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Global Wafer Dicing Saw Blades Market Research Report 2023
Published Date: August 2023
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Report Code: QYRE-Auto-27S14861
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Global Wafer Dicing Saw Blades Market Research Report 2023
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Global Wafer Dicing Saw Blades Market Research Report 2023

Code: QYRE-Auto-27S14861
Report
August 2023
Pages:102
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Wafer Dicing Saw Blades Market

A Wafer Dicing Saw Blade, also referred to as a diamond dicing blade or simply a dicing blade, is a cutting tool specifically designed for separating wafers into individual chips or devices in the semiconductor industry. These blades are typically made of a metal core with diamond particles embedded in a resin or metal bond.
According to QYResearch’s new survey, global Wafer Dicing Saw Blades market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Wafer Dicing Saw Blades market research.
Key manufacturers engaged in the Wafer Dicing Saw Blades industry include DISCO, Tokyo Seimitsu, Advanced Dicing Technologies (ADT), Loadpoint, Kulicke and Soffa Industries, Asahi Diamond Industrial, Norton Winter (Saint-Gobain), EHWA and Thermocarbon, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Wafer Dicing Saw Blades production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Wafer Dicing Saw Blades were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Wafer Dicing Saw Blades market and estimated to attract more attentions from industry insiders and investors.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Wafer Dicing Saw Blades market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.

Scope of Wafer Dicing Saw Blades Market Report

Report Metric Details
Report Name Wafer Dicing Saw Blades Market
Segment by Type
  • Hubless Dicing Blades
  • Hubbed Dicing Blades
Segment by Application
  • Semiconductor
  • LED
  • Photovoltaic
  • Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company DISCO, Tokyo Seimitsu, Advanced Dicing Technologies (ADT), Loadpoint, Kulicke and Soffa Industries, Asahi Diamond Industrial, Norton Winter (Saint-Gobain), EHWA, Thermocarbon, UKAM Industrial Superhard Tools, Ceiba Technologies, Gl Tech, Zhengzhou Hongtuo Superabrasive Products, Shanghai Sinyang Semiconductor Materials, System Technology (Shenzhen), Zhengzhou Qisheng Precision Manufacturing
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends
1 Wafer Dicing Saw Blades Market Overview
1.1 Product Definition
1.2 Wafer Dicing Saw Blades Segment by Type
1.2.1 Global Wafer Dicing Saw Blades Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Hubless Dicing Blades
1.2.3 Hubbed Dicing Blades
1.3 Wafer Dicing Saw Blades Segment by Application
1.3.1 Global Wafer Dicing Saw Blades Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Semiconductor
1.3.3 LED
1.3.4 Photovoltaic
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Dicing Saw Blades Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Wafer Dicing Saw Blades Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Wafer Dicing Saw Blades Production Estimates and Forecasts (2018-2029)
1.4.4 Global Wafer Dicing Saw Blades Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Dicing Saw Blades Production Market Share by Manufacturers (2018-2023)
2.2 Global Wafer Dicing Saw Blades Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Wafer Dicing Saw Blades, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Wafer Dicing Saw Blades Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Dicing Saw Blades Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Wafer Dicing Saw Blades, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Dicing Saw Blades, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Dicing Saw Blades, Date of Enter into This Industry
2.9 Wafer Dicing Saw Blades Market Competitive Situation and Trends
