The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

Blades for Wafer Cutting - Market

The global market for Blades for Wafer Cutting was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.

Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Blades for Wafer Cutting, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Blades for Wafer Cutting by region & country, by Type, and by Application.

The Blades for Wafer Cutting market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Blades for Wafer Cutting.

Market Segmentation

Scope of Blades for Wafer Cutting - Market Report

Report Metric	Details
Report Name	Blades for Wafer Cutting - Market
Accounted market size in year	US$ 579 billion
Forecasted market size in 2029	US$ 790 billion
CAGR	6%
Base Year	year
Forecasted years	2024 - 2029
Segment by Type:	Resin-blades Metal Sintered Blades Nickel Blades Others
Segment by Application	Semiconductor Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Accretech, Advanced Dicing Technologies (ADT), DISCO, K&S, UKAM, Ceiba, Shanghai Sinyang, Kinik, ITI
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Blades for Wafer Cutting manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Blades for Wafer Cutting in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Blades for Wafer Cutting in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

FAQ for this report

How fast is Blades for Wafer Cutting - Market growing?

Ans: The Blades for Wafer Cutting - Market witnessing a CAGR of 6% during the forecast period 2024-2029.

What is the Blades for Wafer Cutting - Market size in 2029?

Ans: The Blades for Wafer Cutting - Market size in 2029 will be US$ 790 billion.

Who are the main players in the Blades for Wafer Cutting - Market report?

Ans: The main players in the Blades for Wafer Cutting - Market are Accretech, Advanced Dicing Technologies (ADT), DISCO, K&S, UKAM, Ceiba, Shanghai Sinyang, Kinik, ITI

What are the Application segmentation covered in the Blades for Wafer Cutting - Market report?

Ans: The Applications covered in the Blades for Wafer Cutting - Market report are Semiconductor, Others

What are the Type segmentation covered in the Blades for Wafer Cutting - Market report?

Ans: The Types covered in the Blades for Wafer Cutting - Market report are Resin-blades, Metal Sintered Blades, Nickel Blades, Others

1 Market Overview

1.1 Blades for Wafer Cutting Product Introduction

1.2 Global Blades for Wafer Cutting Market Size Forecast

1.2.1 Global Blades for Wafer Cutting Sales Value (2019-2030)

1.2.2 Global Blades for Wafer Cutting Sales Volume (2019-2030)

1.2.3 Global Blades for Wafer Cutting Sales Price (2019-2030)

1.3 Blades for Wafer Cutting Market Trends & Drivers

1.3.1 Blades for Wafer Cutting Industry Trends

1.3.2 Blades for Wafer Cutting Market Drivers & Opportunity

1.3.3 Blades for Wafer Cutting Market Challenges

1.3.4 Blades for Wafer Cutting Market Restraints

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Competitive Analysis by Company

2.1 Global Blades for Wafer Cutting Players Revenue Ranking (2023)

2.2 Global Blades for Wafer Cutting Revenue by Company (2019-2024)

2.3 Global Blades for Wafer Cutting Players Sales Volume Ranking (2023)

2.4 Global Blades for Wafer Cutting Sales Volume by Company Players (2019-2024)

2.5 Global Blades for Wafer Cutting Average Price by Company (2019-2024)

2.6 Key Manufacturers Blades for Wafer Cutting Manufacturing Base Distribution and Headquarters

2.7 Key Manufacturers Blades for Wafer Cutting Product Offered

2.8 Key Manufacturers Time to Begin Mass Production of Blades for Wafer Cutting

2.9 Blades for Wafer Cutting Market Competitive Analysis

2.9.1 Blades for Wafer Cutting Market Concentration Rate (2019-2024)

2.9.2 Global 5 and 10 Largest Manufacturers by Blades for Wafer Cutting Revenue in 2023

2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Blades for Wafer Cutting as of 2023)

