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Global SiC Wafer Laser Cutting Equipment Market Research Report 2025

Published Date: March 2025

Report Code: QYRE-Auto-36G11188

Global SiC Wafer Laser Cutting Equipment Market Research Report 2022

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Global SiC Wafer Laser Cutting Equipment Market Research Report 2025

Code: QYRE-Auto-36G11188

Report

March 2025

Pages:95

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

DISCO Corporation

Suzhou Delphi Laser Co

Han’s Laser Technology

3D Micromac

Synova

HGTECH

ASMPT

GHN.GIE

Wuhan DR Laser Technology

SiC Wafer Laser Cutting Equipment Market Size

The global market for SiC Wafer Laser Cutting Equipment was valued at US$ 138 million in the year 2024 and is projected to reach a revised size of US$ 392 million by 2031, growing at a CAGR of 16.3% during the forecast period.

SiC Wafer Laser Cutting Equipment Market

Silicon carbide (SiC) was discovered in 1893 as an industrial abrasive for grinding wheels and automotive brakes. The scheme of laser cutting silicon carbide is laser modified cutting technology. The principle is to use a laser beam with a high transmission wavelength to focus on the inside of the wafer through a lens, and multiphoton absorption occurs, resulting in a local deformation layer, namely modified layer. The layer is mainly composed of holes, high dislocation density layers and cracks. The modified layer is the starting point of subsequent wafer dicing and cracking. The modified layer can be confined inside the wafer by optimizing the laser and optical path system, and no thermal damage is caused to the surface and bottom of the wafer. Then, use external force to guide the cracks to the surface and bottom of the wafer, separating the wafer into the required size.

Global key players of SiC wafer laser cutting equipment include DISCO Corporation, SuZhou Delphi Laser and Han"s Laser, etc. The top three players hold a share over 60%.From the perspective of consumption value by region，Asia-Pacific (excluding China) is the largest market of SiC wafer laser cutting equipment, followed by China, North America, and Europe. In terms of type, processing sizes up to 6 Inches account for more than 75% of the market share. In terms of application, foundry has a share over 60 %.

Report Scope

This report aims to provide a comprehensive presentation of the global market for SiC Wafer Laser Cutting Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Laser Cutting Equipment.

The SiC Wafer Laser Cutting Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global SiC Wafer Laser Cutting Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the SiC Wafer Laser Cutting Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of SiC Wafer Laser Cutting Equipment Market Report

Report Metric	Details
Report Name	SiC Wafer Laser Cutting Equipment Market
Accounted market size in year	US$ 138 million
Forecasted market size in 2031	US$ 392 million
CAGR	16.3%
Base Year	year
Forecasted years	2025 - 2031
by Type	Processing Sizes up to 6 Inches Processing Sizes up to 8 Inches
by Application	Foundry IDM
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	DISCO Corporation, Suzhou Delphi Laser Co, Han's Laser Technology, 3D-Micromac, Synova S.A., HGTECH, ASMPT, GHN.GIE, Wuhan DR Laser Technology
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of SiC Wafer Laser Cutting Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of SiC Wafer Laser Cutting Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of SiC Wafer Laser Cutting Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is SiC Wafer Laser Cutting Equipment Market growing?

Ans: The SiC Wafer Laser Cutting Equipment Market witnessing a CAGR of 16.3% during the forecast period 2025-2031.

What is the SiC Wafer Laser Cutting Equipment Market size in 2031?

Ans: The SiC Wafer Laser Cutting Equipment Market size in 2031 will be US$ 392 million.

What is the SiC Wafer Laser Cutting Equipment Market share by type?

Ans: In terms of type, processing sizes up to 6 Inches account for more than 75% of the market share.

What is the SiC Wafer Laser Cutting Equipment Market share by application?

Ans: In terms of application, foundry has a share over 60 %.

Who are the main players in the SiC Wafer Laser Cutting Equipment Market report?

Ans: The main players in the SiC Wafer Laser Cutting Equipment Market are DISCO Corporation, Suzhou Delphi Laser Co, Han's Laser Technology, 3D-Micromac, Synova S.A., HGTECH, ASMPT, GHN.GIE, Wuhan DR Laser Technology

What are the Application segmentation covered in the SiC Wafer Laser Cutting Equipment Market report?

