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Global (United States, European Union and China) 3D IC & 2.5D IC Packaging Market Research Report 2019-2025
Published Date: September 2019
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Report Code: QYRE-Auto-31A154
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Global United States European Union and China 3D IC 2 5D IC Packaging Market Research Report 2019 2025

Global (United States, European Union and China) 3D IC & 2.5D IC Packaging Market Research Report 2019-2025

Code: QYRE-Auto-31A154
Report
September 2019
118 Pages
QYResearch
Region: Global, United States, China, Korea, India, Japan,
Description
Table of Content
Tables & Figures

2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.

3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP).

Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.

In 2019, the market size of 3D IC & 2.5D IC Packaging is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.

In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC & 2.5D IC Packaging.

This report studies the global market size of 3D IC & 2.5D IC Packaging, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).

This study presents the 3D IC & 2.5D IC Packaging production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.

For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

 

In global market, the following companies are covered:

  •     Intel Corporation
  •     Toshiba Corp
  •     Samsung Electronics
  •     Stmicroelectronics
  •     Taiwan Semiconductor Manufacturing
  •     Amkor Technology
  •     United Microelectronics
  •     Broadcom
  •     ASE Group
  •     Pure Storage
  •     Advanced Semiconductor Engineering

 

Market Segment by Product Type

  •     3D TSV
  •     2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

 

Market Segment by Application

  •     Automotive
  •     Consumer electronics
  •     Medical devices
  •     Military & aerospace
  •     Telecommunication
  •     Industrial sector and smart technologies

 

Key Regions split in this report: breakdown data for each region.

  •     United States
  •     China
  •     European Union
  •     Rest of World (Japan, Korea, India and Southeast Asia)

 

The study objectives are:

  •     To analyze and research the 3D IC & 2.5D IC Packaging status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
  •     To present the key 3D IC & 2.5D IC Packaging manufacturers, presenting the sales, revenue, market share, and recent development for key players.
  •     To split the breakdown data by regions, type, companies and applications
  •     To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
  •     To identify significant trends, drivers, influence factors in global and regions
  •     To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

 

In this study, the years considered to estimate the market size of 3D IC & 2.5D IC Packaging are as follows:

    History Year: 2014-2018

    Base Year: 2018

    Estimated Year: 2019

    Forecast Year 2019 to 2025

Table of Contents
 
1 Report Overview
    1.1 Research Scope
    1.2 Major Manufacturers Covered in This Report
    1.3 Market Segment by Type
        1.3.1 Global 3D IC & 2.5D IC Packaging Market Size Growth Rate by Type (2019-2025)
        1.3.2 3D TSV
        1.3.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
    1.4 Market Segment by Application
        1.4.1 Global 3D IC & 2.5D IC Packaging Market Share by Application (2019-2025)
        1.4.2 Automotive
        1.4.3 Consumer electronics
        1.4.4 Medical devices
        1.4.5 Military & aerospace
        1.4.6 Telecommunication
        1.4.7 Industrial sector and smart technologies
    1.5 Study Objectives
    1.6 Years Considered
 
2 Global Growth Trends
    2.1 Production and Capacity Analysis
        2.1.1 Global 3D IC & 2.5D IC Packaging Production Value 2014-2025
        2.1.2 Global 3D IC & 2.5D IC Packaging Production 2014-2025
        2.1.3 Global 3D IC & 2.5D IC Packaging Capacity 2014-2025
        2.1.4 Global 3D IC & 2.5D IC Packaging Marketing Pricing and Trends
    2.2 Key Producers Growth Rate (CAGR) 2019-2025
        2.2.1 Global 3D IC & 2.5D IC Packaging Market Size CAGR of Key Regions
        2.2.2 Global 3D IC & 2.5D IC Packaging Market Share of Key Regions
2.3 Industry Trends
        2.3.1 Market Top Trends
        2.3.2 Market Drivers
 
3 Market Share by Manufacturers
    3.1 Capacity and Production by Manufacturers
        3.1.1 Global 3D IC & 2.5D IC Packaging Capacity by Manufacturers
        3.1.2 Global 3D IC & 2.5D IC Packaging Production by Manufacturers
    3.2 Revenue by Manufacturers
        3.2.1 3D IC & 2.5D IC Packaging Revenue by Manufacturers (2014-2019)
        3.2.2 3D IC & 2.5D IC Packaging Revenue Share by Manufacturers (2014-2019)
        3.2.3 Global 3D IC & 2.5D IC Packaging Market Concentration Ratio (CR5 and HHI)
    3.3 3D IC & 2.5D IC Packaging Price by Manufacturers
    3.4 Key Manufacturers 3D IC & 2.5D IC Packaging Plants/Factories Distribution and Area Served
    3.5 Date of Key Manufacturers Enter into 3D IC & 2.5D IC Packaging Market
    3.6 Key Manufacturers 3D IC & 2.5D IC Packaging Product Offered
    3.7 Mergers & Acquisitions, Expansion Plans
 
4 Market Size by Type
    4.1 Production and Production Value for Each Type
        4.1.1 3D TSV Production and Production Value (2014-2019)
        4.1.2 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Production and Production Value (2014-2019)
    4.2 Global 3D IC & 2.5D IC Packaging Production Market Share by Type
    4.3 Global 3D IC & 2.5D IC Packaging Production Value Market Share by Type
    4.4 3D IC & 2.5D IC Packaging Ex-factory Price by Type
 
5 Market Size by Application
    5.1 Overview
    5.2 Global 3D IC & 2.5D IC Packaging Consumption by Application
 
6 Production by Regions
    6.1 Global 3D IC & 2.5D IC Packaging Production (History Data) by Regions 2014-2019
    6.2 Global 3D IC & 2.5D IC Packaging Production Value (History Data) by Regions
    6.3 United States
        6.3.1 United States 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019
        6.3.2 United States 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019
        6.3.3 Key Players in United States
        6.3.4 United States 3D IC & 2.5D IC Packaging Import & Export
    6.4 European Union
        6.4.1 European Union 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019
        6.4.2 European Union 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019
        6.4.3 Key Players in European Union
        6.4.4 European Union 3D IC & 2.5D IC Packaging Import & Export
    6.5 China
        6.5.1 China 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019
        6.5.2 China 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019
        6.5.3 Key Players in China
        6.5.4 China 3D IC & 2.5D IC Packaging Import & Export
    6.6 Rest of World
        6.6.1 Japan
        6.6.2 Korea
        6.6.3 India
        6.6.4 Southeast Asia
 
