinery, Quick Intelligent Equipment, Shenzhen Liande Automatic Equipment, Notting Intelligent Technology, Shenzhen Xinyichang Technology, Shenzhen S-king Intelligent Equipment, Shenzhen Microview

What are the Application segmentation covered in the Discrete Device Die Bonder Market report?

Ans: The Applications covered in the Discrete Device Die Bonder Market report are IGBT Module, SiC Power Device, Others

What are the Type segmentation covered in the Discrete Device Die Bonder Market report?

Ans: The Types covered in the Discrete Device Die Bonder Market report are Fully-automatic, Semi-automatic

1 Discrete Device Die Bonder Market Overview

1.1 Product Definition

1.2 Discrete Device Die Bonder by Type

1.2.1 Global Discrete Device Die Bonder Market Value Growth Rate Analysis by Type: 2023 VS 2030

1.2.2 Fully-automatic

1.2.3 Semi-automatic

1.3 Discrete Device Die Bonder by Application

1.3.1 Global Discrete Device Die Bonder Market Value Growth Rate Analysis by Application: 2023 VS 2030

1.3.2 IGBT Module

1.3.3 SiC Power Device

1.3.4 Others

1.4 Global Market Growth Prospects

1.4.1 Global Discrete Device Die Bonder Production Value Estimates and Forecasts (2019-2030)

1.4.2 Global Discrete Device Die Bonder Production Capacity Estimates and Forecasts (2019-2030)

1.4.3 Global Discrete Device Die Bonder Production Estimates and Forecasts (2019-2030)

1.4.4 Global Discrete Device Die Bonder Market Average Price Estimates and Forecasts (2019-2030)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Discrete Device Die Bonder Production Market Share by Manufacturers (2019-2024)

2.2 Global Discrete Device Die Bonder Production Value Market Share by Manufacturers (2019-2024)

2.3 Global Key Players of Discrete Device Die Bonder, Industry Ranking, 2022 VS 2023

2.4 Global Discrete Device Die Bonder Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Discrete Device Die Bonder Average Price by Manufacturers (2019-2024)

2.6 Global Key Manufacturers of Discrete Device Die Bonder, Manufacturing Sites & Headquarters

2.7 Global Key Manufacturers of Discrete Device Die Bonder, Product Type & Application

2.8 Global Key Manufacturers of Discrete Device Die Bonder, Date of Enter into This Industry

2.9 Global Discrete Device Die Bonder Market Competitive Situation and Trends

2.9.1 Global Discrete Device Die Bonder Market Concentration Rate

2.9.2 Global 5 and 10 Largest Discrete Device Die Bonder Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Discrete Device Die Bonder Production by Region

3.1 Global Discrete Device Die Bonder Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030

3.2 Global Discrete Device Die Bonder Production Value by Region (2019-2030)

3.2.1 Global Discrete Device Die Bonder Production Value Market Share by Region (2019-2024)

3.2.2 Global Forecasted Production Value of Discrete Device Die Bonder by Region (2025-2030)

3.3 Global Discrete Device Die Bonder Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030

3.4 Global Discrete Device Die Bonder Production by Region (2019-2030)

3.4.1 Global Discrete Device Die Bonder Production Market Share by Region (2019-2024)

3.4.2 Global Forecasted Production of Discrete Device Die Bonder by Region (2025-2030)

3.5 Global Discrete Device Die Bonder Market Price Analysis by Region (2019-2024)

3.6 Global Discrete Device Die Bonder Production and Value, Year-over-Year Growth

3.6.1 North America Discrete Device Die Bonder Production Value Estimates and Forecasts (2019-2030)

3.6.2 Europe Discrete Device Die Bonder Production Value Estimates and Forecasts (2019-2030)

3.6.3 China Discrete Device Die Bonder Production Value Estimates and Forecasts (2019-2030)

3.6.4 Japan Discrete Device Die Bonder Production Value Estimates and Forecasts (2019-2030)

4 Discrete Device Die Bonder Consumption by Region

4.1 Global Discrete Device Die Bonder Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030

4.2 Global Discrete Device Die Bonder Consumption by Region (2019-2030)

4.2.1 Global Discrete Device Die Bonder Consumption by Region (2019-2030)

4.2.2 Global Discrete Device Die Bonder Forecasted Consumption by Region (2025-2030)

4.3 North America

4.3.1 North America Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030

4.3.2 North America Discrete Device Die Bonder Consumption by Country (2019-2030)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030

