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Global Blades for Wafer Cutting Market Research Report 2025

Published Date: July 2025

Report Code: QYRE-Auto-26R9213

Global Blades for Wafer Cutting Market Research Report 2022

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Global Blades for Wafer Cutting Market Research Report 2025

Code: QYRE-Auto-26R9213

Report

July 2025

Pages:86

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

ACCRETECH

Advanced Dicing Technologies (ADT)

Disco

K+S

UKAM

Ceiba

Shanghai Sinyang

Kinik

ITI

Blades for Wafer Cutting Market Size

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

Blades for Wafer Cutting Market

The global market for Blades for Wafer Cutting was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Blades for Wafer Cutting, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Blades for Wafer Cutting.

The Blades for Wafer Cutting market size, estimations, and forecasts are provided in terms of sales volume (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Blades for Wafer Cutting market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Blades for Wafer Cutting manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Scope of Blades for Wafer Cutting Market Report

Report Metric	Details
Report Name	Blades for Wafer Cutting Market
Accounted market size in year	US$ 579 billion
Forecasted market size in 2029	US$ 790 billion
CAGR	6%
Base Year	year
Forecasted years	2025 - 2029
Segment by Type	Resin-blades Metal Sintered Blades Nickel Blades Others
Segment by Application	Semiconductor Others
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	Accretech, Advanced Dicing Technologies (ADT), DISCO, K&S, UKAM, Ceiba, Shanghai Sinyang, Kinik, ITI
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Core Chapters

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Blades for Wafer Cutting manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Sales, revenue of Blades for Wafer Cutting in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 7: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 8: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 9: The main points and conclusions of the report.

FAQ for this report

How fast is Blades for Wafer Cutting Market growing?

Ans: The Blades for Wafer Cutting Market witnessing a CAGR of 6% during the forecast period 2025-2029.

What is the Blades for Wafer Cutting Market size in 2029?

Ans: The Blades for Wafer Cutting Market size in 2029 will be US$ 790 billion.

Who are the main players in the Blades for Wafer Cutting Market report?

Ans: The main players in the Blades for Wafer Cutting Market are Accretech, Advanced Dicing Technologies (ADT), DISCO, K&S, UKAM, Ceiba, Shanghai Sinyang, Kinik, ITI

What are the Application segmentation covered in the Blades for Wafer Cutting Market report?

Ans: The Applications covered in the Blades for Wafer Cutting Market report are Semiconductor, Others

What are the Type segmentation covered in the Blades for Wafer Cutting Market report?

Ans: The Types covered in the Blades for Wafer Cutting Market report are Resin-blades, Metal Sintered Blades, Nickel Blades, Others