7 3D IC & 2.5D IC Packaging Consumption by Regions
    7.1 Global 3D IC & 2.5D IC Packaging Consumption (History Data) by Regions
   7.2 United States
        7.2.1 United States 3D IC & 2.5D IC Packaging Consumption by Type
        7.2.2 United States 3D IC & 2.5D IC Packaging Consumption by Application
    7.3 European Union
        7.3.1 European Union 3D IC & 2.5D IC Packaging Consumption by Type
        7.3.2 European Union 3D IC & 2.5D IC Packaging Consumption by Application
   7.4 China
        7.4.1 China 3D IC & 2.5D IC Packaging Consumption by Type
        7.4.2 China 3D IC & 2.5D IC Packaging Consumption by Application
   7.5 Rest of World
        7.5.1 Rest of World 3D IC & 2.5D IC Packaging Consumption by Type
        7.5.2 Rest of World 3D IC & 2.5D IC Packaging Consumption by Application
        7.5.1 Japan
        7.5.2 Korea
        7.5.3 India
        7.5.4 Southeast Asia
 
8 Company Profiles
    8.1 Intel Corporation
        8.1.1 Intel Corporation Company Details
        8.1.2 Company Description and Business Overview
        8.1.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.1.4 3D IC & 2.5D IC Packaging Product Introduction
        8.1.5 Intel Corporation Recent Development
    8.2 Toshiba Corp
        8.2.1 Toshiba Corp Company Details
        8.2.2 Company Description and Business Overview
        8.2.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.2.4 3D IC & 2.5D IC Packaging Product Introduction
        8.2.5 Toshiba Corp Recent Development
    8.3 Samsung Electronics
        8.3.1 Samsung Electronics Company Details
        8.3.2 Company Description and Business Overview
        8.3.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.3.4 3D IC & 2.5D IC Packaging Product Introduction
        8.3.5 Samsung Electronics Recent Development
    8.4 Stmicroelectronics
        8.4.1 Stmicroelectronics Company Details
        8.4.2 Company Description and Business Overview
        8.4.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.4.4 3D IC & 2.5D IC Packaging Product Introduction
        8.4.5 Stmicroelectronics Recent Development
    8.5 Taiwan Semiconductor Manufacturing
        8.5.1 Taiwan Semiconductor Manufacturing Company Details
        8.5.2 Company Description and Business Overview
        8.5.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.5.4 3D IC & 2.5D IC Packaging Product Introduction
        8.5.5 Taiwan Semiconductor Manufacturing Recent Development
    8.6 Amkor Technology
        8.6.1 Amkor Technology Company Details
        8.6.2 Company Description and Business Overview
        8.6.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.6.4 3D IC & 2.5D IC Packaging Product Introduction
        8.6.5 Amkor Technology Recent Development
    8.7 United Microelectronics
        8.7.1 United Microelectronics Company Details
        8.7.2 Company Description and Business Overview
        8.7.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.7.4 3D IC & 2.5D IC Packaging Product Introduction
        8.7.5 United Microelectronics Recent Development
    8.8 Broadcom
        8.8.1 Broadcom Company Details
        8.8.2 Company Description and Business Overview
        8.8.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.8.4 3D IC & 2.5D IC Packaging Product Introduction
        8.8.5 Broadcom Recent Development
    8.9 ASE Group
        8.9.1 ASE Group Company Details
        8.9.2 Company Description and Business Overview
        8.9.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.9.4 3D IC & 2.5D IC Packaging Product Introduction
        8.9.5 ASE Group Recent Development
    8.10 Pure Storage
        8.10.1 Pure Storage Company Details
        8.10.2 Company Description and Business Overview
        8.10.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.10.4 3D IC & 2.5D IC Packaging Product Introduction
        8.10.5 Pure Storage Recent Development
    8.11 Advanced Semiconductor Engineering
 
9 Market Forecast
    9.1 Global Market Size Forecast
        9.1.1 Global 3D IC & 2.5D IC Packaging Capacity, Production Forecast 2019-2025
        9.1.2 Global 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025
    9.2 Market Forecast by Regions
        9.2.1 Global 3D IC & 2.5D IC Packaging Production and Value Forecast by Regions 2019-2025
        9.2.2 Global 3D IC & 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
    9.3 United States
        9.3.1 Production and Value Forecast in United States
        9.3.2 Consumption Forecast in United States
    9.4 European Union
        9.4.1 Production and Value Forecast in European Union
        9.4.2 Consumption Forecast in European Union
    9.5 China
        9.5.1 Production and Value Forecast in China
        9.5.2 Consumption Forecast in China
    9.6 Rest of World
        9.6.1 Japan
        9.6.2 Korea
        9.6.3 India
        9.6.4 Southeast Asia
    9.7 Forecast by Type
        9.7.1 Global 3D IC & 2.5D IC Packaging Production Forecast by Type
        9.7.2 Global 3D IC & 2.5D IC Packaging Production Value Forecast by Type
    9.8 Consumption Forecast by Application
 
10 Value Chain and Sales Channels Analysis
    10.1 Value Chain Analysis
    10.2 Sales Channels Analysis
        10.2.1 3D IC & 2.5D IC Packaging Sales Channels
        10.2.2 3D IC & 2.5D IC Packaging Distributors
    10.3 3D IC & 2.5D IC Packaging Customers
 
11 Opportunities & Challenges, Threat and Affecting Factors
    11.1 Market Opportunities
    11.2 Market Challenges
    11.3 Porter's Five Forces Analysis
 
12 Key Findings
 
13 Appendix
    13.1 Research Methodology
        13.1.1 Methodology/Research Approach
            13.1.1.1 Research Programs/Design
            13.1.1.2 Market Size Estimation
            13.1.1.3 Market Breakdown and Data Triangulation
        13.1.2 Data Source
            13.1.2.1 Secondary Sources
            13.1.2.2 Primary Sources
    13.2 Author Details
    13.3 Disclaimer
List of Tables and Figures
 