Ans: The Applications covered in the SiC Wafer Laser Cutting Equipment Market report are Foundry, IDM

What are the Type segmentation covered in the SiC Wafer Laser Cutting Equipment Market report?

Ans: The Types covered in the SiC Wafer Laser Cutting Equipment Market report are Processing Sizes up to 6 Inches, Processing Sizes up to 8 Inches

Recommended Reports

SiC Wafer Equipment

Semiconductor Lasers & Cutting

SiC Materials & Devices

1 SiC Wafer Laser Cutting Equipment Market Overview

1.1 Product Definition

1.2 SiC Wafer Laser Cutting Equipment by Type

1.2.1 Global SiC Wafer Laser Cutting Equipment Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Processing Sizes up to 6 Inches

1.2.3 Processing Sizes up to 8 Inches

1.3 SiC Wafer Laser Cutting Equipment by Application

1.3.1 Global SiC Wafer Laser Cutting Equipment Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 Foundry

1.3.3 IDM

1.4 Global Market Growth Prospects

1.4.1 Global SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global SiC Wafer Laser Cutting Equipment Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global SiC Wafer Laser Cutting Equipment Production Estimates and Forecasts (2020-2031)

1.4.4 Global SiC Wafer Laser Cutting Equipment Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global SiC Wafer Laser Cutting Equipment Production Market Share by Manufacturers (2020-2025)

2.2 Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of SiC Wafer Laser Cutting Equipment, Industry Ranking, 2023 VS 2024

2.4 Global SiC Wafer Laser Cutting Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global SiC Wafer Laser Cutting Equipment Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Product Offered and Application

2.8 Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Date of Enter into This Industry

2.9 SiC Wafer Laser Cutting Equipment Market Competitive Situation and Trends

2.9.1 SiC Wafer Laser Cutting Equipment Market Concentration Rate

2.9.2 Global 5 and 10 Largest SiC Wafer Laser Cutting Equipment Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 SiC Wafer Laser Cutting Equipment Production by Region

3.1 Global SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global SiC Wafer Laser Cutting Equipment Production Value by Region (2020-2031)

3.2.1 Global SiC Wafer Laser Cutting Equipment Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of SiC Wafer Laser Cutting Equipment by Region (2026-2031)

3.3 Global SiC Wafer Laser Cutting Equipment Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global SiC Wafer Laser Cutting Equipment Production Volume by Region (2020-2031)

3.4.1 Global SiC Wafer Laser Cutting Equipment Production by Region (2020-2025)

3.4.2 Global Forecasted Production of SiC Wafer Laser Cutting Equipment by Region (2026-2031)

3.5 Global SiC Wafer Laser Cutting Equipment Market Price Analysis by Region (2020-2025)

3.6 Global SiC Wafer Laser Cutting Equipment Production and Value, Year-over-Year Growth

3.6.1 North America SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.3 China SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2020-2031)

4 SiC Wafer Laser Cutting Equipment Consumption by Region

4.1 Global SiC Wafer Laser Cutting Equipment Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global SiC Wafer Laser Cutting Equipment Consumption by Region (2020-2031)

4.2.1 Global SiC Wafer Laser Cutting Equipment Consumption by Region (2020-2025)

4.2.2 Global SiC Wafer Laser Cutting Equipment Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific SiC Wafer Laser Cutting Equipment Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global SiC Wafer Laser Cutting Equipment Production by Type (2020-2031)

5.1.1 Global SiC Wafer Laser Cutting Equipment Production by Type (2020-2025)

5.1.2 Global SiC Wafer Laser Cutting Equipment Production by Type (2026-2031)

5.1.3 Global SiC Wafer Laser Cutting Equipment Production Market Share by Type (2020-2031)

5.2 Global SiC Wafer Laser Cutting Equipment Production Value by Type (2020-2031)

5.2.1 Global SiC Wafer Laser Cutting Equipment Production Value by Type (2020-2025)

5.2.2 Global SiC Wafer Laser Cutting Equipment Production Value by Type (2026-2031)

5.2.3 Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Type (2020-2031)

