The global market for Semiconductor Packaging and Assembly Services was valued at US$ 10240 million in the year 2024 and is projected to reach a revised size of US$ 18410 million by 2031, growing at a CAGR of 10.2% during the forecast period.

Semiconductor Packaging and Assembly Services Market

Semiconductor packaging and assembly services refer to a series of processes and services that involve assembling semiconductor chips onto packaging substrates, encapsulating them with packaging shells, and connecting them to external circuits. Packaging mainly protects chips, provides electrical connections, and dissipates heat, while assembly combines packaged chips with other electronic components into a complete circuit or system.

North American market for Semiconductor Packaging and Assembly Services is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

Asia-Pacific market for Semiconductor Packaging and Assembly Services is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

The global market for Semiconductor Packaging and Assembly Services in Consumer Electronics is estimated to increase from $ million in 2024 to $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

The major global companies of Semiconductor Packaging and Assembly Services include Alter Technology TUV NORD, Microchip Technology, Intech Technologies, QP Technologies, Amkor Technology, ASE Holdings, Integra Technologies, Yole Group, ASMPT, StratEdge Corporation, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging and Assembly Services, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging and Assembly Services.

The Semiconductor Packaging and Assembly Services market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Semiconductor Packaging and Assembly Services market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Semiconductor Packaging and Assembly Services companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Semiconductor Packaging and Assembly Services Market Report

Report Metric	Details
Report Name	Semiconductor Packaging and Assembly Services Market
Accounted market size in year	US$ 10240 million
Forecasted market size in 2031	US$ 18410 million
CAGR	10.2%
Base Year	year
Forecasted years	2025 - 2031
Segment by Type	First Level Second Level Third Level Fourth Level
Segment by Application	Consumer Electronics Communication Equipment Automotive Electronics Aerospace Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Alter Technology TUV NORD, Microchip Technology, Intech Technologies, QP Technologies, Amkor Technology, ASE Holdings, Integra Technologies, Yole Group, ASMPT, StratEdge Corporation, Engent, Criteria Labs, AmTECH Micro electronics, IBE Electronics, OSAT, CSIS
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Packaging and Assembly Services company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Semiconductor Packaging and Assembly Services Market growing?

Ans: The Semiconductor Packaging and Assembly Services Market witnessing a CAGR of 10.2% during the forecast period 2025-2031.

What is the Semiconductor Packaging and Assembly Services Market size in 2031?

Ans: The Semiconductor Packaging and Assembly Services Market size in 2031 will be US$ 18410 million.

Who are the main players in the Semiconductor Packaging and Assembly Services Market report?

Ans: The main players in the Semiconductor Packaging and Assembly Services Market are Alter Technology TUV NORD, Microchip Technology, Intech Technologies, QP Technologies, Amkor Technology, ASE Holdings, Integra Technologies, Yole Group, ASMPT, StratEdge Corporation, Engent, Criteria Labs, AmTECH Micro electronics, IBE Electronics, OSAT, CSIS

What are the Application segmentation covered in the Semiconductor Packaging and Assembly Services Market report?

Ans: The Applications covered in the Semiconductor Packaging and Assembly Services Market report are Consumer Electronics, Communication Equipment, Automotive Electronics, Aerospace, Others

What are the Type segmentation covered in the Semiconductor Packaging and Assembly Services Market report?

