The global Semiconductor IC Design, Manufacturing, Packaging and Testing market was valued at US$ 803790 million in 2023 and is anticipated to reach US$ 1144320 million by 2030, witnessing a CAGR of 5.4% during the forecast period 2024-2030.

Semiconductor IC Design, Manufacturing, Packaging and Testing Market

The semiconductor supply chain involves a complex network of companies, organizations, and individuals involved in the design, manufacturing, Semiconductor Test and Packaging, Semiconductor Equipment and Materials.

This report studies the semiconductor IC Design (IDM and fabless), IC Manufacturing (foundries and IDM), IC Packaging and IC Testing (OSAT and IDM).

Key IC design companies include NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, Realtek Semiconductor Corporation and OmniVision Technology, Inc.

Key IC manufacturing/wafer fabrication companies are TSMC, Samsung Foundry, GlobalFoundries, United Microelectronics Corporation (UMC), SMIC, Tower Semiconductor, PSMC, VIS (Vanguard International Semiconductor), and Hua Hong Semiconductor, etc.

Key IDMs include Samsung, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi, etc.

Key Assembly, Test, and Packaging (OSAT) companies include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), HT-tech, King Yuan Electronics Corp. (KYEC), ChipMOS TECHNOLOGIES and Chipbond Technology, etc.

North American market for Semiconductor IC Design, Manufacturing, Packaging and Testing is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

Asia-Pacific market for Semiconductor IC Design, Manufacturing, Packaging and Testing is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

The global market for Semiconductor IC Design, Manufacturing, Packaging and Testing in Communication is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

The major global companies of Semiconductor IC Design, Manufacturing, Packaging and Testing include Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.

This report aims to provide a comprehensive presentation of the global market for Semiconductor IC Design, Manufacturing, Packaging and Testing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor IC Design, Manufacturing, Packaging and Testing.

The Semiconductor IC Design, Manufacturing, Packaging and Testing market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor IC Design, Manufacturing, Packaging and Testing market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Semiconductor IC Design, Manufacturing, Packaging and Testing companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Semiconductor IC Design, Manufacturing, Packaging and Testing Market Report

Report Metric	Details
Report Name	Semiconductor IC Design, Manufacturing, Packaging and Testing Market
Accounted market size in 2023	US$ 803790 million
Forecasted market size in 2030	US$ 1144320 million
CAGR	5.4%
Base Year	2023
Forecasted years	2024 - 2030
Segment by Type	IC Design IC Manufacturing IC Packaging & Testing
Segment by Application	Communication Computer/PC Consumer Automotive Industrial Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology, Onsemi, NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, Realtek Semiconductor Corporation, OmniVision Technology, Inc, Monolithic Power Systems, Inc. (MPS), Cirrus Logic, Inc., Socionext Inc., LX Semicon, HiSilicon Technologies, TSMC, Samsung Foundry, GlobalFoundries, United Microelectronics Corporation (UMC), SMIC, Tower Semiconductor, PSMC, VIS (Vanguard International Semiconductor), Hua Hong Semiconductor, HLMC, ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), HT-tech, King Yuan Electronics Corp. (KYEC), ChipMOS TECHNOLOGIES, SFA Semicon, Chipbond Technology Corporation, UTAC, ASML, TEL (Tokyo Electron Ltd.), Lam Research, KLA, Nikon, Carsem, Forehope Electronic (Ningbo) Co.,Ltd., Unisem Group, OSE CORP.
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor IC Design, Manufacturing, Packaging and Testing company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Semiconductor IC Design, Manufacturing, Packaging and Testing Market growing?

Ans: The Semiconductor IC Design, Manufacturing, Packaging and Testing Market witnessing a CAGR of 5.4% during the forecast period 2024-2030.

What is the Semiconductor IC Design, Manufacturing, Packaging and Testing Market size in 2030?

Ans: The Semiconductor IC Design, Manufacturing, Packaging and Testing Market size in 2030 will be US$ 1144320 million.

Who are the main players in the Semiconductor IC Design, Manufacturing, Packaging and Testing Market report?

