ABOUT US
CONTACT US
FAQ
PRIVACY POLICY
REFUND AND CANCELLATION
BLOGS
COMPANIES
REPORTS
0
U.S. (TOLL FREE)
+1 (315) 215-3225
Automative
0
U.S. (TOLL FREE)
+1 (315) 215-3225
Global Dual in-Line Package (DIP) Socket Market Research Report 2025
Published Date: February 2025
|
Report Code: QYRE-Auto-34B12201
Home | Market Reports | Computers & Electronics| Electronics & Electrical| Electronic Components
Global Dual in Line Package DIP Socket Market Research Report 2022
BUY CHAPTERS

Global Dual in-Line Package (DIP) Socket Market Research Report 2025

Code: QYRE-Auto-34B12201
Report
February 2025
Pages:98
QYResearch
Buy Now with 15% Discount
DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
TE Connectivity
3M
Aries Electronics
Preci-Dip
Mill-Max
Amphenol
Harwin
Molex
Samtec
Omron
Yamaichi Electronics

Dual in-Line Package (DIP) Socket Market Size

The global market for Dual in-Line Package (DIP) Socket was valued at US$ 1050 million in the year 2024 and is projected to reach a revised size of US$ 1686 million by 2031, growing at a CAGR of 7.1% during the forecast period.

Dual in-Line Package (DIP) Socket Market

Dual in-Line Package (DIP) Socket Market

A DIP socket is an electronic accessory used to mount dual in-line package (DIP) components on printed circuit boards (PCBs). These sockets are either square or rectangular in shape and feature two rows of pins on the underside of the socket connected to corresponding push-in mountings on the upper side. The pins are placed through holes in the PCB and soldered onto the tracks etched into the board surface. The component is then pushed into the socket mounting points, securing a good electrical connection between it and the board circuit. The DIP socket is typically used to facilitate easy, non-destructive replacement of DIP components, and are available in single unit form or in strips, which can be cut to size as required.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Dual in-Line Package (DIP) Socket, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Dual in-Line Package (DIP) Socket.
The Dual in-Line Package (DIP) Socket market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Dual in-Line Package (DIP) Socket market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Dual in-Line Package (DIP) Socket manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Dual in-Line Package (DIP) Socket Market Report

Report Metric Details
Report Name Dual in-Line Package (DIP) Socket Market
Accounted market size in year US$ 1050 million
Forecasted market size in 2031 US$ 1686 million
CAGR 7.1%
Base Year year
Forecasted years 2025 - 2031
by Type
  • Open-Frame Styles
  • Closed-Frame Styles
by Application
  • Consumer Electronics
  • Automotive
  • Defense
  • Medical
  • Other
Production by Region
  • North America
  • Europe
  • China
  • Japan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company TE Connectivity, 3M, Aries Electronics, Preci-dip, Mill-Max, Amphenol, Harwin, Molex, Samtec, Omron, Yamaichi Electronics
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Dual in-Line Package (DIP) Socket manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Dual in-Line Package (DIP) Socket by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Dual in-Line Package (DIP) Socket in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Dual in-Line Package (DIP) Socket Market growing?

Ans: The Dual in-Line Package (DIP) Socket Market witnessing a CAGR of 7.1% during the forecast period 2025-2031.

What is the Dual in-Line Package (DIP) Socket Market size in 2031?

Ans: The Dual in-Line Package (DIP) Socket Market size in 2031 will be US$ 1686 million.

Who are the main players in the Dual in-Line Package (DIP) Socket Market report?

Ans: The main players in the Dual in-Line Package (DIP) Socket Market are TE Connectivity, 3M, Aries Electronics, Preci-dip, Mill-Max, Amphenol, Harwin, Molex, Samtec, Omron, Yamaichi Electronics

What are the Application segmentation covered in the Dual in-Line Package (DIP) Socket Market report?

Ans: The Applications covered in the Dual in-Line Package (DIP) Socket Market report are Consumer Electronics, Automotive, Defense, Medical, Other

What are the Type segmentation covered in the Dual in-Line Package (DIP) Socket Market report?