2.9.1 Wafer Dicing Saw Blades Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Dicing Saw Blades Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Dicing Saw Blades Production by Region
3.1 Global Wafer Dicing Saw Blades Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Dicing Saw Blades Production Value by Region (2018-2029)
3.2.1 Global Wafer Dicing Saw Blades Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Wafer Dicing Saw Blades by Region (2024-2029)
3.3 Global Wafer Dicing Saw Blades Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Wafer Dicing Saw Blades Production by Region (2018-2029)
3.4.1 Global Wafer Dicing Saw Blades Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Wafer Dicing Saw Blades by Region (2024-2029)
3.5 Global Wafer Dicing Saw Blades Market Price Analysis by Region (2018-2023)
3.6 Global Wafer Dicing Saw Blades Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Dicing Saw Blades Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Wafer Dicing Saw Blades Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Wafer Dicing Saw Blades Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Wafer Dicing Saw Blades Production Value Estimates and Forecasts (2018-2029)
4 Wafer Dicing Saw Blades Consumption by Region
4.1 Global Wafer Dicing Saw Blades Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Wafer Dicing Saw Blades Consumption by Region (2018-2029)
4.2.1 Global Wafer Dicing Saw Blades Consumption by Region (2018-2023)
4.2.2 Global Wafer Dicing Saw Blades Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Wafer Dicing Saw Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Wafer Dicing Saw Blades Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Dicing Saw Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Wafer Dicing Saw Blades Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Dicing Saw Blades Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Wafer Dicing Saw Blades Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Dicing Saw Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Wafer Dicing Saw Blades Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Wafer Dicing Saw Blades Production by Type (2018-2029)
5.1.1 Global Wafer Dicing Saw Blades Production by Type (2018-2023)
5.1.2 Global Wafer Dicing Saw Blades Production by Type (2024-2029)
5.1.3 Global Wafer Dicing Saw Blades Production Market Share by Type (2018-2029)
5.2 Global Wafer Dicing Saw Blades Production Value by Type (2018-2029)
5.2.1 Global Wafer Dicing Saw Blades Production Value by Type (2018-2023)
5.2.2 Global Wafer Dicing Saw Blades Production Value by Type (2024-2029)
5.2.3 Global Wafer Dicing Saw Blades Production Value Market Share by Type (2018-2029)
5.3 Global Wafer Dicing Saw Blades Price by Type (2018-2029)
6 Segment by Application
6.1 Global Wafer Dicing Saw Blades Production by Application (2018-2029)
6.1.1 Global Wafer Dicing Saw Blades Production by Application (2018-2023)
6.1.2 Global Wafer Dicing Saw Blades Production by Application (2024-2029)
6.1.3 Global Wafer Dicing Saw Blades Production Market Share by Application (2018-2029)
6.2 Global Wafer Dicing Saw Blades Production Value by Application (2018-2029)
6.2.1 Global Wafer Dicing Saw Blades Production Value by Application (2018-2023)
6.2.2 Global Wafer Dicing Saw Blades Production Value by Application (2024-2029)
6.2.3 Global Wafer Dicing Saw Blades Production Value Market Share by Application (2018-2029)
6.3 Global Wafer Dicing Saw Blades Price by Application (2018-2029)
7 Key Companies Profiled
7.1 DISCO
7.1.1 DISCO Wafer Dicing Saw Blades Corporation Information
7.1.2 DISCO Wafer Dicing Saw Blades Product Portfolio
7.1.3 DISCO Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.1.4 DISCO Main Business and Markets Served
7.1.5 DISCO Recent Developments/Updates
7.2 Tokyo Seimitsu
7.2.1 Tokyo Seimitsu Wafer Dicing Saw Blades Corporation Information
7.2.2 Tokyo Seimitsu Wafer Dicing Saw Blades Product Portfolio
7.2.3 Tokyo Seimitsu Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Tokyo Seimitsu Main Business and Markets Served
7.2.5 Tokyo Seimitsu Recent Developments/Updates
7.3 Advanced Dicing Technologies (ADT)