Ans: The Types covered in the Semiconductor Packaging and Assembly Services Market report are First Level, Second Level, Third Level, Fourth Level

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Semiconductor Packaging and Assembly Services Market Size Growth Rate by Type: 2020 VS 2024 VS 2031

1.2.2 First Level

1.2.3 Second Level

1.2.4 Third Level

1.2.5 Fourth Level

1.3 Market by Application

1.3.1 Global Semiconductor Packaging and Assembly Services Market Growth by Application: 2020 VS 2024 VS 2031

1.3.2 Consumer Electronics

1.3.3 Communication Equipment

1.3.4 Automotive Electronics

1.3.5 Aerospace

1.3.6 Others

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global Semiconductor Packaging and Assembly Services Market Perspective (2020-2031)

2.2 Global Semiconductor Packaging and Assembly Services Growth Trends by Region

2.2.1 Global Semiconductor Packaging and Assembly Services Market Size by Region: 2020 VS 2024 VS 2031

2.2.2 Semiconductor Packaging and Assembly Services Historic Market Size by Region (2020-2025)

2.2.3 Semiconductor Packaging and Assembly Services Forecasted Market Size by Region (2026-2031)

2.3 Semiconductor Packaging and Assembly Services Market Dynamics

2.3.1 Semiconductor Packaging and Assembly Services Industry Trends

2.3.2 Semiconductor Packaging and Assembly Services Market Drivers

2.3.3 Semiconductor Packaging and Assembly Services Market Challenges

2.3.4 Semiconductor Packaging and Assembly Services Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Semiconductor Packaging and Assembly Services Players by Revenue

3.1.1 Global Top Semiconductor Packaging and Assembly Services Players by Revenue (2020-2025)

3.1.2 Global Semiconductor Packaging and Assembly Services Revenue Market Share by Players (2020-2025)

3.2 Global Top Semiconductor Packaging and Assembly Services Players by Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by Semiconductor Packaging and Assembly Services Revenue

3.4 Global Semiconductor Packaging and Assembly Services Market Concentration Ratio

3.4.1 Global Semiconductor Packaging and Assembly Services Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Semiconductor Packaging and Assembly Services Revenue in 2024

3.5 Global Key Players of Semiconductor Packaging and Assembly Services Head office and Area Served

3.6 Global Key Players of Semiconductor Packaging and Assembly Services, Product and Application

3.7 Global Key Players of Semiconductor Packaging and Assembly Services, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 Semiconductor Packaging and Assembly Services Breakdown Data by Type

4.1 Global Semiconductor Packaging and Assembly Services Historic Market Size by Type (2020-2025)

4.2 Global Semiconductor Packaging and Assembly Services Forecasted Market Size by Type (2026-2031)

5 Semiconductor Packaging and Assembly Services Breakdown Data by Application

5.1 Global Semiconductor Packaging and Assembly Services Historic Market Size by Application (2020-2025)

5.2 Global Semiconductor Packaging and Assembly Services Forecasted Market Size by Application (2026-2031)

6 North America

6.1 North America Semiconductor Packaging and Assembly Services Market Size (2020-2031)

6.2 North America Semiconductor Packaging and Assembly Services Market Growth Rate by Country: 2020 VS 2024 VS 2031

6.3 North America Semiconductor Packaging and Assembly Services Market Size by Country (2020-2025)

6.4 North America Semiconductor Packaging and Assembly Services Market Size by Country (2026-2031)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Semiconductor Packaging and Assembly Services Market Size (2020-2031)

7.2 Europe Semiconductor Packaging and Assembly Services Market Growth Rate by Country: 2020 VS 2024 VS 2031

7.3 Europe Semiconductor Packaging and Assembly Services Market Size by Country (2020-2025)

7.4 Europe Semiconductor Packaging and Assembly Services Market Size by Country (2026-2031)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Semiconductor Packaging and Assembly Services Market Size (2020-2031)

8.2 Asia-Pacific Semiconductor Packaging and Assembly Services Market Growth Rate by Region: 2020 VS 2024 VS 2031

8.3 Asia-Pacific Semiconductor Packaging and Assembly Services Market Size by Region (2020-2025)

8.4 Asia-Pacific Semiconductor Packaging and Assembly Services Market Size by Region (2026-2031)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Semiconductor Packaging and Assembly Services Market Size (2020-2031)