Ans: The Types covered in the Dual in-Line Package (DIP) Socket Market report are Open-Frame Styles, Closed-Frame Styles

Recommended Reports

Semiconductor Packaging

Analog & Interface ICs

Test & Substrates

1 Dual in-Line Package (DIP) Socket Market Overview
1.1 Product Definition
1.2 Dual in-Line Package (DIP) Socket by Type
1.2.1 Global Dual in-Line Package (DIP) Socket Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Open-Frame Styles
1.2.3 Closed-Frame Styles
1.3 Dual in-Line Package (DIP) Socket by Application
1.3.1 Global Dual in-Line Package (DIP) Socket Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Defense
1.3.5 Medical
1.3.6 Other
1.4 Global Market Growth Prospects
1.4.1 Global Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Dual in-Line Package (DIP) Socket Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Dual in-Line Package (DIP) Socket Production Estimates and Forecasts (2020-2031)
1.4.4 Global Dual in-Line Package (DIP) Socket Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Dual in-Line Package (DIP) Socket Production Market Share by Manufacturers (2020-2025)
2.2 Global Dual in-Line Package (DIP) Socket Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Dual in-Line Package (DIP) Socket, Industry Ranking, 2023 VS 2024
2.4 Global Dual in-Line Package (DIP) Socket Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Dual in-Line Package (DIP) Socket Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Product Offered and Application
2.8 Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Date of Enter into This Industry
2.9 Dual in-Line Package (DIP) Socket Market Competitive Situation and Trends
2.9.1 Dual in-Line Package (DIP) Socket Market Concentration Rate
2.9.2 Global 5 and 10 Largest Dual in-Line Package (DIP) Socket Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Dual in-Line Package (DIP) Socket Production by Region
3.1 Global Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Dual in-Line Package (DIP) Socket Production Value by Region (2020-2031)
3.2.1 Global Dual in-Line Package (DIP) Socket Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Dual in-Line Package (DIP) Socket by Region (2026-2031)
3.3 Global Dual in-Line Package (DIP) Socket Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Dual in-Line Package (DIP) Socket Production Volume by Region (2020-2031)
3.4.1 Global Dual in-Line Package (DIP) Socket Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Dual in-Line Package (DIP) Socket by Region (2026-2031)
3.5 Global Dual in-Line Package (DIP) Socket Market Price Analysis by Region (2020-2025)
3.6 Global Dual in-Line Package (DIP) Socket Production and Value, Year-over-Year Growth
3.6.1 North America Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Dual in-Line Package (DIP) Socket Production Value Estimates and Forecasts (2020-2031)
4 Dual in-Line Package (DIP) Socket Consumption by Region
4.1 Global Dual in-Line Package (DIP) Socket Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Dual in-Line Package (DIP) Socket Consumption by Region (2020-2031)
4.2.1 Global Dual in-Line Package (DIP) Socket Consumption by Region (2020-2025)
4.2.2 Global Dual in-Line Package (DIP) Socket Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Dual in-Line Package (DIP) Socket Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Dual in-Line Package (DIP) Socket Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Dual in-Line Package (DIP) Socket Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Dual in-Line Package (DIP) Socket Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Dual in-Line Package (DIP) Socket Production by Type (2020-2031)
5.1.1 Global Dual in-Line Package (DIP) Socket Production by Type (2020-2025)
5.1.2 Global Dual in-Line Package (DIP) Socket Production by Type (2026-2031)
5.1.3 Global Dual in-Line Package (DIP) Socket Production Market Share by Type (2020-2031)
5.2 Global Dual in-Line Package (DIP) Socket Production Value by Type (2020-2031)
5.2.1 Global Dual in-Line Package (DIP) Socket Production Value by Type (2020-2025)
5.2.2 Global Dual in-Line Package (DIP) Socket Production Value by Type (2026-2031)
5.2.3 Global Dual in-Line Package (DIP) Socket Production Value Market Share by Type (2020-2031)
5.3 Global Dual in-Line Package (DIP) Socket Price by Type (2020-2031)
6 Segment by Application
6.1 Global Dual in-Line Package (DIP) Socket Production by Application (2020-2031)
6.1.1 Global Dual in-Line Package (DIP) Socket Production by Application (2020-2025)
6.1.2 Global Dual in-Line Package (DIP) Socket Production by Application (2026-2031)
6.1.3 Global Dual in-Line Package (DIP) Socket Production Market Share by Application (2020-2031)
6.2 Global Dual in-Line Package (DIP) Socket Production Value by Application (2020-2031)
6.2.1 Global Dual in-Line Package (DIP) Socket Production Value by Application (2020-2025)