5.3 Global SiC Wafer Laser Cutting Equipment Price by Type (2020-2031)

6 Segment by Application

6.1 Global SiC Wafer Laser Cutting Equipment Production by Application (2020-2031)

6.1.1 Global SiC Wafer Laser Cutting Equipment Production by Application (2020-2025)

6.1.2 Global SiC Wafer Laser Cutting Equipment Production by Application (2026-2031)

6.1.3 Global SiC Wafer Laser Cutting Equipment Production Market Share by Application (2020-2031)

6.2 Global SiC Wafer Laser Cutting Equipment Production Value by Application (2020-2031)

6.2.1 Global SiC Wafer Laser Cutting Equipment Production Value by Application (2020-2025)

6.2.2 Global SiC Wafer Laser Cutting Equipment Production Value by Application (2026-2031)

6.2.3 Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Application (2020-2031)

6.3 Global SiC Wafer Laser Cutting Equipment Price by Application (2020-2031)

7 Key Companies Profiled

7.1 DISCO Corporation

7.1.1 DISCO Corporation SiC Wafer Laser Cutting Equipment Company Information

7.1.2 DISCO Corporation SiC Wafer Laser Cutting Equipment Product Portfolio

7.1.3 DISCO Corporation SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.1.4 DISCO Corporation Main Business and Markets Served

7.1.5 DISCO Corporation Recent Developments/Updates

7.2 Suzhou Delphi Laser Co

7.2.1 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Company Information

7.2.2 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Product Portfolio

7.2.3 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.2.4 Suzhou Delphi Laser Co Main Business and Markets Served

7.2.5 Suzhou Delphi Laser Co Recent Developments/Updates

7.3 Han's Laser Technology

7.3.1 Han's Laser Technology SiC Wafer Laser Cutting Equipment Company Information

7.3.2 Han's Laser Technology SiC Wafer Laser Cutting Equipment Product Portfolio

7.3.3 Han's Laser Technology SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.3.4 Han's Laser Technology Main Business and Markets Served

7.3.5 Han's Laser Technology Recent Developments/Updates

7.4 3D-Micromac

7.4.1 3D-Micromac SiC Wafer Laser Cutting Equipment Company Information

7.4.2 3D-Micromac SiC Wafer Laser Cutting Equipment Product Portfolio

7.4.3 3D-Micromac SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.4.4 3D-Micromac Main Business and Markets Served

7.4.5 3D-Micromac Recent Developments/Updates

7.5 Synova S.A.

7.5.1 Synova S.A. SiC Wafer Laser Cutting Equipment Company Information

7.5.2 Synova S.A. SiC Wafer Laser Cutting Equipment Product Portfolio

7.5.3 Synova S.A. SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.5.4 Synova S.A. Main Business and Markets Served

7.5.5 Synova S.A. Recent Developments/Updates

7.6 HGTECH

7.6.1 HGTECH SiC Wafer Laser Cutting Equipment Company Information

7.6.2 HGTECH SiC Wafer Laser Cutting Equipment Product Portfolio

7.6.3 HGTECH SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.6.4 HGTECH Main Business and Markets Served

7.6.5 HGTECH Recent Developments/Updates

7.7 ASMPT

7.7.1 ASMPT SiC Wafer Laser Cutting Equipment Company Information

7.7.2 ASMPT SiC Wafer Laser Cutting Equipment Product Portfolio

7.7.3 ASMPT SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.7.4 ASMPT Main Business and Markets Served

7.7.5 ASMPT Recent Developments/Updates

7.8 GHN.GIE

7.8.1 GHN.GIE SiC Wafer Laser Cutting Equipment Company Information

7.8.2 GHN.GIE SiC Wafer Laser Cutting Equipment Product Portfolio

7.8.3 GHN.GIE SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.8.4 GHN.GIE Main Business and Markets Served

7.8.5 GHN.GIE Recent Developments/Updates

7.9 Wuhan DR Laser Technology

7.9.1 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Company Information

7.9.2 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Product Portfolio

7.9.3 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Wuhan DR Laser Technology Main Business and Markets Served

7.9.5 Wuhan DR Laser Technology Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 SiC Wafer Laser Cutting Equipment Industry Chain Analysis

8.2 SiC Wafer Laser Cutting Equipment Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 SiC Wafer Laser Cutting Equipment Production Mode & Process Analysis

