The global market for 6-8 inches SiC Wafer Laser Cutting Equipment was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

According to our Semiconductor Research Center, in 2022, the global SiC wafer was valued at US$ 750 million, will grow rapidly in next six years, driven by the strong demand from electric vehicle (EV). Currently the 6 inch SiC substrates are dominating this market, and in next six years, more players will put into production the 8 inch SiC wafers. Currently the key players of SiC are mainly located headquartered United States, Europe, Japan and China, especially in China, more companies are entering the SiC market. It is predicted that, Chinese companies will play key roles in the SiC market in next ten years.

Report Scope

This report aims to provide a comprehensive presentation of the global market for 6-8 inches SiC Wafer Laser Cutting Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 6-8 inches SiC Wafer Laser Cutting Equipment.

The 6-8 inches SiC Wafer Laser Cutting Equipment market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global 6-8 inches SiC Wafer Laser Cutting Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the 6-8 inches SiC Wafer Laser Cutting Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of 6-8 inches SiC Wafer Laser Cutting Equipment Market Report

Report Metric	Details
Report Name	6-8 inches SiC Wafer Laser Cutting Equipment Market
by Type	Laser Modified Cutting Thermal Laser Separation Laser MicroJet Laser Ablation
by Application	SiC Wafer GaN Wafer Other
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	DISCO, Delphi Laser, Han's Laser, 3D-Micromac AG, Synova S.A., HGLaser, CHN.GIE, DR Laser, Quick Laser, Lumi Laser
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of 6-8 inches SiC Wafer Laser Cutting Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of 6-8 inches SiC Wafer Laser Cutting Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of 6-8 inches SiC Wafer Laser Cutting Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the 6-8 inches SiC Wafer Laser Cutting Equipment Market report?

Ans: The main players in the 6-8 inches SiC Wafer Laser Cutting Equipment Market are DISCO, Delphi Laser, Han's Laser, 3D-Micromac AG, Synova S.A., HGLaser, CHN.GIE, DR Laser, Quick Laser, Lumi Laser

What are the Application segmentation covered in the 6-8 inches SiC Wafer Laser Cutting Equipment Market report?

Ans: The Applications covered in the 6-8 inches SiC Wafer Laser Cutting Equipment Market report are SiC Wafer, GaN Wafer, Other

What are the Type segmentation covered in the 6-8 inches SiC Wafer Laser Cutting Equipment Market report?

Ans: The Types covered in the 6-8 inches SiC Wafer Laser Cutting Equipment Market report are Laser Modified Cutting, Thermal Laser Separation, Laser MicroJet, Laser Ablation

1 6-8 inches SiC Wafer Laser Cutting Equipment Market Overview

1.1 Product Definition

1.2 6-8 inches SiC Wafer Laser Cutting Equipment by Type

1.2.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Laser Modified Cutting

1.2.3 Thermal Laser Separation

1.2.4 Laser MicroJet

1.2.5 Laser Ablation

1.3 6-8 inches SiC Wafer Laser Cutting Equipment by Application

1.3.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 SiC Wafer

1.3.3 GaN Wafer

1.3.4 Other

1.4 Global Market Growth Prospects

1.4.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Estimates and Forecasts (2020-2031)

1.4.4 Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share by Manufacturers (2020-2025)

2.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of 6-8 inches SiC Wafer Laser Cutting Equipment, Industry Ranking, 2023 VS 2024

2.4 Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global 6-8 inches SiC Wafer Laser Cutting Equipment Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of 6-8 inches SiC Wafer Laser Cutting Equipment, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of 6-8 inches SiC Wafer Laser Cutting Equipment, Product Offered and Application

2.8 Global Key Manufacturers of 6-8 inches SiC Wafer Laser Cutting Equipment, Date of Enter into This Industry

2.9 6-8 inches SiC Wafer Laser Cutting Equipment Market Competitive Situation and Trends

2.9.1 6-8 inches SiC Wafer Laser Cutting Equipment Market Concentration Rate

2.9.2 Global 5 and 10 Largest 6-8 inches SiC Wafer Laser Cutting Equipment Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 6-8 inches SiC Wafer Laser Cutting Equipment Production by Region

