Global Electronic Glass Fabrics for IC Package Substrate Market Research Report 2025

Electronic Glass Fabrics for IC Package Substrate Market

The 2025 U.S. tariff policies introduce profound uncertainty into the global economic landscape. This report critically examines the implications of recent tariff adjustments and international strategic countermeasures on Electronic Glass Fabrics for IC Package Substrate competitive dynamics, regional economic interdependencies, and supply chain reconfigurations.

Electronic Glass Fabrics used in IC package substrates are ultra-thin, highly uniform electronic glass cloths woven from electronic-grade glass yarns such as E-glass, NE-glass, T-glass, L-glass or even quartz fibers, and they serve as both the mechanical backbone and dielectric/CTE-tuning component of ABF/BT resin systems in advanced package substrates. Conventional E-glass fabrics still dominate FR-4 and general HDI PCBs, but IC-substrate-grade materials fall into several distinct categories: (i) low-dielectric (Low-Dk/Low-Df) electronic glass cloths, exemplified by Nittobo’s NE-glass and AGY’s L-Glass, which modify the glass composition (lower CaO/MgO, tailored network modifiers) to significantly reduce dielectric constant and loss tangent and are now widely used in high-speed PCBs and IC packaging to improve signal integrity; (ii) low-CTE electronic glass cloths such as T-glass, featuring high elastic modulus and low coefficient of thermal expansion, which Nittobo, Taiwan Glass and Baotek specifically target at large FC-BGA substrates for CPUs/GPUs/AI accelerators and advanced package substrates in order to minimize CTE mismatch, warpage and solder fatigue; (iii) functional ultra-thin and high-spread fabrics (e.g., 1037/1027/1017 styles), which use finer fibers and spreading techniques to lower void content and reduce fiber-weave-induced skew, thereby improving flatness, dimensional stability and CAF resistance in very high-layer-count substrates—Nan Ya, Grace and other suppliers explicitly highlight high spreading, low hollow fiber and CAF resistance in products positioned for IC substrates, HDI and high-end MLBs; and (iv) emerging quartz or hybrid glass fabrics that push Df even lower and tune CTE more precisely for 112G/224G SerDes, CoWoS/2.5D packages and future glass-core substrates. Together with ABF/BT and other advanced resins, these fiberglass fabrics define the dielectric constant/loss, CTE, warpage behavior and reliability of IC substrates and are extensively used in package substrates for CPUs, GPUs, AI accelerators, network switches/routers, SerDes PHYs and HBM stacks, with spill-over into high-speed backplanes, 5G RF boards and high-frequency automotive and industrial electronics.