2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

3.1 Introduction by Type

3.1.1 Resin-blades

3.1.2 Metal Sintered Blades

3.1.3 Nickel Blades

3.1.4 Others

3.2 Global Blades for Wafer Cutting Sales Value by Type

3.2.1 Global Blades for Wafer Cutting Sales Value by Type (2019 VS 2023 VS 2030)

3.2.2 Global Blades for Wafer Cutting Sales Value, by Type (2019-2030)

3.2.3 Global Blades for Wafer Cutting Sales Value, by Type (%) (2019-2030)

3.3 Global Blades for Wafer Cutting Sales Volume by Type

3.3.1 Global Blades for Wafer Cutting Sales Volume by Type (2019 VS 2023 VS 2030)

3.3.2 Global Blades for Wafer Cutting Sales Volume, by Type (2019-2030)

3.3.3 Global Blades for Wafer Cutting Sales Volume, by Type (%) (2019-2030)

3.4 Global Blades for Wafer Cutting Average Price by Type (2019-2030)

4 Segmentation by Application

4.1 Introduction by Application

4.1.1 Semiconductor

4.1.2 Others

4.2 Global Blades for Wafer Cutting Sales Value by Application

4.2.1 Global Blades for Wafer Cutting Sales Value by Application (2019 VS 2023 VS 2030)

4.2.2 Global Blades for Wafer Cutting Sales Value, by Application (2019-2030)

4.2.3 Global Blades for Wafer Cutting Sales Value, by Application (%) (2019-2030)

4.3 Global Blades for Wafer Cutting Sales Volume by Application

4.3.1 Global Blades for Wafer Cutting Sales Volume by Application (2019 VS 2023 VS 2030)

4.3.2 Global Blades for Wafer Cutting Sales Volume, by Application (2019-2030)

4.3.3 Global Blades for Wafer Cutting Sales Volume, by Application (%) (2019-2030)

4.4 Global Blades for Wafer Cutting Average Price by Application (2019-2030)

5 Segmentation by Region

5.1 Global Blades for Wafer Cutting Sales Value by Region

5.1.1 Global Blades for Wafer Cutting Sales Value by Region: 2019 VS 2023 VS 2030

5.1.2 Global Blades for Wafer Cutting Sales Value by Region (2019-2024)

5.1.3 Global Blades for Wafer Cutting Sales Value by Region (2025-2030)

5.1.4 Global Blades for Wafer Cutting Sales Value by Region (%), (2019-2030)

5.2 Global Blades for Wafer Cutting Sales Volume by Region

5.2.1 Global Blades for Wafer Cutting Sales Volume by Region: 2019 VS 2023 VS 2030

5.2.2 Global Blades for Wafer Cutting Sales Volume by Region (2019-2024)

5.2.3 Global Blades for Wafer Cutting Sales Volume by Region (2025-2030)

5.2.4 Global Blades for Wafer Cutting Sales Volume by Region (%), (2019-2030)

5.3 Global Blades for Wafer Cutting Average Price by Region (2019-2030)

5.4 North America

5.4.1 North America Blades for Wafer Cutting Sales Value, 2019-2030

5.4.2 North America Blades for Wafer Cutting Sales Value by Country (%), 2023 VS 2030

5.5 Europe

5.5.1 Europe Blades for Wafer Cutting Sales Value, 2019-2030

5.5.2 Europe Blades for Wafer Cutting Sales Value by Country (%), 2023 VS 2030

5.6 Asia Pacific

5.6.1 Asia Pacific Blades for Wafer Cutting Sales Value, 2019-2030

5.6.2 Asia Pacific Blades for Wafer Cutting Sales Value by Country (%), 2023 VS 2030