Recommended Reports

Wafer Equipment Markets

Semiconductor Consumables

Wafer Processing Tools

1 Blades for Wafer Cutting Market Overview

1.1 Product Definition

1.2 Blades for Wafer Cutting by Type

1.2.1 Global Blades for Wafer Cutting Market Value Comparison by Type (2024 VS 2031)

1.2.2 Resin-blades

1.2.3 Metal Sintered Blades

1.2.4 Nickel Blades

1.2.5 Others

1.3 Blades for Wafer Cutting by Application

1.3.1 Global Blades for Wafer Cutting Market Value by Application (2024 VS 2031)

1.3.2 Semiconductor

1.3.3 Others

1.4 Global Blades for Wafer Cutting Market Size Estimates and Forecasts

1.4.1 Global Blades for Wafer Cutting Revenue 2020-2031

1.4.2 Global Blades for Wafer Cutting Sales 2020-2031

1.4.3 Global Blades for Wafer Cutting Market Average Price (2020-2031)

1.5 Assumptions and Limitations

2 Blades for Wafer Cutting Market Competition by Manufacturers

2.1 Global Blades for Wafer Cutting Sales Market Share by Manufacturers (2020-2025)

2.2 Global Blades for Wafer Cutting Revenue Market Share by Manufacturers (2020-2025)

2.3 Global Blades for Wafer Cutting Average Price by Manufacturers (2020-2025)

2.4 Global Key Players of Blades for Wafer Cutting, Industry Ranking, 2022 VS 2023 VS 2024

2.5 Global Key Manufacturers of Blades for Wafer Cutting, Manufacturing Sites & Headquarters

2.6 Global Key Manufacturers of Blades for Wafer Cutting, Product Type & Application

2.7 Global Key Manufacturers of Blades for Wafer Cutting, Date of Enter into This Industry

2.8 Global Blades for Wafer Cutting Market Competitive Situation and Trends

2.8.1 Global Blades for Wafer Cutting Market Concentration Rate

2.8.2 The Global 5 and 10 Largest Blades for Wafer Cutting Players Market Share by Revenue

2.8.3 Global Blades for Wafer Cutting Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.9 Manufacturers Mergers & Acquisitions, Expansion Plans