From an industry standpoint, Electronic Glass Fabrics for IC package substrates have evolved from generic E-glass electronic cloths into a specialized sub-segment centered on low dielectric properties, low CTE and extreme thinness. Growth is driven by three structural vectors: first, the surge of AI servers, GPU clusters and advanced packaging (CoWoS, HBM, multi-chip FC-BGA) is pushing IC substrates to larger sizes, higher layer counts and more high-speed channels, turning T-glass-type low-CTE, high-modulus cloth into a critical bottleneck material—industry reports note that only Nittobo, Taiwan Glass and Taishan Fiberglass can stably mass-produce low-CTE fiberglass fabric for high-end IC substrates, resulting in a highly concentrated and tight supply; second, 5G infrastructure and data-center switches/routers migrating to 25–112G SerDes make low-Dk/Df fabrics and spread-glass construction a baseline requirement for high-speed CCL and substrates, with materials vendors and PCB houses consistently identifying low Dk/Df as the central trend in next-generation PCB/substrate materials; third, automotive electronics, EV power modules and mission-critical industrial/military systems increase demand for dimensionally stable, low-CTE, CAF-resistant and high-temperature electronic fabrics. Looking ahead, material systems are shifting from E-glass to NE-glass, L-glass, T-glass and eventually quartz-based fibers, often combined with halogen-free, low-polarity resins to further lower Dk/Df for 100G/200G-class signaling; at the same time, fiber diameters and fabric thickness keep shrinking (down toward 3–4 μm fibers and 5–10 μm ultra-thin fabrics), with high-spread, low-void constructions used to mitigate fiber-weave effects and enhance stack-up flatness and reliability, while hybrid glass–quartz and glass-core panel technologies blur the boundary between “glass fabric reinforced organics” and “glass substrates” in heterogeneous integration. Overall, AI, 5G and automotive electronics will continue to drive high-speed and high-reliability requirements, underpinning robust mid-to-long-term demand for IC-substrate-grade fiberglass fabrics, while long investment cycles and stringent quality barriers mean the segment is likely to remain a seller’s market for several years.Competitively, the market for IC-substrate-grade fiberglass fabrics—especially low-Dk, low-CTE and ultra-thin constructions—is highly concentrated among a handful of Japanese, Taiwanese, US and Chinese players, forming a “global oligopoly + regional champions + emerging domestic challengers” structure: on the global low-dielectric glass fiber front, key players include Nittobo, Taishan Fiberglass, AGY, Taiwan Glass and Fulltech Fiber Glass, with the top five accounting for a large share of the market; Nittobo leads with its NE-glass (the de-facto standard low-Dk glass) and T-glass (high-elasticity, low-CTE glass described in its integrated reports as essential to semiconductor package substrates) and continues to invest in new special glass cloth capacity for 5G/AI applications, while Taiwan Glass and Baotek cooperate closely with IC-substrate material makers via T-glass/NE-glass tech-transfer and are widely cited as core suppliers for ABF/FC-BGA substrates used in Nvidia-class GPUs. AGY, through its L-Glass and L-HDI product lines, provides low-Dk/Df, low-CTE fibers targeted at high-frequency PCBs, backplanes, AI-infrastructure boards and IC packaging, and is a key supplier in North American and European high-end markets. In Taiwan, besides Taiwan Glass, Nan Ya Plastics, Baotek, Fulltech and PFG offer electronic glass fabrics, with Nan Ya explicitly positioning its high-spread, low-void, CAF-resistant fabrics for IC substrates, HDI and MLBs. In mainland China, Grace Fabric Technology (603256.SH) focuses on mid-to-high-end electronic-grade fiberglass cloth and classifies its products into low-Dk/Df, low-CTE, high anti-CAF and high-dimension-stability categories, explicitly citing advanced IC packaging and fast-signal-transmission boards as target applications; recent technical and financial coverage notes that Grace has developed 5-μm-class ultra-thin fabrics adopted in high-end electronics including game consoles and smartphones. Brokerage and industry reports further highlight Linzhou Guangyuan, Taishan Fiberglass and Sinoma-backed projects as mainstream domestic suppliers of low-dielectric electronic glass cloth, with new first-generation and second-generation Low-Dk lines under construction and special glass cloth projects of tens of millions of meters per year being announced, all aiming at import substitution against NE-glass/T-glass-class materials. Overall, Japanese and Taiwanese suppliers still dominate the highest-end IC-substrate fabric segment in terms of technology and margins, US players like AGY lead in specialty low-loss fibers for high-frequency and AI infrastructure, while Chinese manufacturers already hold scale advantages in general-purpose electronic fabrics and are rapidly closing the gap in Low-Dk, Low-CTE and ultra-thin fabrics to penetrate global IC-substrate and high-speed PCB supply chains.In the value chain, IC-substrate fiberglass fabrics sit in the middle of a long sequence that runs “raw materials → electronic glass yarn → electronic fabrics → CCL/IC-substrate materials → substrate fabs → OSAT/IDM and system OEMs”: upstream are high-purity silica, alumina, boron oxide and other glass-forming chemicals plus energy (natural gas/electricity), followed by electronic-grade fiber production via pool-furnace or bushing melting and drawing, where fiber diameter (typically 3–6 μm, even finer for ultra-thin fabrics) and sizing chemistry are tightly controlled to support Low-Dk, Low-CTE and ultra-thin fabric performance; this yarn is then woven, spread, desized and surface-treated in electronic-cloth plants to produce a range of fabric styles from traditional 7628/2116 to ultra-thin 1037/1027/1017 grades, with high strength, heat resistance, flame retardance and electrical insulation specifically tuned for PCBs and IC substrates. These fabrics then flow to CCL and IC-substrate material makers, who impregnate them with epoxy, BT, ABF or other low-polarity resin systems and laminate with copper foils (including HVLP and low-CTE foils) to create high-speed CCL, core materials and build-up dielectrics tailored for FC-BGA and IC-substrate applications; downstream, IC-substrate manufacturers such as Ibiden, Shinko, Unimicron, Nan Ya PCB and numerous Taiwanese/Chinese substrate houses convert these materials into package substrates for CPUs, GPUs, AI accelerators, SerDes, HBM and mobile SoCs, which are then assembled and tested by OSATs and IDMs before entering servers, GPU accelerator cards, networking gear, 5G base stations, smartphones and automotive The primary bottleneck in this chain lies in the midstream fabric segment—particularly Low-Dk, Low-CTE and ultra-thin cloth—where capacity expansion requires large capex, long ramp-up times and stringent process control, so high-end suppliers like Nittobo, Taiwan Glass, Taishan and Grace wield significant influence over ABF/BT substrate and high-end PCB supply security and pricing; in response, Japan, Taiwan and China are all investing aggressively in special glass cloth capacity (e.g., Baotek’s T-glass/NE-glass tech-transfer projects, Sinoma and China Jushi’s special electronic cloth projects, and multiple Chinese Low-Dk lines), aiming to localize supply and mitigate material risks as AI, 5G and EV demand drives an unprecedented build-out of high-performance package substrates and glass-reinforced electronics.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Electronic Glass Fabrics for IC Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Glass Fabrics for IC Package Substrate.