Ans: The main players in the Semiconductor IC Design, Manufacturing, Packaging and Testing Market are Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology, Onsemi, NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, Realtek Semiconductor Corporation, OmniVision Technology, Inc, Monolithic Power Systems, Inc. (MPS), Cirrus Logic, Inc., Socionext Inc., LX Semicon, HiSilicon Technologies, TSMC, Samsung Foundry, GlobalFoundries, United Microelectronics Corporation (UMC), SMIC, Tower Semiconductor, PSMC, VIS (Vanguard International Semiconductor), Hua Hong Semiconductor, HLMC, ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), HT-tech, King Yuan Electronics Corp. (KYEC), ChipMOS TECHNOLOGIES, SFA Semicon, Chipbond Technology Corporation, UTAC, ASML, TEL (Tokyo Electron Ltd.), Lam Research, KLA, Nikon, Carsem, Forehope Electronic (Ningbo) Co.,Ltd., Unisem Group, OSE CORP.

What are the Application segmentation covered in the Semiconductor IC Design, Manufacturing, Packaging and Testing Market report?

Ans: The Applications covered in the Semiconductor IC Design, Manufacturing, Packaging and Testing Market report are Communication, Computer/PC, Consumer, Automotive, Industrial, Others

What are the Type segmentation covered in the Semiconductor IC Design, Manufacturing, Packaging and Testing Market report?

Ans: The Types covered in the Semiconductor IC Design, Manufacturing, Packaging and Testing Market report are IC Design, IC Manufacturing, IC Packaging & Testing

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Growth Rate by Type: 2019 VS 2023 VS 2030

1.2.2 IC Design

1.2.3 IC Manufacturing

1.2.4 IC Packaging & Testing

1.3 Market by Application

1.3.1 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Growth by Application: 2019 VS 2023 VS 2030

1.3.2 Communication

1.3.3 Computer/PC

1.3.4 Consumer

1.3.5 Automotive

1.3.6 Industrial

1.3.7 Others

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Perspective (2019-2030)

2.2 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Growth Trends by Region

2.2.1 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Region: 2019 VS 2023 VS 2030

2.2.2 Semiconductor IC Design, Manufacturing, Packaging and Testing Historic Market Size by Region (2019-2024)

2.2.3 Semiconductor IC Design, Manufacturing, Packaging and Testing Forecasted Market Size by Region (2025-2030)

2.3 Semiconductor IC Design, Manufacturing, Packaging and Testing Market Dynamics

2.3.1 Semiconductor IC Design, Manufacturing, Packaging and Testing Industry Trends

2.3.2 Semiconductor IC Design, Manufacturing, Packaging and Testing Market Drivers

2.3.3 Semiconductor IC Design, Manufacturing, Packaging and Testing Market Challenges

2.3.4 Semiconductor IC Design, Manufacturing, Packaging and Testing Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Semiconductor IC Design, Manufacturing, Packaging and Testing Players by Revenue

3.1.1 Global Top Semiconductor IC Design, Manufacturing, Packaging and Testing Players by Revenue (2019-2024)

3.1.2 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share by Players (2019-2024)

3.2 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue

3.4 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Concentration Ratio

3.4.1 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue in 2023

3.5 Global Key Players of Semiconductor IC Design, Manufacturing, Packaging and Testing Head office and Area Served

3.6 Global Key Players of Semiconductor IC Design, Manufacturing, Packaging and Testing, Product and Application

3.7 Global Key Players of Semiconductor IC Design, Manufacturing, Packaging and Testing, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 Semiconductor IC Design, Manufacturing, Packaging and Testing Breakdown Data by Type

4.1 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Historic Market Size by Type (2019-2024)

4.2 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Forecasted Market Size by Type (2025-2030)

5 Semiconductor IC Design, Manufacturing, Packaging and Testing Breakdown Data by Application

5.1 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Historic Market Size by Application (2019-2024)

5.2 Global Semiconductor IC Design, Manufacturing, Packaging and Testing Forecasted Market Size by Application (2025-2030)

6 North America

6.1 North America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size (2019-2030)

6.2 North America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030

6.3 North America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2019-2024)

6.4 North America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2025-2030)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size (2019-2030)

7.2 Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030

7.3 Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2019-2024)

7.4 Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2025-2030)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size (2019-2030)

8.2 Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030

8.3 Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Region (2019-2024)

8.4 Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Region (2025-2030)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size (2019-2030)

9.2 Latin America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030

9.3 Latin America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2019-2024)

9.4 Latin America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2025-2030)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size (2019-2030)

10.2 Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging and Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030

10.3 Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2019-2024)

10.4 Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2025-2030)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 Samsung-Memory

11.1.1 Samsung-Memory Company Details

11.1.2 Samsung-Memory Business Overview

11.1.3 Samsung-Memory Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.1.4 Samsung-Memory Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.1.5 Samsung-Memory Recent Development

11.2 Intel

11.2.1 Intel Company Details

11.2.2 Intel Business Overview

11.2.3 Intel Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.2.4 Intel Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.2.5 Intel Recent Development

