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Global Wafer Backgrinding Tape and Dicing Tapes Market Research Report 2026
Published Date: 2026-04-20
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Report Code: QYRE-Auto-27E16972
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Global Wafer Backgrinding Tape and Dicing Tapes Market Research Report 2026

Code: QYRE-Auto-27E16972
Report
2026-04-20
Pages:173
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Wafer Backgrinding Tape and Dicing Tapes Market Size

The global Wafer Backgrinding Tape and Dicing Tapes market was valued at US$ 927 million in 2025 and is anticipated to reach US$ 1671 million by 2032, at a CAGR of 8.9% from 2026 to 2032.

Wafer Backgrinding Tape and Dicing Tapes Market

Wafer Backgrinding Tape and Dicing Tapes Market

The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Wafer Backgrinding Tape and Dicing Tapes competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.
This report studies the semiconductor wafer tape, include UV tapes and Non-UV tapes used in wafer Back Grinding and wafer dicing process.
UV tape has stronger adhesive strength and can hold wafer firmly in back grinding process or dicing process. After UV irradiation, adhesive strength decreases drastically and easy de-taping or die pick up can be achieved.
Non-UV tape, which is designed to peel-off from wafer material without UV irradiation.
Back Grinding Tape is a type of adhesive tape used for grinding the back of silicon wafers, also known as back grinding tape. It is usually made of polyimide film, with high strength and high temperature resistance. In the semiconductor manufacturing process, silicon wafers need to undergo back grinding to reduce their thickness, in order to achieve higher integration in subsequent steps. The Back Grinding Tape secures the silicon wafer on the back grinder and protects the surface of the wafer from damage during the grinding process. The selection of Back Grinding Tape depends on the size and shape of the silicon wafer, as well as the type of abrasive used during the grinding process and the parameters of the grinding machine. Usually, manufacturers provide different types and specifications of Back Grinding Tapes to meet different application requirements.
In terms of consumption side, China Taiwan is currently the world's largest consumer market, accounting for 34.0% of the market share in 2023, followed by mainland China and North America, accounting for 27.4% and 9.27% respectively. Southeast Asia is expected to grow fastest in the next few years, with a CAGR of approximately 10.6% during 2024-2030.
From the production side, Japan is the largest production area, and the key manufacturers are mainly headquartered in Japan. In 2023, Japan accounted for approximately 83% of the production share. It is expected that in the next few years, the production of wafer tape in the Chinese market will maintain the fastest growth rate, and the share is expected to reach 9.41% in 2030.
In terms of product type, UV wafer tape has a higher proportion, with a share of 62.5% in 2023 and an estimated share of 64% in 2030.
From the application point of view, the wafer cutting process accounts for a high proportion, with a share of 54.95% in 2023. It is expected that the wafer grinding process will grow faster in the next few years, and the share will increase from 45.05% in 2023 to 46.01% in 2030.
From the perspective of manufacturers, the key manufacturers of semiconductor wafer tapes worldwide mainly include Mitsui Chemicals, LINTEC Corporation, Furukawa Electric, Denka, Nitto Denko Corporation, Maxell Sliontec and Sekisui Chemical. In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share. Chinese local manufacturers of wafer tapes are currently mainly in the verification and small batch stages. Representative companies include Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology and Sunliky New Material Technology. It is expected that in the next few years, Chinese local companies will gradually grow and occupy a higher share in the Chinese market.
This report delivers a comprehensive overview of the global Wafer Backgrinding Tape and Dicing Tapes market, with both quantitative and qualitative analyses, to help readers develop growth strategies, assess the competitive landscape, evaluate their position in the current market, and make informed business decisions regarding Wafer Backgrinding Tape and Dicing Tapes. The Wafer Backgrinding Tape and Dicing Tapes market size, estimates, and forecasts are provided in terms of shipments (K Sqm) and revenue (US$ millions), with 2025 as the base year and historical and forecast data for 2021–2032.
The report segments the global Wafer Backgrinding Tape and Dicing Tapes market comprehensively. Regional market sizes by Type, by Application, , and by company are also provided. For deeper insight, the report profiles the competitive landscape, key competitors, and their respective market rankings, and discusses technological trends and new product developments.
This report will assist Wafer Backgrinding Tape and Dicing Tapes manufacturers, new entrants, and companies across the industry value chain with information on revenues, production, and average prices for the overall market and its sub-segments, by company, by Type, by Application, and by region.
Market Segmentation