3 Global Blades for Wafer Cutting Market Scenario by Region

3.1 Global Blades for Wafer Cutting Market Size by Region: 2020 Versus 2024 Versus 2031

3.2 Global Blades for Wafer Cutting Sales by Region: 2020-2031

3.2.1 Global Blades for Wafer Cutting Sales by Region: 2020-2025

3.2.2 Global Blades for Wafer Cutting Sales by Region: 2026-2031

3.3 Global Blades for Wafer Cutting Revenue by Region: 2020-2031

3.3.1 Global Blades for Wafer Cutting Revenue by Region: 2020-2025

3.3.2 Global Blades for Wafer Cutting Revenue by Region: 2026-2031

3.4 North America Blades for Wafer Cutting Market Facts & Figures by Country

3.4.1 North America Blades for Wafer Cutting Market Size by Country: 2020 VS 2024 VS 2031

3.4.2 North America Blades for Wafer Cutting Sales by Country (2020-2031)

3.4.3 North America Blades for Wafer Cutting Revenue by Country (2020-2031)

3.4.4 United States

3.4.5 Canada

3.5 Europe Blades for Wafer Cutting Market Facts & Figures by Country

3.5.1 Europe Blades for Wafer Cutting Market Size by Country: 2020 VS 2024 VS 2031

3.5.2 Europe Blades for Wafer Cutting Sales by Country (2020-2031)

3.5.3 Europe Blades for Wafer Cutting Revenue by Country (2020-2031)

3.5.4 Germany

3.5.5 France

3.5.6 U.K.

3.5.7 Italy

3.5.8 Russia

3.6 Asia Pacific Blades for Wafer Cutting Market Facts & Figures by Region

3.6.1 Asia Pacific Blades for Wafer Cutting Market Size by Region: 2020 VS 2024 VS 2031

3.6.2 Asia Pacific Blades for Wafer Cutting Sales by Region (2020-2031)

3.6.3 Asia Pacific Blades for Wafer Cutting Revenue by Region (2020-2031)

3.6.4 China

3.6.5 Japan

3.6.6 South Korea

3.6.7 India

3.6.8 Australia

3.6.9 China Taiwan

3.6.10 Indonesia

3.6.11 Thailand

3.6.12 Malaysia

3.7 Latin America Blades for Wafer Cutting Market Facts & Figures by Country

3.7.1 Latin America Blades for Wafer Cutting Market Size by Country: 2020 VS 2024 VS 2031

3.7.2 Latin America Blades for Wafer Cutting Sales by Country (2020-2031)

3.7.3 Latin America Blades for Wafer Cutting Revenue by Country (2020-2031)

3.7.4 Mexico

3.7.5 Brazil

3.7.6 Argentina

3.8 Middle East and Africa Blades for Wafer Cutting Market Facts & Figures by Country

3.8.1 Middle East and Africa Blades for Wafer Cutting Market Size by Country: 2020 VS 2024 VS 2031

3.8.2 Middle East and Africa Blades for Wafer Cutting Sales by Country (2020-2031)

3.8.3 Middle East and Africa Blades for Wafer Cutting Revenue by Country (2020-2031)

3.8.4 Turkey

3.8.5 Saudi Arabia

3.8.6 UAE

4 Segment by Type

4.1 Global Blades for Wafer Cutting Sales by Type (2020-2031)

4.1.1 Global Blades for Wafer Cutting Sales by Type (2020-2025)

4.1.2 Global Blades for Wafer Cutting Sales by Type (2026-2031)

4.1.3 Global Blades for Wafer Cutting Sales Market Share by Type (2020-2031)

4.2 Global Blades for Wafer Cutting Revenue by Type (2020-2031)

4.2.1 Global Blades for Wafer Cutting Revenue by Type (2020-2025)

4.2.2 Global Blades for Wafer Cutting Revenue by Type (2026-2031)

4.2.3 Global Blades for Wafer Cutting Revenue Market Share by Type (2020-2031)

4.3 Global Blades for Wafer Cutting Price by Type (2020-2031)

5 Segment by Application

5.1 Global Blades for Wafer Cutting Sales by Application (2020-2031)

5.1.1 Global Blades for Wafer Cutting Sales by Application (2020-2025)

5.1.2 Global Blades for Wafer Cutting Sales by Application (2026-2031)

5.1.3 Global Blades for Wafer Cutting Sales Market Share by Application (2020-2031)

5.2 Global Blades for Wafer Cutting Revenue by Application (2020-2031)

5.2.1 Global Blades for Wafer Cutting Revenue by Application (2020-2025)

5.2.2 Global Blades for Wafer Cutting Revenue by Application (2026-2031)

5.2.3 Global Blades for Wafer Cutting Revenue Market Share by Application (2020-2031)

5.3 Global Blades for Wafer Cutting Price by Application (2020-2031)

6 Key Companies Profiled

6.1 Accretech

6.1.1 Accretech Company Information

6.1.2 Accretech Description and Business Overview

6.1.3 Accretech Blades for Wafer Cutting Sales, Revenue and Gross Margin (2020-2025)

6.1.4 Accretech Blades for Wafer Cutting Product Portfolio

6.1.5 Accretech Recent Developments/Updates

6.2 Advanced Dicing Technologies (ADT)

6.2.1 Advanced Dicing Technologies (ADT) Company Information

6.2.2 Advanced Dicing Technologies (ADT) Description and Business Overview

6.2.3 Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Sales, Revenue and Gross Margin (2020-2025)