3.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Region (2020-2031)

3.2.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of 6-8 inches SiC Wafer Laser Cutting Equipment by Region (2026-2031)

3.3 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Volume by Region (2020-2031)

3.4.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production by Region (2020-2025)

3.4.2 Global Forecasted Production of 6-8 inches SiC Wafer Laser Cutting Equipment by Region (2026-2031)

3.5 Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Price Analysis by Region (2020-2025)

3.6 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production and Value, Year-over-Year Growth

3.6.1 North America 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.3 China 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2020-2031)

4 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Region

4.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Region (2020-2031)

4.2.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Region (2020-2025)

4.2.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production by Type (2020-2031)

5.1.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production by Type (2020-2025)

5.1.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production by Type (2026-2031)

5.1.3 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share by Type (2020-2031)

5.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Type (2020-2031)

5.2.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Type (2020-2025)

5.2.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Type (2026-2031)

5.2.3 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Market Share by Type (2020-2031)

5.3 Global 6-8 inches SiC Wafer Laser Cutting Equipment Price by Type (2020-2031)

6 Segment by Application

6.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production by Application (2020-2031)

6.1.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production by Application (2020-2025)

6.1.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production by Application (2026-2031)

6.1.3 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share by Application (2020-2031)

6.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Application (2020-2031)

6.2.1 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Application (2020-2025)

6.2.2 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Application (2026-2031)

6.2.3 Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Market Share by Application (2020-2031)

6.3 Global 6-8 inches SiC Wafer Laser Cutting Equipment Price by Application (2020-2031)

7 Key Companies Profiled

7.1 DISCO

7.1.1 DISCO 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

7.1.2 DISCO 6-8 inches SiC Wafer Laser Cutting Equipment Product Portfolio

7.1.3 DISCO 6-8 inches SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.1.4 DISCO Main Business and Markets Served

7.1.5 DISCO Recent Developments/Updates

7.2 Delphi Laser

7.2.1 Delphi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

7.2.2 Delphi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Product Portfolio

7.2.3 Delphi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.2.4 Delphi Laser Main Business and Markets Served

7.2.5 Delphi Laser Recent Developments/Updates

7.3 Han's Laser

7.3.1 Han's Laser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

7.3.2 Han's Laser 6-8 inches SiC Wafer Laser Cutting Equipment Product Portfolio

7.3.3 Han's Laser 6-8 inches SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.3.4 Han's Laser Main Business and Markets Served

7.3.5 Han's Laser Recent Developments/Updates

7.4 3D-Micromac AG

7.4.1 3D-Micromac AG 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

7.4.2 3D-Micromac AG 6-8 inches SiC Wafer Laser Cutting Equipment Product Portfolio

7.4.3 3D-Micromac AG 6-8 inches SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.4.4 3D-Micromac AG Main Business and Markets Served

7.4.5 3D-Micromac AG Recent Developments/Updates

7.5 Synova S.A.

7.5.1 Synova S.A. 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

7.5.2 Synova S.A. 6-8 inches SiC Wafer Laser Cutting Equipment Product Portfolio

7.5.3 Synova S.A. 6-8 inches SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.5.4 Synova S.A. Main Business and Markets Served

7.5.5 Synova S.A. Recent Developments/Updates

7.6 HGLaser

7.6.1 HGLaser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

7.6.2 HGLaser 6-8 inches SiC Wafer Laser Cutting Equipment Product Portfolio

7.6.3 HGLaser 6-8 inches SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.6.4 HGLaser Main Business and Markets Served

7.6.5 HGLaser Recent Developments/Updates

7.7 CHN.GIE

7.7.1 CHN.GIE 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

7.7.2 CHN.GIE 6-8 inches SiC Wafer Laser Cutting Equipment Product Portfolio

7.7.3 CHN.GIE 6-8 inches SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.7.4 CHN.GIE Main Business and Markets Served

7.7.5 CHN.GIE Recent Developments/Updates

7.8 DR Laser

7.8.1 DR Laser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

7.8.2 DR Laser 6-8 inches SiC Wafer Laser Cutting Equipment Product Portfolio

7.8.3 DR Laser 6-8 inches SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.8.4 DR Laser Main Business and Markets Served