    Figure 3D IC & 2.5D IC Packaging Product Picture
    Table 3D IC & 2.5D IC Packaging Key Market Segments
    Table Major Manufacturers 3D IC & 2.5D IC Packaging Covered in This Report
    Table Global 3D IC & 2.5D IC Packaging Market Size Growth Rate by Type 2019-2025 (K Units) & (Million US$)
    Figure Global 3D IC & 2.5D IC Packaging Sales Market Shar by Type 2014-2025
    Figure 3D TSV Figures
    Table Major Manufacturers of 3D TSV
    Figure 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Figures
    Table Major Manufacturers of 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
    Table Global 3D IC & 2.5D IC Packaging Market Share by Application 2019-2025 (K Units)
    Figure Automotive Use Case
    Figure Consumer electronics Use Case
    Figure Medical devices Use Case
    Figure Military & aerospace Use Case
    Figure Telecommunication Use Case
    Figure Industrial sector and smart technologies Use Case
    Figure 3D IC & 2.5D IC Packaging Report Years Considered
    Figure Global 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2025 (Million US$)
    Figure Global 3D IC & 2.5D IC Packaging Production 2014-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Capacity 2014-2025 (K Units)
    Table Key Manufacturers 3D IC & 2.5D IC Packaging Capacity (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Price 2014-2025 (USD/Unit)
    Table Global 3D IC & 2.5D IC Packaging Market Size of Key Regions (Million USD) & (K Units)
    Table Global 3D IC & 2.5D IC Packaging Growth Rate of Key Regions 2019-2025 (Million USD)
    Table Global 3D IC & 2.5D IC Packaging Market Share for of Regions 2019-2025 (K Units)
    Table Market Top Trends
    Table Global 3D IC & 2.5D IC Packaging Capacity by Manufacturers (2014-2019) (K Units)
    Table Global 3D IC & 2.5D IC Packaging Capacity Market Share by Manufacturers (2014-2019)
    Table Global 3D IC & 2.5D IC Packaging Production by Manufacturers (2014-2019) (K Units)
    Table Global 3D IC & 2.5D IC Packaging Production Share by Manufacturers (2014-2019)
    Figure Global 3D IC & 2.5D IC Packaging Production Share by Manufacturers in 2018
    Table 3D IC & 2.5D IC Packaging Revenue by Manufacturers (2014-2019) (Million USD)
    Table 3D IC & 2.5D IC Packaging Revenue Share by Manufacturers (2014-2019)
    Figure 3D IC & 2.5D IC Packaging Value Share by Manufacturers in 2018
    Table Global 3D IC & 2.5D IC Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)
    Table 3D IC & 2.5D IC Packaging Price by Manufacturers 2014-2019 (USD/Unit)
    Table Key Manufacturers 3D IC & 2.5D IC Packaging Plants/Factories Distribution
    Table Key Manufacturers 3D IC & 2.5D IC Packaging Area Served
    Table Date of Key Manufacturers Enter into 3D IC & 2.5D IC Packaging Market
    Table Key Manufacturers 3D IC & 2.5D IC Packaging Product Type
    Table Mergers & Acquisitions, Expansion Plans
    Table Global 3D TSV Production and Production Value (2014-2019) (K Units) & (Million US$)
    Table Global 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Production and Production Value (2014-2019) (K Units) & (Million US$)
    Table Global 3D IC & 2.5D IC Packaging Production by Type (2014-2019) (K Units)
    Table Global 3D IC & 2.5D IC Packaging Production Share by Type (2014-2019)
    Figure Global 3D IC & 2.5D IC Packaging Production Market Share by Type (2014-2019)
    Figure Global 3D IC & 2.5D IC Packaging Production Market Share by Type in 2018
    Table Global 3D IC & 2.5D IC Packaging Production Value by Type (2014-2019) (Million US$)
    Table Global 3D IC & 2.5D IC Packaging Production Value Share by Type (2014-2019)
    Figure Global 3D IC & 2.5D IC Packaging Production Value Market Share by Type (2014-2019)
    Figure Global 3D IC & 2.5D IC Packaging Production Value Market Share by Type in 2018
    Table 3D IC & 2.5D IC Packaging Ex-factory Price by Type 2014-2019 (USD/Unit)
    Table Global 3D IC & 2.5D IC Packaging Consumption by Application (2014-2019) (K Units)
    Table Global 3D IC & 2.5D IC Packaging Consumption Share by Application (2014-2019)
    Figure Global Consumption 3D IC & 2.5D IC Packaging Market Share by Application (2014-2019)
    Table Global 3D IC & 2.5D IC Packaging Production by Regions 2014-2019 (K Units)
    Table Global 3D IC & 2.5D IC Packaging Production Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Production Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Production Market Share by Regions in 2018
    Table Global 3D IC & 2.5D IC Packaging Production Value by Regions 2014-2019 (Million USD)
    Table Global 3D IC & 2.5D IC Packaging Production Value Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Production Value Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Production Value Market Share by Regions in 2018
    Table United States 3D IC & 2.5D IC Packaging Production and Value 2014-2019 (K Units) & (Million USD)
    Figure United States 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure United States 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Table United States 3D IC & 2.5D IC Packaging Import & Export (K Units)
    Table European Union 3D IC & 2.5D IC Packaging Production and Value 2014-2019 (K Units) & (Million USD)
    Figure European Union 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure European Union 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Table European Union 3D IC & 2.5D IC Packaging Import & Export (K Units)
    Table China 3D IC & 2.5D IC Packaging Production and Value 2014-2019 (K Units) & (Million USD)
    Figure China 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure China 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Table China 3D IC & 2.5D IC Packaging Import & Export (K Units)
    Figure Japan 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure Japan 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Figure Korea 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure Korea 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Figure India 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure India 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Figure Southeast Asia 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure Southeast Asia 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Table Global 3D IC & 2.5D IC Packaging Consumption by Regions 2014-2019 (K Units)
    Table Global 3D IC & 2.5D IC Packaging Consumption Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Consumption Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Consumption Market Share by Regions in 2018
    Figure United States 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Table United States 3D IC & 2.5D IC Packaging Consumption by Type (2014-2019) (K Units)
    Figure United States 3D IC & 2.5D IC Packaging Consumption Market Share by Type in 2019
    Table United States 3D IC & 2.5D IC Packaging Consumption by Application (2014-2019) (K Units)
    Figure United States 3D IC & 2.5D IC Packaging Consumption Market Share by Application in 2019
    Figure European Union 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Table European Union 3D IC & 2.5D IC Packaging Consumption by Type (2014-2019) (K Units)
    Figure European Union 3D IC & 2.5D IC Packaging Consumption Market Share by Type in 2019
    Table European Union 3D IC & 2.5D IC Packaging Consumption by Application (2014-2019) (K Units)
    Figure European Union 3D IC & 2.5D IC Packaging Consumption Market Share by Application in 2019
    Figure China 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Table China 3D IC & 2.5D IC Packaging Consumption by Type (2014-2019) (K Units)
    Figure China 3D IC & 2.5D IC Packaging Consumption Market Share by Type in 2019
    Table China 3D IC & 2.5D IC Packaging Consumption by Application (2014-2019) (K Units)
    Figure China 3D IC & 2.5D IC Packaging Consumption Market Share by Application in 2019