4.4.2 Europe Discrete Device Die Bonder Consumption by Country (2019-2030)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030

4.5.2 Asia Pacific Discrete Device Die Bonder Consumption by Region (2019-2030)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030

4.6.2 Latin America, Middle East & Africa Discrete Device Die Bonder Consumption by Country (2019-2030)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Israel

5 Segment by Type

5.1 Global Discrete Device Die Bonder Production by Type (2019-2030)

5.1.1 Global Discrete Device Die Bonder Production by Type (2019-2024)

5.1.2 Global Discrete Device Die Bonder Production by Type (2025-2030)

5.1.3 Global Discrete Device Die Bonder Production Market Share by Type (2019-2030)

5.2 Global Discrete Device Die Bonder Production Value by Type (2019-2030)

5.2.1 Global Discrete Device Die Bonder Production Value by Type (2019-2024)

5.2.2 Global Discrete Device Die Bonder Production Value by Type (2025-2030)

5.2.3 Global Discrete Device Die Bonder Production Value Market Share by Type (2019-2030)

5.3 Global Discrete Device Die Bonder Price by Type (2019-2030)

6 Segment by Application

6.1 Global Discrete Device Die Bonder Production by Application (2019-2030)

6.1.1 Global Discrete Device Die Bonder Production by Application (2019-2024)

6.1.2 Global Discrete Device Die Bonder Production by Application (2025-2030)

6.1.3 Global Discrete Device Die Bonder Production Market Share by Application (2019-2030)

6.2 Global Discrete Device Die Bonder Production Value by Application (2019-2030)

6.2.1 Global Discrete Device Die Bonder Production Value by Application (2019-2024)

6.2.2 Global Discrete Device Die Bonder Production Value by Application (2025-2030)

6.2.3 Global Discrete Device Die Bonder Production Value Market Share by Application (2019-2030)

6.3 Global Discrete Device Die Bonder Price by Application (2019-2030)

7 Key Companies Profiled

7.1 ASMPT

7.1.1 ASMPT Discrete Device Die Bonder Company Information

7.1.2 ASMPT Discrete Device Die Bonder Product Portfolio

7.1.3 ASMPT Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)

7.1.4 ASMPT Main Business and Markets Served

7.1.5 ASMPT Recent Developments/Updates

7.2 BESI

7.2.1 BESI Discrete Device Die Bonder Company Information

7.2.2 BESI Discrete Device Die Bonder Product Portfolio

7.2.3 BESI Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)

7.2.4 BESI Main Business and Markets Served

7.2.5 BESI Recent Developments/Updates

7.3 Canon Machinery

7.3.1 Canon Machinery Discrete Device Die Bonder Company Information

7.3.2 Canon Machinery Discrete Device Die Bonder Product Portfolio

7.3.3 Canon Machinery Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)

7.3.4 Canon Machinery Main Business and Markets Served

7.3.5 Canon Machinery Recent Developments/Updates

7.4 Quick Intelligent Equipment

7.4.1 Quick Intelligent Equipment Discrete Device Die Bonder Company Information

7.4.2 Quick Intelligent Equipment Discrete Device Die Bonder Product Portfolio

7.4.3 Quick Intelligent Equipment Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)

7.4.4 Quick Intelligent Equipment Main Business and Markets Served

7.4.5 Quick Intelligent Equipment Recent Developments/Updates

7.5 Shenzhen Liande Automatic Equipment

7.5.1 Shenzhen Liande Automatic Equipment Discrete Device Die Bonder Company Information

7.5.2 Shenzhen Liande Automatic Equipment Discrete Device Die Bonder Product Portfolio

7.5.3 Shenzhen Liande Automatic Equipment Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)

7.5.4 Shenzhen Liande Automatic Equipment Main Business and Markets Served

7.5.5 Shenzhen Liande Automatic Equipment Recent Developments/Updates

7.6 Notting Intelligent Technology

7.6.1 Notting Intelligent Technology Discrete Device Die Bonder Company Information

7.6.2 Notting Intelligent Technology Discrete Device Die Bonder Product Portfolio

7.6.3 Notting Intelligent Technology Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)

7.6.4 Notting Intelligent Technology Main Business and Markets Served

7.6.5 Notting Intelligent Technology Recent Developments/Updates

7.7 Shenzhen Xinyichang Technology