9.2 Latin America Semiconductor Packaging and Assembly Services Market Growth Rate by Country: 2020 VS 2024 VS 2031

9.3 Latin America Semiconductor Packaging and Assembly Services Market Size by Country (2020-2025)

9.4 Latin America Semiconductor Packaging and Assembly Services Market Size by Country (2026-2031)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Semiconductor Packaging and Assembly Services Market Size (2020-2031)

10.2 Middle East & Africa Semiconductor Packaging and Assembly Services Market Growth Rate by Country: 2020 VS 2024 VS 2031

10.3 Middle East & Africa Semiconductor Packaging and Assembly Services Market Size by Country (2020-2025)

10.4 Middle East & Africa Semiconductor Packaging and Assembly Services Market Size by Country (2026-2031)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 Alter Technology TUV NORD

11.1.1 Alter Technology TUV NORD Company Details

11.1.2 Alter Technology TUV NORD Business Overview

11.1.3 Alter Technology TUV NORD Semiconductor Packaging and Assembly Services Introduction

11.1.4 Alter Technology TUV NORD Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.1.5 Alter Technology TUV NORD Recent Development

11.2 Microchip Technology

11.2.1 Microchip Technology Company Details

11.2.2 Microchip Technology Business Overview

11.2.3 Microchip Technology Semiconductor Packaging and Assembly Services Introduction

11.2.4 Microchip Technology Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.2.5 Microchip Technology Recent Development

11.3 Intech Technologies

11.3.1 Intech Technologies Company Details

11.3.2 Intech Technologies Business Overview

11.3.3 Intech Technologies Semiconductor Packaging and Assembly Services Introduction

11.3.4 Intech Technologies Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.3.5 Intech Technologies Recent Development

11.4 QP Technologies

11.4.1 QP Technologies Company Details

11.4.2 QP Technologies Business Overview

11.4.3 QP Technologies Semiconductor Packaging and Assembly Services Introduction

11.4.4 QP Technologies Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.4.5 QP Technologies Recent Development

11.5 Amkor Technology

11.5.1 Amkor Technology Company Details

11.5.2 Amkor Technology Business Overview

11.5.3 Amkor Technology Semiconductor Packaging and Assembly Services Introduction

11.5.4 Amkor Technology Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.5.5 Amkor Technology Recent Development

11.6 ASE Holdings

11.6.1 ASE Holdings Company Details

11.6.2 ASE Holdings Business Overview

11.6.3 ASE Holdings Semiconductor Packaging and Assembly Services Introduction

11.6.4 ASE Holdings Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.6.5 ASE Holdings Recent Development

11.7 Integra Technologies

11.7.1 Integra Technologies Company Details

11.7.2 Integra Technologies Business Overview

11.7.3 Integra Technologies Semiconductor Packaging and Assembly Services Introduction

11.7.4 Integra Technologies Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.7.5 Integra Technologies Recent Development

11.8 Yole Group

11.8.1 Yole Group Company Details

11.8.2 Yole Group Business Overview

11.8.3 Yole Group Semiconductor Packaging and Assembly Services Introduction

11.8.4 Yole Group Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.8.5 Yole Group Recent Development

11.9 ASMPT

11.9.1 ASMPT Company Details

11.9.2 ASMPT Business Overview

11.9.3 ASMPT Semiconductor Packaging and Assembly Services Introduction

11.9.4 ASMPT Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.9.5 ASMPT Recent Development

11.10 StratEdge Corporation

11.10.1 StratEdge Corporation Company Details

11.10.2 StratEdge Corporation Business Overview

11.10.3 StratEdge Corporation Semiconductor Packaging and Assembly Services Introduction

11.10.4 StratEdge Corporation Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.10.5 StratEdge Corporation Recent Development