The Electronic Glass Fabrics for IC Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Electronic Glass Fabrics for IC Package Substrate market comprehensively. Regional market sizes, concerning products by Technology, by Application, by Substrate Type and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Electronic Glass Fabrics for IC Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Technology, by Application, by Substrate Type and by regions.

Scope of Electronic Glass Fabrics for IC Package Substrate Market Report

Chapter Outline

1.1 Product Definition

1.2 Electronic Glass Fabrics for IC Package Substrate by Technology

1.2.1 Global Electronic Glass Fabrics for IC Package Substrate Market Value Growth Rate Analysis by Technology: 2024 VS 2031

1.2.2 Low-CTE Glass Cloth

1.2.3 Low-Dk / Low-Df Glass Cloth

1.2.4 E-glass

1.2.5 Quartz Q-glass

1.3 Electronic Glass Fabrics for IC Package Substrate by Substrate Type

1.3.1 Global Electronic Glass Fabrics for IC Package Substrate Market Value Growth Rate Analysis by Substrate Type: 2024 VS 2031

1.3.2 FCBGA Substrate

1.3.3 FCCSP Substrate

1.3.4 WB-CSP/BGA

1.4 Electronic Glass Fabrics for IC Package Substrate by End Use

1.4.1 Global Electronic Glass Fabrics for IC Package Substrate Market Value Growth Rate Analysis by End Use: 2024 VS 2031

1.4.2 PCs

1.4.3 Server/Data Center

1.4.4 AI/HPC Chips

1.4.5 Communication

1.4.6 Smart Phone

1.4.7 Wearable and Consumer Electronics

1.4.8 Automotive Electronics

1.4.9 Others

1.5 Electronic Glass Fabrics for IC Package Substrate by Application

1.5.1 Global Electronic Glass Fabrics for IC Package Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.5.2 ABF Substrate

1.5.3 BT Substrate

1.6 Global Market Growth Prospects

1.6.1 Global Electronic Glass Fabrics for IC Package Substrate Production Value Estimates and Forecasts (2020-2031)

1.6.2 Global Electronic Glass Fabrics for IC Package Substrate Production Capacity Estimates and Forecasts (2020-2031)

1.6.3 Global Electronic Glass Fabrics for IC Package Substrate Production Estimates and Forecasts (2020-2031)

1.6.4 Global Electronic Glass Fabrics for IC Package Substrate Market Average Price Estimates and Forecasts (2020-2031)

1.7 Assumptions and Limitations

2.1 Global Electronic Glass Fabrics for IC Package Substrate Production Market Share by Manufacturers (2020-2025)

2.2 Global Electronic Glass Fabrics for IC Package Substrate Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Electronic Glass Fabrics for IC Package Substrate, Industry Ranking, 2023 VS 2024

2.4 Global Electronic Glass Fabrics for IC Package Substrate Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Electronic Glass Fabrics for IC Package Substrate Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Electronic Glass Fabrics for IC Package Substrate, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Electronic Glass Fabrics for IC Package Substrate, Product Offered and Application

2.8 Global Key Manufacturers of Electronic Glass Fabrics for IC Package Substrate, Date of Enter into This Industry

2.9 Electronic Glass Fabrics for IC Package Substrate Market Competitive Situation and Trends

2.9.1 Electronic Glass Fabrics for IC Package Substrate Market Concentration Rate

2.9.2 Global 5 and 10 Largest Electronic Glass Fabrics for IC Package Substrate Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3.1 Global Electronic Glass Fabrics for IC Package Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Electronic Glass Fabrics for IC Package Substrate Production Value by Region (2020-2031)

3.2.1 Global Electronic Glass Fabrics for IC Package Substrate Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Electronic Glass Fabrics for IC Package Substrate by Region (2026-2031)

3.3 Global Electronic Glass Fabrics for IC Package Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Electronic Glass Fabrics for IC Package Substrate Production Volume by Region (2020-2031)

3.4.1 Global Electronic Glass Fabrics for IC Package Substrate Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Electronic Glass Fabrics for IC Package Substrate by Region (2026-2031)

3.5 Global Electronic Glass Fabrics for IC Package Substrate Market Price Analysis by Region (2020-2025)

3.6 Global Electronic Glass Fabrics for IC Package Substrate Production and Value, Year-over-Year Growth

3.6.1 Japan Electronic Glass Fabrics for IC Package Substrate Production Value Estimates and Forecasts (2020-2031)

3.6.2 North America Electronic Glass Fabrics for IC Package Substrate Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Taiwan Electronic Glass Fabrics for IC Package Substrate Production Value Estimates and Forecasts (2020-2031)

3.6.4 China Electronic Glass Fabrics for IC Package Substrate Production Value Estimates and Forecasts (2020-2031)

4.1 Global Electronic Glass Fabrics for IC Package Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Electronic Glass Fabrics for IC Package Substrate Consumption by Region (2020-2031)

4.2.1 Global Electronic Glass Fabrics for IC Package Substrate Consumption by Region (2020-2025)

4.2.2 Global Electronic Glass Fabrics for IC Package Substrate Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Electronic Glass Fabrics for IC Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Electronic Glass Fabrics for IC Package Substrate Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Electronic Glass Fabrics for IC Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Electronic Glass Fabrics for IC Package Substrate Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Russia