11.3 SK Hynix

11.3.1 SK Hynix Company Details

11.3.2 SK Hynix Business Overview

11.3.3 SK Hynix Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.3.4 SK Hynix Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.3.5 SK Hynix Recent Development

11.4 Micron Technology

11.4.1 Micron Technology Company Details

11.4.2 Micron Technology Business Overview

11.4.3 Micron Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.4.4 Micron Technology Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.4.5 Micron Technology Recent Development

11.5 Texas Instruments (TI)

11.5.1 Texas Instruments (TI) Company Details

11.5.2 Texas Instruments (TI) Business Overview

11.5.3 Texas Instruments (TI) Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.5.4 Texas Instruments (TI) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.5.5 Texas Instruments (TI) Recent Development

11.6 STMicroelectronics

11.6.1 STMicroelectronics Company Details

11.6.2 STMicroelectronics Business Overview

11.6.3 STMicroelectronics Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.6.4 STMicroelectronics Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.6.5 STMicroelectronics Recent Development

11.7 Kioxia

11.7.1 Kioxia Company Details

11.7.2 Kioxia Business Overview

11.7.3 Kioxia Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.7.4 Kioxia Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.7.5 Kioxia Recent Development

11.8 Sony Semiconductor Solutions Corporation (SSS)

11.8.1 Sony Semiconductor Solutions Corporation (SSS) Company Details

11.8.2 Sony Semiconductor Solutions Corporation (SSS) Business Overview

11.8.3 Sony Semiconductor Solutions Corporation (SSS) Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.8.4 Sony Semiconductor Solutions Corporation (SSS) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.8.5 Sony Semiconductor Solutions Corporation (SSS) Recent Development

11.9 Infineon

11.9.1 Infineon Company Details

11.9.2 Infineon Business Overview

11.9.3 Infineon Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.9.4 Infineon Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.9.5 Infineon Recent Development

11.10 NXP

11.10.1 NXP Company Details

11.10.2 NXP Business Overview

11.10.3 NXP Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.10.4 NXP Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.10.5 NXP Recent Development

11.11 Analog Devices, Inc. (ADI)

11.11.1 Analog Devices, Inc. (ADI) Company Details

11.11.2 Analog Devices, Inc. (ADI) Business Overview

11.11.3 Analog Devices, Inc. (ADI) Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.11.4 Analog Devices, Inc. (ADI) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.11.5 Analog Devices, Inc. (ADI) Recent Development

11.12 Renesas Electronics

11.12.1 Renesas Electronics Company Details

11.12.2 Renesas Electronics Business Overview

11.12.3 Renesas Electronics Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.12.4 Renesas Electronics Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.12.5 Renesas Electronics Recent Development

11.13 Microchip Technology

11.13.1 Microchip Technology Company Details

11.13.2 Microchip Technology Business Overview

11.13.3 Microchip Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.13.4 Microchip Technology Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.13.5 Microchip Technology Recent Development

11.14 Onsemi

11.14.1 Onsemi Company Details

11.14.2 Onsemi Business Overview

11.14.3 Onsemi Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.14.4 Onsemi Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.14.5 Onsemi Recent Development

11.15 NVIDIA

11.15.1 NVIDIA Company Details

11.15.2 NVIDIA Business Overview

11.15.3 NVIDIA Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.15.4 NVIDIA Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.15.5 NVIDIA Recent Development

11.16 Qualcomm

11.16.1 Qualcomm Company Details

11.16.2 Qualcomm Business Overview

11.16.3 Qualcomm Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.16.4 Qualcomm Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.16.5 Qualcomm Recent Development

11.17 Broadcom

11.17.1 Broadcom Company Details

11.17.2 Broadcom Business Overview

11.17.3 Broadcom Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.17.4 Broadcom Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.17.5 Broadcom Recent Development

11.18 Advanced Micro Devices, Inc. (AMD)

11.18.1 Advanced Micro Devices, Inc. (AMD) Company Details

11.18.2 Advanced Micro Devices, Inc. (AMD) Business Overview

11.18.3 Advanced Micro Devices, Inc. (AMD) Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.18.4 Advanced Micro Devices, Inc. (AMD) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.18.5 Advanced Micro Devices, Inc. (AMD) Recent Development

11.19 MediaTek

11.19.1 MediaTek Company Details

11.19.2 MediaTek Business Overview

11.19.3 MediaTek Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.19.4 MediaTek Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.19.5 MediaTek Recent Development