11.11 Engent

11.11.1 Engent Company Details

11.11.2 Engent Business Overview

11.11.3 Engent Semiconductor Packaging and Assembly Services Introduction

11.11.4 Engent Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.11.5 Engent Recent Development

11.12 Criteria Labs

11.12.1 Criteria Labs Company Details

11.12.2 Criteria Labs Business Overview

11.12.3 Criteria Labs Semiconductor Packaging and Assembly Services Introduction

11.12.4 Criteria Labs Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.12.5 Criteria Labs Recent Development

11.13 AmTECH Micro electronics

11.13.1 AmTECH Micro electronics Company Details

11.13.2 AmTECH Micro electronics Business Overview

11.13.3 AmTECH Micro electronics Semiconductor Packaging and Assembly Services Introduction

11.13.4 AmTECH Micro electronics Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.13.5 AmTECH Micro electronics Recent Development

11.14 IBE Electronics

11.14.1 IBE Electronics Company Details

11.14.2 IBE Electronics Business Overview

11.14.3 IBE Electronics Semiconductor Packaging and Assembly Services Introduction

11.14.4 IBE Electronics Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.14.5 IBE Electronics Recent Development

11.15 OSAT

11.15.1 OSAT Company Details

11.15.2 OSAT Business Overview

11.15.3 OSAT Semiconductor Packaging and Assembly Services Introduction

11.15.4 OSAT Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.15.5 OSAT Recent Development

11.16 CSIS

11.16.1 CSIS Company Details

11.16.2 CSIS Business Overview

11.16.3 CSIS Semiconductor Packaging and Assembly Services Introduction

11.16.4 CSIS Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025)

11.16.5 CSIS Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

StratEdge Corporation

Criteria Labs

IBE Electronics

CSIS

Alter Technology TUV NORD

Engent

AmTECH Micro electronics

OSAT

List of Tables

Table 1. Global Semiconductor Packaging and Assembly Services Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031

Table 2. Key Players of First Level

Table 3. Key Players of Second Level

Table 4. Key Players of Third Level

Table 5. Key Players of Fourth Level

Table 6. Global Semiconductor Packaging and Assembly Services Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031

Table 7. Global Semiconductor Packaging and Assembly Services Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Table 8. Global Semiconductor Packaging and Assembly Services Market Size by Region (2020-2025) & (US$ Million)

Table 9. Global Semiconductor Packaging and Assembly Services Market Share by Region (2020-2025)

Table 10. Global Semiconductor Packaging and Assembly Services Forecasted Market Size by Region (2026-2031) & (US$ Million)

Table 11. Global Semiconductor Packaging and Assembly Services Market Share by Region (2026-2031)

Table 12. Semiconductor Packaging and Assembly Services Market Trends

Table 13. Semiconductor Packaging and Assembly Services Market Drivers

Table 14. Semiconductor Packaging and Assembly Services Market Challenges

Table 15. Semiconductor Packaging and Assembly Services Market Restraints

Table 16. Global Semiconductor Packaging and Assembly Services Revenue by Players (2020-2025) & (US$ Million)

Table 17. Global Semiconductor Packaging and Assembly Services Market Share by Players (2020-2025)

Table 18. Global Top Semiconductor Packaging and Assembly Services Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Packaging and Assembly Services as of 2024)

Table 19. Ranking of Global Top Semiconductor Packaging and Assembly Services Companies by Revenue (US$ Million) in 2024

Table 20. Global 5 Largest Players Market Share by Semiconductor Packaging and Assembly Services Revenue (CR5 and HHI) & (2020-2025)

Table 21. Global Key Players of Semiconductor Packaging and Assembly Services, Headquarters and Area Served

Table 22. Global Key Players of Semiconductor Packaging and Assembly Services, Product and Application

Table 23. Global Key Players of Semiconductor Packaging and Assembly Services, Date of Enter into This Industry

Table 24. Mergers & Acquisitions, Expansion Plans

Table 25. Global Semiconductor Packaging and Assembly Services Market Size by Type (2020-2025) & (US$ Million)

Table 26. Global Semiconductor Packaging and Assembly Services Revenue Market Share by Type (2020-2025)