7.8.5 DR Laser Recent Developments/Updates

7.9 Quick Laser

7.9.1 Quick Laser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

7.9.2 Quick Laser 6-8 inches SiC Wafer Laser Cutting Equipment Product Portfolio

7.9.3 Quick Laser 6-8 inches SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Quick Laser Main Business and Markets Served

7.9.5 Quick Laser Recent Developments/Updates

7.10 Lumi Laser

7.10.1 Lumi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

7.10.2 Lumi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Product Portfolio

7.10.3 Lumi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)

7.10.4 Lumi Laser Main Business and Markets Served

7.10.5 Lumi Laser Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 6-8 inches SiC Wafer Laser Cutting Equipment Industry Chain Analysis

8.2 6-8 inches SiC Wafer Laser Cutting Equipment Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 6-8 inches SiC Wafer Laser Cutting Equipment Production Mode & Process Analysis

8.4 6-8 inches SiC Wafer Laser Cutting Equipment Sales and Marketing

8.4.1 6-8 inches SiC Wafer Laser Cutting Equipment Sales Channels

8.4.2 6-8 inches SiC Wafer Laser Cutting Equipment Distributors

8.5 6-8 inches SiC Wafer Laser Cutting Equipment Customer Analysis

9 6-8 inches SiC Wafer Laser Cutting Equipment Market Dynamics

9.1 6-8 inches SiC Wafer Laser Cutting Equipment Industry Trends

9.2 6-8 inches SiC Wafer Laser Cutting Equipment Market Drivers

9.3 6-8 inches SiC Wafer Laser Cutting Equipment Market Challenges

9.4 6-8 inches SiC Wafer Laser Cutting Equipment Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

List of Tables

Table 1. Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Capacity (K Units) by Manufacturers in 2024

Table 4. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production by Manufacturers (2020-2025) & (K Units)

Table 5. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share by Manufacturers (2020-2025)

Table 6. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of 6-8 inches SiC Wafer Laser Cutting Equipment, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in 6-8 inches SiC Wafer Laser Cutting Equipment as of 2024)

Table 10. Global Market 6-8 inches SiC Wafer Laser Cutting Equipment Average Price by Manufacturers (US$/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of 6-8 inches SiC Wafer Laser Cutting Equipment, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of 6-8 inches SiC Wafer Laser Cutting Equipment, Product Offered and Application

Table 13. Global Key Manufacturers of 6-8 inches SiC Wafer Laser Cutting Equipment, Date of Enter into This Industry

Table 14. Global 6-8 inches SiC Wafer Laser Cutting Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) by Region (2020-2025)

Table 18. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Market Share by Region (2020-2025)

Table 19. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)

Table 22. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units) by Region (2020-2025)

Table 23. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share by Region (2020-2025)

Table 24. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units) Forecast by Region (2026-2031)

Table 25. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share Forecast by Region (2026-2031)

Table 26. Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Average Price (US$/Unit) by Region (2020-2025)

Table 27. Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Average Price (US$/Unit) by Region (2026-2031)

Table 28. Global 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)

Table 29. Global 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Region (2020-2025) & (K Units)

Table 30. Global 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Market Share by Region (2020-2025)

Table 31. Global 6-8 inches SiC Wafer Laser Cutting Equipment Forecasted Consumption by Region (2026-2031) & (K Units)

Table 32. Global 6-8 inches SiC Wafer Laser Cutting Equipment Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 34. North America 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2025) & (K Units)

Table 35. North America 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Country (2026-2031) & (K Units)

Table 36. Europe 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 37. Europe 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2025) & (K Units)

Table 38. Europe 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Country (2026-2031) & (K Units)

Table 39. Asia Pacific 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)

Table 40. Asia Pacific 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Region (2020-2025) & (K Units)

Table 41. Asia Pacific 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Region (2026-2031) & (K Units)

Table 42. Latin America, Middle East & Africa 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 43. Latin America, Middle East & Africa 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Country (2020-2025) & (K Units)

Table 44. Latin America, Middle East & Africa 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Country (2026-2031) & (K Units)

Table 45. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units) by Type (2020-2025)

Table 46. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units) by Type (2026-2031)