4.5 Asia Pacific

4.5.1 Asia Pacific Electronic Glass Fabrics for IC Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Electronic Glass Fabrics for IC Package Substrate Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Electronic Glass Fabrics for IC Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Electronic Glass Fabrics for IC Package Substrate Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5.1 Global Electronic Glass Fabrics for IC Package Substrate Production by Technology (2020-2031)

5.1.1 Global Electronic Glass Fabrics for IC Package Substrate Production by Technology (2020-2025)

5.1.2 Global Electronic Glass Fabrics for IC Package Substrate Production by Technology (2026-2031)

5.1.3 Global Electronic Glass Fabrics for IC Package Substrate Production Market Share by Technology (2020-2031)

5.2 Global Electronic Glass Fabrics for IC Package Substrate Production Value by Technology (2020-2031)

5.2.1 Global Electronic Glass Fabrics for IC Package Substrate Production Value by Technology (2020-2025)

5.2.2 Global Electronic Glass Fabrics for IC Package Substrate Production Value by Technology (2026-2031)

5.2.3 Global Electronic Glass Fabrics for IC Package Substrate Production Value Market Share by Technology (2020-2031)

5.3 Global Electronic Glass Fabrics for IC Package Substrate Price by Technology (2020-2031)

6.1 Global Electronic Glass Fabrics for IC Package Substrate Production by Application (2020-2031)

6.1.1 Global Electronic Glass Fabrics for IC Package Substrate Production by Application (2020-2025)

6.1.2 Global Electronic Glass Fabrics for IC Package Substrate Production by Application (2026-2031)

6.1.3 Global Electronic Glass Fabrics for IC Package Substrate Production Market Share by Application (2020-2031)

6.2 Global Electronic Glass Fabrics for IC Package Substrate Production Value by Application (2020-2031)

6.2.1 Global Electronic Glass Fabrics for IC Package Substrate Production Value by Application (2020-2025)

6.2.2 Global Electronic Glass Fabrics for IC Package Substrate Production Value by Application (2026-2031)

6.2.3 Global Electronic Glass Fabrics for IC Package Substrate Production Value Market Share by Application (2020-2031)

6.3 Global Electronic Glass Fabrics for IC Package Substrate Price by Application (2020-2031)

7.1 Nittobo (Nitto Boseki)

7.1.1 Nittobo (Nitto Boseki) Electronic Glass Fabrics for IC Package Substrate Company Information

7.1.2 Nittobo (Nitto Boseki) Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.1.3 Nittobo (Nitto Boseki) Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.1.4 Nittobo (Nitto Boseki) Main Business and Markets Served

7.1.5 Nittobo (Nitto Boseki) Recent Developments/Updates

7.2 Taiwan Glass

7.2.1 Taiwan Glass Electronic Glass Fabrics for IC Package Substrate Company Information

7.2.2 Taiwan Glass Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.2.3 Taiwan Glass Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.2.4 Taiwan Glass Main Business and Markets Served

7.2.5 Taiwan Glass Recent Developments/Updates

7.3 AGY

7.3.1 AGY Electronic Glass Fabrics for IC Package Substrate Company Information

7.3.2 AGY Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.3.3 AGY Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.3.4 AGY Main Business and Markets Served

7.3.5 AGY Recent Developments/Updates

7.4 Asahi Kasei

7.4.1 Asahi Kasei Electronic Glass Fabrics for IC Package Substrate Company Information

7.4.2 Asahi Kasei Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.4.3 Asahi Kasei Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.4.4 Asahi Kasei Main Business and Markets Served

7.4.5 Asahi Kasei Recent Developments/Updates

7.5 Panasonic

7.5.1 Panasonic Electronic Glass Fabrics for IC Package Substrate Company Information

7.5.2 Panasonic Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.5.3 Panasonic Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.5.4 Panasonic Main Business and Markets Served

7.5.5 Panasonic Recent Developments/Updates

7.6 NAN-YA Glass Fabrics

7.6.1 NAN-YA Glass Fabrics Electronic Glass Fabrics for IC Package Substrate Company Information

7.6.2 NAN-YA Glass Fabrics Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.6.3 NAN-YA Glass Fabrics Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.6.4 NAN-YA Glass Fabrics Main Business and Markets Served

7.6.5 NAN-YA Glass Fabrics Recent Developments/Updates

7.7 Grace Fabric Technology

7.7.1 Grace Fabric Technology Electronic Glass Fabrics for IC Package Substrate Company Information

7.7.2 Grace Fabric Technology Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.7.3 Grace Fabric Technology Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.7.4 Grace Fabric Technology Main Business and Markets Served

7.7.5 Grace Fabric Technology Recent Developments/Updates

7.8 Baotek Industrial Materials

7.8.1 Baotek Industrial Materials Electronic Glass Fabrics for IC Package Substrate Company Information

7.8.2 Baotek Industrial Materials Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.8.3 Baotek Industrial Materials Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.8.4 Baotek Industrial Materials Main Business and Markets Served