    Figure Rest of World 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Table Rest of World 3D IC & 2.5D IC Packaging Consumption by Type (2014-2019) (K Units)
    Figure Rest of World 3D IC & 2.5D IC Packaging Consumption Market Share by Type in 2019
    Table Rest of World 3D IC & 2.5D IC Packaging Consumption by Application (2014-2019) (K Units)
    Figure Rest of World 3D IC & 2.5D IC Packaging Consumption Market Share by Application in 2019
    Figure Japan 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Figure Korea 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Figure India 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Figure Southeast Asia 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Table Intel Corporation Company Details
    Table Intel Corporation Description and Business Overview
    Table Intel Corporation 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Intel Corporation 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Intel Corporation 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Intel Corporation Recent Development
    Table Toshiba Corp Company Details
    Table Toshiba Corp Description and Business Overview
    Table Toshiba Corp 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Toshiba Corp 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Toshiba Corp 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Toshiba Corp Recent Development
    Table Samsung Electronics Company Details
    Table Samsung Electronics Description and Business Overview
    Table Samsung Electronics 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Samsung Electronics 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Samsung Electronics 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Samsung Electronics Recent Development
    Table Stmicroelectronics Company Details
    Table Stmicroelectronics Description and Business Overview
    Table Stmicroelectronics 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Stmicroelectronics 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Stmicroelectronics 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Stmicroelectronics Recent Development
    Table Taiwan Semiconductor Manufacturing Company Details
    Table Taiwan Semiconductor Manufacturing Description and Business Overview
    Table Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Taiwan Semiconductor Manufacturing Recent Development
    Table Amkor Technology Company Details
    Table Amkor Technology Description and Business Overview
    Table Amkor Technology 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Amkor Technology 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Amkor Technology 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Amkor Technology Recent Development
    Table United Microelectronics Company Details
    Table United Microelectronics Description and Business Overview
    Table United Microelectronics 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table United Microelectronics 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table United Microelectronics 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table United Microelectronics Recent Development
    Table Broadcom Company Details
    Table Broadcom Description and Business Overview
    Table Broadcom 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Broadcom 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Broadcom 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Broadcom Recent Development
    Table ASE Group Company Details
    Table ASE Group Description and Business Overview
    Table ASE Group 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table ASE Group 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table ASE Group 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table ASE Group Recent Development
    Table Pure Storage Company Details
    Table Pure Storage Description and Business Overview
    Table Pure Storage 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Pure Storage 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Pure Storage 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Pure Storage Recent Development
    Table Advanced Semiconductor Engineering Company Details
    Table Global 3D IC & 2.5D IC Packaging Capacity, Production Forecast 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Capacity Forecast 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Production Forecast 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025 (Million US$)
    Table Global 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025 (Million US$)
    Table Global 3D IC & 2.5D IC Packaging Production Forecast by Regions 2019-2025 (K Units)
    Table Global 3D IC & 2.5D IC Packaging Production Market Share Forecast by Regions 2019-2025
    Table Global 3D IC & 2.5D IC Packaging Production Value Forecast by Regions 2019-2025 (Million US$)
    Table Global 3D IC & 2.5D IC Packaging Consumption Forecast by Regions 2019-2025 (K Units)
    Table Global 3D IC & 2.5D IC Packaging Consumption Market Share Forecast by Regions 2019-2025
    Table United States 3D IC & 2.5D IC Packaging Production and Production Value Forecast 2019-2025 (K Units) & (Million US$)
    Figure United States 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Table United States 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025 (Million US$)
    Figure United States 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Table European Union 3D IC & 2.5D IC Packaging Production and Production Value Forecast 2019-2025 (K Units) & (Million US$)
    Figure European Union 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Table European Union 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025 (Million US$)
    Figure European Union 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Table China 3D IC & 2.5D IC Packaging Production and Production Value Forecast 2019-2025 (K Units) & (Million US$)
    Figure China 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Table China 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025 (Million US$)
    Figure China 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Figure Japan 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Figure Japan 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Figure Korea 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Figure Korea 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Figure India 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Figure India 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Figure Southeast Asia 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Figure Southeast Asia 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Table Global 3D IC & 2.5D IC Packaging Production Forecast by Type 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Production Forecast by Type 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Production Market Share Forecast by Type 2019-2025
    Table Global 3D IC & 2.5D IC Packaging Production Value Forecast by Type 2019-2025 (Million US$)
    Figure Global 3D IC & 2.5D IC Packaging Production Value Forecast by Type 2019-2025 (Million US$)
    Figure Global 3D IC & 2.5D IC Packaging Production Value Market Share Forecast by Type 2019-2025
    Table Global 3D IC & 2.5D IC Packaging Consumption Forecast by Application 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Consumption Forecast by Application 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Consumption Market Share Forecast by Application 2019-2025
    Figure 3D IC & 2.5D IC Packaging Value Chain
    Table 3D IC & 2.5D IC Packaging Distributors List
    Table 3D IC & 2.5D IC Packaging Customers List
    Table Porter's Five Forces Analysis
    Table Research Programs/Design for This Report
    Figure Bottom-up and Top-down Approaches for This Report
    Figure Data Triangulation
    Table Key Data Information from Secondary Sources
    Table Key Data Information from Primary Sources