Table 27. Global Semiconductor Packaging and Assembly Services Forecasted Market Size by Type (2026-2031) & (US$ Million)

Table 28. Global Semiconductor Packaging and Assembly Services Revenue Market Share by Type (2026-2031)

Table 29. Global Semiconductor Packaging and Assembly Services Market Size by Application (2020-2025) & (US$ Million)

Table 30. Global Semiconductor Packaging and Assembly Services Revenue Market Share by Application (2020-2025)

Table 31. Global Semiconductor Packaging and Assembly Services Forecasted Market Size by Application (2026-2031) & (US$ Million)

Table 32. Global Semiconductor Packaging and Assembly Services Revenue Market Share by Application (2026-2031)

Table 33. North America Semiconductor Packaging and Assembly Services Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 34. North America Semiconductor Packaging and Assembly Services Market Size by Country (2020-2025) & (US$ Million)

Table 35. North America Semiconductor Packaging and Assembly Services Market Size by Country (2026-2031) & (US$ Million)

Table 36. Europe Semiconductor Packaging and Assembly Services Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 37. Europe Semiconductor Packaging and Assembly Services Market Size by Country (2020-2025) & (US$ Million)

Table 38. Europe Semiconductor Packaging and Assembly Services Market Size by Country (2026-2031) & (US$ Million)

Table 39. Asia-Pacific Semiconductor Packaging and Assembly Services Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031

Table 40. Asia-Pacific Semiconductor Packaging and Assembly Services Market Size by Region (2020-2025) & (US$ Million)

Table 41. Asia-Pacific Semiconductor Packaging and Assembly Services Market Size by Region (2026-2031) & (US$ Million)

Table 42. Latin America Semiconductor Packaging and Assembly Services Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 43. Latin America Semiconductor Packaging and Assembly Services Market Size by Country (2020-2025) & (US$ Million)

Table 44. Latin America Semiconductor Packaging and Assembly Services Market Size by Country (2026-2031) & (US$ Million)

Table 45. Middle East & Africa Semiconductor Packaging and Assembly Services Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 46. Middle East & Africa Semiconductor Packaging and Assembly Services Market Size by Country (2020-2025) & (US$ Million)

Table 47. Middle East & Africa Semiconductor Packaging and Assembly Services Market Size by Country (2026-2031) & (US$ Million)

Table 48. Alter Technology TUV NORD Company Details

Table 49. Alter Technology TUV NORD Business Overview

Table 50. Alter Technology TUV NORD Semiconductor Packaging and Assembly Services Product

Table 51. Alter Technology TUV NORD Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 52. Alter Technology TUV NORD Recent Development

Table 53. Microchip Technology Company Details

Table 54. Microchip Technology Business Overview

Table 55. Microchip Technology Semiconductor Packaging and Assembly Services Product

Table 56. Microchip Technology Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 57. Microchip Technology Recent Development

Table 58. Intech Technologies Company Details

Table 59. Intech Technologies Business Overview

Table 60. Intech Technologies Semiconductor Packaging and Assembly Services Product

Table 61. Intech Technologies Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 62. Intech Technologies Recent Development

Table 63. QP Technologies Company Details

Table 64. QP Technologies Business Overview

Table 65. QP Technologies Semiconductor Packaging and Assembly Services Product

Table 66. QP Technologies Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 67. QP Technologies Recent Development

Table 68. Amkor Technology Company Details

Table 69. Amkor Technology Business Overview

Table 70. Amkor Technology Semiconductor Packaging and Assembly Services Product

Table 71. Amkor Technology Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 72. Amkor Technology Recent Development

Table 73. ASE Holdings Company Details

Table 74. ASE Holdings Business Overview

Table 75. ASE Holdings Semiconductor Packaging and Assembly Services Product

Table 76. ASE Holdings Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 77. ASE Holdings Recent Development

Table 78. Integra Technologies Company Details

Table 79. Integra Technologies Business Overview

Table 80. Integra Technologies Semiconductor Packaging and Assembly Services Product