7.8.5 Baotek Industrial Materials Recent Developments/Updates

7.9 Fulltech Fiber Glass Corporation

7.9.1 Fulltech Fiber Glass Corporation Electronic Glass Fabrics for IC Package Substrate Company Information

7.9.2 Fulltech Fiber Glass Corporation Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.9.3 Fulltech Fiber Glass Corporation Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Fulltech Fiber Glass Corporation Main Business and Markets Served

7.9.5 Fulltech Fiber Glass Corporation Recent Developments/Updates

7.10 Henan Guangyuan new material

7.10.1 Henan Guangyuan new material Electronic Glass Fabrics for IC Package Substrate Company Information

7.10.2 Henan Guangyuan new material Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.10.3 Henan Guangyuan new material Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.10.4 Henan Guangyuan new material Main Business and Markets Served

7.10.5 Henan Guangyuan new material Recent Developments/Updates

7.11 Sinoma Science & Technology

7.11.1 Sinoma Science & Technology Electronic Glass Fabrics for IC Package Substrate Company Information

7.11.2 Sinoma Science & Technology Electronic Glass Fabrics for IC Package Substrate Product Portfolio

7.11.3 Sinoma Science & Technology Electronic Glass Fabrics for IC Package Substrate Production, Value, Price and Gross Margin (2020-2025)

7.11.4 Sinoma Science & Technology Main Business and Markets Served

7.11.5 Sinoma Science & Technology Recent Developments/Updates

8.1 Electronic Glass Fabrics for IC Package Substrate Industry Chain Analysis

8.2 Electronic Glass Fabrics for IC Package Substrate Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Electronic Glass Fabrics for IC Package Substrate Production Mode & Process Analysis

8.4 Electronic Glass Fabrics for IC Package Substrate Sales and Marketing

8.4.1 Electronic Glass Fabrics for IC Package Substrate Sales Channels

8.4.2 Electronic Glass Fabrics for IC Package Substrate Distributors

8.5 Electronic Glass Fabrics for IC Package Substrate Customer Analysis

9.1 Electronic Glass Fabrics for IC Package Substrate Industry Trends

9.2 Electronic Glass Fabrics for IC Package Substrate Market Drivers

9.3 Electronic Glass Fabrics for IC Package Substrate Market Challenges

9.4 Electronic Glass Fabrics for IC Package Substrate Market Restraints

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

List of Tables

 Table 1. Global Electronic Glass Fabrics for IC Package Substrate Market Value by Technology, (US$ Million) & (2024 VS 2031)

 Table 2. Global Electronic Glass Fabrics for IC Package Substrate Market Value by Substrate Type, (US$ Million) & (2024 VS 2031)

 Table 3. Global Electronic Glass Fabrics for IC Package Substrate Market Value by End Use, (US$ Million) & (2024 VS 2031)

 Table 4. Global Electronic Glass Fabrics for IC Package Substrate Market Value by Application, (US$ Million) & (2024 VS 2031)

 Table 5. Global Electronic Glass Fabrics for IC Package Substrate Production Capacity (K Sqm) by Manufacturers in 2024

 Table 6. Global Electronic Glass Fabrics for IC Package Substrate Production by Manufacturers (2020-2025) & (K Sqm)

 Table 7. Global Electronic Glass Fabrics for IC Package Substrate Production Market Share by Manufacturers (2020-2025)

 Table 8. Global Electronic Glass Fabrics for IC Package Substrate Production Value by Manufacturers (2020-2025) & (US$ Million)

 Table 9. Global Electronic Glass Fabrics for IC Package Substrate Production Value Share by Manufacturers (2020-2025)

 Table 10. Global Key Players of Electronic Glass Fabrics for IC Package Substrate, Industry Ranking, 2023 VS 2024

 Table 11. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Electronic Glass Fabrics for IC Package Substrate as of 2024)

 Table 12. Global Market Electronic Glass Fabrics for IC Package Substrate Average Price by Manufacturers (US$/Sq m) & (2020-2025)

 Table 13. Global Key Manufacturers of Electronic Glass Fabrics for IC Package Substrate, Manufacturing Base Distribution and Headquarters

 Table 14. Global Key Manufacturers of Electronic Glass Fabrics for IC Package Substrate, Product Offered and Application

 Table 15. Global Key Manufacturers of Electronic Glass Fabrics for IC Package Substrate, Date of Enter into This Industry

 Table 16. Global Electronic Glass Fabrics for IC Package Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)

 Table 17. Mergers & Acquisitions, Expansion Plans

 Table 18. Global Electronic Glass Fabrics for IC Package Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

 Table 19. Global Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) by Region (2020-2025)

 Table 20. Global Electronic Glass Fabrics for IC Package Substrate Production Value Market Share by Region (2020-2025)

 Table 21. Global Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) Forecast by Region (2026-2031)