5.7 South America

5.7.1 South America Blades for Wafer Cutting Sales Value, 2019-2030

5.7.2 South America Blades for Wafer Cutting Sales Value by Country (%), 2023 VS 2030

5.8 Middle East & Africa

5.8.1 Middle East & Africa Blades for Wafer Cutting Sales Value, 2019-2030

5.8.2 Middle East & Africa Blades for Wafer Cutting Sales Value by Country (%), 2023 VS 2030

6 Segmentation by Key Countries/Regions

6.1 Key Countries/Regions Blades for Wafer Cutting Sales Value Growth Trends, 2019 VS 2023 VS 2030

6.2 Key Countries/Regions Blades for Wafer Cutting Sales Value

6.2.1 Key Countries/Regions Blades for Wafer Cutting Sales Value, 2019-2030

6.2.2 Key Countries/Regions Blades for Wafer Cutting Sales Volume, 2019-2030

6.3 United States

6.3.1 United States Blades for Wafer Cutting Sales Value, 2019-2030

6.3.2 United States Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

6.3.3 United States Blades for Wafer Cutting Sales Value by Application, 2023 VS 2030

6.4 Europe

6.4.1 Europe Blades for Wafer Cutting Sales Value, 2019-2030

6.4.2 Europe Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

6.4.3 Europe Blades for Wafer Cutting Sales Value by Application, 2023 VS 2030

6.5 China

6.5.1 China Blades for Wafer Cutting Sales Value, 2019-2030

6.5.2 China Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

6.5.3 China Blades for Wafer Cutting Sales Value by Application, 2023 VS 2030

6.6 Japan

6.6.1 Japan Blades for Wafer Cutting Sales Value, 2019-2030

6.6.2 Japan Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

6.6.3 Japan Blades for Wafer Cutting Sales Value by Application, 2023 VS 2030

6.7 South Korea

6.7.1 South Korea Blades for Wafer Cutting Sales Value, 2019-2030

6.7.2 South Korea Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

6.7.3 South Korea Blades for Wafer Cutting Sales Value by Application, 2023 VS 2030

6.8 Southeast Asia

6.8.1 Southeast Asia Blades for Wafer Cutting Sales Value, 2019-2030

6.8.2 Southeast Asia Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

6.8.3 Southeast Asia Blades for Wafer Cutting Sales Value by Application, 2023 VS 2030

6.9 India

6.9.1 India Blades for Wafer Cutting Sales Value, 2019-2030

6.9.2 India Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

6.9.3 India Blades for Wafer Cutting Sales Value by Application, 2023 VS 2030

7 Company Profiles

7.1 Accretech

7.1.1 Accretech Company Information

7.1.2 Accretech Introduction and Business Overview

7.1.3 Accretech Blades for Wafer Cutting Sales, Revenue and Gross Margin (2019-2024)

7.1.4 Accretech Blades for Wafer Cutting Product Offerings

7.1.5 Accretech Recent Development

7.2 Advanced Dicing Technologies (ADT)

7.2.1 Advanced Dicing Technologies (ADT) Company Information

7.2.2 Advanced Dicing Technologies (ADT) Introduction and Business Overview

7.2.3 Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Sales, Revenue and Gross Margin (2019-2024)

