The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

Epoxy Molding Compound in Semiconductor Packaging Market

The global market for Epoxy Molding Compound in Semiconductor Packaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

Epoxy molding compounds (EMCs) are critical in semiconductor packaging for protecting delicate integrated circuits (ICs) and other electronic components. These compounds encapsulate the semiconductor devices, providing mechanical support, environmental protection, and electrical insulation.

Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound in Semiconductor Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound in Semiconductor Packaging.

The Epoxy Molding Compound in Semiconductor Packaging market size, estimations, and forecasts are provided in terms of output/shipments (Ton) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Epoxy Molding Compound in Semiconductor Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Epoxy Molding Compound in Semiconductor Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Epoxy Molding Compound in Semiconductor Packaging Market Report

Report Metric	Details
Report Name	Epoxy Molding Compound in Semiconductor Packaging Market
Accounted market size in year	US$ 579 billion
Forecasted market size in 2029	US$ 790 billion
CAGR	6%
Base Year	year
Forecasted years	2025 - 2029
by Type	Normal Epoxy Molding Compound Green Epoxy Molding Compound
by Application	Advanced Packaging Traditional Packaging
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	Sumitomo Bakelite, Nitto Denko, Resonac, Shin-Etsu Chemical, KCC, NEPES, CHANG CHUN SB(CHANGSHU), Hysol Huawei Electronics, Jiangsu Huahai Chengkexin Material, PhiChem Corporation, Duresco
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Epoxy Molding Compound in Semiconductor Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Epoxy Molding Compound in Semiconductor Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Epoxy Molding Compound in Semiconductor Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Epoxy Molding Compound in Semiconductor Packaging Market growing?

Ans: The Epoxy Molding Compound in Semiconductor Packaging Market witnessing a CAGR of 6% during the forecast period 2025-2029.

What is the Epoxy Molding Compound in Semiconductor Packaging Market size in 2029?

Ans: The Epoxy Molding Compound in Semiconductor Packaging Market size in 2029 will be US$ 790 billion.

Who are the main players in the Epoxy Molding Compound in Semiconductor Packaging Market report?

Ans: The main players in the Epoxy Molding Compound in Semiconductor Packaging Market are Sumitomo Bakelite, Nitto Denko, Resonac, Shin-Etsu Chemical, KCC, NEPES, CHANG CHUN SB(CHANGSHU), Hysol Huawei Electronics, Jiangsu Huahai Chengkexin Material, PhiChem Corporation, Duresco

What are the Application segmentation covered in the Epoxy Molding Compound in Semiconductor Packaging Market report?

Ans: The Applications covered in the Epoxy Molding Compound in Semiconductor Packaging Market report are Advanced Packaging, Traditional Packaging

What are the Type segmentation covered in the Epoxy Molding Compound in Semiconductor Packaging Market report?

Ans: The Types covered in the Epoxy Molding Compound in Semiconductor Packaging Market report are Normal Epoxy Molding Compound, Green Epoxy Molding Compound

1 Epoxy Molding Compound in Semiconductor Packaging Market Overview

1.1 Product Definition

1.2 Epoxy Molding Compound in Semiconductor Packaging by Type

1.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Normal Epoxy Molding Compound

1.2.3 Green Epoxy Molding Compound

1.3 Epoxy Molding Compound in Semiconductor Packaging by Application

1.3.1 Global Epoxy Molding Compound in Semiconductor Packaging Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 Advanced Packaging

1.3.3 Traditional Packaging

1.4 Global Market Growth Prospects

1.4.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Estimates and Forecasts (2020-2031)

1.4.4 Global Epoxy Molding Compound in Semiconductor Packaging Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Manufacturers (2020-2025)

2.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Epoxy Molding Compound in Semiconductor Packaging, Industry Ranking, 2023 VS 2024

2.4 Global Epoxy Molding Compound in Semiconductor Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Epoxy Molding Compound in Semiconductor Packaging Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Product Offered and Application

2.8 Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Date of Enter into This Industry

2.9 Epoxy Molding Compound in Semiconductor Packaging Market Competitive Situation and Trends

2.9.1 Epoxy Molding Compound in Semiconductor Packaging Market Concentration Rate

2.9.2 Global 5 and 10 Largest Epoxy Molding Compound in Semiconductor Packaging Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Epoxy Molding Compound in Semiconductor Packaging Production by Region

3.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Region (2020-2031)