6.2.2 Global Dual in-Line Package (DIP) Socket Production Value by Application (2026-2031)
6.2.3 Global Dual in-Line Package (DIP) Socket Production Value Market Share by Application (2020-2031)
6.3 Global Dual in-Line Package (DIP) Socket Price by Application (2020-2031)
7 Key Companies Profiled
7.1 TE Connectivity
7.1.1 TE Connectivity Dual in-Line Package (DIP) Socket Company Information
7.1.2 TE Connectivity Dual in-Line Package (DIP) Socket Product Portfolio
7.1.3 TE Connectivity Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.1.4 TE Connectivity Main Business and Markets Served
7.1.5 TE Connectivity Recent Developments/Updates
7.2 3M
7.2.1 3M Dual in-Line Package (DIP) Socket Company Information
7.2.2 3M Dual in-Line Package (DIP) Socket Product Portfolio
7.2.3 3M Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.2.4 3M Main Business and Markets Served
7.2.5 3M Recent Developments/Updates
7.3 Aries Electronics
7.3.1 Aries Electronics Dual in-Line Package (DIP) Socket Company Information
7.3.2 Aries Electronics Dual in-Line Package (DIP) Socket Product Portfolio
7.3.3 Aries Electronics Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Aries Electronics Main Business and Markets Served
7.3.5 Aries Electronics Recent Developments/Updates
7.4 Preci-dip
7.4.1 Preci-dip Dual in-Line Package (DIP) Socket Company Information
7.4.2 Preci-dip Dual in-Line Package (DIP) Socket Product Portfolio
7.4.3 Preci-dip Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Preci-dip Main Business and Markets Served
7.4.5 Preci-dip Recent Developments/Updates
7.5 Mill-Max
7.5.1 Mill-Max Dual in-Line Package (DIP) Socket Company Information
7.5.2 Mill-Max Dual in-Line Package (DIP) Socket Product Portfolio
7.5.3 Mill-Max Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Mill-Max Main Business and Markets Served
7.5.5 Mill-Max Recent Developments/Updates
7.6 Amphenol
7.6.1 Amphenol Dual in-Line Package (DIP) Socket Company Information
7.6.2 Amphenol Dual in-Line Package (DIP) Socket Product Portfolio
7.6.3 Amphenol Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Amphenol Main Business and Markets Served
7.6.5 Amphenol Recent Developments/Updates
7.7 Harwin
7.7.1 Harwin Dual in-Line Package (DIP) Socket Company Information
7.7.2 Harwin Dual in-Line Package (DIP) Socket Product Portfolio
7.7.3 Harwin Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Harwin Main Business and Markets Served
7.7.5 Harwin Recent Developments/Updates
7.8 Molex
7.8.1 Molex Dual in-Line Package (DIP) Socket Company Information
7.8.2 Molex Dual in-Line Package (DIP) Socket Product Portfolio
7.8.3 Molex Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Molex Main Business and Markets Served
7.8.5 Molex Recent Developments/Updates
7.9 Samtec
7.9.1 Samtec Dual in-Line Package (DIP) Socket Company Information
7.9.2 Samtec Dual in-Line Package (DIP) Socket Product Portfolio
7.9.3 Samtec Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Samtec Main Business and Markets Served
7.9.5 Samtec Recent Developments/Updates
7.10 Omron
7.10.1 Omron Dual in-Line Package (DIP) Socket Company Information
7.10.2 Omron Dual in-Line Package (DIP) Socket Product Portfolio
7.10.3 Omron Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Omron Main Business and Markets Served
7.10.5 Omron Recent Developments/Updates
7.11 Yamaichi Electronics
7.11.1 Yamaichi Electronics Dual in-Line Package (DIP) Socket Company Information
7.11.2 Yamaichi Electronics Dual in-Line Package (DIP) Socket Product Portfolio
7.11.3 Yamaichi Electronics Dual in-Line Package (DIP) Socket Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Yamaichi Electronics Main Business and Markets Served
7.11.5 Yamaichi Electronics Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Dual in-Line Package (DIP) Socket Industry Chain Analysis
8.2 Dual in-Line Package (DIP) Socket Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Dual in-Line Package (DIP) Socket Production Mode & Process Analysis
8.4 Dual in-Line Package (DIP) Socket Sales and Marketing
8.4.1 Dual in-Line Package (DIP) Socket Sales Channels
8.4.2 Dual in-Line Package (DIP) Socket Distributors
8.5 Dual in-Line Package (DIP) Socket Customer Analysis
9 Dual in-Line Package (DIP) Socket Market Dynamics
9.1 Dual in-Line Package (DIP) Socket Industry Trends
9.2 Dual in-Line Package (DIP) Socket Market Drivers
9.3 Dual in-Line Package (DIP) Socket Market Challenges
9.4 Dual in-Line Package (DIP) Socket Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
TE Connectivity
3M
Aries Electronics
Preci-Dip
Mill-Max
Amphenol
Harwin
Molex
Samtec
Omron
Yamaichi Electronics
List of Tables