7.3.1 Advanced Dicing Technologies (ADT) Wafer Dicing Saw Blades Corporation Information
7.3.2 Advanced Dicing Technologies (ADT) Wafer Dicing Saw Blades Product Portfolio
7.3.3 Advanced Dicing Technologies (ADT) Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Advanced Dicing Technologies (ADT) Main Business and Markets Served
7.3.5 Advanced Dicing Technologies (ADT) Recent Developments/Updates
7.4 Loadpoint
7.4.1 Loadpoint Wafer Dicing Saw Blades Corporation Information
7.4.2 Loadpoint Wafer Dicing Saw Blades Product Portfolio
7.4.3 Loadpoint Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Loadpoint Main Business and Markets Served
7.4.5 Loadpoint Recent Developments/Updates
7.5 Kulicke and Soffa Industries
7.5.1 Kulicke and Soffa Industries Wafer Dicing Saw Blades Corporation Information
7.5.2 Kulicke and Soffa Industries Wafer Dicing Saw Blades Product Portfolio
7.5.3 Kulicke and Soffa Industries Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Kulicke and Soffa Industries Main Business and Markets Served
7.5.5 Kulicke and Soffa Industries Recent Developments/Updates
7.6 Asahi Diamond Industrial
7.6.1 Asahi Diamond Industrial Wafer Dicing Saw Blades Corporation Information
7.6.2 Asahi Diamond Industrial Wafer Dicing Saw Blades Product Portfolio
7.6.3 Asahi Diamond Industrial Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Asahi Diamond Industrial Main Business and Markets Served
7.6.5 Asahi Diamond Industrial Recent Developments/Updates
7.7 Norton Winter (Saint-Gobain)
7.7.1 Norton Winter (Saint-Gobain) Wafer Dicing Saw Blades Corporation Information
7.7.2 Norton Winter (Saint-Gobain) Wafer Dicing Saw Blades Product Portfolio
7.7.3 Norton Winter (Saint-Gobain) Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Norton Winter (Saint-Gobain) Main Business and Markets Served
7.7.5 Norton Winter (Saint-Gobain) Recent Developments/Updates
7.8 EHWA
7.8.1 EHWA Wafer Dicing Saw Blades Corporation Information
7.8.2 EHWA Wafer Dicing Saw Blades Product Portfolio
7.8.3 EHWA Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.8.4 EHWA Main Business and Markets Served
7.7.5 EHWA Recent Developments/Updates
7.9 Thermocarbon
7.9.1 Thermocarbon Wafer Dicing Saw Blades Corporation Information
7.9.2 Thermocarbon Wafer Dicing Saw Blades Product Portfolio
7.9.3 Thermocarbon Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Thermocarbon Main Business and Markets Served
7.9.5 Thermocarbon Recent Developments/Updates
7.10 Kulicke and Soffa Industries
7.10.1 Kulicke and Soffa Industries Wafer Dicing Saw Blades Corporation Information
7.10.2 Kulicke and Soffa Industries Wafer Dicing Saw Blades Product Portfolio
7.10.3 Kulicke and Soffa Industries Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Kulicke and Soffa Industries Main Business and Markets Served
7.10.5 Kulicke and Soffa Industries Recent Developments/Updates
7.11 UKAM Industrial Superhard Tools
7.11.1 UKAM Industrial Superhard Tools Wafer Dicing Saw Blades Corporation Information
7.11.2 UKAM Industrial Superhard Tools Wafer Dicing Saw Blades Product Portfolio
7.11.3 UKAM Industrial Superhard Tools Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.11.4 UKAM Industrial Superhard Tools Main Business and Markets Served
7.11.5 UKAM Industrial Superhard Tools Recent Developments/Updates
7.12 Ceiba Technologies
7.12.1 Ceiba Technologies Wafer Dicing Saw Blades Corporation Information
7.12.2 Ceiba Technologies Wafer Dicing Saw Blades Product Portfolio
7.12.3 Ceiba Technologies Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Ceiba Technologies Main Business and Markets Served
7.12.5 Ceiba Technologies Recent Developments/Updates
7.13 Gl Tech
7.13.1 Gl Tech Wafer Dicing Saw Blades Corporation Information
7.13.2 Gl Tech Wafer Dicing Saw Blades Product Portfolio
7.13.3 Gl Tech Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Gl Tech Main Business and Markets Served
7.13.5 Gl Tech Recent Developments/Updates
7.14 Zhengzhou Hongtuo Superabrasive Products
7.14.1 Zhengzhou Hongtuo Superabrasive Products Wafer Dicing Saw Blades Corporation Information