7.2.4 Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Product Offerings

7.2.5 Advanced Dicing Technologies (ADT) Recent Development

7.3 DISCO

7.3.1 DISCO Company Information

7.3.2 DISCO Introduction and Business Overview

7.3.3 DISCO Blades for Wafer Cutting Sales, Revenue and Gross Margin (2019-2024)

7.3.4 DISCO Blades for Wafer Cutting Product Offerings

7.3.5 DISCO Recent Development

7.4 K&S

7.4.1 K&S Company Information

7.4.2 K&S Introduction and Business Overview

7.4.3 K&S Blades for Wafer Cutting Sales, Revenue and Gross Margin (2019-2024)

7.4.4 K&S Blades for Wafer Cutting Product Offerings

7.4.5 K&S Recent Development

7.5 UKAM

7.5.1 UKAM Company Information

7.5.2 UKAM Introduction and Business Overview

7.5.3 UKAM Blades for Wafer Cutting Sales, Revenue and Gross Margin (2019-2024)

7.5.4 UKAM Blades for Wafer Cutting Product Offerings

7.5.5 UKAM Recent Development

7.6 Ceiba

7.6.1 Ceiba Company Information

7.6.2 Ceiba Introduction and Business Overview

7.6.3 Ceiba Blades for Wafer Cutting Sales, Revenue and Gross Margin (2019-2024)

7.6.4 Ceiba Blades for Wafer Cutting Product Offerings

7.6.5 Ceiba Recent Development

7.7 Shanghai Sinyang

7.7.1 Shanghai Sinyang Company Information

7.7.2 Shanghai Sinyang Introduction and Business Overview

7.7.3 Shanghai Sinyang Blades for Wafer Cutting Sales, Revenue and Gross Margin (2019-2024)

7.7.4 Shanghai Sinyang Blades for Wafer Cutting Product Offerings

7.7.5 Shanghai Sinyang Recent Development

7.8 Kinik

7.8.1 Kinik Company Information

7.8.2 Kinik Introduction and Business Overview

7.8.3 Kinik Blades for Wafer Cutting Sales, Revenue and Gross Margin (2019-2024)

7.8.4 Kinik Blades for Wafer Cutting Product Offerings

7.8.5 Kinik Recent Development

7.9 ITI

7.9.1 ITI Company Information

7.9.2 ITI Introduction and Business Overview

7.9.3 ITI Blades for Wafer Cutting Sales, Revenue and Gross Margin (2019-2024)

7.9.4 ITI Blades for Wafer Cutting Product Offerings

7.9.5 ITI Recent Development

8 Industry Chain Analysis

8.1 Blades for Wafer Cutting Industrial Chain

8.2 Blades for Wafer Cutting Upstream Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.2.3 Manufacturing Cost Structure

8.3 Midstream Analysis

8.4 Downstream Analysis (Customers Analysis)

8.5 Sales Model and Sales Channels

8.5.1 Blades for Wafer Cutting Sales Model

8.5.2 Sales Channel

8.5.3 Blades for Wafer Cutting Distributors

9 Research Findings and Conclusion

10 Appendix

10.1 Research Methodology

10.1.1 Methodology/Research Approach

10.1.2 Data Source

10.2 Author Details

10.3 Disclaimer

FEATURED COMPANIES

ACCRETECH

Advanced Dicing Technologies (ADT)

List of Tables

Table 1. Blades for Wafer Cutting Market Trends

Table 2. Blades for Wafer Cutting Market Drivers & Opportunity

Table 3. Blades for Wafer Cutting Market Challenges

Table 4. Blades for Wafer Cutting Market Restraints

Table 5. Global Blades for Wafer Cutting Revenue by Company (2019-2024) & (US$ Million)

Table 6. Global Blades for Wafer Cutting Revenue Market Share by Company (2019-2024)

Table 7. Global Blades for Wafer Cutting Sales Volume by Company (2019-2024) & (K Units)

Table 8. Global Blades for Wafer Cutting Sales Volume Market Share by Company (2019-2024)

Table 9. Global Market Blades for Wafer Cutting Price by Company (2019-2024) & (USD/Unit)

Table 10. Key Manufacturers Blades for Wafer Cutting Manufacturing Base Distribution and Headquarters

Table 11. Key Manufacturers Blades for Wafer Cutting Product Type

Table 12. Key Manufacturers Time to Begin Mass Production of Blades for Wafer Cutting

Table 13. Global Blades for Wafer Cutting Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Blades for Wafer Cutting as of 2023)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Blades for Wafer Cutting Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million)

Table 17. Global Blades for Wafer Cutting Sales Value by Type (2019-2024) & (US$ Million)

Table 18. Global Blades for Wafer Cutting Sales Value by Type (2025-2030) & (US$ Million)

Table 19. Global Blades for Wafer Cutting Sales Market Share in Value by Type (2019-2024) & (%)

Table 20. Global Blades for Wafer Cutting Sales Market Share in Value by Type (2025-2030) & (%)

Table 21. Global Blades for Wafer Cutting Sales Volume by Type: 2019 VS 2023 VS 2030 (K Units)

Table 22. Global Blades for Wafer Cutting Sales Volume by Type (2019-2024) & (K Units)

Table 23. Global Blades for Wafer Cutting Sales Volume by Type (2025-2030) & (K Units)

Table 24. Global Blades for Wafer Cutting Sales Market Share in Volume by Type (2019-2024) & (%)

Table 25. Global Blades for Wafer Cutting Sales Market Share in Volume by Type (2025-2030) & (%)