7.7.1 Shenzhen Xinyichang Technology Discrete Device Die Bonder Company Information

7.7.2 Shenzhen Xinyichang Technology Discrete Device Die Bonder Product Portfolio

7.7.3 Shenzhen Xinyichang Technology Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)

7.7.4 Shenzhen Xinyichang Technology Main Business and Markets Served

7.7.5 Shenzhen Xinyichang Technology Recent Developments/Updates

7.8 Shenzhen S-king Intelligent Equipment

7.8.1 Shenzhen S-king Intelligent Equipment Discrete Device Die Bonder Company Information

7.8.2 Shenzhen S-king Intelligent Equipment Discrete Device Die Bonder Product Portfolio

7.8.3 Shenzhen S-king Intelligent Equipment Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)

7.8.4 Shenzhen S-king Intelligent Equipment Main Business and Markets Served

7.8.5 Shenzhen S-king Intelligent Equipment Recent Developments/Updates

7.9 Shenzhen Microview

7.9.1 Shenzhen Microview Discrete Device Die Bonder Company Information

7.9.2 Shenzhen Microview Discrete Device Die Bonder Product Portfolio

7.9.3 Shenzhen Microview Discrete Device Die Bonder Production, Value, Price and Gross Margin (2019-2024)

7.9.4 Shenzhen Microview Main Business and Markets Served

7.9.5 Shenzhen Microview Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Discrete Device Die Bonder Industry Chain Analysis

8.2 Discrete Device Die Bonder Key Raw Materials

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Discrete Device Die Bonder Production Mode & Process

8.4 Discrete Device Die Bonder Sales and Marketing

8.4.1 Discrete Device Die Bonder Sales Channels

8.4.2 Discrete Device Die Bonder Distributors

8.5 Discrete Device Die Bonder Customers

9 Discrete Device Die Bonder Market Dynamics

9.1 Discrete Device Die Bonder Industry Trends

9.2 Discrete Device Die Bonder Market Drivers

9.3 Discrete Device Die Bonder Market Challenges

9.4 Discrete Device Die Bonder Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

ASMPT

Besi

Canon Machinery

Quick Intelligent Equipment.

Shenzhen Liande Automatic Equipment

Shenzhen Xinyichang Technology

Shenzhen S-king Intelligent Equipment

Notting Intelligent Technology

Shenzhen Microview

List of Tables

Table 1. Global Discrete Device Die Bonder Market Value by Type, (US$ Million) & (2023 VS 2030)

Table 2. Global Discrete Device Die Bonder Market Value by Application, (US$ Million) & (2023 VS 2030)

Table 3. Global Discrete Device Die Bonder Production by Manufacturers (2019-2024) & (Units)

Table 4. Global Discrete Device Die Bonder Production Market Share by Manufacturers (2019-2024)

Table 5. Global Discrete Device Die Bonder Production Value by Manufacturers (2019-2024) & (US$ Million)

Table 6. Global Discrete Device Die Bonder Production Value Share by Manufacturers (2019-2024)

Table 7. Global Key Players of Discrete Device Die Bonder, Industry Ranking, 2022 VS 2023

Table 8. Global Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Discrete Device Die Bonder as of 2023)

Table 9. Global Market Discrete Device Die Bonder Average Price by Manufacturers (K US$/Unit) & (2019-2024)

Table 10. Global Key Manufacturers of Discrete Device Die Bonder, Manufacturing Sites & Headquarters

Table 11. Global Key Manufacturers of Discrete Device Die Bonder, Product Type & Application

Table 12. Global Key Manufacturers of Discrete Device Die Bonder, Date of Enter into This Industry

Table 13. Global Discrete Device Die Bonder Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 14. Mergers & Acquisitions, Expansion Plans

Table 15. Global Discrete Device Die Bonder Production Value Growth Rate by Region: 2019 VS 2023 VS 2030 (US$ Million)

Table 16. Global Discrete Device Die Bonder Production Value (US$ Million) by Region (2019-2024)

Table 17. Global Discrete Device Die Bonder Production Value Market Share by Region (2019-2024)

Table 18. Global Discrete Device Die Bonder Production Value (US$ Million) Forecast by Region (2025-2030)

Table 19. Global Discrete Device Die Bonder Production Value Market Share Forecast by Region (2025-2030)

Table 20. Global Discrete Device Die Bonder Production Comparison by Region: 2019 VS 2023 VS 2030 (Units)

Table 21. Global Discrete Device Die Bonder Production (Units) by Region (2019-2024)