Table 47. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share by Type (2020-2025)

Table 48. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share by Type (2026-2031)

Table 49. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) by Type (2020-2025)

Table 50. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) by Type (2026-2031)

Table 51. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Market Share by Type (2020-2025)

Table 52. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Market Share by Type (2026-2031)

Table 53. Global 6-8 inches SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Type (2020-2025)

Table 54. Global 6-8 inches SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Type (2026-2031)

Table 55. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units) by Application (2020-2025)

Table 56. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units) by Application (2026-2031)

Table 57. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share by Application (2020-2025)

Table 58. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share by Application (2026-2031)

Table 59. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) by Application (2020-2025)

Table 60. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) by Application (2026-2031)

Table 61. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Market Share by Application (2020-2025)

Table 62. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Market Share by Application (2026-2031)

Table 63. Global 6-8 inches SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Application (2020-2025)

Table 64. Global 6-8 inches SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Application (2026-2031)

Table 65. DISCO 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

Table 66. DISCO 6-8 inches SiC Wafer Laser Cutting Equipment Specification and Application

Table 67. DISCO 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 68. DISCO Main Business and Markets Served

Table 69. DISCO Recent Developments/Updates

Table 70. Delphi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

Table 71. Delphi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Specification and Application

Table 72. Delphi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 73. Delphi Laser Main Business and Markets Served

Table 74. Delphi Laser Recent Developments/Updates

Table 75. Han's Laser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

Table 76. Han's Laser 6-8 inches SiC Wafer Laser Cutting Equipment Specification and Application

Table 77. Han's Laser 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 78. Han's Laser Main Business and Markets Served

Table 79. Han's Laser Recent Developments/Updates

Table 80. 3D-Micromac AG 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

Table 81. 3D-Micromac AG 6-8 inches SiC Wafer Laser Cutting Equipment Specification and Application

Table 82. 3D-Micromac AG 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 83. 3D-Micromac AG Main Business and Markets Served

Table 84. 3D-Micromac AG Recent Developments/Updates

Table 85. Synova S.A. 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

Table 86. Synova S.A. 6-8 inches SiC Wafer Laser Cutting Equipment Specification and Application

Table 87. Synova S.A. 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 88. Synova S.A. Main Business and Markets Served

Table 89. Synova S.A. Recent Developments/Updates

Table 90. HGLaser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

Table 91. HGLaser 6-8 inches SiC Wafer Laser Cutting Equipment Specification and Application

Table 92. HGLaser 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 93. HGLaser Main Business and Markets Served

Table 94. HGLaser Recent Developments/Updates

Table 95. CHN.GIE 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

Table 96. CHN.GIE 6-8 inches SiC Wafer Laser Cutting Equipment Specification and Application

Table 97. CHN.GIE 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 98. CHN.GIE Main Business and Markets Served

Table 99. CHN.GIE Recent Developments/Updates

Table 100. DR Laser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

Table 101. DR Laser 6-8 inches SiC Wafer Laser Cutting Equipment Specification and Application

Table 102. DR Laser 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 103. DR Laser Main Business and Markets Served

Table 104. DR Laser Recent Developments/Updates

Table 105. Quick Laser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

Table 106. Quick Laser 6-8 inches SiC Wafer Laser Cutting Equipment Specification and Application

Table 107. Quick Laser 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 108. Quick Laser Main Business and Markets Served

Table 109. Quick Laser Recent Developments/Updates

Table 110. Lumi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Company Information

Table 111. Lumi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Specification and Application

Table 112. Lumi Laser 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 113. Lumi Laser Main Business and Markets Served

Table 114. Lumi Laser Recent Developments/Updates

Table 115. Key Raw Materials Lists

Table 116. Raw Materials Key Suppliers Lists

Table 117. 6-8 inches SiC Wafer Laser Cutting Equipment Distributors List

Table 118. 6-8 inches SiC Wafer Laser Cutting Equipment Customers List

Table 119. 6-8 inches SiC Wafer Laser Cutting Equipment Market Trends

Table 120. 6-8 inches SiC Wafer Laser Cutting Equipment Market Drivers

Table 121. 6-8 inches SiC Wafer Laser Cutting Equipment Market Challenges

Table 122. 6-8 inches SiC Wafer Laser Cutting Equipment Market Restraints

Table 123. Research Programs/Design for This Report

Table 124. Key Data Information from Secondary Sources

Table 125. Key Data Information from Primary Sources

Table 126. Authors List of This Report

List of Figures

Figure 1. Product Picture of 6-8 inches SiC Wafer Laser Cutting Equipment

Figure 2. Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Share by Type: 2024 VS 2031