8.4 SiC Wafer Laser Cutting Equipment Sales and Marketing

8.4.1 SiC Wafer Laser Cutting Equipment Sales Channels

8.4.2 SiC Wafer Laser Cutting Equipment Distributors

8.5 SiC Wafer Laser Cutting Equipment Customer Analysis

9 SiC Wafer Laser Cutting Equipment Market Dynamics

9.1 SiC Wafer Laser Cutting Equipment Industry Trends

9.2 SiC Wafer Laser Cutting Equipment Market Drivers

9.3 SiC Wafer Laser Cutting Equipment Market Challenges

9.4 SiC Wafer Laser Cutting Equipment Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

DISCO Corporation

Suzhou Delphi Laser Co

Han’s Laser Technology

3D Micromac

Synova

HGTECH

ASMPT

GHN.GIE

Wuhan DR Laser Technology

List of Tables

Table 1. Global SiC Wafer Laser Cutting Equipment Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global SiC Wafer Laser Cutting Equipment Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global SiC Wafer Laser Cutting Equipment Production Capacity (Units) by Manufacturers in 2024

Table 4. Global SiC Wafer Laser Cutting Equipment Production by Manufacturers (2020-2025) & (Units)

Table 5. Global SiC Wafer Laser Cutting Equipment Production Market Share by Manufacturers (2020-2025)

Table 6. Global SiC Wafer Laser Cutting Equipment Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global SiC Wafer Laser Cutting Equipment Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of SiC Wafer Laser Cutting Equipment, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in SiC Wafer Laser Cutting Equipment as of 2024)

Table 10. Global Market SiC Wafer Laser Cutting Equipment Average Price by Manufacturers (US$/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Product Offered and Application

Table 13. Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Date of Enter into This Industry

Table 14. Global SiC Wafer Laser Cutting Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global SiC Wafer Laser Cutting Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global SiC Wafer Laser Cutting Equipment Production Value (US$ Million) by Region (2020-2025)

Table 18. Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Region (2020-2025)

Table 19. Global SiC Wafer Laser Cutting Equipment Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global SiC Wafer Laser Cutting Equipment Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global SiC Wafer Laser Cutting Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Table 22. Global SiC Wafer Laser Cutting Equipment Production (Units) by Region (2020-2025)

Table 23. Global SiC Wafer Laser Cutting Equipment Production Market Share by Region (2020-2025)

Table 24. Global SiC Wafer Laser Cutting Equipment Production (Units) Forecast by Region (2026-2031)

Table 25. Global SiC Wafer Laser Cutting Equipment Production Market Share Forecast by Region (2026-2031)

Table 26. Global SiC Wafer Laser Cutting Equipment Market Average Price (US$/Unit) by Region (2020-2025)

Table 27. Global SiC Wafer Laser Cutting Equipment Market Average Price (US$/Unit) by Region (2026-2031)

Table 28. Global SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 29. Global SiC Wafer Laser Cutting Equipment Consumption by Region (2020-2025) & (Units)

Table 30. Global SiC Wafer Laser Cutting Equipment Consumption Market Share by Region (2020-2025)

Table 31. Global SiC Wafer Laser Cutting Equipment Forecasted Consumption by Region (2026-2031) & (Units)

Table 32. Global SiC Wafer Laser Cutting Equipment Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 34. North America SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2025) & (Units)

Table 35. North America SiC Wafer Laser Cutting Equipment Consumption by Country (2026-2031) & (Units)

Table 36. Europe SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 37. Europe SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2025) & (Units)

Table 38. Europe SiC Wafer Laser Cutting Equipment Consumption by Country (2026-2031) & (Units)

Table 39. Asia Pacific SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 40. Asia Pacific SiC Wafer Laser Cutting Equipment Consumption by Region (2020-2025) & (Units)

Table 41. Asia Pacific SiC Wafer Laser Cutting Equipment Consumption by Region (2026-2031) & (Units)

Table 42. Latin America, Middle East & Africa SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 43. Latin America, Middle East & Africa SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2025) & (Units)

Table 44. Latin America, Middle East & Africa SiC Wafer Laser Cutting Equipment Consumption by Country (2026-2031) & (Units)

Table 45. Global SiC Wafer Laser Cutting Equipment Production (Units) by Type (2020-2025)

Table 46. Global SiC Wafer Laser Cutting Equipment Production (Units) by Type (2026-2031)

Table 47. Global SiC Wafer Laser Cutting Equipment Production Market Share by Type (2020-2025)

Table 48. Global SiC Wafer Laser Cutting Equipment Production Market Share by Type (2026-2031)

Table 49. Global SiC Wafer Laser Cutting Equipment Production Value (US$ Million) by Type (2020-2025)

Table 50. Global SiC Wafer Laser Cutting Equipment Production Value (US$ Million) by Type (2026-2031)