7.14.2 Zhengzhou Hongtuo Superabrasive Products Wafer Dicing Saw Blades Product Portfolio
7.14.3 Zhengzhou Hongtuo Superabrasive Products Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Zhengzhou Hongtuo Superabrasive Products Main Business and Markets Served
7.14.5 Zhengzhou Hongtuo Superabrasive Products Recent Developments/Updates
7.15 Shanghai Sinyang Semiconductor Materials
7.15.1 Shanghai Sinyang Semiconductor Materials Wafer Dicing Saw Blades Corporation Information
7.15.2 Shanghai Sinyang Semiconductor Materials Wafer Dicing Saw Blades Product Portfolio
7.15.3 Shanghai Sinyang Semiconductor Materials Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Shanghai Sinyang Semiconductor Materials Main Business and Markets Served
7.15.5 Shanghai Sinyang Semiconductor Materials Recent Developments/Updates
7.16 System Technology (Shenzhen)
7.16.1 System Technology (Shenzhen) Wafer Dicing Saw Blades Corporation Information
7.16.2 System Technology (Shenzhen) Wafer Dicing Saw Blades Product Portfolio
7.16.3 System Technology (Shenzhen) Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.16.4 System Technology (Shenzhen) Main Business and Markets Served
7.16.5 System Technology (Shenzhen) Recent Developments/Updates
7.17 Zhengzhou Qisheng Precision Manufacturing
7.17.1 Zhengzhou Qisheng Precision Manufacturing Wafer Dicing Saw Blades Corporation Information
7.17.2 Zhengzhou Qisheng Precision Manufacturing Wafer Dicing Saw Blades Product Portfolio
7.17.3 Zhengzhou Qisheng Precision Manufacturing Wafer Dicing Saw Blades Production, Value, Price and Gross Margin (2018-2023)
7.17.4 Zhengzhou Qisheng Precision Manufacturing Main Business and Markets Served
7.17.5 Zhengzhou Qisheng Precision Manufacturing Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Dicing Saw Blades Industry Chain Analysis
8.2 Wafer Dicing Saw Blades Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Dicing Saw Blades Production Mode & Process
8.4 Wafer Dicing Saw Blades Sales and Marketing
8.4.1 Wafer Dicing Saw Blades Sales Channels
8.4.2 Wafer Dicing Saw Blades Distributors
8.5 Wafer Dicing Saw Blades Customers
9 Wafer Dicing Saw Blades Market Dynamics
9.1 Wafer Dicing Saw Blades Industry Trends
9.2 Wafer Dicing Saw Blades Market Drivers
9.3 Wafer Dicing Saw Blades Market Challenges
9.4 Wafer Dicing Saw Blades Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
    Table 1. Global Wafer Dicing Saw Blades Market Value by Type, (US$ Million) & (2022 VS 2029)
    Table 2. Global Wafer Dicing Saw Blades Market Value by Application, (US$ Million) & (2022 VS 2029)
    Table 3. Global Wafer Dicing Saw Blades Production Capacity (K Units) by Manufacturers in 2022
    Table 4. Global Wafer Dicing Saw Blades Production by Manufacturers (2018-2023) & (K Units)
    Table 5. Global Wafer Dicing Saw Blades Production Market Share by Manufacturers (2018-2023)
    Table 6. Global Wafer Dicing Saw Blades Production Value by Manufacturers (2018-2023) & (US$ Million)
    Table 7. Global Wafer Dicing Saw Blades Production Value Share by Manufacturers (2018-2023)
    Table 8. Global Wafer Dicing Saw Blades Industry Ranking 2021 VS 2022 VS 2023
    Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Wafer Dicing Saw Blades as of 2022)
    Table 10. Global Market Wafer Dicing Saw Blades Average Price by Manufacturers (US$/Unit) & (2018-2023)
    Table 11. Manufacturers Wafer Dicing Saw Blades Production Sites and Area Served
    Table 12. Manufacturers Wafer Dicing Saw Blades Product Types
    Table 13. Global Wafer Dicing Saw Blades Manufacturers Market Concentration Ratio (CR5 and HHI)
    Table 14. Mergers & Acquisitions, Expansion
    Table 15. Global Wafer Dicing Saw Blades Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
    Table 16. Global Wafer Dicing Saw Blades Production Value (US$ Million) by Region (2018-2023)
    Table 17. Global Wafer Dicing Saw Blades Production Value Market Share by Region (2018-2023)
    Table 18. Global Wafer Dicing Saw Blades Production Value (US$ Million) Forecast by Region (2024-2029)