6.2.4 Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Product Portfolio

6.2.5 Advanced Dicing Technologies (ADT) Recent Developments/Updates

6.3 DISCO

6.3.1 DISCO Company Information

6.3.2 DISCO Description and Business Overview

6.3.3 DISCO Blades for Wafer Cutting Sales, Revenue and Gross Margin (2020-2025)

6.3.4 DISCO Blades for Wafer Cutting Product Portfolio

6.3.5 DISCO Recent Developments/Updates

6.4 K&S

6.4.1 K&S Company Information

6.4.2 K&S Description and Business Overview

6.4.3 K&S Blades for Wafer Cutting Sales, Revenue and Gross Margin (2020-2025)

6.4.4 K&S Blades for Wafer Cutting Product Portfolio

6.4.5 K&S Recent Developments/Updates

6.5 UKAM

6.5.1 UKAM Company Information

6.5.2 UKAM Description and Business Overview

6.5.3 UKAM Blades for Wafer Cutting Sales, Revenue and Gross Margin (2020-2025)

6.5.4 UKAM Blades for Wafer Cutting Product Portfolio

6.5.5 UKAM Recent Developments/Updates

6.6 Ceiba

6.6.1 Ceiba Company Information

6.6.2 Ceiba Description and Business Overview

6.6.3 Ceiba Blades for Wafer Cutting Sales, Revenue and Gross Margin (2020-2025)

6.6.4 Ceiba Blades for Wafer Cutting Product Portfolio

6.6.5 Ceiba Recent Developments/Updates

6.7 Shanghai Sinyang

6.7.1 Shanghai Sinyang Company Information

6.7.2 Shanghai Sinyang Description and Business Overview

6.7.3 Shanghai Sinyang Blades for Wafer Cutting Sales, Revenue and Gross Margin (2020-2025)

6.7.4 Shanghai Sinyang Blades for Wafer Cutting Product Portfolio

6.7.5 Shanghai Sinyang Recent Developments/Updates

6.8 Kinik

6.8.1 Kinik Company Information

6.8.2 Kinik Description and Business Overview

6.8.3 Kinik Blades for Wafer Cutting Sales, Revenue and Gross Margin (2020-2025)

6.8.4 Kinik Blades for Wafer Cutting Product Portfolio

6.8.5 Kinik Recent Developments/Updates

6.9 ITI

6.9.1 ITI Company Information

6.9.2 ITI Description and Business Overview

6.9.3 ITI Blades for Wafer Cutting Sales, Revenue and Gross Margin (2020-2025)

6.9.4 ITI Blades for Wafer Cutting Product Portfolio

6.9.5 ITI Recent Developments/Updates

7 Industry Chain and Sales Channels Analysis

7.1 Blades for Wafer Cutting Industry Chain Analysis

7.2 Blades for Wafer Cutting Raw Material Supply Analysis

7.2.1 Key Raw Materials

7.2.2 Raw Materials Key Suppliers

7.3 Blades for Wafer Cutting Production Mode & Process Analysis

7.4 Blades for Wafer Cutting Sales and Marketing

7.4.1 Blades for Wafer Cutting Sales Channels

7.4.2 Blades for Wafer Cutting Distributors

7.5 Blades for Wafer Cutting Customer Analysis

8 Blades for Wafer Cutting Market Dynamics

8.1 Blades for Wafer Cutting Industry Trends

8.2 Blades for Wafer Cutting Market Drivers

8.3 Blades for Wafer Cutting Market Challenges

8.4 Blades for Wafer Cutting Market Restraints

9 Research Findings and Conclusion

10 Methodology and Data Source

10.1 Methodology/Research Approach

10.1.1 Research Programs/Design

10.1.2 Market Size Estimation

10.1.3 Market Breakdown and Data Triangulation

10.2 Data Source

10.2.1 Secondary Sources

10.2.2 Primary Sources

10.3 Author List

10.4 Disclaimer

FEATURED COMPANIES

ACCRETECH

Advanced Dicing Technologies (ADT)

Disco

K+S

UKAM

Ceiba

Shanghai Sinyang

Kinik

ITI

List of Tables

Table 1. Global Blades for Wafer Cutting Market Value Comparison by Type (2024 VS 2031) & (US$ Million)

Table 2. Global Blades for Wafer Cutting Market Value by Application (2024 VS 2031) & (US$ Million)

Table 3. Global Blades for Wafer Cutting Market Competitive Situation by Manufacturers in 2024

Table 4. Global Blades for Wafer Cutting Sales (K Units) of Key Manufacturers (2020-2025)

Table 5. Global Blades for Wafer Cutting Sales Market Share by Manufacturers (2020-2025)

Table 6. Global Blades for Wafer Cutting Revenue (US$ Million) by Manufacturers (2020-2025)

Table 7. Global Blades for Wafer Cutting Revenue Share by Manufacturers (2020-2025)

Table 8. Global Market Blades for Wafer Cutting Average Price (USD/Unit) of Key Manufacturers (2020-2025)

Table 9. Global Key Players of Blades for Wafer Cutting, Industry Ranking, 2022 VS 2023 VS 2024

Table 10. Global Key Manufacturers of Blades for Wafer Cutting, Manufacturing Sites & Headquarters

Table 11. Global Key Manufacturers of Blades for Wafer Cutting, Product Type & Application

Table 12. Global Key Manufacturers of Blades for Wafer Cutting, Date of Enter into This Industry

Table 13. Global Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 14. Global Blades for Wafer Cutting by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Blades for Wafer Cutting as of 2024)

Table 15. Manufacturers Mergers & Acquisitions, Expansion Plans

Table 16. Global Blades for Wafer Cutting Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Table 17. Global Blades for Wafer Cutting Sales by Region (2020-2025) & (K Units)

Table 18. Global Blades for Wafer Cutting Sales Market Share by Region (2020-2025)

Table 19. Global Blades for Wafer Cutting Sales by Region (2026-2031) & (K Units)