Table 26. Global Blades for Wafer Cutting Price by Type (2019-2024) & (USD/Unit)

Table 27. Global Blades for Wafer Cutting Price by Type (2025-2030) & (USD/Unit)

Table 28. Global Blades for Wafer Cutting Sales Value by Application: 2019 VS 2023 VS 2030 (US$ Million)

Table 29. Global Blades for Wafer Cutting Sales Value by Application (2019-2024) & (US$ Million)

Table 30. Global Blades for Wafer Cutting Sales Value by Application (2025-2030) & (US$ Million)

Table 31. Global Blades for Wafer Cutting Sales Market Share in Value by Application (2019-2024) & (%)

Table 32. Global Blades for Wafer Cutting Sales Market Share in Value by Application (2025-2030) & (%)

Table 33. Global Blades for Wafer Cutting Sales Volume by Application: 2019 VS 2023 VS 2030 (K Units)

Table 34. Global Blades for Wafer Cutting Sales Volume by Application (2019-2024) & (K Units)

Table 35. Global Blades for Wafer Cutting Sales Volume by Application (2025-2030) & (K Units)

Table 36. Global Blades for Wafer Cutting Sales Market Share in Volume by Application (2019-2024) & (%)

Table 37. Global Blades for Wafer Cutting Sales Market Share in Volume by Application (2025-2030) & (%)

Table 38. Global Blades for Wafer Cutting Price by Application (2019-2024) & (USD/Unit)

Table 39. Global Blades for Wafer Cutting Price by Application (2025-2030) & (USD/Unit)

Table 40. Global Blades for Wafer Cutting Sales Value by Region: 2019 VS 2023 VS 2030 (US$ Million)

Table 41. Global Blades for Wafer Cutting Sales Value by Region (2019-2024) & (US$ Million)

Table 42. Global Blades for Wafer Cutting Sales Value by Region (2025-2030) & (US$ Million)

Table 43. Global Blades for Wafer Cutting Sales Value by Region (2019-2024) & (%)

Table 44. Global Blades for Wafer Cutting Sales Value by Region (2025-2030) & (%)

Table 45. Global Blades for Wafer Cutting Sales Volume by Region (K Units): 2019 VS 2023 VS 2030

Table 46. Global Blades for Wafer Cutting Sales Volume by Region (2019-2024) & (K Units)

Table 47. Global Blades for Wafer Cutting Sales Volume by Region (2025-2030) & (K Units)

Table 48. Global Blades for Wafer Cutting Sales Volume by Region (2019-2024) & (%)

Table 49. Global Blades for Wafer Cutting Sales Volume by Region (2025-2030) & (%)

Table 50. Global Blades for Wafer Cutting Average Price by Region (2019-2024) & (USD/Unit)

Table 51. Global Blades for Wafer Cutting Average Price by Region (2025-2030) & (USD/Unit)

Table 52. Key Countries/Regions Blades for Wafer Cutting Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030

Table 53. Key Countries/Regions Blades for Wafer Cutting Sales Value, (2019-2024) & (US$ Million)

Table 54. Key Countries/Regions Blades for Wafer Cutting Sales Value, (2025-2030) & (US$ Million)

Table 55. Key Countries/Regions Blades for Wafer Cutting Sales Volume, (2019-2024) & (K Units)

Table 56. Key Countries/Regions Blades for Wafer Cutting Sales Volume, (2025-2030) & (K Units)

Table 57. Accretech Company Information

Table 58. Accretech Introduction and Business Overview

Table 59. Accretech Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)

Table 60. Accretech Blades for Wafer Cutting Product Offerings

Table 61. Accretech Recent Development

Table 62. Advanced Dicing Technologies (ADT) Company Information

Table 63. Advanced Dicing Technologies (ADT) Introduction and Business Overview

Table 64. Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)

Table 65. Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Product Offerings

Table 66. Advanced Dicing Technologies (ADT) Recent Development

Table 67. DISCO Company Information

Table 68. DISCO Introduction and Business Overview

Table 69. DISCO Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)