    Table 19. Global Wafer Dicing Saw Blades Production Value Market Share Forecast by Region (2024-2029)
    Table 20. Global Wafer Dicing Saw Blades Production Comparison by Region: 2018 VS 2022 VS 2029 (K Units)
    Table 21. Global Wafer Dicing Saw Blades Production (K Units) by Region (2018-2023)
    Table 22. Global Wafer Dicing Saw Blades Production Market Share by Region (2018-2023)
    Table 23. Global Wafer Dicing Saw Blades Production (K Units) Forecast by Region (2024-2029)
    Table 24. Global Wafer Dicing Saw Blades Production Market Share Forecast by Region (2024-2029)
    Table 25. Global Wafer Dicing Saw Blades Market Average Price (US$/Unit) by Region (2018-2023)
    Table 26. Global Wafer Dicing Saw Blades Market Average Price (US$/Unit) by Region (2024-2029)
    Table 27. Global Wafer Dicing Saw Blades Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (K Units)
    Table 28. Global Wafer Dicing Saw Blades Consumption by Region (2018-2023) & (K Units)
    Table 29. Global Wafer Dicing Saw Blades Consumption Market Share by Region (2018-2023)
    Table 30. Global Wafer Dicing Saw Blades Forecasted Consumption by Region (2024-2029) & (K Units)
    Table 31. Global Wafer Dicing Saw Blades Forecasted Consumption Market Share by Region (2018-2023)
    Table 32. North America Wafer Dicing Saw Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
    Table 33. North America Wafer Dicing Saw Blades Consumption by Country (2018-2023) & (K Units)
    Table 34. North America Wafer Dicing Saw Blades Consumption by Country (2024-2029) & (K Units)
    Table 35. Europe Wafer Dicing Saw Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
    Table 36. Europe Wafer Dicing Saw Blades Consumption by Country (2018-2023) & (K Units)
    Table 37. Europe Wafer Dicing Saw Blades Consumption by Country (2024-2029) & (K Units)
    Table 38. Asia Pacific Wafer Dicing Saw Blades Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (K Units)
    Table 39. Asia Pacific Wafer Dicing Saw Blades Consumption by Region (2018-2023) & (K Units)
    Table 40. Asia Pacific Wafer Dicing Saw Blades Consumption by Region (2024-2029) & (K Units)
    Table 41. Latin America, Middle East & Africa Wafer Dicing Saw Blades Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
    Table 42. Latin America, Middle East & Africa Wafer Dicing Saw Blades Consumption by Country (2018-2023) & (K Units)
    Table 43. Latin America, Middle East & Africa Wafer Dicing Saw Blades Consumption by Country (2024-2029) & (K Units)
    Table 44. Global Wafer Dicing Saw Blades Production (K Units) by Type (2018-2023)
    Table 45. Global Wafer Dicing Saw Blades Production (K Units) by Type (2024-2029)
    Table 46. Global Wafer Dicing Saw Blades Production Market Share by Type (2018-2023)
    Table 47. Global Wafer Dicing Saw Blades Production Market Share by Type (2024-2029)
    Table 48. Global Wafer Dicing Saw Blades Production Value (US$ Million) by Type (2018-2023)
    Table 49. Global Wafer Dicing Saw Blades Production Value (US$ Million) by Type (2024-2029)
    Table 50. Global Wafer Dicing Saw Blades Production Value Share by Type (2018-2023)
    Table 51. Global Wafer Dicing Saw Blades Production Value Share by Type (2024-2029)
    Table 52. Global Wafer Dicing Saw Blades Price (US$/Unit) by Type (2018-2023)
    Table 53. Global Wafer Dicing Saw Blades Price (US$/Unit) by Type (2024-2029)
    Table 54. Global Wafer Dicing Saw Blades Production (K Units) by Application (2018-2023)
    Table 55. Global Wafer Dicing Saw Blades Production (K Units) by Application (2024-2029)
    Table 56. Global Wafer Dicing Saw Blades Production Market Share by Application (2018-2023)
    Table 57. Global Wafer Dicing Saw Blades Production Market Share by Application (2024-2029)
    Table 58. Global Wafer Dicing Saw Blades Production Value (US$ Million) by Application (2018-2023)
    Table 59. Global Wafer Dicing Saw Blades Production Value (US$ Million) by Application (2024-2029)
    Table 60. Global Wafer Dicing Saw Blades Production Value Share by Application (2018-2023)