Scope of Wafer Backgrinding Tape and Dicing Tapes Market Report

Report Metric Details
Report Name Wafer Backgrinding Tape and Dicing Tapes Market
Accounted market size in 2025 US$ 927 million
Forecasted market size in 2032 US$ 1671 million
CAGR 8.9%
Base Year 2025
Forecasted years 2026 - 2032
Segment by Type
  • UV Tape
  • Non-UV Tape
by Application
  • Back Grinding Tape
  • Dicing Tape
Production by Region
  • Japan
  • China Taiwan
  • North America
  • China
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Mitsui Chemicals, LINTEC Corporation, Denka, Nitto Denko Corporation, Furukawa Electric, Sekisui Chemical, Maxell Sliontec, Resonac Corporation, Sumitomo Bakelite Company, D&X Co., Ltd, KGK Chemical Corporation, AI Technology, Inc. (AIT), Ultron System, Daehyun ST, Solar Plus Company, Alliance Material Co., Ltd (AMC), 3M, Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology, Sunliky New Material Technology, GTA Material
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Defines the scope of the report and presents an executive summary of market segments (by Type, by Application, , etc.), including the size of each segment and its future growth potential. It offers a high-level view of the current market and its likely evolution in the short, medium, and long term.
  • Chapter 2: Provides a detailed analysis of the competitive landscape for Wafer Backgrinding Tape and Dicing Tapes manufacturers, including prices, production, value-based market shares, latest development plans, and information on mergers and acquisitions.
  • Chapter 3: Examines Wafer Backgrinding Tape and Dicing Tapes production/output and value by region and country, providing a quantitative assessment of market size and growth potential for each region over the next six years.
  • Chapter 4: Analyzes Wafer Backgrinding Tape and Dicing Tapes consumption at the regional and country levels. It quantifies market size and growth potential for each region and its key countries, and outlines market development, outlook, addressable space, and national production.
  • Chapter 5: Analyzes market segments by Type, covering the size and growth potential of each segment to help readers identify “blue ocean” opportunities.
  • Chapter 6: Analyzes market segments by Application, covering the size and growth potential of each segment to help readers identify “blue ocean” opportunities in downstream markets.
  • Chapter 7: Profiles key players, detailing the fundamentals of major companies, including product production/output, value, price, gross margin, product portfolio/introductions, and recent developments.
  • Chapter 8: Reviews the industry value chain, including upstream and downstream segments.
  • Chapter 9: Discusses market dynamics and recent developments, including drivers, restraints, challenges and risks for manufacturers, U.S. Tariffs and relevant policy analysis.
  • Chapter 10: Summarizes the key findings and conclusions of the report.

FAQ for this report

How fast is Wafer Backgrinding Tape and Dicing Tapes Market growing?

Ans: The Wafer Backgrinding Tape and Dicing Tapes Market witnessing a CAGR of 8.9% during the forecast period 2026-2032.

What is the Wafer Backgrinding Tape and Dicing Tapes Market size in 2032?

Ans: The Wafer Backgrinding Tape and Dicing Tapes Market size in 2032 will be US$ 1671 million.

What is the Wafer Backgrinding Tape and Dicing Tapes Market share by region?

Ans: In terms of consumption side, China Taiwan is currently the world's largest consumer market, accounting for 34.0% of the market share in 2023, followed by mainland China and North America, accounting for 27.4% and 9.27% respectively.

What is the Wafer Backgrinding Tape and Dicing Tapes Market production share by region?

Ans: In 2023, Japan accounted for approximately 83% of the production share.

What is the market share of major companies in Wafer Backgrinding Tape and Dicing Tapes Market?

Ans: In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share.

Who are the main players in the Wafer Backgrinding Tape and Dicing Tapes Market report?

Ans: The main players in the Wafer Backgrinding Tape and Dicing Tapes Market are Mitsui Chemicals, LINTEC Corporation, Denka, Nitto Denko Corporation, Furukawa Electric, Sekisui Chemical, Maxell Sliontec, Resonac Corporation, Sumitomo Bakelite Company, D&X Co., Ltd, KGK Chemical Corporation, AI Technology, Inc. (AIT), Ultron System, Daehyun ST, Solar Plus Company, Alliance Material Co., Ltd (AMC), 3M, Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology, Sunliky New Material Technology, GTA Material

What are the Application segmentation covered in the Wafer Backgrinding Tape and Dicing Tapes Market report?

Ans: The Applications covered in the Wafer Backgrinding Tape and Dicing Tapes Market report are Back Grinding Tape, Dicing Tape

What are the Type segmentation covered in the Wafer Backgrinding Tape and Dicing Tapes Market report?

Ans: The Types covered in the Wafer Backgrinding Tape and Dicing Tapes Market report are UV Tape, Non-UV Tape