Table 20. Global Blades for Wafer Cutting Sales Market Share by Region (2026-2031)

Table 21. Global Blades for Wafer Cutting Revenue by Region (2020-2025) & (US$ Million)

Table 22. Global Blades for Wafer Cutting Revenue Market Share by Region (2020-2025)

Table 23. Global Blades for Wafer Cutting Revenue by Region (2026-2031) & (US$ Million)

Table 24. Global Blades for Wafer Cutting Revenue Market Share by Region (2026-2031)

Table 25. North America Blades for Wafer Cutting Revenue by Country: 2020 VS 2024 VS 2031 (US$ Million)

Table 26. North America Blades for Wafer Cutting Sales by Country (2020-2025) & (K Units)

Table 27. North America Blades for Wafer Cutting Sales by Country (2026-2031) & (K Units)

Table 28. North America Blades for Wafer Cutting Revenue by Country (2020-2025) & (US$ Million)

Table 29. North America Blades for Wafer Cutting Revenue by Country (2026-2031) & (US$ Million)

Table 30. Europe Blades for Wafer Cutting Revenue by Country: 2020 VS 2024 VS 2031 (US$ Million)

Table 31. Europe Blades for Wafer Cutting Sales by Country (2020-2025) & (K Units)

Table 32. Europe Blades for Wafer Cutting Sales by Country (2026-2031) & (K Units)

Table 33. Europe Blades for Wafer Cutting Revenue by Country (2020-2025) & (US$ Million)

Table 34. Europe Blades for Wafer Cutting Revenue by Country (2026-2031) & (US$ Million)

Table 35. Asia Pacific Blades for Wafer Cutting Revenue by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 36. Asia Pacific Blades for Wafer Cutting Sales by Region (2020-2025) & (K Units)

Table 37. Asia Pacific Blades for Wafer Cutting Sales by Region (2026-2031) & (K Units)

Table 38. Asia Pacific Blades for Wafer Cutting Revenue by Region (2020-2025) & (US$ Million)

Table 39. Asia Pacific Blades for Wafer Cutting Revenue by Region (2026-2031) & (US$ Million)

Table 40. Latin America Blades for Wafer Cutting Revenue by Country: 2020 VS 2024 VS 2031 (US$ Million)

Table 41. Latin America Blades for Wafer Cutting Sales by Country (2020-2025) & (K Units)

Table 42. Latin America Blades for Wafer Cutting Sales by Country (2026-2031) & (K Units)

Table 43. Latin America Blades for Wafer Cutting Revenue by Country (2020-2025) & (US$ Million)

Table 44. Latin America Blades for Wafer Cutting Revenue by Country (2026-2031) & (US$ Million)

Table 45. Middle East and Africa Blades for Wafer Cutting Revenue by Country: 2020 VS 2024 VS 2031 (US$ Million)

Table 46. Middle East and Africa Blades for Wafer Cutting Sales by Country (2020-2025) & (K Units)

Table 47. Middle East and Africa Blades for Wafer Cutting Sales by Country (2026-2031) & (K Units)

Table 48. Middle East and Africa Blades for Wafer Cutting Revenue by Country (2020-2025) & (US$ Million)

Table 49. Middle East and Africa Blades for Wafer Cutting Revenue by Country (2026-2031) & (US$ Million)

Table 50. Global Blades for Wafer Cutting Sales (K Units) by Type (2020-2025)

Table 51. Global Blades for Wafer Cutting Sales (K Units) by Type (2026-2031)

Table 52. Global Blades for Wafer Cutting Sales Market Share by Type (2020-2025)

Table 53. Global Blades for Wafer Cutting Sales Market Share by Type (2026-2031)

Table 54. Global Blades for Wafer Cutting Revenue (US$ Million) by Type (2020-2025)

Table 55. Global Blades for Wafer Cutting Revenue (US$ Million) by Type (2026-2031)

Table 56. Global Blades for Wafer Cutting Revenue Market Share by Type (2020-2025)

Table 57. Global Blades for Wafer Cutting Revenue Market Share by Type (2026-2031)