    Table 61. Global Wafer Dicing Saw Blades Production Value Share by Application (2024-2029)
    Table 62. Global Wafer Dicing Saw Blades Price (US$/Unit) by Application (2018-2023)
    Table 63. Global Wafer Dicing Saw Blades Price (US$/Unit) by Application (2024-2029)
    Table 64. DISCO Wafer Dicing Saw Blades Corporation Information
    Table 65. DISCO Specification and Application
    Table 66. DISCO Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 67. DISCO Main Business and Markets Served
    Table 68. DISCO Recent Developments/Updates
    Table 69. Tokyo Seimitsu Wafer Dicing Saw Blades Corporation Information
    Table 70. Tokyo Seimitsu Specification and Application
    Table 71. Tokyo Seimitsu Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 72. Tokyo Seimitsu Main Business and Markets Served
    Table 73. Tokyo Seimitsu Recent Developments/Updates
    Table 74. Advanced Dicing Technologies (ADT) Wafer Dicing Saw Blades Corporation Information
    Table 75. Advanced Dicing Technologies (ADT) Specification and Application
    Table 76. Advanced Dicing Technologies (ADT) Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 77. Advanced Dicing Technologies (ADT) Main Business and Markets Served
    Table 78. Advanced Dicing Technologies (ADT) Recent Developments/Updates
    Table 79. Loadpoint Wafer Dicing Saw Blades Corporation Information
    Table 80. Loadpoint Specification and Application
    Table 81. Loadpoint Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 82. Loadpoint Main Business and Markets Served
    Table 83. Loadpoint Recent Developments/Updates
    Table 84. Kulicke and Soffa Industries Wafer Dicing Saw Blades Corporation Information
    Table 85. Kulicke and Soffa Industries Specification and Application
    Table 86. Kulicke and Soffa Industries Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 87. Kulicke and Soffa Industries Main Business and Markets Served
    Table 88. Kulicke and Soffa Industries Recent Developments/Updates
    Table 89. Asahi Diamond Industrial Wafer Dicing Saw Blades Corporation Information
    Table 90. Asahi Diamond Industrial Specification and Application
    Table 91. Asahi Diamond Industrial Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 92. Asahi Diamond Industrial Main Business and Markets Served
    Table 93. Asahi Diamond Industrial Recent Developments/Updates
    Table 94. Norton Winter (Saint-Gobain) Wafer Dicing Saw Blades Corporation Information
    Table 95. Norton Winter (Saint-Gobain) Specification and Application
    Table 96. Norton Winter (Saint-Gobain) Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 97. Norton Winter (Saint-Gobain) Main Business and Markets Served
    Table 98. Norton Winter (Saint-Gobain) Recent Developments/Updates
    Table 99. EHWA Wafer Dicing Saw Blades Corporation Information
    Table 100. EHWA Specification and Application
    Table 101. EHWA Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 102. EHWA Main Business and Markets Served
    Table 103. EHWA Recent Developments/Updates
    Table 104. Thermocarbon Wafer Dicing Saw Blades Corporation Information
    Table 105. Thermocarbon Specification and Application
    Table 106. Thermocarbon Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 107. Thermocarbon Main Business and Markets Served
    Table 108. Thermocarbon Recent Developments/Updates
    Table 109. Kulicke and Soffa Industries Wafer Dicing Saw Blades Corporation Information
    Table 110. Kulicke and Soffa Industries Specification and Application
    Table 111. Kulicke and Soffa Industries Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 112. Kulicke and Soffa Industries Main Business and Markets Served
    Table 113. Kulicke and Soffa Industries Recent Developments/Updates
    Table 114. UKAM Industrial Superhard Tools Wafer Dicing Saw Blades Corporation Information
    Table 115. UKAM Industrial Superhard Tools Specification and Application
    Table 116. UKAM Industrial Superhard Tools Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 117. UKAM Industrial Superhard Tools Main Business and Markets Served