Table 81. Integra Technologies Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 82. Integra Technologies Recent Development

Table 83. Yole Group Company Details

Table 84. Yole Group Business Overview

Table 85. Yole Group Semiconductor Packaging and Assembly Services Product

Table 86. Yole Group Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 87. Yole Group Recent Development

Table 88. ASMPT Company Details

Table 89. ASMPT Business Overview

Table 90. ASMPT Semiconductor Packaging and Assembly Services Product

Table 91. ASMPT Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 92. ASMPT Recent Development

Table 93. StratEdge Corporation Company Details

Table 94. StratEdge Corporation Business Overview

Table 95. StratEdge Corporation Semiconductor Packaging and Assembly Services Product

Table 96. StratEdge Corporation Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 97. StratEdge Corporation Recent Development

Table 98. Engent Company Details

Table 99. Engent Business Overview

Table 100. Engent Semiconductor Packaging and Assembly Services Product

Table 101. Engent Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 102. Engent Recent Development

Table 103. Criteria Labs Company Details

Table 104. Criteria Labs Business Overview

Table 105. Criteria Labs Semiconductor Packaging and Assembly Services Product

Table 106. Criteria Labs Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 107. Criteria Labs Recent Development

Table 108. AmTECH Micro electronics Company Details

Table 109. AmTECH Micro electronics Business Overview

Table 110. AmTECH Micro electronics Semiconductor Packaging and Assembly Services Product

Table 111. AmTECH Micro electronics Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 112. AmTECH Micro electronics Recent Development

Table 113. IBE Electronics Company Details

Table 114. IBE Electronics Business Overview

Table 115. IBE Electronics Semiconductor Packaging and Assembly Services Product

Table 116. IBE Electronics Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 117. IBE Electronics Recent Development

Table 118. OSAT Company Details

Table 119. OSAT Business Overview

Table 120. OSAT Semiconductor Packaging and Assembly Services Product

Table 121. OSAT Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 122. OSAT Recent Development

Table 123. CSIS Company Details

Table 124. CSIS Business Overview

Table 125. CSIS Semiconductor Packaging and Assembly Services Product

Table 126. CSIS Revenue in Semiconductor Packaging and Assembly Services Business (2020-2025) & (US$ Million)

Table 127. CSIS Recent Development

Table 128. Research Programs/Design for This Report

Table 129. Key Data Information from Secondary Sources

Table 130. Key Data Information from Primary Sources

Table 131. Authors List of This Report

List of Figures

Figure 1. Semiconductor Packaging and Assembly Services Picture

Figure 2. Global Semiconductor Packaging and Assembly Services Market Size Comparison by Type (2020-2031) & (US$ Million)

Figure 3. Global Semiconductor Packaging and Assembly Services Market Share by Type: 2024 VS 2031

Figure 4. First Level Features

Figure 5. Second Level Features

Figure 6. Third Level Features

Figure 7. Fourth Level Features

Figure 8. Global Semiconductor Packaging and Assembly Services Market Size by Application (2020-2031) & (US$ Million)

Figure 9. Global Semiconductor Packaging and Assembly Services Market Share by Application: 2024 VS 2031

Figure 10. Consumer Electronics Case Studies

Figure 11. Communication Equipment Case Studies

Figure 12. Automotive Electronics Case Studies

Figure 13. Aerospace Case Studies

Figure 14. Others Case Studies

Figure 15. Semiconductor Packaging and Assembly Services Report Years Considered

Figure 16. Global Semiconductor Packaging and Assembly Services Market Size (US$ Million), Year-over-Year: 2020-2031

Figure 17. Global Semiconductor Packaging and Assembly Services Market Size, (US$ Million), 2020 VS 2024 VS 2031

Figure 18. Global Semiconductor Packaging and Assembly Services Market Share by Region: 2024 VS 2031