1 Wafer Backgrinding Tape and Dicing Tapes Market Overview
1.1 Product Definition
1.2 Wafer Backgrinding Tape and Dicing Tapes by Type
1.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Market Value Growth Rate Analysis by Type: 2025 vs 2032
1.2.2 UV Tape
1.2.3 Non-UV Tape
1.3 Wafer Backgrinding Tape and Dicing Tapes by Application
1.3.1 Global Wafer Backgrinding Tape and Dicing Tapes Market Value Growth Rate Analysis by Application: 2025 vs 2032
1.3.2 Back Grinding Tape
1.3.3 Dicing Tape
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Backgrinding Tape and Dicing Tapes Production Value Estimates and Forecasts (2021–2032)
1.4.2 Global Wafer Backgrinding Tape and Dicing Tapes Production Capacity Estimates and Forecasts (2021–2032)
1.4.3 Global Wafer Backgrinding Tape and Dicing Tapes Production Estimates and Forecasts (2021–2032)
1.4.4 Global Wafer Backgrinding Tape and Dicing Tapes Market Average Price Estimates and Forecasts (2021–2032)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share by Manufacturers (2021–2026)
2.2 Global Wafer Backgrinding Tape and Dicing Tapes Production Value Market Share by Manufacturers (2021–2026)
2.3 Global Key Players of Wafer Backgrinding Tape and Dicing Tapes, Industry Ranking, 2024 vs 2025
2.4 Global Wafer Backgrinding Tape and Dicing Tapes Market Share by Company Tier (Tier 1, Tier 2, Tier 3)
2.5 Global Wafer Backgrinding Tape and Dicing Tapes Average Price by Manufacturers (2021–2026)
2.6 Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Manufacturing Footprints and Headquarters
2.7 Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Product Offerings and Applications
2.8 Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Date of Entry into the Industry
2.9 Wafer Backgrinding Tape and Dicing Tapes Market Competitive Situation and Trends
2.9.1 Wafer Backgrinding Tape and Dicing Tapes Market Concentration Rate
2.9.2 Top 5 and Top 10 Global Wafer Backgrinding Tape and Dicing Tapes Players Market Share by Revenue
2.10 Mergers & Acquisitions and Expansion
3 Wafer Backgrinding Tape and Dicing Tapes Production by Region
3.1 Global Wafer Backgrinding Tape and Dicing Tapes Production Value Estimates and Forecasts by Region: 2021 vs 2025 vs 2032
3.2 Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Region (2021–2032)
3.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Region (2021–2026)
3.2.2 Global Forecasted Production Value of Wafer Backgrinding Tape and Dicing Tapes by Region (2027–2032)
3.3 Global Wafer Backgrinding Tape and Dicing Tapes Production Estimates and Forecasts by Region: 2021 vs 2025 vs 2032
3.4 Global Wafer Backgrinding Tape and Dicing Tapes Production Volume by Region (2021–2032)
3.4.1 Global Wafer Backgrinding Tape and Dicing Tapes Production by Region (2021–2026)
3.4.2 Global Forecasted Production of Wafer Backgrinding Tape and Dicing Tapes by Region (2027–2032)
3.5 Global Wafer Backgrinding Tape and Dicing Tapes Market Price Analysis by Region (2021–2026)
3.6 Global Wafer Backgrinding Tape and Dicing Tapes Production, Value, and Year-over-Year Growth
3.6.1 Japan Wafer Backgrinding Tape and Dicing Tapes Production Value Estimates and Forecasts (2021–2032)
3.6.2 China Taiwan Wafer Backgrinding Tape and Dicing Tapes Production Value Estimates and Forecasts (2021–2032)
3.6.3 North America Wafer Backgrinding Tape and Dicing Tapes Production Value Estimates and Forecasts (2021–2032)
3.6.4 China Wafer Backgrinding Tape and Dicing Tapes Production Value Estimates and Forecasts (2021–2032)
3.6.5 South Korea Wafer Backgrinding Tape and Dicing Tapes Production Value Estimates and Forecasts (2021–2032)
4 Wafer Backgrinding Tape and Dicing Tapes Consumption by Region
4.1 Global Wafer Backgrinding Tape and Dicing Tapes Consumption Estimates and Forecasts by Region: 2021 vs 2025 vs 2032
4.2 Global Wafer Backgrinding Tape and Dicing Tapes Consumption by Region (2021–2032)
4.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Consumption by Region (2021–2026)
4.2.2 Global Wafer Backgrinding Tape and Dicing Tapes Forecasted Consumption by Region (2027–2032)
4.3 North America
4.3.1 North America Wafer Backgrinding Tape and Dicing Tapes Consumption Growth Rate by Country: 2021 vs 2025 vs 2032
4.3.2 North America Wafer Backgrinding Tape and Dicing Tapes Consumption by Country (2021–2032)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Backgrinding Tape and Dicing Tapes Consumption Growth Rate by Country: 2021 vs 2025 vs 2032
4.4.2 Europe Wafer Backgrinding Tape and Dicing Tapes Consumption by Country (2021–2032)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Consumption Growth Rate by Region: 2021 vs 2025 vs 2032
4.5.2 Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Consumption by Region (2021–2032)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Backgrinding Tape and Dicing Tapes Consumption Growth Rate by Country: 2021 vs 2025 vs 2032
4.6.2 Latin America, Middle East & Africa Wafer Backgrinding Tape and Dicing Tapes Consumption by Country (2021–2032)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Wafer Backgrinding Tape and Dicing Tapes Production by Type (2021–2032)
5.1.1 Global Wafer Backgrinding Tape and Dicing Tapes Production by Type (2021–2026)
5.1.2 Global Wafer Backgrinding Tape and Dicing Tapes Production by Type (2027–2032)
5.1.3 Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share by Type (2021–2032)
5.2 Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Type (2021–2032)
5.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Type (2021–2026)
5.2.2 Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Type (2027–2032)
5.2.3 Global Wafer Backgrinding Tape and Dicing Tapes Production Value Market Share by Type (2021–2032)
5.3 Global Wafer Backgrinding Tape and Dicing Tapes Price by Type (2021–2032)
6 Segment by Application
6.1 Global Wafer Backgrinding Tape and Dicing Tapes Production by Application (2021–2032)
6.1.1 Global Wafer Backgrinding Tape and Dicing Tapes Production by Application (2021–2026)
6.1.2 Global Wafer Backgrinding Tape and Dicing Tapes Production by Application (2027–2032)
6.1.3 Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share by Application (2021–2032)
6.2 Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Application (2021–2032)
6.2.1 Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Application (2021–2026)
6.2.2 Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Application (2027–2032)
6.2.3 Global Wafer Backgrinding Tape and Dicing Tapes Production Value Market Share by Application (2021–2032)
6.3 Global Wafer Backgrinding Tape and Dicing Tapes Price by Application (2021–2032)
7 Key Companies Profiled
7.1 Mitsui Chemicals
7.1.1 Mitsui Chemicals Wafer Backgrinding Tape and Dicing Tapes Company Information