2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.

3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP).

Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.

In 2019, the market size of 3D IC & 2.5D IC Packaging is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.

In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC & 2.5D IC Packaging.

This report studies the global market size of 3D IC & 2.5D IC Packaging, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).

This study presents the 3D IC & 2.5D IC Packaging production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.

For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

 

In global market, the following companies are covered:

  •     Intel Corporation
  •     Toshiba Corp
  •     Samsung Electronics
  •     Stmicroelectronics
  •     Taiwan Semiconductor Manufacturing
  •     Amkor Technology
  •     United Microelectronics
  •     Broadcom
  •     ASE Group
  •     Pure Storage
  •     Advanced Semiconductor Engineering

 

Market Segment by Product Type

  •     3D TSV
  •     2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

 

Market Segment by Application

  •     Automotive
  •     Consumer electronics
  •     Medical devices
  •     Military & aerospace
  •     Telecommunication
  •     Industrial sector and smart technologies

 

Key Regions split in this report: breakdown data for each region.

  •     United States
  •     China
  •     European Union
  •     Rest of World (Japan, Korea, India and Southeast Asia)

 

The study objectives are:

  •     To analyze and research the 3D IC & 2.5D IC Packaging status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
  •     To present the key 3D IC & 2.5D IC Packaging manufacturers, presenting the sales, revenue, market share, and recent development for key players.
  •     To split the breakdown data by regions, type, companies and applications
  •     To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
  •     To identify significant trends, drivers, influence factors in global and regions
  •     To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

 

In this study, the years considered to estimate the market size of 3D IC & 2.5D IC Packaging are as follows:

    History Year: 2014-2018

    Base Year: 2018

    Estimated Year: 2019

    Forecast Year 2019 to 2025

Read More
Table of Contents
 
1 Report Overview
    1.1 Research Scope
    1.2 Major Manufacturers Covered in This Report
    1.3 Market Segment by Type
        1.3.1 Global 3D IC & 2.5D IC Packaging Market Size Growth Rate by Type (2019-2025)
        1.3.2 3D TSV
        1.3.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
    1.4 Market Segment by Application
        1.4.1 Global 3D IC & 2.5D IC Packaging Market Share by Application (2019-2025)
        1.4.2 Automotive
        1.4.3 Consumer electronics
        1.4.4 Medical devices
        1.4.5 Military & aerospace
        1.4.6 Telecommunication
        1.4.7 Industrial sector and smart technologies
    1.5 Study Objectives
    1.6 Years Considered
 
2 Global Growth Trends
    2.1 Production and Capacity Analysis
        2.1.1 Global 3D IC & 2.5D IC Packaging Production Value 2014-2025
        2.1.2 Global 3D IC & 2.5D IC Packaging Production 2014-2025
        2.1.3 Global 3D IC & 2.5D IC Packaging Capacity 2014-2025
        2.1.4 Global 3D IC & 2.5D IC Packaging Marketing Pricing and Trends
    2.2 Key Producers Growth Rate (CAGR) 2019-2025
        2.2.1 Global 3D IC & 2.5D IC Packaging Market Size CAGR of Key Regions
        2.2.2 Global 3D IC & 2.5D IC Packaging Market Share of Key Regions
2.3 Industry Trends
        2.3.1 Market Top Trends
        2.3.2 Market Drivers
 
3 Market Share by Manufacturers
    3.1 Capacity and Production by Manufacturers
        3.1.1 Global 3D IC & 2.5D IC Packaging Capacity by Manufacturers
        3.1.2 Global 3D IC & 2.5D IC Packaging Production by Manufacturers
    3.2 Revenue by Manufacturers
        3.2.1 3D IC & 2.5D IC Packaging Revenue by Manufacturers (2014-2019)
        3.2.2 3D IC & 2.5D IC Packaging Revenue Share by Manufacturers (2014-2019)
        3.2.3 Global 3D IC & 2.5D IC Packaging Market Concentration Ratio (CR5 and HHI)
    3.3 3D IC & 2.5D IC Packaging Price by Manufacturers
    3.4 Key Manufacturers 3D IC & 2.5D IC Packaging Plants/Factories Distribution and Area Served
    3.5 Date of Key Manufacturers Enter into 3D IC & 2.5D IC Packaging Market
    3.6 Key Manufacturers 3D IC & 2.5D IC Packaging Product Offered
    3.7 Mergers & Acquisitions, Expansion Plans
 
4 Market Size by Type
    4.1 Production and Production Value for Each Type
        4.1.1 3D TSV Production and Production Value (2014-2019)
        4.1.2 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Production and Production Value (2014-2019)
    4.2 Global 3D IC & 2.5D IC Packaging Production Market Share by Type
    4.3 Global 3D IC & 2.5D IC Packaging Production Value Market Share by Type
    4.4 3D IC & 2.5D IC Packaging Ex-factory Price by Type
 
5 Market Size by Application
    5.1 Overview
    5.2 Global 3D IC & 2.5D IC Packaging Consumption by Application
 
6 Production by Regions
    6.1 Global 3D IC & 2.5D IC Packaging Production (History Data) by Regions 2014-2019
    6.2 Global 3D IC & 2.5D IC Packaging Production Value (History Data) by Regions
    6.3 United States
        6.3.1 United States 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019
        6.3.2 United States 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019
        6.3.3 Key Players in United States
        6.3.4 United States 3D IC & 2.5D IC Packaging Import & Export
    6.4 European Union
        6.4.1 European Union 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019
        6.4.2 European Union 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019
        6.4.3 Key Players in European Union
        6.4.4 European Union 3D IC & 2.5D IC Packaging Import & Export
    6.5 China
        6.5.1 China 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019
        6.5.2 China 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019
        6.5.3 Key Players in China
        6.5.4 China 3D IC & 2.5D IC Packaging Import & Export
    6.6 Rest of World
        6.6.1 Japan
        6.6.2 Korea
        6.6.3 India
        6.6.4 Southeast Asia
 
7 3D IC & 2.5D IC Packaging Consumption by Regions
    7.1 Global 3D IC & 2.5D IC Packaging Consumption (History Data) by Regions
   7.2 United States
        7.2.1 United States 3D IC & 2.5D IC Packaging Consumption by Type
        7.2.2 United States 3D IC & 2.5D IC Packaging Consumption by Application
    7.3 European Union
        7.3.1 European Union 3D IC & 2.5D IC Packaging Consumption by Type
        7.3.2 European Union 3D IC & 2.5D IC Packaging Consumption by Application
   7.4 China
        7.4.1 China 3D IC & 2.5D IC Packaging Consumption by Type
        7.4.2 China 3D IC & 2.5D IC Packaging Consumption by Application
   7.5 Rest of World
        7.5.1 Rest of World 3D IC & 2.5D IC Packaging Consumption by Type
        7.5.2 Rest of World 3D IC & 2.5D IC Packaging Consumption by Application
        7.5.1 Japan
        7.5.2 Korea
        7.5.3 India
        7.5.4 Southeast Asia
 