Table 70. DISCO Blades for Wafer Cutting Product Offerings

Table 71. DISCO Recent Development

Table 72. K&S Company Information

Table 73. K&S Introduction and Business Overview

Table 74. K&S Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)

Table 75. K&S Blades for Wafer Cutting Product Offerings

Table 76. K&S Recent Development

Table 77. UKAM Company Information

Table 78. UKAM Introduction and Business Overview

Table 79. UKAM Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)

Table 80. UKAM Blades for Wafer Cutting Product Offerings

Table 81. UKAM Recent Development

Table 82. Ceiba Company Information

Table 83. Ceiba Introduction and Business Overview

Table 84. Ceiba Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)

Table 85. Ceiba Blades for Wafer Cutting Product Offerings

Table 86. Ceiba Recent Development

Table 87. Shanghai Sinyang Company Information

Table 88. Shanghai Sinyang Introduction and Business Overview

Table 89. Shanghai Sinyang Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)

Table 90. Shanghai Sinyang Blades for Wafer Cutting Product Offerings

Table 91. Shanghai Sinyang Recent Development

Table 92. Kinik Company Information

Table 93. Kinik Introduction and Business Overview

Table 94. Kinik Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)

Table 95. Kinik Blades for Wafer Cutting Product Offerings

Table 96. Kinik Recent Development

Table 97. ITI Company Information

Table 98. ITI Introduction and Business Overview

Table 99. ITI Blades for Wafer Cutting Sales (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2019-2024)

Table 100. ITI Blades for Wafer Cutting Product Offerings

Table 101. ITI Recent Development

Table 102. Key Raw Materials Lists

Table 103. Raw Materials Key Suppliers Lists

Table 104. Blades for Wafer Cutting Downstream Customers

Table 105. Blades for Wafer Cutting Distributors List

Table 106. Research Programs/Design for This Report

Table 107. Key Data Information from Secondary Sources

Table 108. Key Data Information from Primary Sources

List of Figures

Figure 1. Blades for Wafer Cutting Product Picture

Figure 2. Global Blades for Wafer Cutting Sales Value, 2019 VS 2023 VS 2030 (US$ Million)

Figure 3. Global Blades for Wafer Cutting Sales Value (2019-2030) & (US$ Million)

Figure 4. Global Blades for Wafer Cutting Sales Volume (2019-2030) & (K Units)

Figure 5. Global Blades for Wafer Cutting Sales Price (2019-2030) & (USD/Unit)

Figure 6. Blades for Wafer Cutting Report Years Considered

Figure 7. Global Blades for Wafer Cutting Players Revenue Ranking (2023) & (US$ Million)

Figure 8. Global Blades for Wafer Cutting Players Sales Volume Ranking (2023) & (K Units)

Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Blades for Wafer Cutting Revenue in 2023

Figure 10. Blades for Wafer Cutting Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023

Figure 11. Resin-blades Picture

Figure 12. Metal Sintered Blades Picture

Figure 13. Nickel Blades Picture

Figure 14. Others Picture

Figure 15. Global Blades for Wafer Cutting Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million)

Figure 16. Global Blades for Wafer Cutting Sales Value Market Share by Type, 2023 & 2030

Figure 17. Global Blades for Wafer Cutting Sales Volume by Type (2019 VS 2023 VS 2030) & (K Units)

Figure 18. Global Blades for Wafer Cutting Sales Volume Market Share by Type, 2023 & 2030

Figure 19. Global Blades for Wafer Cutting Price by Type (2019-2030) & (USD/Unit)

Figure 20. Product Picture of Semiconductor

Figure 21. Product Picture of Others

Figure 22. Global Blades for Wafer Cutting Sales Value by Application (2019 VS 2023 VS 2030) & (US$ Million)

Figure 23. Global Blades for Wafer Cutting Sales Value Market Share by Application, 2023 & 2030

Figure 24. Global Blades for Wafer Cutting Sales Volume by Application (2019 VS 2023 VS 2030) & (K Units)

Figure 25. Global Blades for Wafer Cutting Sales Volume Market Share by Application, 2023 & 2030

Figure 26. Global Blades for Wafer Cutting Price by Application (2019-2030) & (USD/Unit)