 Table 1. Global Dual in-Line Package (DIP) Socket Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Dual in-Line Package (DIP) Socket Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Dual in-Line Package (DIP) Socket Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global Dual in-Line Package (DIP) Socket Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global Dual in-Line Package (DIP) Socket Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Dual in-Line Package (DIP) Socket Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Dual in-Line Package (DIP) Socket Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Dual in-Line Package (DIP) Socket, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Dual in-Line Package (DIP) Socket as of 2024)
 Table 10. Global Market Dual in-Line Package (DIP) Socket Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Product Offered and Application
 Table 13. Global Key Manufacturers of Dual in-Line Package (DIP) Socket, Date of Enter into This Industry
 Table 14. Global Dual in-Line Package (DIP) Socket Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Dual in-Line Package (DIP) Socket Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Dual in-Line Package (DIP) Socket Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Dual in-Line Package (DIP) Socket Production Value Market Share by Region (2020-2025)
 Table 19. Global Dual in-Line Package (DIP) Socket Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Dual in-Line Package (DIP) Socket Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Dual in-Line Package (DIP) Socket Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global Dual in-Line Package (DIP) Socket Production (K Units) by Region (2020-2025)
 Table 23. Global Dual in-Line Package (DIP) Socket Production Market Share by Region (2020-2025)
 Table 24. Global Dual in-Line Package (DIP) Socket Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global Dual in-Line Package (DIP) Socket Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Dual in-Line Package (DIP) Socket Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global Dual in-Line Package (DIP) Socket Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global Dual in-Line Package (DIP) Socket Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global Dual in-Line Package (DIP) Socket Consumption by Region (2020-2025) & (K Units)
 Table 30. Global Dual in-Line Package (DIP) Socket Consumption Market Share by Region (2020-2025)
 Table 31. Global Dual in-Line Package (DIP) Socket Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global Dual in-Line Package (DIP) Socket Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America Dual in-Line Package (DIP) Socket Consumption by Country (2020-2025) & (K Units)
 Table 35. North America Dual in-Line Package (DIP) Socket Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe Dual in-Line Package (DIP) Socket Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe Dual in-Line Package (DIP) Socket Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific Dual in-Line Package (DIP) Socket Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific Dual in-Line Package (DIP) Socket Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific Dual in-Line Package (DIP) Socket Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption by Country (2026-2031) & (K Units)
 Table 45. Global Dual in-Line Package (DIP) Socket Production (K Units) by Type (2020-2025)
 Table 46. Global Dual in-Line Package (DIP) Socket Production (K Units) by Type (2026-2031)
 Table 47. Global Dual in-Line Package (DIP) Socket Production Market Share by Type (2020-2025)
 Table 48. Global Dual in-Line Package (DIP) Socket Production Market Share by Type (2026-2031)
 Table 49. Global Dual in-Line Package (DIP) Socket Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Dual in-Line Package (DIP) Socket Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Dual in-Line Package (DIP) Socket Production Value Market Share by Type (2020-2025)
 Table 52. Global Dual in-Line Package (DIP) Socket Production Value Market Share by Type (2026-2031)
 Table 53. Global Dual in-Line Package (DIP) Socket Price (US$/Unit) by Type (2020-2025)
 Table 54. Global Dual in-Line Package (DIP) Socket Price (US$/Unit) by Type (2026-2031)
 Table 55. Global Dual in-Line Package (DIP) Socket Production (K Units) by Application (2020-2025)
 Table 56. Global Dual in-Line Package (DIP) Socket Production (K Units) by Application (2026-2031)
 Table 57. Global Dual in-Line Package (DIP) Socket Production Market Share by Application (2020-2025)
 Table 58. Global Dual in-Line Package (DIP) Socket Production Market Share by Application (2026-2031)
 Table 59. Global Dual in-Line Package (DIP) Socket Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Dual in-Line Package (DIP) Socket Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Dual in-Line Package (DIP) Socket Production Value Market Share by Application (2020-2025)
 Table 62. Global Dual in-Line Package (DIP) Socket Production Value Market Share by Application (2026-2031)