7.1.2 Mitsui Chemicals Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.1.3 Mitsui Chemicals Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.1.4 Mitsui Chemicals Main Business and Markets Served
7.1.5 Mitsui Chemicals Recent Developments/Updates
7.2 LINTEC Corporation
7.2.1 LINTEC Corporation Wafer Backgrinding Tape and Dicing Tapes Company Information
7.2.2 LINTEC Corporation Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.2.3 LINTEC Corporation Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.2.4 LINTEC Corporation Main Business and Markets Served
7.2.5 LINTEC Corporation Recent Developments/Updates
7.3 Denka
7.3.1 Denka Wafer Backgrinding Tape and Dicing Tapes Company Information
7.3.2 Denka Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.3.3 Denka Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.3.4 Denka Main Business and Markets Served
7.3.5 Denka Recent Developments/Updates
7.4 Nitto Denko Corporation
7.4.1 Nitto Denko Corporation Wafer Backgrinding Tape and Dicing Tapes Company Information
7.4.2 Nitto Denko Corporation Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.4.3 Nitto Denko Corporation Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.4.4 Nitto Denko Corporation Main Business and Markets Served
7.4.5 Nitto Denko Corporation Recent Developments/Updates
7.5 Furukawa Electric
7.5.1 Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Company Information
7.5.2 Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.5.3 Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.5.4 Furukawa Electric Main Business and Markets Served
7.5.5 Furukawa Electric Recent Developments/Updates
7.6 Sekisui Chemical
7.6.1 Sekisui Chemical Wafer Backgrinding Tape and Dicing Tapes Company Information
7.6.2 Sekisui Chemical Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.6.3 Sekisui Chemical Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.6.4 Sekisui Chemical Main Business and Markets Served
7.6.5 Sekisui Chemical Recent Developments/Updates
7.7 Maxell Sliontec
7.7.1 Maxell Sliontec Wafer Backgrinding Tape and Dicing Tapes Company Information
7.7.2 Maxell Sliontec Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.7.3 Maxell Sliontec Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.7.4 Maxell Sliontec Main Business and Markets Served
7.7.5 Maxell Sliontec Recent Developments/Updates
7.8 Resonac Corporation
7.8.1 Resonac Corporation Wafer Backgrinding Tape and Dicing Tapes Company Information
7.8.2 Resonac Corporation Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.8.3 Resonac Corporation Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.8.4 Resonac Corporation Main Business and Markets Served
7.8.5 Resonac Corporation Recent Developments/Updates
7.9 Sumitomo Bakelite Company
7.9.1 Sumitomo Bakelite Company Wafer Backgrinding Tape and Dicing Tapes Company Information
7.9.2 Sumitomo Bakelite Company Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.9.3 Sumitomo Bakelite Company Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.9.4 Sumitomo Bakelite Company Main Business and Markets Served
7.9.5 Sumitomo Bakelite Company Recent Developments/Updates
7.10 D&X Co., Ltd
7.10.1 D&X Co., Ltd Wafer Backgrinding Tape and Dicing Tapes Company Information
7.10.2 D&X Co., Ltd Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.10.3 D&X Co., Ltd Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.10.4 D&X Co., Ltd Main Business and Markets Served
7.10.5 D&X Co., Ltd Recent Developments/Updates
7.11 KGK Chemical Corporation
7.11.1 KGK Chemical Corporation Wafer Backgrinding Tape and Dicing Tapes Company Information
7.11.2 KGK Chemical Corporation Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.11.3 KGK Chemical Corporation Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.11.4 KGK Chemical Corporation Main Business and Markets Served
7.11.5 KGK Chemical Corporation Recent Developments/Updates
7.12 AI Technology, Inc. (AIT)
7.12.1 AI Technology, Inc. (AIT) Wafer Backgrinding Tape and Dicing Tapes Company Information
7.12.2 AI Technology, Inc. (AIT) Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.12.3 AI Technology, Inc. (AIT) Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.12.4 AI Technology, Inc. (AIT) Main Business and Markets Served
7.12.5 AI Technology, Inc. (AIT) Recent Developments/Updates
7.13 Ultron System
7.13.1 Ultron System Wafer Backgrinding Tape and Dicing Tapes Company Information
7.13.2 Ultron System Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.13.3 Ultron System Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.13.4 Ultron System Main Business and Markets Served
7.13.5 Ultron System Recent Developments/Updates
7.14 Daehyun ST
7.14.1 Daehyun ST Wafer Backgrinding Tape and Dicing Tapes Company Information
7.14.2 Daehyun ST Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.14.3 Daehyun ST Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.14.4 Daehyun ST Main Business and Markets Served
7.14.5 Daehyun ST Recent Developments/Updates
7.15 Solar Plus Company
7.15.1 Solar Plus Company Wafer Backgrinding Tape and Dicing Tapes Company Information
7.15.2 Solar Plus Company Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.15.3 Solar Plus Company Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.15.4 Solar Plus Company Main Business and Markets Served
7.15.5 Solar Plus Company Recent Developments/Updates
7.16 Alliance Material Co., Ltd (AMC)
7.16.1 Alliance Material Co., Ltd (AMC) Wafer Backgrinding Tape and Dicing Tapes Company Information
7.16.2 Alliance Material Co., Ltd (AMC) Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.16.3 Alliance Material Co., Ltd (AMC) Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.16.4 Alliance Material Co., Ltd (AMC) Main Business and Markets Served
7.16.5 Alliance Material Co., Ltd (AMC) Recent Developments/Updates
7.17 3M
7.17.1 3M Wafer Backgrinding Tape and Dicing Tapes Company Information
7.17.2 3M Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.17.3 3M Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.17.4 3M Main Business and Markets Served
7.17.5 3M Recent Developments/Updates
7.18 Shanghai Guke Adhesive Tape Technology
7.18.1 Shanghai Guke Adhesive Tape Technology Wafer Backgrinding Tape and Dicing Tapes Company Information
7.18.2 Shanghai Guke Adhesive Tape Technology Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.18.3 Shanghai Guke Adhesive Tape Technology Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.18.4 Shanghai Guke Adhesive Tape Technology Main Business and Markets Served
7.18.5 Shanghai Guke Adhesive Tape Technology Recent Developments/Updates
7.19 Plusco Tech
7.19.1 Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Company Information