Table 58. Global Blades for Wafer Cutting Price (USD/Unit) by Type (2020-2025)

Table 59. Global Blades for Wafer Cutting Price (USD/Unit) by Type (2026-2031)

Table 60. Global Blades for Wafer Cutting Sales (K Units) by Application (2020-2025)

Table 61. Global Blades for Wafer Cutting Sales (K Units) by Application (2026-2031)

Table 62. Global Blades for Wafer Cutting Sales Market Share by Application (2020-2025)

Table 63. Global Blades for Wafer Cutting Sales Market Share by Application (2026-2031)

Table 64. Global Blades for Wafer Cutting Revenue (US$ Million) by Application (2020-2025)

Table 65. Global Blades for Wafer Cutting Revenue (US$ Million) by Application (2026-2031)

Table 66. Global Blades for Wafer Cutting Revenue Market Share by Application (2020-2025)

Table 67. Global Blades for Wafer Cutting Revenue Market Share by Application (2026-2031)

Table 68. Global Blades for Wafer Cutting Price (USD/Unit) by Application (2020-2025)

Table 69. Global Blades for Wafer Cutting Price (USD/Unit) by Application (2026-2031)

Table 70. Accretech Company Information

Table 71. Accretech Description and Business Overview

Table 72. Accretech Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2020-2025)

Table 73. Accretech Blades for Wafer Cutting Product

Table 74. Accretech Recent Developments/Updates

Table 75. Advanced Dicing Technologies (ADT) Company Information

Table 76. Advanced Dicing Technologies (ADT) Description and Business Overview

Table 77. Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2020-2025)

Table 78. Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Product

Table 79. Advanced Dicing Technologies (ADT) Recent Developments/Updates

Table 80. DISCO Company Information

Table 81. DISCO Description and Business Overview

Table 82. DISCO Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2020-2025)

Table 83. DISCO Blades for Wafer Cutting Product

Table 84. DISCO Recent Developments/Updates

Table 85. K&S Company Information

Table 86. K&S Description and Business Overview

Table 87. K&S Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2020-2025)

Table 88. K&S Blades for Wafer Cutting Product

Table 89. K&S Recent Developments/Updates

Table 90. UKAM Company Information

Table 91. UKAM Description and Business Overview

Table 92. UKAM Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2020-2025)

Table 93. UKAM Blades for Wafer Cutting Product

Table 94. UKAM Recent Developments/Updates

Table 95. Ceiba Company Information

Table 96. Ceiba Description and Business Overview

Table 97. Ceiba Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2020-2025)

Table 98. Ceiba Blades for Wafer Cutting Product

Table 99. Ceiba Recent Developments/Updates

Table 100. Shanghai Sinyang Company Information

Table 101. Shanghai Sinyang Description and Business Overview

Table 102. Shanghai Sinyang Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2020-2025)

Table 103. Shanghai Sinyang Blades for Wafer Cutting Product

Table 104. Shanghai Sinyang Recent Developments/Updates

Table 105. Kinik Company Information

Table 106. Kinik Description and Business Overview

Table 107. Kinik Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2020-2025)

Table 108. Kinik Blades for Wafer Cutting Product

Table 109. Kinik Recent Developments/Updates

Table 110. ITI Company Information

Table 111. ITI Description and Business Overview

Table 112. ITI Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2020-2025)

Table 113. ITI Blades for Wafer Cutting Product

Table 114. ITI Recent Developments/Updates

Table 115. Key Raw Materials Lists

Table 116. Raw Materials Key Suppliers Lists

Table 117. Blades for Wafer Cutting Distributors List

Table 118. Blades for Wafer Cutting Customers List

Table 119. Blades for Wafer Cutting Market Trends

Table 120. Blades for Wafer Cutting Market Drivers

Table 121. Blades for Wafer Cutting Market Challenges

Table 122. Blades for Wafer Cutting Market Restraints

Table 123. Research Programs/Design for This Report

Table 124. Key Data Information from Secondary Sources

Table 125. Key Data Information from Primary Sources

Table 126. Authors List of This Report

List of Figures

Figure 1. Product Picture of Blades for Wafer Cutting

Figure 2. Global Blades for Wafer Cutting Market Value Comparison by Type (2020-2031) & (US$ Million)