8 Company Profiles
    8.1 Intel Corporation
        8.1.1 Intel Corporation Company Details
        8.1.2 Company Description and Business Overview
        8.1.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.1.4 3D IC & 2.5D IC Packaging Product Introduction
        8.1.5 Intel Corporation Recent Development
    8.2 Toshiba Corp
        8.2.1 Toshiba Corp Company Details
        8.2.2 Company Description and Business Overview
        8.2.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.2.4 3D IC & 2.5D IC Packaging Product Introduction
        8.2.5 Toshiba Corp Recent Development
    8.3 Samsung Electronics
        8.3.1 Samsung Electronics Company Details
        8.3.2 Company Description and Business Overview
        8.3.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.3.4 3D IC & 2.5D IC Packaging Product Introduction
        8.3.5 Samsung Electronics Recent Development
    8.4 Stmicroelectronics
        8.4.1 Stmicroelectronics Company Details
        8.4.2 Company Description and Business Overview
        8.4.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.4.4 3D IC & 2.5D IC Packaging Product Introduction
        8.4.5 Stmicroelectronics Recent Development
    8.5 Taiwan Semiconductor Manufacturing
        8.5.1 Taiwan Semiconductor Manufacturing Company Details
        8.5.2 Company Description and Business Overview
        8.5.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.5.4 3D IC & 2.5D IC Packaging Product Introduction
        8.5.5 Taiwan Semiconductor Manufacturing Recent Development
    8.6 Amkor Technology
        8.6.1 Amkor Technology Company Details
        8.6.2 Company Description and Business Overview
        8.6.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.6.4 3D IC & 2.5D IC Packaging Product Introduction
        8.6.5 Amkor Technology Recent Development
    8.7 United Microelectronics
        8.7.1 United Microelectronics Company Details
        8.7.2 Company Description and Business Overview
        8.7.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.7.4 3D IC & 2.5D IC Packaging Product Introduction
        8.7.5 United Microelectronics Recent Development
    8.8 Broadcom
        8.8.1 Broadcom Company Details
        8.8.2 Company Description and Business Overview
        8.8.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.8.4 3D IC & 2.5D IC Packaging Product Introduction
        8.8.5 Broadcom Recent Development
    8.9 ASE Group
        8.9.1 ASE Group Company Details
        8.9.2 Company Description and Business Overview
        8.9.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.9.4 3D IC & 2.5D IC Packaging Product Introduction
        8.9.5 ASE Group Recent Development
    8.10 Pure Storage
        8.10.1 Pure Storage Company Details
        8.10.2 Company Description and Business Overview
        8.10.3 Production and Revenue of 3D IC & 2.5D IC Packaging
        8.10.4 3D IC & 2.5D IC Packaging Product Introduction
        8.10.5 Pure Storage Recent Development
    8.11 Advanced Semiconductor Engineering
 
9 Market Forecast
    9.1 Global Market Size Forecast
        9.1.1 Global 3D IC & 2.5D IC Packaging Capacity, Production Forecast 2019-2025
        9.1.2 Global 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025
    9.2 Market Forecast by Regions
        9.2.1 Global 3D IC & 2.5D IC Packaging Production and Value Forecast by Regions 2019-2025
        9.2.2 Global 3D IC & 2.5D IC Packaging Consumption Forecast by Regions 2019-2025
    9.3 United States
        9.3.1 Production and Value Forecast in United States
        9.3.2 Consumption Forecast in United States
    9.4 European Union
        9.4.1 Production and Value Forecast in European Union
        9.4.2 Consumption Forecast in European Union
    9.5 China
        9.5.1 Production and Value Forecast in China
        9.5.2 Consumption Forecast in China
    9.6 Rest of World
        9.6.1 Japan
        9.6.2 Korea
        9.6.3 India
        9.6.4 Southeast Asia
    9.7 Forecast by Type
        9.7.1 Global 3D IC & 2.5D IC Packaging Production Forecast by Type
        9.7.2 Global 3D IC & 2.5D IC Packaging Production Value Forecast by Type
    9.8 Consumption Forecast by Application
 
10 Value Chain and Sales Channels Analysis
    10.1 Value Chain Analysis
    10.2 Sales Channels Analysis
        10.2.1 3D IC & 2.5D IC Packaging Sales Channels
        10.2.2 3D IC & 2.5D IC Packaging Distributors
    10.3 3D IC & 2.5D IC Packaging Customers
 
11 Opportunities & Challenges, Threat and Affecting Factors
    11.1 Market Opportunities
    11.2 Market Challenges
    11.3 Porter's Five Forces Analysis
 
12 Key Findings
 
13 Appendix
    13.1 Research Methodology
        13.1.1 Methodology/Research Approach
            13.1.1.1 Research Programs/Design
            13.1.1.2 Market Size Estimation
            13.1.1.3 Market Breakdown and Data Triangulation
        13.1.2 Data Source
            13.1.2.1 Secondary Sources
            13.1.2.2 Primary Sources
    13.2 Author Details
    13.3 Disclaimer
Read More
List of Tables and Figures
 