3.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Epoxy Molding Compound in Semiconductor Packaging by Region (2026-2031)

3.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Epoxy Molding Compound in Semiconductor Packaging Production Volume by Region (2020-2031)

3.4.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Epoxy Molding Compound in Semiconductor Packaging by Region (2026-2031)

3.5 Global Epoxy Molding Compound in Semiconductor Packaging Market Price Analysis by Region (2020-2025)

3.6 Global Epoxy Molding Compound in Semiconductor Packaging Production and Value, Year-over-Year Growth

3.6.1 North America Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan Epoxy Molding Compound in Semiconductor Packaging Production Value Estimates and Forecasts (2020-2031)

4 Epoxy Molding Compound in Semiconductor Packaging Consumption by Region

4.1 Global Epoxy Molding Compound in Semiconductor Packaging Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2020-2031)

4.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2020-2025)

4.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Russia

4.5 Asia Pacific

4.5.1 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Type (2020-2031)

5.1.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Type (2020-2025)

5.1.2 Global Epoxy Molding Compound in Semiconductor Packaging Production by Type (2026-2031)

5.1.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Type (2020-2031)

5.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Type (2020-2031)

5.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Type (2020-2025)

5.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Type (2026-2031)

5.2.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Type (2020-2031)

5.3 Global Epoxy Molding Compound in Semiconductor Packaging Price by Type (2020-2031)

6 Segment by Application

6.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Application (2020-2031)

6.1.1 Global Epoxy Molding Compound in Semiconductor Packaging Production by Application (2020-2025)

6.1.2 Global Epoxy Molding Compound in Semiconductor Packaging Production by Application (2026-2031)

6.1.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Application (2020-2031)

6.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Application (2020-2031)

6.2.1 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Application (2020-2025)

6.2.2 Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Application (2026-2031)

6.2.3 Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Application (2020-2031)

6.3 Global Epoxy Molding Compound in Semiconductor Packaging Price by Application (2020-2031)

7 Key Companies Profiled

7.1 Sumitomo Bakelite

7.1.1 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Company Information

7.1.2 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.1.3 Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.1.4 Sumitomo Bakelite Main Business and Markets Served

7.1.5 Sumitomo Bakelite Recent Developments/Updates

7.2 Nitto Denko

7.2.1 Nitto Denko Epoxy Molding Compound in Semiconductor Packaging Company Information

7.2.2 Nitto Denko Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.2.3 Nitto Denko Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.2.4 Nitto Denko Main Business and Markets Served

7.2.5 Nitto Denko Recent Developments/Updates

7.3 Resonac

7.3.1 Resonac Epoxy Molding Compound in Semiconductor Packaging Company Information

7.3.2 Resonac Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.3.3 Resonac Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.3.4 Resonac Main Business and Markets Served

7.3.5 Resonac Recent Developments/Updates

7.4 Shin-Etsu Chemical

7.4.1 Shin-Etsu Chemical Epoxy Molding Compound in Semiconductor Packaging Company Information

7.4.2 Shin-Etsu Chemical Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.4.3 Shin-Etsu Chemical Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.4.4 Shin-Etsu Chemical Main Business and Markets Served

7.4.5 Shin-Etsu Chemical Recent Developments/Updates

7.5 KCC

7.5.1 KCC Epoxy Molding Compound in Semiconductor Packaging Company Information

7.5.2 KCC Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.5.3 KCC Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.5.4 KCC Main Business and Markets Served

7.5.5 KCC Recent Developments/Updates

7.6 NEPES

7.6.1 NEPES Epoxy Molding Compound in Semiconductor Packaging Company Information

7.6.2 NEPES Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.6.3 NEPES Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.6.4 NEPES Main Business and Markets Served

7.6.5 NEPES Recent Developments/Updates

7.7 CHANG CHUN SB(CHANGSHU)

7.7.1 CHANG CHUN SB(CHANGSHU) Epoxy Molding Compound in Semiconductor Packaging Company Information

7.7.2 CHANG CHUN SB(CHANGSHU) Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.7.3 CHANG CHUN SB(CHANGSHU) Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.7.4 CHANG CHUN SB(CHANGSHU) Main Business and Markets Served

7.7.5 CHANG CHUN SB(CHANGSHU) Recent Developments/Updates

7.8 Hysol Huawei Electronics

7.8.1 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Company Information

7.8.2 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.8.3 Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.8.4 Hysol Huawei Electronics Main Business and Markets Served