7.19.2 Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.19.3 Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.19.4 Plusco Tech Main Business and Markets Served
7.19.5 Plusco Tech Recent Developments/Updates
7.20 Taicang Zhanxin Adhesive Material
7.20.1 Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Company Information
7.20.2 Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.20.3 Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.20.4 Taicang Zhanxin Adhesive Material Main Business and Markets Served
7.20.5 Taicang Zhanxin Adhesive Material Recent Developments/Updates
7.21 Cybrid Technologies
7.21.1 Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Company Information
7.21.2 Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.21.3 Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.21.4 Cybrid Technologies Main Business and Markets Served
7.21.5 Cybrid Technologies Recent Developments/Updates
7.22 ZZSM
7.22.1 ZZSM Wafer Backgrinding Tape and Dicing Tapes Company Information
7.22.2 ZZSM Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.22.3 ZZSM Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.22.4 ZZSM Main Business and Markets Served
7.22.5 ZZSM Recent Developments/Updates
7.23 BYE POLYMER MATERIAL
7.23.1 BYE POLYMER MATERIAL Wafer Backgrinding Tape and Dicing Tapes Company Information
7.23.2 BYE POLYMER MATERIAL Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.23.3 BYE POLYMER MATERIAL Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.23.4 BYE POLYMER MATERIAL Main Business and Markets Served
7.23.5 BYE POLYMER MATERIAL Recent Developments/Updates
7.24 ZHONGSHAN CROWN ADHESIVE PRODUCTS
7.24.1 ZHONGSHAN CROWN ADHESIVE PRODUCTS Wafer Backgrinding Tape and Dicing Tapes Company Information
7.24.2 ZHONGSHAN CROWN ADHESIVE PRODUCTS Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.24.3 ZHONGSHAN CROWN ADHESIVE PRODUCTS Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.24.4 ZHONGSHAN CROWN ADHESIVE PRODUCTS Main Business and Markets Served
7.24.5 ZHONGSHAN CROWN ADHESIVE PRODUCTS Recent Developments/Updates
7.25 Yantai Darbond Technology
7.25.1 Yantai Darbond Technology Wafer Backgrinding Tape and Dicing Tapes Company Information
7.25.2 Yantai Darbond Technology Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.25.3 Yantai Darbond Technology Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.25.4 Yantai Darbond Technology Main Business and Markets Served
7.25.5 Yantai Darbond Technology Recent Developments/Updates
7.26 Sunliky New Material Technology
7.26.1 Sunliky New Material Technology Wafer Backgrinding Tape and Dicing Tapes Company Information
7.26.2 Sunliky New Material Technology Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.26.3 Sunliky New Material Technology Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.26.4 Sunliky New Material Technology Main Business and Markets Served
7.26.5 Sunliky New Material Technology Recent Developments/Updates
7.27 GTA Material
7.27.1 GTA Material Wafer Backgrinding Tape and Dicing Tapes Company Information
7.27.2 GTA Material Wafer Backgrinding Tape and Dicing Tapes Product Portfolio
7.27.3 GTA Material Wafer Backgrinding Tape and Dicing Tapes Production, Value, Price, and Gross Margin (2021–2026)
7.27.4 GTA Material Main Business and Markets Served
7.27.5 GTA Material Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Backgrinding Tape and Dicing Tapes Industry Chain Analysis
8.2 Wafer Backgrinding Tape and Dicing Tapes Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Backgrinding Tape and Dicing Tapes Production Modes and Processes
8.4 Wafer Backgrinding Tape and Dicing Tapes Sales and Marketing
8.4.1 Wafer Backgrinding Tape and Dicing Tapes Sales Channels
8.4.2 Wafer Backgrinding Tape and Dicing Tapes Distributors
8.5 Wafer Backgrinding Tape and Dicing Tapes Customer Analysis
9 Wafer Backgrinding Tape and Dicing Tapes Market Dynamics
9.1 Wafer Backgrinding Tape and Dicing Tapes Industry Trends
9.2 Wafer Backgrinding Tape and Dicing Tapes Market Drivers
9.3 Wafer Backgrinding Tape and Dicing Tapes Market Challenges
9.4 Wafer Backgrinding Tape and Dicing Tapes Market Restraints
9.5 Impact of U.S. Tariffs
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Wafer Backgrinding Tape and Dicing Tapes Market Value by Type (US$ Million), 2025 vs 2032
 Table 2. Global Wafer Backgrinding Tape and Dicing Tapes Market Value by Application (US$ Million), 2025 vs 2032
 Table 3. Global Wafer Backgrinding Tape and Dicing Tapes Production Capacity (K Sqm) by Manufacturers in 2025
 Table 4. Global Wafer Backgrinding Tape and Dicing Tapes Production by Manufacturers (K Sqm), 2021–2026
 Table 5. Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share by Manufacturers (2021–2026)
 Table 6. Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Manufacturers (US$ Million), 2021–2026
 Table 7. Global Wafer Backgrinding Tape and Dicing Tapes Production Value Share by Manufacturers (2021–2026)
 Table 8. Global Key Players of Wafer Backgrinding Tape and Dicing Tapes, Industry Ranking, 2024 vs 2025
 Table 9. Classification of Companies by Tier (Tier 1, Tier 2, Tier 3), based on Wafer Backgrinding Tape and Dicing Tapes Production Value, 2025
 Table 10. Global Market Wafer Backgrinding Tape and Dicing Tapes Average Price by Manufacturers (US$/Sq m), 2021–2026
 Table 11. Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Manufacturing Footprints and Headquarters
 Table 12. Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Product Offerings and Applications
 Table 13. Global Key Manufacturers of Wafer Backgrinding Tape and Dicing Tapes, Date of Entry into the Industry
 Table 14. Global Wafer Backgrinding Tape and Dicing Tapes Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions and Expansion Plans
 Table 16. Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Region: 2021 vs 2025 vs 2032 (US$ Million)
 Table 17. Global Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) by Region (2021–2026)
 Table 18. Global Wafer Backgrinding Tape and Dicing Tapes Production Value Market Share by Region (2021–2026)
 Table 19. Global Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) Forecast by Region (2027–2032)
 Table 20. Global Wafer Backgrinding Tape and Dicing Tapes Production Value Market Share Forecast by Region (2027–2032)
 Table 21. Global Wafer Backgrinding Tape and Dicing Tapes Production Comparison by Region: 2021 vs 2025 vs 2032 (K Sqm)
 Table 22. Global Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm) by Region (2021–2026)
 Table 23. Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share by Region (2021–2026)
 Table 24. Global Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm) Forecast by Region (2027–2032)