    Figure 3D IC & 2.5D IC Packaging Product Picture
    Table 3D IC & 2.5D IC Packaging Key Market Segments
    Table Major Manufacturers 3D IC & 2.5D IC Packaging Covered in This Report
    Table Global 3D IC & 2.5D IC Packaging Market Size Growth Rate by Type 2019-2025 (K Units) & (Million US$)
    Figure Global 3D IC & 2.5D IC Packaging Sales Market Shar by Type 2014-2025
    Figure 3D TSV Figures
    Table Major Manufacturers of 3D TSV
    Figure 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Figures
    Table Major Manufacturers of 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
    Table Global 3D IC & 2.5D IC Packaging Market Share by Application 2019-2025 (K Units)
    Figure Automotive Use Case
    Figure Consumer electronics Use Case
    Figure Medical devices Use Case
    Figure Military & aerospace Use Case
    Figure Telecommunication Use Case
    Figure Industrial sector and smart technologies Use Case
    Figure 3D IC & 2.5D IC Packaging Report Years Considered
    Figure Global 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2025 (Million US$)
    Figure Global 3D IC & 2.5D IC Packaging Production 2014-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Capacity 2014-2025 (K Units)
    Table Key Manufacturers 3D IC & 2.5D IC Packaging Capacity (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Price 2014-2025 (USD/Unit)
    Table Global 3D IC & 2.5D IC Packaging Market Size of Key Regions (Million USD) & (K Units)
    Table Global 3D IC & 2.5D IC Packaging Growth Rate of Key Regions 2019-2025 (Million USD)
    Table Global 3D IC & 2.5D IC Packaging Market Share for of Regions 2019-2025 (K Units)
    Table Market Top Trends
    Table Global 3D IC & 2.5D IC Packaging Capacity by Manufacturers (2014-2019) (K Units)
    Table Global 3D IC & 2.5D IC Packaging Capacity Market Share by Manufacturers (2014-2019)
    Table Global 3D IC & 2.5D IC Packaging Production by Manufacturers (2014-2019) (K Units)
    Table Global 3D IC & 2.5D IC Packaging Production Share by Manufacturers (2014-2019)
    Figure Global 3D IC & 2.5D IC Packaging Production Share by Manufacturers in 2018
    Table 3D IC & 2.5D IC Packaging Revenue by Manufacturers (2014-2019) (Million USD)
    Table 3D IC & 2.5D IC Packaging Revenue Share by Manufacturers (2014-2019)
    Figure 3D IC & 2.5D IC Packaging Value Share by Manufacturers in 2018
    Table Global 3D IC & 2.5D IC Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)
    Table 3D IC & 2.5D IC Packaging Price by Manufacturers 2014-2019 (USD/Unit)
    Table Key Manufacturers 3D IC & 2.5D IC Packaging Plants/Factories Distribution
    Table Key Manufacturers 3D IC & 2.5D IC Packaging Area Served
    Table Date of Key Manufacturers Enter into 3D IC & 2.5D IC Packaging Market
    Table Key Manufacturers 3D IC & 2.5D IC Packaging Product Type
    Table Mergers & Acquisitions, Expansion Plans
    Table Global 3D TSV Production and Production Value (2014-2019) (K Units) & (Million US$)
    Table Global 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP) Production and Production Value (2014-2019) (K Units) & (Million US$)
    Table Global 3D IC & 2.5D IC Packaging Production by Type (2014-2019) (K Units)
    Table Global 3D IC & 2.5D IC Packaging Production Share by Type (2014-2019)
    Figure Global 3D IC & 2.5D IC Packaging Production Market Share by Type (2014-2019)
    Figure Global 3D IC & 2.5D IC Packaging Production Market Share by Type in 2018
    Table Global 3D IC & 2.5D IC Packaging Production Value by Type (2014-2019) (Million US$)
    Table Global 3D IC & 2.5D IC Packaging Production Value Share by Type (2014-2019)
    Figure Global 3D IC & 2.5D IC Packaging Production Value Market Share by Type (2014-2019)
    Figure Global 3D IC & 2.5D IC Packaging Production Value Market Share by Type in 2018
    Table 3D IC & 2.5D IC Packaging Ex-factory Price by Type 2014-2019 (USD/Unit)
    Table Global 3D IC & 2.5D IC Packaging Consumption by Application (2014-2019) (K Units)
    Table Global 3D IC & 2.5D IC Packaging Consumption Share by Application (2014-2019)
    Figure Global Consumption 3D IC & 2.5D IC Packaging Market Share by Application (2014-2019)
    Table Global 3D IC & 2.5D IC Packaging Production by Regions 2014-2019 (K Units)
    Table Global 3D IC & 2.5D IC Packaging Production Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Production Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Production Market Share by Regions in 2018
    Table Global 3D IC & 2.5D IC Packaging Production Value by Regions 2014-2019 (Million USD)
    Table Global 3D IC & 2.5D IC Packaging Production Value Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Production Value Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Production Value Market Share by Regions in 2018
    Table United States 3D IC & 2.5D IC Packaging Production and Value 2014-2019 (K Units) & (Million USD)
    Figure United States 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure United States 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Table United States 3D IC & 2.5D IC Packaging Import & Export (K Units)
    Table European Union 3D IC & 2.5D IC Packaging Production and Value 2014-2019 (K Units) & (Million USD)
    Figure European Union 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure European Union 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Table European Union 3D IC & 2.5D IC Packaging Import & Export (K Units)
    Table China 3D IC & 2.5D IC Packaging Production and Value 2014-2019 (K Units) & (Million USD)
    Figure China 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure China 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Table China 3D IC & 2.5D IC Packaging Import & Export (K Units)
    Figure Japan 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure Japan 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Figure Korea 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure Korea 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Figure India 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure India 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Figure Southeast Asia 3D IC & 2.5D IC Packaging Production Growth Rate 2014-2019 (K Units)
    Figure Southeast Asia 3D IC & 2.5D IC Packaging Production Value Growth Rate 2014-2019 (Million USD)
    Table Global 3D IC & 2.5D IC Packaging Consumption by Regions 2014-2019 (K Units)
    Table Global 3D IC & 2.5D IC Packaging Consumption Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Consumption Market Share by Regions 2014-2019
    Figure Global 3D IC & 2.5D IC Packaging Consumption Market Share by Regions in 2018
    Figure United States 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Table United States 3D IC & 2.5D IC Packaging Consumption by Type (2014-2019) (K Units)
    Figure United States 3D IC & 2.5D IC Packaging Consumption Market Share by Type in 2019
    Table United States 3D IC & 2.5D IC Packaging Consumption by Application (2014-2019) (K Units)
    Figure United States 3D IC & 2.5D IC Packaging Consumption Market Share by Application in 2019
    Figure European Union 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Table European Union 3D IC & 2.5D IC Packaging Consumption by Type (2014-2019) (K Units)
    Figure European Union 3D IC & 2.5D IC Packaging Consumption Market Share by Type in 2019
    Table European Union 3D IC & 2.5D IC Packaging Consumption by Application (2014-2019) (K Units)
    Figure European Union 3D IC & 2.5D IC Packaging Consumption Market Share by Application in 2019
    Figure China 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Table China 3D IC & 2.5D IC Packaging Consumption by Type (2014-2019) (K Units)
    Figure China 3D IC & 2.5D IC Packaging Consumption Market Share by Type in 2019
    Table China 3D IC & 2.5D IC Packaging Consumption by Application (2014-2019) (K Units)
    Figure China 3D IC & 2.5D IC Packaging Consumption Market Share by Application in 2019
    Figure Rest of World 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Table Rest of World 3D IC & 2.5D IC Packaging Consumption by Type (2014-2019) (K Units)