7.8.5 Hysol Huawei Electronics Recent Developments/Updates

7.9 Jiangsu Huahai Chengkexin Material

7.9.1 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Company Information

7.9.2 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.9.3 Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Jiangsu Huahai Chengkexin Material Main Business and Markets Served

7.9.5 Jiangsu Huahai Chengkexin Material Recent Developments/Updates

7.10 PhiChem Corporation

7.10.1 PhiChem Corporation Epoxy Molding Compound in Semiconductor Packaging Company Information

7.10.2 PhiChem Corporation Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.10.3 PhiChem Corporation Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.10.4 PhiChem Corporation Main Business and Markets Served

7.10.5 PhiChem Corporation Recent Developments/Updates

7.11 Duresco

7.11.1 Duresco Epoxy Molding Compound in Semiconductor Packaging Company Information

7.11.2 Duresco Epoxy Molding Compound in Semiconductor Packaging Product Portfolio

7.11.3 Duresco Epoxy Molding Compound in Semiconductor Packaging Production, Value, Price and Gross Margin (2020-2025)

7.11.4 Duresco Main Business and Markets Served

7.11.5 Duresco Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Epoxy Molding Compound in Semiconductor Packaging Industry Chain Analysis

8.2 Epoxy Molding Compound in Semiconductor Packaging Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Epoxy Molding Compound in Semiconductor Packaging Production Mode & Process Analysis

8.4 Epoxy Molding Compound in Semiconductor Packaging Sales and Marketing

8.4.1 Epoxy Molding Compound in Semiconductor Packaging Sales Channels

8.4.2 Epoxy Molding Compound in Semiconductor Packaging Distributors

8.5 Epoxy Molding Compound in Semiconductor Packaging Customer Analysis

9 Epoxy Molding Compound in Semiconductor Packaging Market Dynamics

9.1 Epoxy Molding Compound in Semiconductor Packaging Industry Trends

9.2 Epoxy Molding Compound in Semiconductor Packaging Market Drivers

9.3 Epoxy Molding Compound in Semiconductor Packaging Market Challenges

9.4 Epoxy Molding Compound in Semiconductor Packaging Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

Sumitomo Bakelite

KCC

Duresco GmbH

Hysol Huawei Electronics

Jiangsu Huahai Chengkexin Material

CHANG CHUN SB(CHANGSHU)

List of Tables

Table 1. Global Epoxy Molding Compound in Semiconductor Packaging Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Epoxy Molding Compound in Semiconductor Packaging Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity (Ton) by Manufacturers in 2024

Table 4. Global Epoxy Molding Compound in Semiconductor Packaging Production by Manufacturers (2020-2025) & (Ton)

Table 5. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Manufacturers (2020-2025)

Table 6. Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Epoxy Molding Compound in Semiconductor Packaging, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Epoxy Molding Compound in Semiconductor Packaging as of 2024)

Table 10. Global Market Epoxy Molding Compound in Semiconductor Packaging Average Price by Manufacturers (US$/Ton) & (2020-2025)

Table 11. Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Product Offered and Application

Table 13. Global Key Manufacturers of Epoxy Molding Compound in Semiconductor Packaging, Date of Enter into This Industry

Table 14. Global Epoxy Molding Compound in Semiconductor Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Region (2020-2025)

Table 19. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Epoxy Molding Compound in Semiconductor Packaging Production Comparison by Region: 2020 VS 2024 VS 2031 (Ton)

Table 22. Global Epoxy Molding Compound in Semiconductor Packaging Production (Ton) by Region (2020-2025)

Table 23. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region (2020-2025)

Table 24. Global Epoxy Molding Compound in Semiconductor Packaging Production (Ton) Forecast by Region (2026-2031)

Table 25. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share Forecast by Region (2026-2031)

Table 26. Global Epoxy Molding Compound in Semiconductor Packaging Market Average Price (US$/Ton) by Region (2020-2025)

Table 27. Global Epoxy Molding Compound in Semiconductor Packaging Market Average Price (US$/Ton) by Region (2026-2031)

Table 28. Global Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Ton)

Table 29. Global Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2020-2025) & (Ton)

Table 30. Global Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Region (2020-2025)

Table 31. Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Consumption by Region (2026-2031) & (Ton)

Table 32. Global Epoxy Molding Compound in Semiconductor Packaging Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Ton)

Table 34. North America Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2020-2025) & (Ton)

Table 35. North America Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2026-2031) & (Ton)

Table 36. Europe Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Ton)