    Table 118. UKAM Industrial Superhard Tools Recent Developments/Updates
    Table 119. Ceiba Technologies Wafer Dicing Saw Blades Corporation Information
    Table 120. Ceiba Technologies Specification and Application
    Table 121. Ceiba Technologies Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 122. Ceiba Technologies Main Business and Markets Served
    Table 123. Ceiba Technologies Recent Developments/Updates
    Table 124. Gl Tech Wafer Dicing Saw Blades Corporation Information
    Table 125. Gl Tech Specification and Application
    Table 126. Gl Tech Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 127. Gl Tech Main Business and Markets Served
    Table 128. Gl Tech Recent Developments/Updates
    Table 129. Zhengzhou Hongtuo Superabrasive Products Wafer Dicing Saw Blades Corporation Information
    Table 130. Zhengzhou Hongtuo Superabrasive Products Specification and Application
    Table 131. Zhengzhou Hongtuo Superabrasive Products Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 132. Zhengzhou Hongtuo Superabrasive Products Main Business and Markets Served
    Table 133. Zhengzhou Hongtuo Superabrasive Products Recent Developments/Updates
    Table 134. Zhengzhou Hongtuo Superabrasive Products Wafer Dicing Saw Blades Corporation Information
    Table 135. Shanghai Sinyang Semiconductor Materials Specification and Application
    Table 136. Shanghai Sinyang Semiconductor Materials Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 137. Shanghai Sinyang Semiconductor Materials Main Business and Markets Served
    Table 138. Shanghai Sinyang Semiconductor Materials Recent Developments/Updates
    Table 139. System Technology (Shenzhen) Wafer Dicing Saw Blades Corporation Information
    Table 140. System Technology (Shenzhen) Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 141. System Technology (Shenzhen) Main Business and Markets Served
    Table 142. System Technology (Shenzhen) Recent Developments/Updates
    Table 143. Zhengzhou Qisheng Precision Manufacturing Wafer Dicing Saw Blades Corporation Information
    Table 144. Zhengzhou Qisheng Precision Manufacturing Specification and Application
    Table 145. Zhengzhou Qisheng Precision Manufacturing Wafer Dicing Saw Blades Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 146. Zhengzhou Qisheng Precision Manufacturing Main Business and Markets Served
    Table 147. Zhengzhou Qisheng Precision Manufacturing Recent Developments/Updates
    Table 148. Key Raw Materials Lists
    Table 149. Raw Materials Key Suppliers Lists
    Table 150. Wafer Dicing Saw Blades Distributors List
    Table 151. Wafer Dicing Saw Blades Customers List
    Table 152. Wafer Dicing Saw Blades Market Trends
    Table 153. Wafer Dicing Saw Blades Market Drivers
    Table 154. Wafer Dicing Saw Blades Market Challenges
    Table 155. Wafer Dicing Saw Blades Market Restraints
    Table 156. Research Programs/Design for This Report
    Table 157. Key Data Information from Secondary Sources
    Table 158. Key Data Information from Primary Sources
List of Figures
    Figure 1. Product Picture of Wafer Dicing Saw Blades
    Figure 2. Global Wafer Dicing Saw Blades Market Value by Type, (US$ Million) & (2022 VS 2029)
    Figure 3. Global Wafer Dicing Saw Blades Market Share by Type: 2022 VS 2029
    Figure 4. Hubless Dicing Blades Product Picture
    Figure 5. Hubbed Dicing Blades Product Picture
    Figure 6. Global Wafer Dicing Saw Blades Market Value by Application, (US$ Million) & (2022 VS 2029)
    Figure 7. Global Wafer Dicing Saw Blades Market Share by Application: 2022 VS 2029
    Figure 8. Semiconductor
    Figure 9. LED
    Figure 10. Photovoltaic
    Figure 11. Others
    Figure 12. Global Wafer Dicing Saw Blades Production Value (US$ Million), 2018 VS 2022 VS 2029
    Figure 13. Global Wafer Dicing Saw Blades Production Value (US$ Million) & (2018-2029)
    Figure 14. Global Wafer Dicing Saw Blades Production (K Units) & (2018-2029)
    Figure 15. Global Wafer Dicing Saw Blades Average Price (US$/Unit) & (2018-2029)