Figure 4. Laser Modified Cutting Product Picture

Figure 5. Thermal Laser Separation Product Picture

Figure 6. Laser MicroJet Product Picture

Figure 7. Laser Ablation Product Picture

Figure 8. Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Value by Application, (US$ Million) & (2020-2031)

Figure 9. Global 6-8 inches SiC Wafer Laser Cutting Equipment Market Share by Application: 2024 VS 2031

Figure 10. SiC Wafer

Figure 11. GaN Wafer

Figure 12. Other

Figure 13. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 14. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) & (2020-2031)

Figure 15. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Capacity (K Units) & (2020-2031)

Figure 16. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production (K Units) & (2020-2031)

Figure 17. Global 6-8 inches SiC Wafer Laser Cutting Equipment Average Price (US$/Unit) & (2020-2031)

Figure 18. 6-8 inches SiC Wafer Laser Cutting Equipment Report Years Considered

Figure 19. 6-8 inches SiC Wafer Laser Cutting Equipment Production Share by Manufacturers in 2024

Figure 20. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Share by Manufacturers (2024)

Figure 21. 6-8 inches SiC Wafer Laser Cutting Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 22. The Global 5 and 10 Largest Players: Market Share by 6-8 inches SiC Wafer Laser Cutting Equipment Revenue in 2024

Figure 23. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 24. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 25. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)

Figure 26. Global 6-8 inches SiC Wafer Laser Cutting Equipment Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 27. North America 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Europe 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 29. China 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 30. Japan 6-8 inches SiC Wafer Laser Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 31. Global 6-8 inches SiC Wafer Laser Cutting Equipment Consumption by Region: 2020 VS 2024 VS 2031 (K Units)

Figure 32. Global 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 33. North America 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 34. North America 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Market Share by Country (2020-2031)

Figure 35. U.S. 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 36. Canada 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 37. Europe 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 38. Europe 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Market Share by Country (2020-2031)

Figure 39. Germany 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 40. France 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 41. U.K. 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 42. Italy 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 43. Netherlands 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 44. Asia Pacific 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 45. Asia Pacific 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Market Share by Region (2020-2031)

Figure 46. China 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 47. Japan 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 48. South Korea 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 49. China Taiwan 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 50. Southeast Asia 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 51. India 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 52. Latin America, Middle East & Africa 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 53. Latin America, Middle East & Africa 6-8 inches SiC Wafer Laser Cutting Equipment Consumption Market Share by Country (2020-2031)

Figure 54. Mexico 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 55. Brazil 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 56. Turkey 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 57. GCC Countries 6-8 inches SiC Wafer Laser Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)

Figure 58. Global Production Market Share of 6-8 inches SiC Wafer Laser Cutting Equipment by Type (2020-2031)

Figure 59. Global Production Value Market Share of 6-8 inches SiC Wafer Laser Cutting Equipment by Type (2020-2031)

Figure 60. Global 6-8 inches SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Type (2020-2031)

Figure 61. Global Production Market Share of 6-8 inches SiC Wafer Laser Cutting Equipment by Application (2020-2031)

Figure 62. Global Production Value Market Share of 6-8 inches SiC Wafer Laser Cutting Equipment by Application (2020-2031)

Figure 63. Global 6-8 inches SiC Wafer Laser Cutting Equipment Price (US$/Unit) by Application (2020-2031)

Figure 64. 6-8 inches SiC Wafer Laser Cutting Equipment Value Chain

Figure 65. Channels of Distribution (Direct Vs Distribution)

Figure 66. Bottom-up and Top-down Approaches for This Report

Figure 67. Data Triangulation

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SiC Wafer Laser Modified Cutting Equipment Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030

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