Table 37. Europe Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2020-2025) & (Ton)

Table 38. Europe Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2026-2031) & (Ton)

Table 39. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Ton)

Table 40. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2020-2025) & (Ton)

Table 41. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption by Region (2026-2031) & (Ton)

Table 42. Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Ton)

Table 43. Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2020-2025) & (Ton)

Table 44. Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption by Country (2026-2031) & (Ton)

Table 45. Global Epoxy Molding Compound in Semiconductor Packaging Production (Ton) by Type (2020-2025)

Table 46. Global Epoxy Molding Compound in Semiconductor Packaging Production (Ton) by Type (2026-2031)

Table 47. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Type (2020-2025)

Table 48. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Type (2026-2031)

Table 49. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Type (2020-2025)

Table 52. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Type (2026-2031)

Table 53. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Type (2020-2025)

Table 54. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Type (2026-2031)

Table 55. Global Epoxy Molding Compound in Semiconductor Packaging Production (Ton) by Application (2020-2025)

Table 56. Global Epoxy Molding Compound in Semiconductor Packaging Production (Ton) by Application (2026-2031)

Table 57. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Application (2020-2025)

Table 58. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Application (2026-2031)

Table 59. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Application (2020-2025)

Table 62. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Application (2026-2031)

Table 63. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Application (2020-2025)

Table 64. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Application (2026-2031)

Table 65. Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 66. Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 67. Sumitomo Bakelite Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 68. Sumitomo Bakelite Main Business and Markets Served

Table 69. Sumitomo Bakelite Recent Developments/Updates

Table 70. Nitto Denko Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 71. Nitto Denko Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 72. Nitto Denko Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 73. Nitto Denko Main Business and Markets Served

Table 74. Nitto Denko Recent Developments/Updates

Table 75. Resonac Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 76. Resonac Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 77. Resonac Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 78. Resonac Main Business and Markets Served

Table 79. Resonac Recent Developments/Updates

Table 80. Shin-Etsu Chemical Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 81. Shin-Etsu Chemical Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 82. Shin-Etsu Chemical Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 83. Shin-Etsu Chemical Main Business and Markets Served

Table 84. Shin-Etsu Chemical Recent Developments/Updates

Table 85. KCC Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 86. KCC Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 87. KCC Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 88. KCC Main Business and Markets Served

Table 89. KCC Recent Developments/Updates

Table 90. NEPES Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 91. NEPES Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 92. NEPES Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 93. NEPES Main Business and Markets Served

Table 94. NEPES Recent Developments/Updates

Table 95. CHANG CHUN SB(CHANGSHU) Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 96. CHANG CHUN SB(CHANGSHU) Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 97. CHANG CHUN SB(CHANGSHU) Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 98. CHANG CHUN SB(CHANGSHU) Main Business and Markets Served

Table 99. CHANG CHUN SB(CHANGSHU) Recent Developments/Updates

Table 100. Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 101. Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 102. Hysol Huawei Electronics Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 103. Hysol Huawei Electronics Main Business and Markets Served

Table 104. Hysol Huawei Electronics Recent Developments/Updates

Table 105. Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 106. Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 107. Jiangsu Huahai Chengkexin Material Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 108. Jiangsu Huahai Chengkexin Material Main Business and Markets Served

Table 109. Jiangsu Huahai Chengkexin Material Recent Developments/Updates

Table 110. PhiChem Corporation Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 111. PhiChem Corporation Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 112. PhiChem Corporation Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 113. PhiChem Corporation Main Business and Markets Served

Table 114. PhiChem Corporation Recent Developments/Updates

Table 115. Duresco Epoxy Molding Compound in Semiconductor Packaging Company Information

Table 116. Duresco Epoxy Molding Compound in Semiconductor Packaging Specification and Application

Table 117. Duresco Epoxy Molding Compound in Semiconductor Packaging Production (Ton), Value (US$ Million), Price (US$/Ton) and Gross Margin (2020-2025)