    Figure Rest of World 3D IC & 2.5D IC Packaging Consumption Market Share by Type in 2019
    Table Rest of World 3D IC & 2.5D IC Packaging Consumption by Application (2014-2019) (K Units)
    Figure Rest of World 3D IC & 2.5D IC Packaging Consumption Market Share by Application in 2019
    Figure Japan 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Figure Korea 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Figure India 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Figure Southeast Asia 3D IC & 2.5D IC Packaging Consumption Growth Rate (2014-2019) (K Units)
    Table Intel Corporation Company Details
    Table Intel Corporation Description and Business Overview
    Table Intel Corporation 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Intel Corporation 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Intel Corporation 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Intel Corporation Recent Development
    Table Toshiba Corp Company Details
    Table Toshiba Corp Description and Business Overview
    Table Toshiba Corp 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Toshiba Corp 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Toshiba Corp 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Toshiba Corp Recent Development
    Table Samsung Electronics Company Details
    Table Samsung Electronics Description and Business Overview
    Table Samsung Electronics 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Samsung Electronics 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Samsung Electronics 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Samsung Electronics Recent Development
    Table Stmicroelectronics Company Details
    Table Stmicroelectronics Description and Business Overview
    Table Stmicroelectronics 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Stmicroelectronics 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Stmicroelectronics 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Stmicroelectronics Recent Development
    Table Taiwan Semiconductor Manufacturing Company Details
    Table Taiwan Semiconductor Manufacturing Description and Business Overview
    Table Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Taiwan Semiconductor Manufacturing Recent Development
    Table Amkor Technology Company Details
    Table Amkor Technology Description and Business Overview
    Table Amkor Technology 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Amkor Technology 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Amkor Technology 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Amkor Technology Recent Development
    Table United Microelectronics Company Details
    Table United Microelectronics Description and Business Overview
    Table United Microelectronics 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table United Microelectronics 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table United Microelectronics 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table United Microelectronics Recent Development
    Table Broadcom Company Details
    Table Broadcom Description and Business Overview
    Table Broadcom 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Broadcom 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Broadcom 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Broadcom Recent Development
    Table ASE Group Company Details
    Table ASE Group Description and Business Overview
    Table ASE Group 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table ASE Group 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table ASE Group 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table ASE Group Recent Development
    Table Pure Storage Company Details
    Table Pure Storage Description and Business Overview
    Table Pure Storage 3D IC & 2.5D IC Packaging Production (K Units), Revenue (Million US$), Price (USD/Unit) and Gross Margin (2014-2019)
    Table Pure Storage 3D IC & 2.5D IC Packaging Production Growth Rate (2014-2019)
    Table Pure Storage 3D IC & 2.5D IC Packaging Production Market Share in Global Market
    Table Pure Storage Recent Development
    Table Advanced Semiconductor Engineering Company Details
    Table Global 3D IC & 2.5D IC Packaging Capacity, Production Forecast 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Capacity Forecast 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Production Forecast 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025 (Million US$)
    Table Global 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025 (Million US$)
    Table Global 3D IC & 2.5D IC Packaging Production Forecast by Regions 2019-2025 (K Units)
    Table Global 3D IC & 2.5D IC Packaging Production Market Share Forecast by Regions 2019-2025
    Table Global 3D IC & 2.5D IC Packaging Production Value Forecast by Regions 2019-2025 (Million US$)
    Table Global 3D IC & 2.5D IC Packaging Consumption Forecast by Regions 2019-2025 (K Units)
    Table Global 3D IC & 2.5D IC Packaging Consumption Market Share Forecast by Regions 2019-2025
    Table United States 3D IC & 2.5D IC Packaging Production and Production Value Forecast 2019-2025 (K Units) & (Million US$)
    Figure United States 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Table United States 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025 (Million US$)
    Figure United States 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Table European Union 3D IC & 2.5D IC Packaging Production and Production Value Forecast 2019-2025 (K Units) & (Million US$)
    Figure European Union 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Table European Union 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025 (Million US$)
    Figure European Union 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Table China 3D IC & 2.5D IC Packaging Production and Production Value Forecast 2019-2025 (K Units) & (Million US$)
    Figure China 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Table China 3D IC & 2.5D IC Packaging Production Value Forecast 2019-2025 (Million US$)
    Figure China 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Figure Japan 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Figure Japan 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Figure Korea 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Figure Korea 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Figure India 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Figure India 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Figure Southeast Asia 3D IC & 2.5D IC Packaging Production Growth Forecast 2019-2025 (K Units)
    Figure Southeast Asia 3D IC & 2.5D IC Packaging Consumption Forecast 2019-2025 (K Units)
    Table Global 3D IC & 2.5D IC Packaging Production Forecast by Type 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Production Forecast by Type 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Production Market Share Forecast by Type 2019-2025
    Table Global 3D IC & 2.5D IC Packaging Production Value Forecast by Type 2019-2025 (Million US$)
    Figure Global 3D IC & 2.5D IC Packaging Production Value Forecast by Type 2019-2025 (Million US$)
    Figure Global 3D IC & 2.5D IC Packaging Production Value Market Share Forecast by Type 2019-2025
    Table Global 3D IC & 2.5D IC Packaging Consumption Forecast by Application 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Consumption Forecast by Application 2019-2025 (K Units)
    Figure Global 3D IC & 2.5D IC Packaging Consumption Market Share Forecast by Application 2019-2025
    Figure 3D IC & 2.5D IC Packaging Value Chain
    Table 3D IC & 2.5D IC Packaging Distributors List
    Table 3D IC & 2.5D IC Packaging Customers List
    Table Porter's Five Forces Analysis
    Table Research Programs/Design for This Report
    Figure Bottom-up and Top-down Approaches for This Report
    Figure Data Triangulation
    Table Key Data Information from Secondary Sources
    Table Key Data Information from Primary Sources
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