Table 22. Global Discrete Device Die Bonder Production Market Share by Region (2019-2024)

Table 23. Global Discrete Device Die Bonder Production (Units) Forecast by Region (2025-2030)

Table 24. Global Discrete Device Die Bonder Production Market Share Forecast by Region (2025-2030)

Table 25. Global Discrete Device Die Bonder Market Average Price (K US$/Unit) by Region (2019-2024)

Table 26. Global Discrete Device Die Bonder Market Average Price (K US$/Unit) by Region (2025-2030)

Table 27. Global Discrete Device Die Bonder Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (Units)

Table 28. Global Discrete Device Die Bonder Consumption by Region (2019-2024) & (Units)

Table 29. Global Discrete Device Die Bonder Consumption Market Share by Region (2019-2024)

Table 30. Global Discrete Device Die Bonder Forecasted Consumption by Region (2025-2030) & (Units)

Table 31. Global Discrete Device Die Bonder Forecasted Consumption Market Share by Region (2019-2024)

Table 32. North America Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Units)

Table 33. North America Discrete Device Die Bonder Consumption by Country (2019-2024) & (Units)

Table 34. North America Discrete Device Die Bonder Consumption by Country (2025-2030) & (Units)

Table 35. Europe Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Units)

Table 36. Europe Discrete Device Die Bonder Consumption by Country (2019-2024) & (Units)

Table 37. Europe Discrete Device Die Bonder Consumption by Country (2025-2030) & (Units)

Table 38. Asia Pacific Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Units)

Table 39. Asia Pacific Discrete Device Die Bonder Consumption by Region (2019-2024) & (Units)

Table 40. Asia Pacific Discrete Device Die Bonder Consumption by Region (2025-2030) & (Units)

Table 41. Latin America, Middle East & Africa Discrete Device Die Bonder Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (Units)

Table 42. Latin America, Middle East & Africa Discrete Device Die Bonder Consumption by Country (2019-2024) & (Units)

Table 43. Latin America, Middle East & Africa Discrete Device Die Bonder Consumption by Country (2025-2030) & (Units)

Table 44. Global Discrete Device Die Bonder Production (Units) by Type (2019-2024)

Table 45. Global Discrete Device Die Bonder Production (Units) by Type (2025-2030)

Table 46. Global Discrete Device Die Bonder Production Market Share by Type (2019-2024)

Table 47. Global Discrete Device Die Bonder Production Market Share by Type (2025-2030)

Table 48. Global Discrete Device Die Bonder Production Value (US$ Million) by Type (2019-2024)

Table 49. Global Discrete Device Die Bonder Production Value (US$ Million) by Type (2025-2030)

Table 50. Global Discrete Device Die Bonder Production Value Market Share by Type (2019-2024)

Table 51. Global Discrete Device Die Bonder Production Value Market Share by Type (2025-2030)

Table 52. Global Discrete Device Die Bonder Price (K US$/Unit) by Type (2019-2024)

Table 53. Global Discrete Device Die Bonder Price (K US$/Unit) by Type (2025-2030)

Table 54. Global Discrete Device Die Bonder Production (Units) by Application (2019-2024)

Table 55. Global Discrete Device Die Bonder Production (Units) by Application (2025-2030)

Table 56. Global Discrete Device Die Bonder Production Market Share by Application (2019-2024)

Table 57. Global Discrete Device Die Bonder Production Market Share by Application (2025-2030)

Table 58. Global Discrete Device Die Bonder Production Value (US$ Million) by Application (2019-2024)

Table 59. Global Discrete Device Die Bonder Production Value (US$ Million) by Application (2025-2030)

Table 60. Global Discrete Device Die Bonder Production Value Market Share by Application (2019-2024)

Table 61. Global Discrete Device Die Bonder Production Value Market Share by Application (2025-2030)

Table 62. Global Discrete Device Die Bonder Price (K US$/Unit) by Application (2019-2024)

Table 63. Global Discrete Device Die Bonder Price (K US$/Unit) by Application (2025-2030)

Table 64. ASMPT Discrete Device Die Bonder Company Information

Table 65. ASMPT Discrete Device Die Bonder Specification and Application

Table 66. ASMPT Discrete Device Die Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2019-2024)

Table 67. ASMPT Main Business and Markets Served

Table 68. ASMPT Recent Developments/Updates

Table 69. BESI Discrete Device Die Bonder Company Information

Table 70. BESI Discrete Device Die Bonder Specification and Application

Table 71. BESI Discrete Device Die Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2019-2024)