11.20 Marvell Technology Group

11.20.1 Marvell Technology Group Company Details

11.20.2 Marvell Technology Group Business Overview

11.20.3 Marvell Technology Group Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.20.4 Marvell Technology Group Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.20.5 Marvell Technology Group Recent Development

11.21 Novatek Microelectronics Corp.

11.21.1 Novatek Microelectronics Corp. Company Details

11.21.2 Novatek Microelectronics Corp. Business Overview

11.21.3 Novatek Microelectronics Corp. Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.21.4 Novatek Microelectronics Corp. Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.21.5 Novatek Microelectronics Corp. Recent Development

11.22 Tsinghua Unigroup

11.22.1 Tsinghua Unigroup Company Details

11.22.2 Tsinghua Unigroup Business Overview

11.22.3 Tsinghua Unigroup Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.22.4 Tsinghua Unigroup Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.22.5 Tsinghua Unigroup Recent Development

11.23 Realtek Semiconductor Corporation

11.23.1 Realtek Semiconductor Corporation Company Details

11.23.2 Realtek Semiconductor Corporation Business Overview

11.23.3 Realtek Semiconductor Corporation Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.23.4 Realtek Semiconductor Corporation Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.23.5 Realtek Semiconductor Corporation Recent Development

11.24 OmniVision Technology, Inc

11.24.1 OmniVision Technology, Inc Company Details

11.24.2 OmniVision Technology, Inc Business Overview

11.24.3 OmniVision Technology, Inc Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.24.4 OmniVision Technology, Inc Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.24.5 OmniVision Technology, Inc Recent Development

11.25 Monolithic Power Systems, Inc. (MPS)

11.25.1 Monolithic Power Systems, Inc. (MPS) Company Details

11.25.2 Monolithic Power Systems, Inc. (MPS) Business Overview

11.25.3 Monolithic Power Systems, Inc. (MPS) Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.25.4 Monolithic Power Systems, Inc. (MPS) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.25.5 Monolithic Power Systems, Inc. (MPS) Recent Development

11.26 Cirrus Logic, Inc.

11.26.1 Cirrus Logic, Inc. Company Details

11.26.2 Cirrus Logic, Inc. Business Overview

11.26.3 Cirrus Logic, Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.26.4 Cirrus Logic, Inc. Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.26.5 Cirrus Logic, Inc. Recent Development

11.27 Socionext Inc.

11.27.1 Socionext Inc. Company Details

11.27.2 Socionext Inc. Business Overview

11.27.3 Socionext Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.27.4 Socionext Inc. Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.27.5 Socionext Inc. Recent Development

11.28 LX Semicon

11.28.1 LX Semicon Company Details

11.28.2 LX Semicon Business Overview

11.28.3 LX Semicon Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.28.4 LX Semicon Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.28.5 LX Semicon Recent Development

11.29 HiSilicon Technologies

11.29.1 HiSilicon Technologies Company Details

11.29.2 HiSilicon Technologies Business Overview

11.29.3 HiSilicon Technologies Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.29.4 HiSilicon Technologies Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.29.5 HiSilicon Technologies Recent Development

11.30 TSMC

11.30.1 TSMC Company Details

11.30.2 TSMC Business Overview

11.30.3 TSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.30.4 TSMC Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.30.5 TSMC Recent Development

11.31 Samsung Foundry

11.31.1 Samsung Foundry Company Details

11.31.2 Samsung Foundry Business Overview

11.31.3 Samsung Foundry Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.31.4 Samsung Foundry Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.31.5 Samsung Foundry Recent Development

11.32 GlobalFoundries

11.32.1 GlobalFoundries Company Details

11.32.2 GlobalFoundries Business Overview

11.32.3 GlobalFoundries Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.32.4 GlobalFoundries Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.32.5 GlobalFoundries Recent Development

11.33 United Microelectronics Corporation (UMC)

11.33.1 United Microelectronics Corporation (UMC) Company Details

11.33.2 United Microelectronics Corporation (UMC) Business Overview

11.33.3 United Microelectronics Corporation (UMC) Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.33.4 United Microelectronics Corporation (UMC) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.33.5 United Microelectronics Corporation (UMC) Recent Development

11.34 SMIC

11.34.1 SMIC Company Details

11.34.2 SMIC Business Overview

11.34.3 SMIC Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.34.4 SMIC Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.34.5 SMIC Recent Development

11.35 Tower Semiconductor

11.35.1 Tower Semiconductor Company Details

11.35.2 Tower Semiconductor Business Overview

11.35.3 Tower Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.35.4 Tower Semiconductor Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.35.5 Tower Semiconductor Recent Development