 Table 63. Global Dual in-Line Package (DIP) Socket Price (US$/Unit) by Application (2020-2025)
 Table 64. Global Dual in-Line Package (DIP) Socket Price (US$/Unit) by Application (2026-2031)
 Table 65. TE Connectivity Dual in-Line Package (DIP) Socket Company Information
 Table 66. TE Connectivity Dual in-Line Package (DIP) Socket Specification and Application
 Table 67. TE Connectivity Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. TE Connectivity Main Business and Markets Served
 Table 69. TE Connectivity Recent Developments/Updates
 Table 70. 3M Dual in-Line Package (DIP) Socket Company Information
 Table 71. 3M Dual in-Line Package (DIP) Socket Specification and Application
 Table 72. 3M Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. 3M Main Business and Markets Served
 Table 74. 3M Recent Developments/Updates
 Table 75. Aries Electronics Dual in-Line Package (DIP) Socket Company Information
 Table 76. Aries Electronics Dual in-Line Package (DIP) Socket Specification and Application
 Table 77. Aries Electronics Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. Aries Electronics Main Business and Markets Served
 Table 79. Aries Electronics Recent Developments/Updates
 Table 80. Preci-dip Dual in-Line Package (DIP) Socket Company Information
 Table 81. Preci-dip Dual in-Line Package (DIP) Socket Specification and Application
 Table 82. Preci-dip Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. Preci-dip Main Business and Markets Served
 Table 84. Preci-dip Recent Developments/Updates
 Table 85. Mill-Max Dual in-Line Package (DIP) Socket Company Information
 Table 86. Mill-Max Dual in-Line Package (DIP) Socket Specification and Application
 Table 87. Mill-Max Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. Mill-Max Main Business and Markets Served
 Table 89. Mill-Max Recent Developments/Updates
 Table 90. Amphenol Dual in-Line Package (DIP) Socket Company Information
 Table 91. Amphenol Dual in-Line Package (DIP) Socket Specification and Application
 Table 92. Amphenol Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. Amphenol Main Business and Markets Served
 Table 94. Amphenol Recent Developments/Updates
 Table 95. Harwin Dual in-Line Package (DIP) Socket Company Information
 Table 96. Harwin Dual in-Line Package (DIP) Socket Specification and Application
 Table 97. Harwin Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. Harwin Main Business and Markets Served
 Table 99. Harwin Recent Developments/Updates
 Table 100. Molex Dual in-Line Package (DIP) Socket Company Information
 Table 101. Molex Dual in-Line Package (DIP) Socket Specification and Application
 Table 102. Molex Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 103. Molex Main Business and Markets Served
 Table 104. Molex Recent Developments/Updates
 Table 105. Samtec Dual in-Line Package (DIP) Socket Company Information
 Table 106. Samtec Dual in-Line Package (DIP) Socket Specification and Application
 Table 107. Samtec Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 108. Samtec Main Business and Markets Served
 Table 109. Samtec Recent Developments/Updates
 Table 110. Omron Dual in-Line Package (DIP) Socket Company Information
 Table 111. Omron Dual in-Line Package (DIP) Socket Specification and Application
 Table 112. Omron Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 113. Omron Main Business and Markets Served
 Table 114. Omron Recent Developments/Updates
 Table 115. Yamaichi Electronics Dual in-Line Package (DIP) Socket Company Information
 Table 116. Yamaichi Electronics Dual in-Line Package (DIP) Socket Specification and Application
 Table 117. Yamaichi Electronics Dual in-Line Package (DIP) Socket Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 118. Yamaichi Electronics Main Business and Markets Served
 Table 119. Yamaichi Electronics Recent Developments/Updates
 Table 120. Key Raw Materials Lists
 Table 121. Raw Materials Key Suppliers Lists
 Table 122. Dual in-Line Package (DIP) Socket Distributors List
 Table 123. Dual in-Line Package (DIP) Socket Customers List
 Table 124. Dual in-Line Package (DIP) Socket Market Trends
 Table 125. Dual in-Line Package (DIP) Socket Market Drivers
 Table 126. Dual in-Line Package (DIP) Socket Market Challenges
 Table 127. Dual in-Line Package (DIP) Socket Market Restraints
 Table 128. Research Programs/Design for This Report
 Table 129. Key Data Information from Secondary Sources
 Table 130. Key Data Information from Primary Sources
 Table 131. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Dual in-Line Package (DIP) Socket
 Figure 2. Global Dual in-Line Package (DIP) Socket Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Dual in-Line Package (DIP) Socket Market Share by Type: 2024 VS 2031
 Figure 4. Open-Frame Styles Product Picture
 Figure 5. Closed-Frame Styles Product Picture