 Table 22. Global Electronic Glass Fabrics for IC Package Substrate Production Value Market Share Forecast by Region (2026-2031)

 Table 23. Global Electronic Glass Fabrics for IC Package Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Sqm)

 Table 24. Global Electronic Glass Fabrics for IC Package Substrate Production (K Sqm) by Region (2020-2025)

 Table 25. Global Electronic Glass Fabrics for IC Package Substrate Production Market Share by Region (2020-2025)

 Table 26. Global Electronic Glass Fabrics for IC Package Substrate Production (K Sqm) Forecast by Region (2026-2031)

 Table 27. Global Electronic Glass Fabrics for IC Package Substrate Production Market Share Forecast by Region (2026-2031)

 Table 28. Global Electronic Glass Fabrics for IC Package Substrate Market Average Price (US$/Sq m) by Region (2020-2025)

 Table 29. Global Electronic Glass Fabrics for IC Package Substrate Market Average Price (US$/Sq m) by Region (2026-2031)

 Table 30. Global Electronic Glass Fabrics for IC Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Sqm)

 Table 31. Global Electronic Glass Fabrics for IC Package Substrate Consumption by Region (2020-2025) & (K Sqm)

 Table 32. Global Electronic Glass Fabrics for IC Package Substrate Consumption Market Share by Region (2020-2025)

 Table 33. Global Electronic Glass Fabrics for IC Package Substrate Forecasted Consumption by Region (2026-2031) & (K Sqm)

 Table 34. Global Electronic Glass Fabrics for IC Package Substrate Forecasted Consumption Market Share by Region (2026-2031)

 Table 35. North America Electronic Glass Fabrics for IC Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)

 Table 36. North America Electronic Glass Fabrics for IC Package Substrate Consumption by Country (2020-2025) & (K Sqm)

 Table 37. North America Electronic Glass Fabrics for IC Package Substrate Consumption by Country (2026-2031) & (K Sqm)

 Table 38. Europe Electronic Glass Fabrics for IC Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)

 Table 39. Europe Electronic Glass Fabrics for IC Package Substrate Consumption by Country (2020-2025) & (K Sqm)

 Table 40. Europe Electronic Glass Fabrics for IC Package Substrate Consumption by Country (2026-2031) & (K Sqm)

 Table 41. Asia Pacific Electronic Glass Fabrics for IC Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Sqm)

 Table 42. Asia Pacific Electronic Glass Fabrics for IC Package Substrate Consumption by Region (2020-2025) & (K Sqm)

 Table 43. Asia Pacific Electronic Glass Fabrics for IC Package Substrate Consumption by Region (2026-2031) & (K Sqm)

 Table 44. Latin America, Middle East & Africa Electronic Glass Fabrics for IC Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)

 Table 45. Latin America, Middle East & Africa Electronic Glass Fabrics for IC Package Substrate Consumption by Country (2020-2025) & (K Sqm)

 Table 46. Latin America, Middle East & Africa Electronic Glass Fabrics for IC Package Substrate Consumption by Country (2026-2031) & (K Sqm)

 Table 47. Global Electronic Glass Fabrics for IC Package Substrate Production (K Sqm) by Technology (2020-2025)

 Table 48. Global Electronic Glass Fabrics for IC Package Substrate Production (K Sqm) by Technology (2026-2031)

 Table 49. Global Electronic Glass Fabrics for IC Package Substrate Production Market Share by Technology (2020-2025)

 Table 50. Global Electronic Glass Fabrics for IC Package Substrate Production Market Share by Technology (2026-2031)

 Table 51. Global Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) by Technology (2020-2025)

 Table 52. Global Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) by Technology (2026-2031)

 Table 53. Global Electronic Glass Fabrics for IC Package Substrate Production Value Market Share by Technology (2020-2025)

 Table 54. Global Electronic Glass Fabrics for IC Package Substrate Production Value Market Share by Technology (2026-2031)

 Table 55. Global Electronic Glass Fabrics for IC Package Substrate Price (US$/Sq m) by Technology (2020-2025)

 Table 56. Global Electronic Glass Fabrics for IC Package Substrate Price (US$/Sq m) by Technology (2026-2031)

 Table 57. Global Electronic Glass Fabrics for IC Package Substrate Production (K Sqm) by Application (2020-2025)

 Table 58. Global Electronic Glass Fabrics for IC Package Substrate Production (K Sqm) by Application (2026-2031)

 Table 59. Global Electronic Glass Fabrics for IC Package Substrate Production Market Share by Application (2020-2025)

 Table 60. Global Electronic Glass Fabrics for IC Package Substrate Production Market Share by Application (2026-2031)

 Table 61. Global Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) by Application (2020-2025)

 Table 62. Global Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) by Application (2026-2031)

 Table 63. Global Electronic Glass Fabrics for IC Package Substrate Production Value Market Share by Application (2020-2025)

 Table 64. Global Electronic Glass Fabrics for IC Package Substrate Production Value Market Share by Application (2026-2031)