11.36 PSMC

11.36.1 PSMC Company Details

11.36.2 PSMC Business Overview

11.36.3 PSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.36.4 PSMC Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.36.5 PSMC Recent Development

11.37 VIS (Vanguard International Semiconductor)

11.37.1 VIS (Vanguard International Semiconductor) Company Details

11.37.2 VIS (Vanguard International Semiconductor) Business Overview

11.37.3 VIS (Vanguard International Semiconductor) Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.37.4 VIS (Vanguard International Semiconductor) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.37.5 VIS (Vanguard International Semiconductor) Recent Development

11.38 Hua Hong Semiconductor

11.38.1 Hua Hong Semiconductor Company Details

11.38.2 Hua Hong Semiconductor Business Overview

11.38.3 Hua Hong Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.38.4 Hua Hong Semiconductor Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.38.5 Hua Hong Semiconductor Recent Development

11.39 HLMC

11.39.1 HLMC Company Details

11.39.2 HLMC Business Overview

11.39.3 HLMC Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.39.4 HLMC Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.39.5 HLMC Recent Development

11.40 ASE (SPIL)

11.40.1 ASE (SPIL) Company Details

11.40.2 ASE (SPIL) Business Overview

11.40.3 ASE (SPIL) Semiconductor IC Design, Manufacturing, Packaging and Testing Introduction

11.40.4 ASE (SPIL) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

11.40.5 ASE (SPIL) Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

United Microelectronics Corporation

SAMSUNG

Novatek Microelectronics Corp.

Marvell Technology Group

Realtek Semiconductor Corporation

GlobalFoundries

TSMC

Samsung-Memory

Texas Instruments (Ti)

STMicroelectronics

Kioxia

Sony Semiconductor Solutions Corporation (SSS)

Infineon

NXP

Analog Devices, Inc. (ADI)

Renesas Electronics

Microchip Technology

Onsemi

Advanced Micro Devices, Inc. (AMD)

OmniVision Technology, Inc

Monolithic Power Systems, Inc. (MPS)

Cirrus Logic, Inc.

Socionext

LX Semicon

Hisilicon Technologies

Samsung Foundry

United Microelectronics Corporation (UMC)

PSMC

VIS (Vanguard International Semiconductor)

Hua Hong Semiconductor

Tongfu Microelectronics (TFME)

Powertech Technology Inc. (PTI)

HT-tech

King Yuan Electronics Corp. (KYEC)

ChipMOS TECHNOLOGIES

SFA Semicon

Chipbond Technology Corporation

UTAC

ASML

TEL (Tokyo Electron Ltd)

Forehope Electronic (Ningbo) Co.,Ltd.

Unisem Group

OSE CORP

List of Tables

Table 1. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030

Table 2. Key Players of IC Design

Table 3. Key Players of IC Manufacturing

Table 4. Key Players of IC Packaging & Testing

Table 5. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030

Table 6. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Region (US$ Million): 2019 VS 2023 VS 2030

Table 7. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Region (2019-2024) & (US$ Million)

Table 8. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Region (2019-2024)

Table 9. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Forecasted Market Size by Region (2025-2030) & (US$ Million)

Table 10. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Region (2025-2030)

Table 11. Semiconductor IC Design, Manufacturing, Packaging and Testing Market Trends

Table 12. Semiconductor IC Design, Manufacturing, Packaging and Testing Market Drivers

Table 13. Semiconductor IC Design, Manufacturing, Packaging and Testing Market Challenges

Table 14. Semiconductor IC Design, Manufacturing, Packaging and Testing Market Restraints

Table 15. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue by Players (2019-2024) & (US$ Million)

Table 16. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Players (2019-2024)

Table 17. Global Top Semiconductor IC Design, Manufacturing, Packaging and Testing Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing as of 2023)

Table 18. Ranking of Global Top Semiconductor IC Design, Manufacturing, Packaging and Testing Companies by Revenue (US$ Million) in 2023

Table 19. Global 5 Largest Players Market Share by Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue (CR5 and HHI) & (2019-2024)

Table 20. Global Key Players of Semiconductor IC Design, Manufacturing, Packaging and Testing, Headquarters and Area Served

Table 21. Global Key Players of Semiconductor IC Design, Manufacturing, Packaging and Testing, Product and Application

Table 22. Global Key Players of Semiconductor IC Design, Manufacturing, Packaging and Testing, Date of Enter into This Industry

Table 23. Mergers & Acquisitions, Expansion Plans

Table 24. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Type (2019-2024) & (US$ Million)

Table 25. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share by Type (2019-2024)

Table 26. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Forecasted Market Size by Type (2025-2030) & (US$ Million)