Table 51. Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Type (2020-2025)

Table 52. Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Type (2026-2031)

Table 53. Global SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Type (2020-2025)

Table 54. Global SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Type (2026-2031)

Table 55. Global SiC Wafer Laser Cutting Equipment Production (Units) by Application (2020-2025)

Table 56. Global SiC Wafer Laser Cutting Equipment Production (Units) by Application (2026-2031)

Table 57. Global SiC Wafer Laser Cutting Equipment Production Market Share by Application (2020-2025)

Table 58. Global SiC Wafer Laser Cutting Equipment Production Market Share by Application (2026-2031)

Table 59. Global SiC Wafer Laser Cutting Equipment Production Value (US$ Million) by Application (2020-2025)

Table 60. Global SiC Wafer Laser Cutting Equipment Production Value (US$ Million) by Application (2026-2031)

Table 61. Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Application (2020-2025)

Table 62. Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Application (2026-2031)

Table 63. Global SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Application (2020-2025)

Table 64. Global SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Application (2026-2031)

Table 65. DISCO Corporation SiC Wafer Laser Cutting Equipment Company Information

Table 66. DISCO Corporation SiC Wafer Laser Cutting Equipment Specification and Application

Table 67. DISCO Corporation SiC Wafer Laser Cutting Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 68. DISCO Corporation Main Business and Markets Served

Table 69. DISCO Corporation Recent Developments/Updates

Table 70. Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Company Information

Table 71. Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Specification and Application

Table 72. Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 73. Suzhou Delphi Laser Co Main Business and Markets Served

Table 74. Suzhou Delphi Laser Co Recent Developments/Updates

Table 75. Han's Laser Technology SiC Wafer Laser Cutting Equipment Company Information

Table 76. Han's Laser Technology SiC Wafer Laser Cutting Equipment Specification and Application

Table 77. Han's Laser Technology SiC Wafer Laser Cutting Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 78. Han's Laser Technology Main Business and Markets Served

Table 79. Han's Laser Technology Recent Developments/Updates

Table 80. 3D-Micromac SiC Wafer Laser Cutting Equipment Company Information

Table 81. 3D-Micromac SiC Wafer Laser Cutting Equipment Specification and Application

Table 82. 3D-Micromac SiC Wafer Laser Cutting Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 83. 3D-Micromac Main Business and Markets Served

Table 84. 3D-Micromac Recent Developments/Updates

Table 85. Synova S.A. SiC Wafer Laser Cutting Equipment Company Information

Table 86. Synova S.A. SiC Wafer Laser Cutting Equipment Specification and Application

Table 87. Synova S.A. SiC Wafer Laser Cutting Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 88. Synova S.A. Main Business and Markets Served

Table 89. Synova S.A. Recent Developments/Updates

Table 90. HGTECH SiC Wafer Laser Cutting Equipment Company Information

Table 91. HGTECH SiC Wafer Laser Cutting Equipment Specification and Application

Table 92. HGTECH SiC Wafer Laser Cutting Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 93. HGTECH Main Business and Markets Served

Table 94. HGTECH Recent Developments/Updates

Table 95. ASMPT SiC Wafer Laser Cutting Equipment Company Information

Table 96. ASMPT SiC Wafer Laser Cutting Equipment Specification and Application

Table 97. ASMPT SiC Wafer Laser Cutting Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 98. ASMPT Main Business and Markets Served

Table 99. ASMPT Recent Developments/Updates

Table 100. GHN.GIE SiC Wafer Laser Cutting Equipment Company Information

Table 101. GHN.GIE SiC Wafer Laser Cutting Equipment Specification and Application

Table 102. GHN.GIE SiC Wafer Laser Cutting Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 103. GHN.GIE Main Business and Markets Served

Table 104. GHN.GIE Recent Developments/Updates

Table 105. Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Company Information

Table 106. Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Specification and Application

Table 107. Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 108. Wuhan DR Laser Technology Main Business and Markets Served