 Figure 6. Global Dual in-Line Package (DIP) Socket Market Value by Application, (US$ Million) & (2020-2031)
 Figure 7. Global Dual in-Line Package (DIP) Socket Market Share by Application: 2024 VS 2031
 Figure 8. Consumer Electronics
 Figure 9. Automotive
 Figure 10. Defense
 Figure 11. Medical
 Figure 12. Other
 Figure 13. Global Dual in-Line Package (DIP) Socket Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 14. Global Dual in-Line Package (DIP) Socket Production Value (US$ Million) & (2020-2031)
 Figure 15. Global Dual in-Line Package (DIP) Socket Production Capacity (K Units) & (2020-2031)
 Figure 16. Global Dual in-Line Package (DIP) Socket Production (K Units) & (2020-2031)
 Figure 17. Global Dual in-Line Package (DIP) Socket Average Price (US$/Unit) & (2020-2031)
 Figure 18. Dual in-Line Package (DIP) Socket Report Years Considered
 Figure 19. Dual in-Line Package (DIP) Socket Production Share by Manufacturers in 2024
 Figure 20. Global Dual in-Line Package (DIP) Socket Production Value Share by Manufacturers (2024)
 Figure 21. Dual in-Line Package (DIP) Socket Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 22. The Global 5 and 10 Largest Players: Market Share by Dual in-Line Package (DIP) Socket Revenue in 2024
 Figure 23. Global Dual in-Line Package (DIP) Socket Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 24. Global Dual in-Line Package (DIP) Socket Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 25. Global Dual in-Line Package (DIP) Socket Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 26. Global Dual in-Line Package (DIP) Socket Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 27. North America Dual in-Line Package (DIP) Socket Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. Europe Dual in-Line Package (DIP) Socket Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. China Dual in-Line Package (DIP) Socket Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Japan Dual in-Line Package (DIP) Socket Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. Global Dual in-Line Package (DIP) Socket Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 32. Global Dual in-Line Package (DIP) Socket Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 33. North America Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 34. North America Dual in-Line Package (DIP) Socket Consumption Market Share by Country (2020-2031)
 Figure 35. U.S. Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 36. Canada Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 37. Europe Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 38. Europe Dual in-Line Package (DIP) Socket Consumption Market Share by Country (2020-2031)
 Figure 39. Germany Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 40. France Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 41. U.K. Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 42. Italy Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. Netherlands Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. Asia Pacific Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. Asia Pacific Dual in-Line Package (DIP) Socket Consumption Market Share by Region (2020-2031)
 Figure 46. China Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Japan Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 48. South Korea Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 49. China Taiwan Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. Southeast Asia Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 51. India Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. Latin America, Middle East & Africa Dual in-Line Package (DIP) Socket Consumption Market Share by Country (2020-2031)
 Figure 54. Mexico Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Brazil Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 56. Turkey Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 57. GCC Countries Dual in-Line Package (DIP) Socket Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 58. Global Production Market Share of Dual in-Line Package (DIP) Socket by Type (2020-2031)
 Figure 59. Global Production Value Market Share of Dual in-Line Package (DIP) Socket by Type (2020-2031)
 Figure 60. Global Dual in-Line Package (DIP) Socket Price (US$/Unit) by Type (2020-2031)
 Figure 61. Global Production Market Share of Dual in-Line Package (DIP) Socket by Application (2020-2031)
 Figure 62. Global Production Value Market Share of Dual in-Line Package (DIP) Socket by Application (2020-2031)
 Figure 63. Global Dual in-Line Package (DIP) Socket Price (US$/Unit) by Application (2020-2031)
 Figure 64. Dual in-Line Package (DIP) Socket Value Chain
 Figure 65. Channels of Distribution (Direct Vs Distribution)
 Figure 66. Bottom-up and Top-down Approaches for This Report
 Figure 67. Data Triangulation
SELECT A FORMAT
Added to Cart
Electronic (PDF)