 Table 25. Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share Forecast by Region (2027–2032)
 Table 26. Global Wafer Backgrinding Tape and Dicing Tapes Market Average Price (US$/Sq m) by Region (2021–2026)
 Table 27. Global Wafer Backgrinding Tape and Dicing Tapes Market Average Price (US$/Sq m) by Region (2027–2032)
 Table 28. Global Wafer Backgrinding Tape and Dicing Tapes Consumption Growth Rate by Region: 2021 vs 2025 vs 2032 (K Sqm)
 Table 29. Global Wafer Backgrinding Tape and Dicing Tapes Consumption by Region (K Sqm), 2021–2026
 Table 30. Global Wafer Backgrinding Tape and Dicing Tapes Consumption Market Share by Region (2021–2026)
 Table 31. Global Wafer Backgrinding Tape and Dicing Tapes Forecasted Consumption by Region (K Sqm), 2027–2032
 Table 32. Global Wafer Backgrinding Tape and Dicing Tapes Forecasted Consumption Market Share by Region (2027–2032)
 Table 33. North America Wafer Backgrinding Tape and Dicing Tapes Consumption Growth Rate by Country: 2021 vs 2025 vs 2032 (K Sqm)
 Table 34. North America Wafer Backgrinding Tape and Dicing Tapes Consumption by Country (K Sqm), 2021–2026
 Table 35. North America Wafer Backgrinding Tape and Dicing Tapes Consumption by Country (K Sqm), 2027–2032
 Table 36. Europe Wafer Backgrinding Tape and Dicing Tapes Consumption Growth Rate by Country: 2021 vs 2025 vs 2032 (K Sqm)
 Table 37. Europe Wafer Backgrinding Tape and Dicing Tapes Consumption by Country (K Sqm), 2021–2026
 Table 38. Europe Wafer Backgrinding Tape and Dicing Tapes Consumption by Country (K Sqm), 2027–2032
 Table 39. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Consumption Growth Rate by Region: 2021 vs 2025 vs 2032 (K Sqm)
 Table 40. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Consumption by Region (K Sqm), 2021–2026
 Table 41. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Consumption by Region (K Sqm), 2027–2032
 Table 42. Latin America, Middle East & Africa Wafer Backgrinding Tape and Dicing Tapes Consumption Growth Rate by Country: 2021 vs 2025 vs 2032 (K Sqm)
 Table 43. Latin America, Middle East & Africa Wafer Backgrinding Tape and Dicing Tapes Consumption by Country (K Sqm), 2021–2026
 Table 44. Latin America, Middle East & Africa Wafer Backgrinding Tape and Dicing Tapes Consumption by Country (K Sqm), 2027–2032
 Table 45. Global Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm) by Type (2021–2026)
 Table 46. Global Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm) by Type (2027–2032)
 Table 47. Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share by Type (2021–2026)
 Table 48. Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share by Type (2027–2032)
 Table 49. Global Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) by Type (2021–2026)
 Table 50. Global Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) by Type (2027–2032)
 Table 51. Global Wafer Backgrinding Tape and Dicing Tapes Production Value Market Share by Type (2021–2026)
 Table 52. Global Wafer Backgrinding Tape and Dicing Tapes Production Value Market Share by Type (2027–2032)
 Table 53. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Sq m) by Type (2021–2026)
 Table 54. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Sq m) by Type (2027–2032)
 Table 55. Global Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm) by Application (2021–2026)
 Table 56. Global Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm) by Application (2027–2032)
 Table 57. Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share by Application (2021–2026)
 Table 58. Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share by Application (2027–2032)
 Table 59. Global Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) by Application (2021–2026)
 Table 60. Global Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) by Application (2027–2032)
 Table 61. Global Wafer Backgrinding Tape and Dicing Tapes Production Value Market Share by Application (2021–2026)
 Table 62. Global Wafer Backgrinding Tape and Dicing Tapes Production Value Market Share by Application (2027–2032)
 Table 63. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Sq m) by Application (2021–2026)
 Table 64. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Sq m) by Application (2027–2032)
 Table 65. Mitsui Chemicals Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 66. Mitsui Chemicals Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 67. Mitsui Chemicals Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 68. Mitsui Chemicals Main Business and Markets Served
 Table 69. Mitsui Chemicals Recent Developments/Updates
 Table 70. LINTEC Corporation Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 71. LINTEC Corporation Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 72. LINTEC Corporation Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 73. LINTEC Corporation Main Business and Markets Served
 Table 74. LINTEC Corporation Recent Developments/Updates
 Table 75. Denka Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 76. Denka Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 77. Denka Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 78. Denka Main Business and Markets Served
 Table 79. Denka Recent Developments/Updates
 Table 80. Nitto Denko Corporation Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 81. Nitto Denko Corporation Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 82. Nitto Denko Corporation Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 83. Nitto Denko Corporation Main Business and Markets Served
 Table 84. Nitto Denko Corporation Recent Developments/Updates
 Table 85. Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 86. Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 87. Furukawa Electric Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 88. Furukawa Electric Main Business and Markets Served
 Table 89. Furukawa Electric Recent Developments/Updates
 Table 90. Sekisui Chemical Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 91. Sekisui Chemical Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 92. Sekisui Chemical Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 93. Sekisui Chemical Main Business and Markets Served
 Table 94. Sekisui Chemical Recent Developments/Updates
 Table 95. Maxell Sliontec Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 96. Maxell Sliontec Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 97. Maxell Sliontec Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 98. Maxell Sliontec Main Business and Markets Served
 Table 99. Maxell Sliontec Recent Developments/Updates