Table 27. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share by Type (2025-2030)

Table 28. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Application (2019-2024) & (US$ Million)

Table 29. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share by Application (2019-2024)

Table 30. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Forecasted Market Size by Application (2025-2030) & (US$ Million)

Table 31. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue Market Share by Application (2025-2030)

Table 32. North America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 33. North America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2019-2024) & (US$ Million)

Table 34. North America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2025-2030) & (US$ Million)

Table 35. Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 36. Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2019-2024) & (US$ Million)

Table 37. Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2025-2030) & (US$ Million)

Table 38. Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 39. Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Region (2019-2024) & (US$ Million)

Table 40. Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Region (2025-2030) & (US$ Million)

Table 41. Latin America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 42. Latin America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2019-2024) & (US$ Million)

Table 43. Latin America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2025-2030) & (US$ Million)

Table 44. Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 45. Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2019-2024) & (US$ Million)

Table 46. Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Country (2025-2030) & (US$ Million)

Table 47. Samsung-Memory Company Details

Table 48. Samsung-Memory Business Overview

Table 49. Samsung-Memory Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 50. Samsung-Memory Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 51. Samsung-Memory Recent Development

Table 52. Intel Company Details

Table 53. Intel Business Overview

Table 54. Intel Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 55. Intel Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 56. Intel Recent Development

Table 57. SK Hynix Company Details

Table 58. SK Hynix Business Overview

Table 59. SK Hynix Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 60. SK Hynix Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 61. SK Hynix Recent Development

Table 62. Micron Technology Company Details

Table 63. Micron Technology Business Overview

Table 64. Micron Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 65. Micron Technology Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 66. Micron Technology Recent Development

Table 67. Texas Instruments (TI) Company Details

Table 68. Texas Instruments (TI) Business Overview

Table 69. Texas Instruments (TI) Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 70. Texas Instruments (TI) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 71. Texas Instruments (TI) Recent Development

Table 72. STMicroelectronics Company Details

Table 73. STMicroelectronics Business Overview

Table 74. STMicroelectronics Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 75. STMicroelectronics Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 76. STMicroelectronics Recent Development

Table 77. Kioxia Company Details

Table 78. Kioxia Business Overview

Table 79. Kioxia Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 80. Kioxia Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 81. Kioxia Recent Development

Table 82. Sony Semiconductor Solutions Corporation (SSS) Company Details

Table 83. Sony Semiconductor Solutions Corporation (SSS) Business Overview

Table 84. Sony Semiconductor Solutions Corporation (SSS) Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 85. Sony Semiconductor Solutions Corporation (SSS) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 86. Sony Semiconductor Solutions Corporation (SSS) Recent Development

Table 87. Infineon Company Details

Table 88. Infineon Business Overview

Table 89. Infineon Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 90. Infineon Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 91. Infineon Recent Development

Table 92. NXP Company Details

Table 93. NXP Business Overview

Table 94. NXP Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 95. NXP Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 96. NXP Recent Development

Table 97. Analog Devices, Inc. (ADI) Company Details

Table 98. Analog Devices, Inc. (ADI) Business Overview

Table 99. Analog Devices, Inc. (ADI) Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 100. Analog Devices, Inc. (ADI) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 101. Analog Devices, Inc. (ADI) Recent Development

Table 102. Renesas Electronics Company Details

Table 103. Renesas Electronics Business Overview

Table 104. Renesas Electronics Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 105. Renesas Electronics Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 106. Renesas Electronics Recent Development

Table 107. Microchip Technology Company Details

Table 108. Microchip Technology Business Overview

Table 109. Microchip Technology Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 110. Microchip Technology Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 111. Microchip Technology Recent Development

Table 112. Onsemi Company Details

Table 113. Onsemi Business Overview

Table 114. Onsemi Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 115. Onsemi Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 116. Onsemi Recent Development

Table 117. NVIDIA Company Details

Table 118. NVIDIA Business Overview

Table 119. NVIDIA Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 120. NVIDIA Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 121. NVIDIA Recent Development

Table 122. Qualcomm Company Details

Table 123. Qualcomm Business Overview

Table 124. Qualcomm Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 125. Qualcomm Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 126. Qualcomm Recent Development

Table 127. Broadcom Company Details

Table 128. Broadcom Business Overview

Table 129. Broadcom Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 130. Broadcom Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 131. Broadcom Recent Development

Table 132. Advanced Micro Devices, Inc. (AMD) Company Details

Table 133. Advanced Micro Devices, Inc. (AMD) Business Overview

Table 134. Advanced Micro Devices, Inc. (AMD) Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 135. Advanced Micro Devices, Inc. (AMD) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 136. Advanced Micro Devices, Inc. (AMD) Recent Development