Table 118. Duresco Main Business and Markets Served

Table 119. Duresco Recent Developments/Updates

Table 120. Key Raw Materials Lists

Table 121. Raw Materials Key Suppliers Lists

Table 122. Epoxy Molding Compound in Semiconductor Packaging Distributors List

Table 123. Epoxy Molding Compound in Semiconductor Packaging Customers List

Table 124. Epoxy Molding Compound in Semiconductor Packaging Market Trends

Table 125. Epoxy Molding Compound in Semiconductor Packaging Market Drivers

Table 126. Epoxy Molding Compound in Semiconductor Packaging Market Challenges

Table 127. Epoxy Molding Compound in Semiconductor Packaging Market Restraints

Table 128. Research Programs/Design for This Report

Table 129. Key Data Information from Secondary Sources

Table 130. Key Data Information from Primary Sources

Table 131. Authors List of This Report

List of Figures

Figure 1. Product Picture of Epoxy Molding Compound in Semiconductor Packaging

Figure 2. Global Epoxy Molding Compound in Semiconductor Packaging Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Epoxy Molding Compound in Semiconductor Packaging Market Share by Type: 2024 VS 2031

Figure 4. Normal Epoxy Molding Compound Product Picture

Figure 5. Green Epoxy Molding Compound Product Picture

Figure 6. Global Epoxy Molding Compound in Semiconductor Packaging Market Value by Application, (US$ Million) & (2020-2031)

Figure 7. Global Epoxy Molding Compound in Semiconductor Packaging Market Share by Application: 2024 VS 2031

Figure 8. Advanced Packaging

Figure 9. Traditional Packaging

Figure 10. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 11. Global Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) & (2020-2031)

Figure 12. Global Epoxy Molding Compound in Semiconductor Packaging Production Capacity (Ton) & (2020-2031)

Figure 13. Global Epoxy Molding Compound in Semiconductor Packaging Production (Ton) & (2020-2031)

Figure 14. Global Epoxy Molding Compound in Semiconductor Packaging Average Price (US$/Ton) & (2020-2031)

Figure 15. Epoxy Molding Compound in Semiconductor Packaging Report Years Considered

Figure 16. Epoxy Molding Compound in Semiconductor Packaging Production Share by Manufacturers in 2024

Figure 17. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Share by Manufacturers (2024)

Figure 18. Epoxy Molding Compound in Semiconductor Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 19. The Global 5 and 10 Largest Players: Market Share by Epoxy Molding Compound in Semiconductor Packaging Revenue in 2024

Figure 20. Global Epoxy Molding Compound in Semiconductor Packaging Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 21. Global Epoxy Molding Compound in Semiconductor Packaging Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 22. Global Epoxy Molding Compound in Semiconductor Packaging Production Comparison by Region: 2020 VS 2024 VS 2031 (Ton)

Figure 23. Global Epoxy Molding Compound in Semiconductor Packaging Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 24. North America Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) Growth Rate (2020-2031)

Figure 25. Europe Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) Growth Rate (2020-2031)

Figure 26. China Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. Japan Epoxy Molding Compound in Semiconductor Packaging Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Global Epoxy Molding Compound in Semiconductor Packaging Consumption by Region: 2020 VS 2024 VS 2031 (Ton)

Figure 29. Global Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 30. North America Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 31. North America Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Country (2020-2031)

Figure 32. U.S. Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 33. Canada Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 34. Europe Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 35. Europe Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Country (2020-2031)

Figure 36. Germany Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 37. France Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 38. U.K. Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 39. Italy Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 40. Russia Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 41. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 42. Asia Pacific Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Region (2020-2031)

Figure 43. China Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 44. Japan Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 45. South Korea Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 46. China Taiwan Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 47. Southeast Asia Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 48. India Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 49. Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 50. Latin America, Middle East & Africa Epoxy Molding Compound in Semiconductor Packaging Consumption Market Share by Country (2020-2031)

Figure 51. Mexico Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 52. Brazil Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 53. Turkey Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 54. GCC Countries Epoxy Molding Compound in Semiconductor Packaging Consumption and Growth Rate (2020-2031) & (Ton)

Figure 55. Global Production Market Share of Epoxy Molding Compound in Semiconductor Packaging by Type (2020-2031)

Figure 56. Global Production Value Market Share of Epoxy Molding Compound in Semiconductor Packaging by Type (2020-2031)

Figure 57. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Type (2020-2031)

Figure 58. Global Production Market Share of Epoxy Molding Compound in Semiconductor Packaging by Application (2020-2031)

Figure 59. Global Production Value Market Share of Epoxy Molding Compound in Semiconductor Packaging by Application (2020-2031)

Figure 60. Global Epoxy Molding Compound in Semiconductor Packaging Price (US$/Ton) by Application (2020-2031)

Figure 61. Epoxy Molding Compound in Semiconductor Packaging Value Chain

Figure 62. Channels of Distribution (Direct Vs Distribution)

Figure 63. Bottom-up and Top-down Approaches for This Report

Figure 64. Data Triangulation

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