$2900

This license allows only one user to access the PDF.
Electronic (PDF)

$4350

This license allows 1 - 5 user to access the PDF, license is suitable for small groups of 5 users working together
Electronic (PDF)

$5800

This license allows users/teams in a same Enterprise to use this report, various departments within an enterpise can use this report
Add to Cart
Buy Now (15% Discount)
INQUIRE FOR DISCOUNT

HAVE A QUERY?

INQUIRE ABOUT REPORT EMAIL US

OUR CUSTOMER

Nano String

SIMILAR REPORTS

Global Surface Mount DIP Switches Market Research Report 2024
Global Dual in line Memory Module Sockets Market Insights Forecast to 2030
Global Semiconductor Test and Burn In Sockets Market Research Report 2025
Global Semiconductor Chip Packaging Test Socket Market Research Report 2025
Global Test Burn in Socket Market Research Report 2024
Global DIP Socket Market Research Report 2025
DIP IC Socket Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030
Global Dual in Line Package Sockets Market Insights Forecast to 2030
Global DIP Switches Market Insights Forecast to 2030
Global Rocker DIP Switches Market Research Report 2025
Global Through Hole Mount DIP Switches Market Research Report 2024
Dual Inline Package Switches Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030
Manual Electronic DIP Switches Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030
Global Integrated Circuit Sockets Market Research Report 2024
Global DIP SIP Switches Market Insights Forecast to 2030
Global DIP Microcontroller Socket Market Research Report 2024
Global Test and Burn in Sockets Market Insights Forecast to 2030
Global SMT PCBA Market Research Report 2024
Global Semiconductor IC Test Sockets Market Research Report 2025
Global DIP Crystal Resonator Market Research Report 2024

RELATED REPORTS

Global PC-Based Motion Controller for Semiconductor Market Research Report 2025

120 Pages
Type: Report
Code: QYRE-Auto-22K17724
Fri Sep 12 00:00:00 UTC 2025

Add to Cart

Global Printed Circuit Borard (PCB) Design Software Market Research Report 2025

120 Pages
Type: Report
Code: QYRE-Auto-2Z2096
Fri Sep 12 00:00:00 UTC 2025

Add to Cart

Global Semiconductor Spintronics Market Research Report 2025

120 Pages
Type: Report
Code: QYRE-Auto-17L3332
Thu Sep 11 00:00:00 UTC 2025

Add to Cart

Global Spintronics Market Research Report 2025

120 Pages
Type: Report
Code: QYRE-Auto-4I2028
Thu Sep 11 00:00:00 UTC 2025

Add to Cart

Call
Buy Now
REQUEST FREE SAMPLE REPORT
Support Contacts
U.S. (TOLL FREE)
+1 (425) 388-2538
THE COMPANY
OUR PRODUCTS
CUSTOMER SUPPORT
POLICES
THE COMPANY
CUSTOMER SUPPORT
OUR PRODUCTS
POLICES
Copyright © 2018 Valuates.com. All Rights Reserved.
Sitemap - Privacy Policy - Terms & Conditions