    Figure 16. Wafer Dicing Saw Blades Report Years Considered
    Figure 17. Wafer Dicing Saw Blades Production Share by Manufacturers in 2022
    Figure 18. Wafer Dicing Saw Blades Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2018 VS 2022
    Figure 19. The Global 5 and 10 Largest Players: Market Share by Wafer Dicing Saw Blades Revenue in 2022
    Figure 20. Global Wafer Dicing Saw Blades Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
    Figure 21. Global Wafer Dicing Saw Blades Production Value Market Share by Region: 2018 VS 2022 VS 2029
    Figure 22. Global Wafer Dicing Saw Blades Production Comparison by Region: 2018 VS 2022 VS 2029 (K Units)
    Figure 23. Global Wafer Dicing Saw Blades Production Market Share by Region: 2018 VS 2022 VS 2029
    Figure 24. North America Wafer Dicing Saw Blades Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 25. Europe Wafer Dicing Saw Blades Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 26. China Wafer Dicing Saw Blades Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 27. Japan Wafer Dicing Saw Blades Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 28. Global Wafer Dicing Saw Blades Consumption by Region: 2018 VS 2022 VS 2029 (K Units)
    Figure 29. Global Wafer Dicing Saw Blades Consumption Market Share by Region: 2018 VS 2022 VS 2029
    Figure 30. North America Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 31. North America Wafer Dicing Saw Blades Consumption Market Share by Country (2018-2029)
    Figure 32. Canada Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 33. U.S. Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 34. Europe Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 35. Europe Wafer Dicing Saw Blades Consumption Market Share by Country (2018-2029)
    Figure 36. Germany Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 37. France Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 38. U.K. Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 39. Italy Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 40. Russia Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 41. Asia Pacific Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 42. Asia Pacific Wafer Dicing Saw Blades Consumption Market Share by Regions (2018-2029)
    Figure 43. China Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 44. Japan Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 45. South Korea Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 46. China Taiwan Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 47. Southeast Asia Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 48. India Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 49. Latin America, Middle East & Africa Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 50. Latin America, Middle East & Africa Wafer Dicing Saw Blades Consumption Market Share by Country (2018-2029)
    Figure 51. Mexico Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 52. Brazil Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 53. Turkey Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 54. GCC Countries Wafer Dicing Saw Blades Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 55. Global Production Market Share of Wafer Dicing Saw Blades by Type (2018-2029)
    Figure 56. Global Production Value Market Share of Wafer Dicing Saw Blades by Type (2018-2029)
    Figure 57. Global Wafer Dicing Saw Blades Price (US$/Unit) by Type (2018-2029)
    Figure 58. Global Production Market Share of Wafer Dicing Saw Blades by Application (2018-2029)
    Figure 59. Global Production Value Market Share of Wafer Dicing Saw Blades by Application (2018-2029)
    Figure 60. Global Wafer Dicing Saw Blades Price (US$/Unit) by Application (2018-2029)
    Figure 61. Wafer Dicing Saw Blades Value Chain
    Figure 62. Wafer Dicing Saw Blades Production Process
    Figure 63. Channels of Distribution (Direct Vs Distribution)
    Figure 64. Distributors Profiles
    Figure 65. Bottom-up and Top-down Approaches for This Report
    Figure 66. Data Triangulation
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