 Table 100. Resonac Corporation Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 101. Resonac Corporation Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 102. Resonac Corporation Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 103. Resonac Corporation Main Business and Markets Served
 Table 104. Resonac Corporation Recent Developments/Updates
 Table 105. Sumitomo Bakelite Company Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 106. Sumitomo Bakelite Company Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 107. Sumitomo Bakelite Company Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 108. Sumitomo Bakelite Company Main Business and Markets Served
 Table 109. Sumitomo Bakelite Company Recent Developments/Updates
 Table 110. D&X Co., Ltd Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 111. D&X Co., Ltd Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 112. D&X Co., Ltd Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 113. D&X Co., Ltd Main Business and Markets Served
 Table 114. D&X Co., Ltd Recent Developments/Updates
 Table 115. KGK Chemical Corporation Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 116. KGK Chemical Corporation Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 117. KGK Chemical Corporation Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 118. KGK Chemical Corporation Main Business and Markets Served
 Table 119. KGK Chemical Corporation Recent Developments/Updates
 Table 120. AI Technology, Inc. (AIT) Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 121. AI Technology, Inc. (AIT) Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 122. AI Technology, Inc. (AIT) Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 123. AI Technology, Inc. (AIT) Main Business and Markets Served
 Table 124. AI Technology, Inc. (AIT) Recent Developments/Updates
 Table 125. Ultron System Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 126. Ultron System Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 127. Ultron System Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 128. Ultron System Main Business and Markets Served
 Table 129. Ultron System Recent Developments/Updates
 Table 130. Daehyun ST Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 131. Daehyun ST Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 132. Daehyun ST Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 133. Daehyun ST Main Business and Markets Served
 Table 134. Daehyun ST Recent Developments/Updates
 Table 135. Solar Plus Company Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 136. Solar Plus Company Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 137. Solar Plus Company Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 138. Solar Plus Company Main Business and Markets Served
 Table 139. Solar Plus Company Recent Developments/Updates
 Table 140. Alliance Material Co., Ltd (AMC) Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 141. Alliance Material Co., Ltd (AMC) Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 142. Alliance Material Co., Ltd (AMC) Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 143. Alliance Material Co., Ltd (AMC) Main Business and Markets Served
 Table 144. Alliance Material Co., Ltd (AMC) Recent Developments/Updates
 Table 145. 3M Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 146. 3M Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 147. 3M Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 148. 3M Main Business and Markets Served
 Table 149. 3M Recent Developments/Updates
 Table 150. Shanghai Guke Adhesive Tape Technology Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 151. Shanghai Guke Adhesive Tape Technology Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 152. Shanghai Guke Adhesive Tape Technology Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 153. Shanghai Guke Adhesive Tape Technology Main Business and Markets Served
 Table 154. Shanghai Guke Adhesive Tape Technology Recent Developments/Updates
 Table 155. Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 156. Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 157. Plusco Tech Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 158. Plusco Tech Main Business and Markets Served
 Table 159. Plusco Tech Recent Developments/Updates
 Table 160. Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 161. Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 162. Taicang Zhanxin Adhesive Material Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 163. Taicang Zhanxin Adhesive Material Main Business and Markets Served
 Table 164. Taicang Zhanxin Adhesive Material Recent Developments/Updates
 Table 165. Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 166. Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 167. Cybrid Technologies Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 168. Cybrid Technologies Main Business and Markets Served
 Table 169. Cybrid Technologies Recent Developments/Updates
 Table 170. ZZSM Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 171. ZZSM Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 172. ZZSM Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 173. ZZSM Main Business and Markets Served
 Table 174. ZZSM Recent Developments/Updates
 Table 175. BYE POLYMER MATERIAL Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 176. BYE POLYMER MATERIAL Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 177. BYE POLYMER MATERIAL Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 178. BYE POLYMER MATERIAL Main Business and Markets Served
 Table 179. BYE POLYMER MATERIAL Recent Developments/Updates
 Table 180. ZHONGSHAN CROWN ADHESIVE PRODUCTS Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 181. ZHONGSHAN CROWN ADHESIVE PRODUCTS Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 182. ZHONGSHAN CROWN ADHESIVE PRODUCTS Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 183. ZHONGSHAN CROWN ADHESIVE PRODUCTS Main Business and Markets Served
 Table 184. ZHONGSHAN CROWN ADHESIVE PRODUCTS Recent Developments/Updates
 Table 185. Yantai Darbond Technology Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 186. Yantai Darbond Technology Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 187. Yantai Darbond Technology Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 188. Yantai Darbond Technology Main Business and Markets Served
 Table 189. Yantai Darbond Technology Recent Developments/Updates
 Table 190. Sunliky New Material Technology Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 191. Sunliky New Material Technology Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 192. Sunliky New Material Technology Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 193. Sunliky New Material Technology Main Business and Markets Served
 Table 194. Sunliky New Material Technology Recent Developments/Updates