Table 137. MediaTek Company Details

Table 138. MediaTek Business Overview

Table 139. MediaTek Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 140. MediaTek Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 141. MediaTek Recent Development

Table 142. Marvell Technology Group Company Details

Table 143. Marvell Technology Group Business Overview

Table 144. Marvell Technology Group Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 145. Marvell Technology Group Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 146. Marvell Technology Group Recent Development

Table 147. Novatek Microelectronics Corp. Company Details

Table 148. Novatek Microelectronics Corp. Business Overview

Table 149. Novatek Microelectronics Corp. Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 150. Novatek Microelectronics Corp. Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 151. Novatek Microelectronics Corp. Recent Development

Table 152. Tsinghua Unigroup Company Details

Table 153. Tsinghua Unigroup Business Overview

Table 154. Tsinghua Unigroup Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 155. Tsinghua Unigroup Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 156. Tsinghua Unigroup Recent Development

Table 157. Realtek Semiconductor Corporation Company Details

Table 158. Realtek Semiconductor Corporation Business Overview

Table 159. Realtek Semiconductor Corporation Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 160. Realtek Semiconductor Corporation Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 161. Realtek Semiconductor Corporation Recent Development

Table 162. OmniVision Technology, Inc Company Details

Table 163. OmniVision Technology, Inc Business Overview

Table 164. OmniVision Technology, Inc Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 165. OmniVision Technology, Inc Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 166. OmniVision Technology, Inc Recent Development

Table 167. Monolithic Power Systems, Inc. (MPS) Company Details

Table 168. Monolithic Power Systems, Inc. (MPS) Business Overview

Table 169. Monolithic Power Systems, Inc. (MPS) Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 170. Monolithic Power Systems, Inc. (MPS) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 171. Monolithic Power Systems, Inc. (MPS) Recent Development

Table 172. Cirrus Logic, Inc. Company Details

Table 173. Cirrus Logic, Inc. Business Overview

Table 174. Cirrus Logic, Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 175. Cirrus Logic, Inc. Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 176. Cirrus Logic, Inc. Recent Development

Table 177. Socionext Inc. Company Details

Table 178. Socionext Inc. Business Overview

Table 179. Socionext Inc. Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 180. Socionext Inc. Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 181. Socionext Inc. Recent Development

Table 182. LX Semicon Company Details

Table 183. LX Semicon Business Overview

Table 184. LX Semicon Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 185. LX Semicon Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 186. LX Semicon Recent Development

Table 187. HiSilicon Technologies Company Details

Table 188. HiSilicon Technologies Business Overview

Table 189. HiSilicon Technologies Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 190. HiSilicon Technologies Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 191. HiSilicon Technologies Recent Development

Table 192. TSMC Company Details

Table 193. TSMC Business Overview

Table 194. TSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 195. TSMC Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 196. TSMC Recent Development

Table 197. Samsung Foundry Company Details

Table 198. Samsung Foundry Business Overview

Table 199. Samsung Foundry Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 200. Samsung Foundry Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 201. Samsung Foundry Recent Development

Table 202. GlobalFoundries Company Details

Table 203. GlobalFoundries Business Overview

Table 204. GlobalFoundries Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 205. GlobalFoundries Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 206. GlobalFoundries Recent Development

Table 207. United Microelectronics Corporation (UMC) Company Details

Table 208. United Microelectronics Corporation (UMC) Business Overview

Table 209. United Microelectronics Corporation (UMC) Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 210. United Microelectronics Corporation (UMC) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 211. United Microelectronics Corporation (UMC) Recent Development

Table 212. SMIC Company Details

Table 213. SMIC Business Overview

Table 214. SMIC Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 215. SMIC Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 216. SMIC Recent Development

Table 217. Tower Semiconductor Company Details

Table 218. Tower Semiconductor Business Overview

Table 219. Tower Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 220. Tower Semiconductor Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 221. Tower Semiconductor Recent Development

Table 222. PSMC Company Details

Table 223. PSMC Business Overview

Table 224. PSMC Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 225. PSMC Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 226. PSMC Recent Development

Table 227. VIS (Vanguard International Semiconductor) Company Details

Table 228. VIS (Vanguard International Semiconductor) Business Overview

Table 229. VIS (Vanguard International Semiconductor) Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 230. VIS (Vanguard International Semiconductor) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 231. VIS (Vanguard International Semiconductor) Recent Development