 Table 65. Global Electronic Glass Fabrics for IC Package Substrate Price (US$/Sq m) by Application (2020-2025)

 Table 66. Global Electronic Glass Fabrics for IC Package Substrate Price (US$/Sq m) by Application (2026-2031)

 Table 67. Nittobo (Nitto Boseki) Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 68. Nittobo (Nitto Boseki) Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 69. Nittobo (Nitto Boseki) Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 70. Nittobo (Nitto Boseki) Main Business and Markets Served

 Table 71. Nittobo (Nitto Boseki) Recent Developments/Updates

 Table 72. Taiwan Glass Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 73. Taiwan Glass Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 74. Taiwan Glass Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 75. Taiwan Glass Main Business and Markets Served

 Table 76. Taiwan Glass Recent Developments/Updates

 Table 77. AGY Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 78. AGY Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 79. AGY Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 80. AGY Main Business and Markets Served

 Table 81. AGY Recent Developments/Updates

 Table 82. Asahi Kasei Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 83. Asahi Kasei Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 84. Asahi Kasei Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 85. Asahi Kasei Main Business and Markets Served

 Table 86. Asahi Kasei Recent Developments/Updates

 Table 87. Panasonic Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 88. Panasonic Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 89. Panasonic Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 90. Panasonic Main Business and Markets Served

 Table 91. Panasonic Recent Developments/Updates

 Table 92. NAN-YA Glass Fabrics Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 93. NAN-YA Glass Fabrics Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 94. NAN-YA Glass Fabrics Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 95. NAN-YA Glass Fabrics Main Business and Markets Served

 Table 96. NAN-YA Glass Fabrics Recent Developments/Updates

 Table 97. Grace Fabric Technology Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 98. Grace Fabric Technology Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 99. Grace Fabric Technology Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 100. Grace Fabric Technology Main Business and Markets Served

 Table 101. Grace Fabric Technology Recent Developments/Updates

 Table 102. Baotek Industrial Materials Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 103. Baotek Industrial Materials Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 104. Baotek Industrial Materials Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 105. Baotek Industrial Materials Main Business and Markets Served

 Table 106. Baotek Industrial Materials Recent Developments/Updates

 Table 107. Fulltech Fiber Glass Corporation Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 108. Fulltech Fiber Glass Corporation Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 109. Fulltech Fiber Glass Corporation Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 110. Fulltech Fiber Glass Corporation Main Business and Markets Served

 Table 111. Fulltech Fiber Glass Corporation Recent Developments/Updates

 Table 112. Henan Guangyuan new material Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 113. Henan Guangyuan new material Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 114. Henan Guangyuan new material Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 115. Henan Guangyuan new material Main Business and Markets Served

 Table 116. Henan Guangyuan new material Recent Developments/Updates

 Table 117. Sinoma Science & Technology Electronic Glass Fabrics for IC Package Substrate Company Information

 Table 118. Sinoma Science & Technology Electronic Glass Fabrics for IC Package Substrate Specification and Application

 Table 119. Sinoma Science & Technology Electronic Glass Fabrics for IC Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sq m) and Gross Margin (2020-2025)

 Table 120. Sinoma Science & Technology Main Business and Markets Served

 Table 121. Sinoma Science & Technology Recent Developments/Updates

 Table 122. Key Raw Materials Lists

 Table 123. Raw Materials Key Suppliers Lists

 Table 124. Electronic Glass Fabrics for IC Package Substrate Distributors List

 Table 125. Electronic Glass Fabrics for IC Package Substrate Customers List

 Table 126. Electronic Glass Fabrics for IC Package Substrate Market Trends

 Table 127. Electronic Glass Fabrics for IC Package Substrate Market Drivers

 Table 128. Electronic Glass Fabrics for IC Package Substrate Market Challenges

 Table 129. Electronic Glass Fabrics for IC Package Substrate Market Restraints

 Table 130. Research Programs/Design for This Report

 Table 131. Key Data Information from Secondary Sources

 Table 132. Key Data Information from Primary Sources

 Table 133. Authors List of This Report

List of Figures

 Figure 1. Product Picture of Electronic Glass Fabrics for IC Package Substrate

 Figure 2. Global Electronic Glass Fabrics for IC Package Substrate Market Value by Technology, (US$ Million) & (2020-2031)

 Figure 3. Global Electronic Glass Fabrics for IC Package Substrate Market Share by Technology: 2024 VS 2031

 Figure 4. Low-CTE Glass Cloth Product Picture

 Figure 5. Low-Dk / Low-Df Glass Cloth Product Picture

 Figure 6. E-glass Product Picture

 Figure 7. Quartz Q-glass Product Picture

 Figure 8. Global Electronic Glass Fabrics for IC Package Substrate Market Value by Substrate Type, (US$ Million) & (2020-2031)

 Figure 9. Global Electronic Glass Fabrics for IC Package Substrate Market Share by Substrate Type: 2024 VS 2031

 Figure 10. FCBGA Substrate Product Picture

 Figure 11. FCCSP Substrate Product Picture

 Figure 12. WB-CSP/BGA Product Picture

 Figure 13. Global Electronic Glass Fabrics for IC Package Substrate Market Value by End Use, (US$ Million) & (2020-2031)