 Table 195. GTA Material Wafer Backgrinding Tape and Dicing Tapes Company Information
 Table 196. GTA Material Wafer Backgrinding Tape and Dicing Tapes Specification and Application
 Table 197. GTA Material Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2021–2026)
 Table 198. GTA Material Main Business and Markets Served
 Table 199. GTA Material Recent Developments/Updates
 Table 200. Key Raw Materials Lists
 Table 201. Raw Materials Key Suppliers Lists
 Table 202. Wafer Backgrinding Tape and Dicing Tapes Distributors List
 Table 203. Wafer Backgrinding Tape and Dicing Tapes Customers List
 Table 204. Wafer Backgrinding Tape and Dicing Tapes Market Trends
 Table 205. Wafer Backgrinding Tape and Dicing Tapes Market Drivers
 Table 206. Wafer Backgrinding Tape and Dicing Tapes Market Challenges
 Table 207. Wafer Backgrinding Tape and Dicing Tapes Market Restraints
 Table 208. Research Programs/Design for This Report
 Table 209. Key Data Information from Secondary Sources
 Table 210. Key Data Information from Primary Sources
 Table 211. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Wafer Backgrinding Tape and Dicing Tapes
 Figure 2. Global Wafer Backgrinding Tape and Dicing Tapes Market Value by Type (US$ Million), 2021–2032
 Figure 3. Global Wafer Backgrinding Tape and Dicing Tapes Market Share by Type: 2025 vs 2032
 Figure 4. UV Tape Product Picture
 Figure 5. Non-UV Tape Product Picture
 Figure 6. Global Wafer Backgrinding Tape and Dicing Tapes Market Value by Application (US$ Million), 2021–2032
 Figure 7. Global Wafer Backgrinding Tape and Dicing Tapes Market Share by Application: 2025 vs 2032
 Figure 8. Back Grinding Tape
 Figure 9. Dicing Tape
 Figure 10. Global Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million), 2021 vs 2025 vs 2032
 Figure 11. Global Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million), 2021–2032
 Figure 12. Global Wafer Backgrinding Tape and Dicing Tapes Production Capacity (K Sqm), 2021–2032
 Figure 13. Global Wafer Backgrinding Tape and Dicing Tapes Production (K Sqm), 2021–2032
 Figure 14. Global Wafer Backgrinding Tape and Dicing Tapes Average Price (US$/Sq m), 2021–2032
 Figure 15. Wafer Backgrinding Tape and Dicing Tapes Report Years Considered
 Figure 16. Wafer Backgrinding Tape and Dicing Tapes Production Share by Manufacturers in 2025
 Figure 17. Global Wafer Backgrinding Tape and Dicing Tapes Production Value Share by Manufacturers (2025)
 Figure 18. Wafer Backgrinding Tape and Dicing Tapes Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2021 vs 2025
 Figure 19. Top 5 and Top 10 Global Players: Market Share by Wafer Backgrinding Tape and Dicing Tapes Revenue in 2025
 Figure 20. Global Wafer Backgrinding Tape and Dicing Tapes Production Value by Region: 2021 vs 2025 vs 2032 (US$ Million)
 Figure 21. Global Wafer Backgrinding Tape and Dicing Tapes Production Value Market Share by Region: 2021 vs 2025 vs 2032
 Figure 22. Global Wafer Backgrinding Tape and Dicing Tapes Production Comparison by Region: 2021 vs 2025 vs 2032 (K Sqm)
 Figure 23. Global Wafer Backgrinding Tape and Dicing Tapes Production Market Share by Region: 2021 vs 2025 vs 2032
 Figure 24. Japan Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) Growth Rate (2021–2032)
 Figure 25. China Taiwan Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) Growth Rate (2021–2032)
 Figure 26. North America Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) Growth Rate (2021–2032)
 Figure 27. China Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) Growth Rate (2021–2032)
 Figure 28. South Korea Wafer Backgrinding Tape and Dicing Tapes Production Value (US$ Million) Growth Rate (2021–2032)
 Figure 29. Global Wafer Backgrinding Tape and Dicing Tapes Consumption by Region: 2021 vs 2025 vs 2032 (K Sqm)
 Figure 30. Global Wafer Backgrinding Tape and Dicing Tapes Consumption Market Share by Region: 2021 vs 2025 vs 2032
 Figure 31. North America Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 32. North America Wafer Backgrinding Tape and Dicing Tapes Consumption Market Share by Country (2021–2032)
 Figure 33. U.S. Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 34. Canada Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 35. Europe Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 36. Europe Wafer Backgrinding Tape and Dicing Tapes Consumption Market Share by Country (2021–2032)
 Figure 37. Germany Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 38. France Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 39. U.K. Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 40. Italy Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 41. Russia Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 42. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 43. Asia Pacific Wafer Backgrinding Tape and Dicing Tapes Consumption Market Share by Region (2021–2032)
 Figure 44. China Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 45. Japan Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 46. South Korea Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 47. China Taiwan Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 48. Southeast Asia Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 49. India Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 50. Latin America, Middle East & Africa Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 51. Latin America, Middle East & Africa Wafer Backgrinding Tape and Dicing Tapes Consumption Market Share by Country (2021–2032)
 Figure 52. Mexico Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 53. Brazil Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 54. Israel Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 55. GCC Countries Wafer Backgrinding Tape and Dicing Tapes Consumption and Growth Rate (K Sqm), 2021–2032
 Figure 56. Global Production Market Share of Wafer Backgrinding Tape and Dicing Tapes by Type (2021–2032)
 Figure 57. Global Production Value Market Share of Wafer Backgrinding Tape and Dicing Tapes by Type (2021–2032)
 Figure 58. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Sq m) by Type (2021–2032)
 Figure 59. Global Production Market Share of Wafer Backgrinding Tape and Dicing Tapes by Application (2021–2032)
 Figure 60. Global Production Value Market Share of Wafer Backgrinding Tape and Dicing Tapes by Application (2021–2032)
 Figure 61. Global Wafer Backgrinding Tape and Dicing Tapes Price (US$/Sq m) by Application (2021–2032)
 Figure 62. Wafer Backgrinding Tape and Dicing Tapes Value Chain
 Figure 63. Channels of Distribution (Direct Vs Distribution)
 Figure 64. Bottom-up and Top-down Approaches for This Report
 Figure 65. Data Triangulation
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