Table 109. Wuhan DR Laser Technology Recent Developments/Updates

Table 110. Key Raw Materials Lists

Table 111. Raw Materials Key Suppliers Lists

Table 112. SiC Wafer Laser Cutting Equipment Distributors List

Table 113. SiC Wafer Laser Cutting Equipment Customers List

Table 114. SiC Wafer Laser Cutting Equipment Market Trends

Table 115. SiC Wafer Laser Cutting Equipment Market Drivers

Table 116. SiC Wafer Laser Cutting Equipment Market Challenges

Table 117. SiC Wafer Laser Cutting Equipment Market Restraints

Table 118. Research Programs/Design for This Report

Table 119. Key Data Information from Secondary Sources

Table 120. Key Data Information from Primary Sources

Table 121. Authors List of This Report

List of Figures

Figure 1. Product Picture of SiC Wafer Laser Cutting Equipment

Figure 2. Global SiC Wafer Laser Cutting Equipment Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global SiC Wafer Laser Cutting Equipment Market Share by Type: 2024 VS 2031

Figure 4. Processing Sizes up to 6 Inches Product Picture

Figure 5. Processing Sizes up to 8 Inches Product Picture

Figure 6. Global SiC Wafer Laser Cutting Equipment Market Value by Application, (US$ Million) & (2020-2031)

Figure 7. Global SiC Wafer Laser Cutting Equipment Market Share by Application: 2024 VS 2031

Figure 8. Foundry

Figure 9. IDM

Figure 10. Global SiC Wafer Laser Cutting Equipment Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 11. Global SiC Wafer Laser Cutting Equipment Production Value (US$ Million) & (2020-2031)

Figure 12. Global SiC Wafer Laser Cutting Equipment Production Capacity (Units) & (2020-2031)

Figure 13. Global SiC Wafer Laser Cutting Equipment Production (Units) & (2020-2031)

Figure 14. Global SiC Wafer Laser Cutting Equipment Average Price (US$/Unit) & (2020-2031)

Figure 15. SiC Wafer Laser Cutting Equipment Report Years Considered

Figure 16. SiC Wafer Laser Cutting Equipment Production Share by Manufacturers in 2024

Figure 17. Global SiC Wafer Laser Cutting Equipment Production Value Share by Manufacturers (2024)

Figure 18. SiC Wafer Laser Cutting Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 19. The Global 5 and 10 Largest Players: Market Share by SiC Wafer Laser Cutting Equipment Revenue in 2024

Figure 20. Global SiC Wafer Laser Cutting Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 21. Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 22. Global SiC Wafer Laser Cutting Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Figure 23. Global SiC Wafer Laser Cutting Equipment Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 24. North America SiC Wafer Laser Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 25. Europe SiC Wafer Laser Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 26. China SiC Wafer Laser Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. Japan SiC Wafer Laser Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Global SiC Wafer Laser Cutting Equipment Consumption by Region: 2020 VS 2024 VS 2031 (Units)

Figure 29. Global SiC Wafer Laser Cutting Equipment Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 30. North America SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 31. North America SiC Wafer Laser Cutting Equipment Consumption Market Share by Country (2020-2031)

Figure 32. U.S. SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 33. Canada SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 34. Europe SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 35. Europe SiC Wafer Laser Cutting Equipment Consumption Market Share by Country (2020-2031)

Figure 36. Germany SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 37. France SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 38. U.K. SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 39. Italy SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 40. Netherlands SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 41. Asia Pacific SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 42. Asia Pacific SiC Wafer Laser Cutting Equipment Consumption Market Share by Region (2020-2031)

Figure 43. China SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 44. Japan SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 45. South Korea SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 46. China Taiwan SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 47. Southeast Asia SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 48. India SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 49. Latin America, Middle East & Africa SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 50. Latin America, Middle East & Africa SiC Wafer Laser Cutting Equipment Consumption Market Share by Country (2020-2031)

Figure 51. Mexico SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 52. Brazil SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 53. Turkey SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 54. GCC Countries SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 55. Global Production Market Share of SiC Wafer Laser Cutting Equipment by Type (2020-2031)

Figure 56. Global Production Value Market Share of SiC Wafer Laser Cutting Equipment by Type (2020-2031)

Figure 57. Global SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Type (2020-2031)

Figure 58. Global Production Market Share of SiC Wafer Laser Cutting Equipment by Application (2020-2031)

Figure 59. Global Production Value Market Share of SiC Wafer Laser Cutting Equipment by Application (2020-2031)

Figure 60. Global SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Application (2020-2031)

Figure 61. SiC Wafer Laser Cutting Equipment Value Chain

Figure 62. Channels of Distribution (Direct Vs Distribution)

Figure 63. Bottom-up and Top-down Approaches for This Report

Figure 64. Data Triangulation

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