Figure 19. Global Semiconductor Packaging and Assembly Services Market Share by Players in 2024

Figure 20. Global Semiconductor Packaging and Assembly Services Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

Figure 21. The Top 10 and 5 Players Market Share by Semiconductor Packaging and Assembly Services Revenue in 2024

Figure 22. North America Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 23. North America Semiconductor Packaging and Assembly Services Market Share by Country (2020-2031)

Figure 24. United States Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 25. Canada Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 26. Europe Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 27. Europe Semiconductor Packaging and Assembly Services Market Share by Country (2020-2031)

Figure 28. Germany Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 29. France Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 30. U.K. Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 31. Italy Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 32. Russia Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 33. Nordic Countries Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 34. Asia-Pacific Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 35. Asia-Pacific Semiconductor Packaging and Assembly Services Market Share by Region (2020-2031)

Figure 36. China Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 37. Japan Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 38. South Korea Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 39. Southeast Asia Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 40. India Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 41. Australia Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 42. Latin America Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 43. Latin America Semiconductor Packaging and Assembly Services Market Share by Country (2020-2031)

Figure 44. Mexico Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 45. Brazil Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 46. Middle East & Africa Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 47. Middle East & Africa Semiconductor Packaging and Assembly Services Market Share by Country (2020-2031)

Figure 48. Turkey Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 49. Saudi Arabia Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 50. UAE Semiconductor Packaging and Assembly Services Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 51. Alter Technology TUV NORD Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 52. Microchip Technology Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 53. Intech Technologies Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 54. QP Technologies Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 55. Amkor Technology Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 56. ASE Holdings Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 57. Integra Technologies Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 58. Yole Group Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 59. ASMPT Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 60. StratEdge Corporation Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 61. Engent Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 62. Criteria Labs Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 63. AmTECH Micro electronics Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 64. IBE Electronics Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 65. OSAT Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 66. CSIS Revenue Growth Rate in Semiconductor Packaging and Assembly Services Business (2020-2025)

Figure 67. Bottom-up and Top-down Approaches for This Report

Figure 68. Data Triangulation

Figure 69. Key Executives Interviewed

SELECT A FORMAT

Added to Cart

Single User

Electronic (PDF)

$2900

This license allows only one user to access the PDF.

Multi User

Electronic (PDF)

$4350

This license allows 1 - 5 user to access the PDF, license is suitable for small groups of 5 users working together

Enterprise User

Electronic (PDF)

$5800

This license allows users/teams in a same Enterprise to use this report, various departments within an enterpise can use this report

Add to Cart

Buy Now (15% Discount)

HAVE A QUERY?

INQUIRE ABOUT REPORT EMAIL US

OUR CUSTOMER

SIMILAR REPORTS

RELATED REPORTS

Global Thyristor Discs Market Research Report 2025

120 Pages

Type: Report

Code: QYRE-Auto-14J20228

Wed Dec 03 00:00:00 UTC 2025

Add to Cart

Global Thyristor Drives Market Research Report 2025

120 Pages

Type: Report

Code: QYRE-Auto-27X19827

Wed Dec 03 00:00:00 UTC 2025

Add to Cart

Global Analog Electrical Conductivity Sensors Market Research Report 2025

120 Pages

Type: Report

Code: QYRE-Auto-25L19925

Wed Dec 03 00:00:00 UTC 2025

Add to Cart

Global Potentiometer Transducers Market Research Report 2025

120 Pages

Type: Report

Code: QYRE-Auto-33U20003

Tue Dec 02 00:00:00 UTC 2025

Add to Cart

aluates Reports

Support Contacts

U.S. (TOLL FREE)

+1 (425) 388-2538

sales@valuates.com

THE COMPANY

OUR PRODUCTS

CUSTOMER SUPPORT

CONTACT
FAQ

POLICES

THE COMPANY

ABOUT US

CUSTOMER SUPPORT

CONTACT
FAQ

OUR PRODUCTS

POLICES

Sitemap - Privacy Policy - Terms & Conditions