Table 72. BESI Main Business and Markets Served

Table 73. BESI Recent Developments/Updates

Table 74. Canon Machinery Discrete Device Die Bonder Company Information

Table 75. Canon Machinery Discrete Device Die Bonder Specification and Application

Table 76. Canon Machinery Discrete Device Die Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2019-2024)

Table 77. Canon Machinery Main Business and Markets Served

Table 78. Canon Machinery Recent Developments/Updates

Table 79. Quick Intelligent Equipment Discrete Device Die Bonder Company Information

Table 80. Quick Intelligent Equipment Discrete Device Die Bonder Specification and Application

Table 81. Quick Intelligent Equipment Discrete Device Die Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2019-2024)

Table 82. Quick Intelligent Equipment Main Business and Markets Served

Table 83. Quick Intelligent Equipment Recent Developments/Updates

Table 84. Shenzhen Liande Automatic Equipment Discrete Device Die Bonder Company Information

Table 85. Shenzhen Liande Automatic Equipment Discrete Device Die Bonder Specification and Application

Table 86. Shenzhen Liande Automatic Equipment Discrete Device Die Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2019-2024)

Table 87. Shenzhen Liande Automatic Equipment Main Business and Markets Served

Table 88. Shenzhen Liande Automatic Equipment Recent Developments/Updates

Table 89. Notting Intelligent Technology Discrete Device Die Bonder Company Information

Table 90. Notting Intelligent Technology Discrete Device Die Bonder Specification and Application

Table 91. Notting Intelligent Technology Discrete Device Die Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2019-2024)

Table 92. Notting Intelligent Technology Main Business and Markets Served

Table 93. Notting Intelligent Technology Recent Developments/Updates

Table 94. Shenzhen Xinyichang Technology Discrete Device Die Bonder Company Information

Table 95. Shenzhen Xinyichang Technology Discrete Device Die Bonder Specification and Application

Table 96. Shenzhen Xinyichang Technology Discrete Device Die Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2019-2024)

Table 97. Shenzhen Xinyichang Technology Main Business and Markets Served

Table 98. Shenzhen Xinyichang Technology Recent Developments/Updates

Table 99. Shenzhen S-king Intelligent Equipment Discrete Device Die Bonder Company Information

Table 100. Shenzhen S-king Intelligent Equipment Discrete Device Die Bonder Specification and Application

Table 101. Shenzhen S-king Intelligent Equipment Discrete Device Die Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2019-2024)

Table 102. Shenzhen S-king Intelligent Equipment Main Business and Markets Served

Table 103. Shenzhen S-king Intelligent Equipment Recent Developments/Updates

Table 104. Shenzhen Microview Discrete Device Die Bonder Company Information

Table 105. Shenzhen Microview Discrete Device Die Bonder Specification and Application

Table 106. Shenzhen Microview Discrete Device Die Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2019-2024)

Table 107. Shenzhen Microview Main Business and Markets Served

Table 108. Shenzhen Microview Recent Developments/Updates

Table 109. Key Raw Materials Lists

Table 110. Raw Materials Key Suppliers Lists

Table 111. Discrete Device Die Bonder Distributors List

Table 112. Discrete Device Die Bonder Customers List

Table 113. Discrete Device Die Bonder Market Trends

Table 114. Discrete Device Die Bonder Market Drivers

Table 115. Discrete Device Die Bonder Market Challenges

Table 116. Discrete Device Die Bonder Market Restraints

Table 117. Research Programs/Design for This Report

Table 118. Key Data Information from Secondary Sources

Table 119. Key Data Information from Primary Sources

Table 120. Authors List of This Report

List of Figures

Figure 1. Product Picture of Discrete Device Die Bonder

Figure 2. Global Discrete Device Die Bonder Market Value by Type, (US$ Million) & (2023 VS 2030)

Figure 3. Global Discrete Device Die Bonder Market Share by Type: 2023 VS 2030

Figure 4. Fully-automatic Product Picture

Figure 5. Semi-automatic Product Picture

Figure 6. Global Discrete Device Die Bonder Market Value by Application, (US$ Million) & (2023 VS 2030)

Figure 7. Global Discrete Device Die Bonder Market Share by Application: 2023 VS 2030

Figure 8. IGBT Module

Figure 9. SiC Power Device

Figure 10. Others

Figure 11. Global Discrete Device Die Bonder Production Value (US$ Million), 2019 VS 2023 VS 2030