Table 232. Hua Hong Semiconductor Company Details

Table 233. Hua Hong Semiconductor Business Overview

Table 234. Hua Hong Semiconductor Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 235. Hua Hong Semiconductor Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 236. Hua Hong Semiconductor Recent Development

Table 237. HLMC Company Details

Table 238. HLMC Business Overview

Table 239. HLMC Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 240. HLMC Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 241. HLMC Recent Development

Table 242. ASE (SPIL) Company Details

Table 243. ASE (SPIL) Business Overview

Table 244. ASE (SPIL) Semiconductor IC Design, Manufacturing, Packaging and Testing Product

Table 245. ASE (SPIL) Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024) & (US$ Million)

Table 246. ASE (SPIL) Recent Development

Table 247. Research Programs/Design for This Report

Table 248. Key Data Information from Secondary Sources

Table 249. Key Data Information from Primary Sources

Table 250. Authors List of This Report

List of Figures

Figure 1. Semiconductor IC Design, Manufacturing, Packaging and Testing Picture

Figure 2. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size Comparison by Type (2024-2030) & (US$ Million)

Figure 3. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Type: 2023 VS 2030

Figure 4. IC Design Features

Figure 5. IC Manufacturing Features

Figure 6. IC Packaging & Testing Features

Figure 7. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size by Application (2024-2030) & (US$ Million)

Figure 8. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Application: 2023 VS 2030

Figure 9. Communication Case Studies

Figure 10. Computer/PC Case Studies

Figure 11. Consumer Case Studies

Figure 12. Automotive Case Studies

Figure 13. Industrial Case Studies

Figure 14. Others Case Studies

Figure 15. Semiconductor IC Design, Manufacturing, Packaging and Testing Report Years Considered

Figure 16. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size (US$ Million), Year-over-Year: 2019-2030

Figure 17. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size, (US$ Million), 2019 VS 2023 VS 2030

Figure 18. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Region: 2023 VS 2030

Figure 19. Global Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Players in 2023

Figure 20. Global Top Semiconductor IC Design, Manufacturing, Packaging and Testing Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor IC Design, Manufacturing, Packaging and Testing as of 2023)

Figure 21. The Top 10 and 5 Players Market Share by Semiconductor IC Design, Manufacturing, Packaging and Testing Revenue in 2023

Figure 22. North America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 23. North America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Country (2019-2030)

Figure 24. United States Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 25. Canada Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 26. Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 27. Europe Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Country (2019-2030)

Figure 28. Germany Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 29. France Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 30. U.K. Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 31. Italy Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 32. Russia Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 33. Nordic Countries Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 34. Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 35. Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Region (2019-2030)

Figure 36. China Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 37. Japan Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 38. South Korea Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 39. Southeast Asia Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 40. India Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 41. Australia Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 42. Latin America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 43. Latin America Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Country (2019-2030)

Figure 44. Mexico Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 45. Brazil Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 46. Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 47. Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging and Testing Market Share by Country (2019-2030)

Figure 48. Turkey Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 49. Saudi Arabia Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 50. UAE Semiconductor IC Design, Manufacturing, Packaging and Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 51. Samsung-Memory Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 52. Intel Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 53. SK Hynix Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 54. Micron Technology Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 55. Texas Instruments (TI) Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 56. STMicroelectronics Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 57. Kioxia Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 58. Sony Semiconductor Solutions Corporation (SSS) Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 59. Infineon Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 60. NXP Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 61. Analog Devices, Inc. (ADI) Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 62. Renesas Electronics Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 63. Microchip Technology Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 64. Onsemi Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 65. NVIDIA Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 66. Qualcomm Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 67. Broadcom Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 68. Advanced Micro Devices, Inc. (AMD) Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 69. MediaTek Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 70. Marvell Technology Group Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 71. Novatek Microelectronics Corp. Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 72. Tsinghua Unigroup Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 73. Realtek Semiconductor Corporation Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 74. OmniVision Technology, Inc Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 75. Monolithic Power Systems, Inc. (MPS) Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 76. Cirrus Logic, Inc. Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 77. Socionext Inc. Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 78. LX Semicon Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 79. HiSilicon Technologies Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 80. TSMC Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 81. Samsung Foundry Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 82. GlobalFoundries Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 83. United Microelectronics Corporation (UMC) Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 84. SMIC Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 85. Tower Semiconductor Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 86. PSMC Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 87. VIS (Vanguard International Semiconductor) Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 88. Hua Hong Semiconductor Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 89. HLMC Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 90. ASE (SPIL) Revenue Growth Rate in Semiconductor IC Design, Manufacturing, Packaging and Testing Business (2019-2024)

Figure 91. Bottom-up and Top-down Approaches for This Report

Figure 92. Data Triangulation

Figure 93. Key Executives Interviewed

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