 Figure 14. Global Electronic Glass Fabrics for IC Package Substrate Market Share by End Use: 2024 VS 2031

 Figure 15. PCs Product Picture

 Figure 16. Server/Data Center Product Picture

 Figure 17. AI/HPC Chips Product Picture

 Figure 18. Communication Product Picture

 Figure 19. Smart Phone Product Picture

 Figure 20. Wearable and Consumer Electronics Product Picture

 Figure 21. Automotive Electronics Product Picture

 Figure 22. Others Product Picture

 Figure 23. Global Electronic Glass Fabrics for IC Package Substrate Market Value by Application, (US$ Million) & (2020-2031)

 Figure 24. Global Electronic Glass Fabrics for IC Package Substrate Market Share by Application: 2024 VS 2031

 Figure 25. ABF Substrate

 Figure 26. BT Substrate

 Figure 27. Global Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million), 2020 VS 2024 VS 2031

 Figure 28. Global Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) & (2020-2031)

 Figure 29. Global Electronic Glass Fabrics for IC Package Substrate Production Capacity (K Sqm) & (2020-2031)

 Figure 30. Global Electronic Glass Fabrics for IC Package Substrate Production (K Sqm) & (2020-2031)

 Figure 31. Global Electronic Glass Fabrics for IC Package Substrate Average Price (US$/Sq m) & (2020-2031)

 Figure 32. Electronic Glass Fabrics for IC Package Substrate Report Years Considered

 Figure 33. Electronic Glass Fabrics for IC Package Substrate Production Share by Manufacturers in 2024

 Figure 34. Global Electronic Glass Fabrics for IC Package Substrate Production Value Share by Manufacturers (2024)

 Figure 35. Electronic Glass Fabrics for IC Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

 Figure 36. The Global 5 and 10 Largest Players: Market Share by Electronic Glass Fabrics for IC Package Substrate Revenue in 2024

 Figure 37. Global Electronic Glass Fabrics for IC Package Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

 Figure 38. Global Electronic Glass Fabrics for IC Package Substrate Production Value Market Share by Region: 2020 VS 2024 VS 2031

 Figure 39. Global Electronic Glass Fabrics for IC Package Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Sqm)

 Figure 40. Global Electronic Glass Fabrics for IC Package Substrate Production Market Share by Region: 2020 VS 2024 VS 2031

 Figure 41. Japan Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)

 Figure 42. North America Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)

 Figure 43. China Taiwan Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)

 Figure 44. China Electronic Glass Fabrics for IC Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)

 Figure 45. Global Electronic Glass Fabrics for IC Package Substrate Consumption by Region: 2020 VS 2024 VS 2031 (K Sqm)

 Figure 46. Global Electronic Glass Fabrics for IC Package Substrate Consumption Market Share by Region: 2020 VS 2024 VS 2031

 Figure 47. North America Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 48. North America Electronic Glass Fabrics for IC Package Substrate Consumption Market Share by Country (2020-2031)

 Figure 49. U.S. Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 50. Canada Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 51. Europe Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 52. Europe Electronic Glass Fabrics for IC Package Substrate Consumption Market Share by Country (2020-2031)

 Figure 53. Germany Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 54. France Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 55. U.K. Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 56. Italy Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 57. Russia Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 58. Asia Pacific Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 59. Asia Pacific Electronic Glass Fabrics for IC Package Substrate Consumption Market Share by Region (2020-2031)

 Figure 60. China Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 61. Japan Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 62. South Korea Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 63. China Taiwan Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 64. Southeast Asia Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 65. India Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 66. Latin America, Middle East & Africa Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 67. Latin America, Middle East & Africa Electronic Glass Fabrics for IC Package Substrate Consumption Market Share by Country (2020-2031)

 Figure 68. Mexico Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 69. Brazil Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 70. Turkey Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 71. GCC Countries Electronic Glass Fabrics for IC Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)

 Figure 72. Global Production Market Share of Electronic Glass Fabrics for IC Package Substrate by Technology (2020-2031)

 Figure 73. Global Production Value Market Share of Electronic Glass Fabrics for IC Package Substrate by Technology (2020-2031)

 Figure 74. Global Electronic Glass Fabrics for IC Package Substrate Price (US$/Sq m) by Technology (2020-2031)

 Figure 75. Global Production Market Share of Electronic Glass Fabrics for IC Package Substrate by Application (2020-2031)

 Figure 76. Global Production Value Market Share of Electronic Glass Fabrics for IC Package Substrate by Application (2020-2031)

 Figure 77. Global Electronic Glass Fabrics for IC Package Substrate Price (US$/Sq m) by Application (2020-2031)

 Figure 78. Electronic Glass Fabrics for IC Package Substrate Value Chain

 Figure 79. Channels of Distribution (Direct Vs Distribution)

 Figure 80. Bottom-up and Top-down Approaches for This Report

 Figure 81. Data Triangulation