Figure 12. Global Discrete Device Die Bonder Production Value (US$ Million) & (2019-2030)

Figure 13. Global Discrete Device Die Bonder Production Capacity (Units) & (2019-2030)

Figure 14. Global Discrete Device Die Bonder Production (Units) & (2019-2030)

Figure 15. Global Discrete Device Die Bonder Average Price (K US$/Unit) & (2019-2030)

Figure 16. Discrete Device Die Bonder Report Years Considered

Figure 17. Discrete Device Die Bonder Production Share by Manufacturers in 2023

Figure 18. Global Discrete Device Die Bonder Production Value Share by Manufacturers (2023)

Figure 19. Discrete Device Die Bonder Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023

Figure 20. The Global 5 and 10 Largest Players: Market Share by Discrete Device Die Bonder Revenue in 2023

Figure 21. Global Discrete Device Die Bonder Production Value Comparison by Region: 2019 VS 2023 VS 2030 (US$ Million)

Figure 22. Global Discrete Device Die Bonder Production Value Market Share by Region: 2019 VS 2023 VS 2030

Figure 23. Global Discrete Device Die Bonder Production Comparison by Region: 2019 VS 2023 VS 2030 (Units)

Figure 24. Global Discrete Device Die Bonder Production Market Share by Region: 2019 VS 2023 VS 2030

Figure 25. North America Discrete Device Die Bonder Production Value (US$ Million) Growth Rate (2019-2030)

Figure 26. Europe Discrete Device Die Bonder Production Value (US$ Million) Growth Rate (2019-2030)

Figure 27. China Discrete Device Die Bonder Production Value (US$ Million) Growth Rate (2019-2030)

Figure 28. Japan Discrete Device Die Bonder Production Value (US$ Million) Growth Rate (2019-2030)

Figure 29. Global Discrete Device Die Bonder Consumption by Region: 2019 VS 2023 VS 2030 (Units)

Figure 30. Global Discrete Device Die Bonder Consumption Market Share by Region: 2019 VS 2023 VS 2030

Figure 31. North America Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 32. North America Discrete Device Die Bonder Consumption Market Share by Country (2019-2030)

Figure 33. U.S. Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 34. Canada Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 35. Europe Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 36. Europe Discrete Device Die Bonder Consumption Market Share by Country (2019-2030)

Figure 37. Germany Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 38. France Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 39. U.K. Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 40. Italy Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 41. Netherlands Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 42. Asia Pacific Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 43. Asia Pacific Discrete Device Die Bonder Consumption Market Share by Region (2025-2030)

Figure 44. China Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 45. Japan Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 46. South Korea Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 47. China Taiwan Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 48. Southeast Asia Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 49. India Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 50. Latin America, Middle East & Africa Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 51. Latin America, Middle East & Africa Discrete Device Die Bonder Consumption Market Share by Country (2019-2030)

Figure 52. Mexico Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 53. Brazil Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 54. Israel Discrete Device Die Bonder Consumption and Growth Rate (2019-2030) & (Units)

Figure 55. Global Production Market Share of Discrete Device Die Bonder by Type (2019-2030)

Figure 56. Global Production Value Market Share of Discrete Device Die Bonder by Type (2019-2030)

Figure 57. Global Discrete Device Die Bonder Price (K US$/Unit) by Type (2019-2030)

Figure 58. Global Production Market Share of Discrete Device Die Bonder by Application (2019-2030)

Figure 59. Global Production Value Market Share of Discrete Device Die Bonder by Application (2019-2030)

Figure 60. Global Discrete Device Die Bonder Price (K US$/Unit) by Application (2019-2030)

Figure 61. Discrete Device Die Bonder Value Chain

Figure 62. Discrete Device Die Bonder Production Process

Figure 63. Channels of Distribution (Direct Vs Distribution)

Figure 64. Bottom-up and Top-down Approaches for This Report

Figure 65. Data Triangulation

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Global Discrete Device Die Bonder Market Research Report 2024

Published Date: November 2024

Report Code: QYRE-Auto-22C18478

Global Discrete Device Die Bonder Market Research Report 2024

FEATURED COMPANIES

Discrete Device Die Bonder Market Size

Discrete Device Die Bonder Market

Report Scope

Scope of Discrete Device Die Bonder Market Report

Chapter Outline

FAQ for this report

How fast is Discrete Device Die Bonder Market growing?

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