Figure 27. North America Blades for Wafer Cutting Sales Value (2019-2030) & (US$ Million)

Figure 28. North America Blades for Wafer Cutting Sales Value by Country (%), 2023 VS 2030

Figure 29. Europe Blades for Wafer Cutting Sales Value (2019-2030) & (US$ Million)

Figure 30. Europe Blades for Wafer Cutting Sales Value by Country (%), 2023 VS 2030

Figure 31. Asia Pacific Blades for Wafer Cutting Sales Value (2019-2030) & (US$ Million)

Figure 32. Asia Pacific Blades for Wafer Cutting Sales Value by Country (%), 2023 VS 2030

Figure 33. South America Blades for Wafer Cutting Sales Value (2019-2030) & (US$ Million)

Figure 34. South America Blades for Wafer Cutting Sales Value by Country (%), 2023 VS 2030

Figure 35. Middle East & Africa Blades for Wafer Cutting Sales Value (2019-2030) & (US$ Million)

Figure 36. Middle East & Africa Blades for Wafer Cutting Sales Value by Country (%), 2023 VS 2030

Figure 37. Key Countries/Regions Blades for Wafer Cutting Sales Value (%), (2019-2030)

Figure 38. Key Countries/Regions Blades for Wafer Cutting Sales Volume (%), (2019-2030)

Figure 39. United States Blades for Wafer Cutting Sales Value, (2019-2030) & (US$ Million)

Figure 40. United States Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

Figure 41. United States Blades for Wafer Cutting Sales Value by Application (%), 2023 VS 2030

Figure 42. Europe Blades for Wafer Cutting Sales Value, (2019-2030) & (US$ Million)

Figure 43. Europe Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

Figure 44. Europe Blades for Wafer Cutting Sales Value by Application (%), 2023 VS 2030

Figure 45. China Blades for Wafer Cutting Sales Value, (2019-2030) & (US$ Million)

Figure 46. China Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

Figure 47. China Blades for Wafer Cutting Sales Value by Application (%), 2023 VS 2030

Figure 48. Japan Blades for Wafer Cutting Sales Value, (2019-2030) & (US$ Million)

Figure 49. Japan Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

Figure 50. Japan Blades for Wafer Cutting Sales Value by Application (%), 2023 VS 2030

Figure 51. South Korea Blades for Wafer Cutting Sales Value, (2019-2030) & (US$ Million)

Figure 52. South Korea Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

Figure 53. South Korea Blades for Wafer Cutting Sales Value by Application (%), 2023 VS 2030

Figure 54. Southeast Asia Blades for Wafer Cutting Sales Value, (2019-2030) & (US$ Million)

Figure 55. Southeast Asia Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

Figure 56. Southeast Asia Blades for Wafer Cutting Sales Value by Application (%), 2023 VS 2030

Figure 57. India Blades for Wafer Cutting Sales Value, (2019-2030) & (US$ Million)

Figure 58. India Blades for Wafer Cutting Sales Value by Type (%), 2023 VS 2030

Figure 59. India Blades for Wafer Cutting Sales Value by Application (%), 2023 VS 2030

Figure 60. Blades for Wafer Cutting Industrial Chain

Figure 61. Blades for Wafer Cutting Manufacturing Cost Structure

Figure 62. Channels of Distribution (Direct Sales, and Distribution)

Figure 63. Bottom-up and Top-down Approaches for This Report

Figure 64. Data Triangulation

Figure 65. Key Executives Interviewed

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Blades for Wafer Cutting - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Published Date: November 2024

Report Code: QYRE-Auto-26R9213

Blades for Wafer Cutting - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

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Blades for Wafer Cutting - Market Size

Blades for Wafer Cutting - Market

Report Scope

Scope of Blades for Wafer Cutting - Market Report

Chapter Outline

FAQ for this report

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What is the Blades for Wafer Cutting - Market size in 2029?

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What are the Application segmentation covered in the Blades for Wafer Cutting - Market report?

What are the Type segmentation covered in the Blades for Wafer Cutting - Market report?

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