Figure 3. Global Blades for Wafer Cutting Market Share by Type: 2024 & 2031

Figure 4. Resin-blades Product Picture

Figure 5. Metal Sintered Blades Product Picture

Figure 6. Nickel Blades Product Picture

Figure 7. Others Product Picture

Figure 8. Global Blades for Wafer Cutting Market Value by Application (2020-2031) & (US$ Million)

Figure 9. Global Blades for Wafer Cutting Market Share by Application: 2024 & 2031

Figure 10. Semiconductor

Figure 11. Others

Figure 12. Global Blades for Wafer Cutting Revenue, (US$ Million), 2020 VS 2024 VS 2031

Figure 13. Global Blades for Wafer Cutting Market Size (2020-2031) & (US$ Million)

Figure 14. Global Blades for Wafer Cutting Sales (2020-2031) & (K Units)

Figure 15. Global Blades for Wafer Cutting Average Price (USD/Unit) & (2020-2031)

Figure 16. Blades for Wafer Cutting Report Years Considered

Figure 17. Blades for Wafer Cutting Sales Share by Manufacturers in 2024

Figure 18. Global Blades for Wafer Cutting Revenue Share by Manufacturers in 2024

Figure 19. Global 5 and 10 Largest Blades for Wafer Cutting Players: Market Share by Revenue in Blades for Wafer Cutting in 2024

Figure 20. Blades for Wafer Cutting Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 21. Global Blades for Wafer Cutting Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Figure 22. North America Blades for Wafer Cutting Sales Market Share by Country (2020-2031)

Figure 23. North America Blades for Wafer Cutting Revenue Market Share by Country (2020-2031)

Figure 24. United States Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 25. Canada Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 26. Europe Blades for Wafer Cutting Sales Market Share by Country (2020-2031)

Figure 27. Europe Blades for Wafer Cutting Revenue Market Share by Country (2020-2031)

Figure 28. Germany Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 29. France Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 30. U.K. Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 31. Italy Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 32. Russia Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 33. Asia Pacific Blades for Wafer Cutting Sales Market Share by Region (2020-2031)

Figure 34. Asia Pacific Blades for Wafer Cutting Revenue Market Share by Region (2020-2031)

Figure 35. China Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 36. Japan Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 37. South Korea Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 38. India Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 39. Australia Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 40. China Taiwan Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 41. Indonesia Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 42. Thailand Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 43. Malaysia Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 44. Latin America Blades for Wafer Cutting Sales Market Share by Country (2020-2031)

Figure 45. Latin America Blades for Wafer Cutting Revenue Market Share by Country (2020-2031)

Figure 46. Mexico Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 47. Brazil Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 48. Argentina Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 49. Middle East and Africa Blades for Wafer Cutting Sales Market Share by Country (2020-2031)

Figure 50. Middle East and Africa Blades for Wafer Cutting Revenue Market Share by Country (2020-2031)

Figure 51. Turkey Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 52. Saudi Arabia Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 53. UAE Blades for Wafer Cutting Revenue Growth Rate (2020-2031) & (US$ Million)

Figure 54. Global Sales Market Share of Blades for Wafer Cutting by Type (2020-2031)

Figure 55. Global Revenue Market Share of Blades for Wafer Cutting by Type (2020-2031)

Figure 56. Global Blades for Wafer Cutting Price (USD/Unit) by Type (2020-2031)

Figure 57. Global Sales Market Share of Blades for Wafer Cutting by Application (2020-2031)

Figure 58. Global Revenue Market Share of Blades for Wafer Cutting by Application (2020-2031)

Figure 59. Global Blades for Wafer Cutting Price (USD/Unit) by Application (2020-2031)

Figure 60. Blades for Wafer Cutting Value Chain

Figure 61. Channels of Distribution (Direct Vs Distribution)

Figure 62. Bottom-up and Top-down Approaches for This Report

Figure 63. Data Triangulation

Figure 64. Key Executives Interviewed

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