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Global Electroless Plating Solutions for Package Substrate Market Research Report 2025
Published Date: June 2025
|
Report Code: QYRE-Auto-39S16872
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Global Electroless Plating Solutions for Package Substrate Market Research Report 2024
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Global Electroless Plating Solutions for Package Substrate Market Research Report 2025

Code: QYRE-Auto-39S16872
Report
June 2025
Pages:80
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
C.Uyemura & Co.
Atotech (MKS)
Tanaka
YMT
Shenzhen Yicheng Electronic
okuno chemical industries
DOW Electronic Materials (Dupont)
MK Chem & Tech Co., Ltd
KPM Tech Vina

Electroless Plating Solutions for Package Substrate Market Size

The global market for Electroless Plating Solutions for Package Substrate was valued at US$ 198 million in the year 2024 and is projected to reach a revised size of US$ 333 million by 2031, growing at a CAGR of 7.8% during the forecast period.

Electroless Plating Solutions for Package Substrate Market

Electroless Plating Solutions for Package Substrate Market

Chemical plating solutions for packaging substrates mainly include electroless nickel plating solutions, chemical palladium plating solutions, chemical gold plating solutions, chemical copper plating solutions, chemical tin plating solutions, degreasing, activation, etc. Among them, the ENEPIG solution can form a nickel-palladium-gold three-layer structure on the lead frame and the pad of the packaging substrate to improve the welding reliability under lead-free solder and prevent failure caused by sulfides.
In the field of IC packaging substrates, the chemical plating solution market is mainly monopolized by the top 1/2 companies. The main reason is that in the field of chemical surface treatment solutions, they are basically designated suppliers. Globally, the TOP5 companies are Uemura, Atotech, Dow Electronic Materials (DuPont), Tanaka, and YMT, with a market share of over 82%.
This report aims to provide a comprehensive presentation of the global market for Electroless Plating Solutions for Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electroless Plating Solutions for Package Substrate.
The Electroless Plating Solutions for Package Substrate market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Electroless Plating Solutions for Package Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electroless Plating Solutions for Package Substrate companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Electroless Plating Solutions for Package Substrate Market Report

Report Metric Details
Report Name Electroless Plating Solutions for Package Substrate Market
Accounted market size in year US$ 198 million
Forecasted market size in 2031 US$ 333 million
CAGR 7.8%
Base Year year
Forecasted years 2025 - 2031
Segment by Type
  • ENEPIG
  • ENIG
  • Others
Segment by Application
  • FC Package Substrate
  • WB Package Substrate
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company C. Uyemura & Co, Atotech (MKS), DOW Electronic Materials (Dupont), TANAKA, YMT, MK Chem & Tech Co., Ltd, Shenzhen Yicheng Electronic, KPM Tech Vina, OKUNO Chemical Industries
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
  • Chapter 3: Detailed analysis of Electroless Plating Solutions for Package Substrate company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
  • Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Electroless Plating Solutions for Package Substrate Market growing?

Ans: The Electroless Plating Solutions for Package Substrate Market witnessing a CAGR of 7.8% during the forecast period 2025-2031.

What is the Electroless Plating Solutions for Package Substrate Market size in 2031?

Ans: The Electroless Plating Solutions for Package Substrate Market size in 2031 will be US$ 333 million.

What is the Dow Electronic Materials (DuPont), Tanaka, YMT share in Electroless Plating Solutions for Package Substrate Market?

Ans: Globally, the TOP5 companies are Uemura, Atotech, Dow Electronic Materials (DuPont), Tanaka, and YMT, with a market share of over 82%.

Who are the main players in the Electroless Plating Solutions for Package Substrate Market report?

Ans: The main players in the Electroless Plating Solutions for Package Substrate Market are C. Uyemura & Co, Atotech (MKS), DOW Electronic Materials (Dupont), TANAKA, YMT, MK Chem & Tech Co., Ltd, Shenzhen Yicheng Electronic, KPM Tech Vina, OKUNO Chemical Industries

What are the Application segmentation covered in the Electroless Plating Solutions for Package Substrate Market report?

Ans: The Applications covered in the Electroless Plating Solutions for Package Substrate Market report are FC Package Substrate, WB Package Substrate

What are the Type segmentation covered in the Electroless Plating Solutions for Package Substrate Market report?

Ans: The Types covered in the Electroless Plating Solutions for Package Substrate Market report are ENEPIG, ENIG, Others

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Electroless Plating Solutions for Package Substrate Market Size Growth Rate by Type: 2020 VS 2024 VS 2031
1.2.2 ENEPIG
1.2.3 ENIG
1.2.4 Others
1.3 Market by Application
1.3.1 Global Electroless Plating Solutions for Package Substrate Market Growth by Application: 2020 VS 2024 VS 2031
1.3.2 FC Package Substrate
1.3.3 WB Package Substrate
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Electroless Plating Solutions for Package Substrate Market Perspective (2020-2031)
2.2 Global Electroless Plating Solutions for Package Substrate Growth Trends by Region
2.2.1 Global Electroless Plating Solutions for Package Substrate Market Size by Region: 2020 VS 2024 VS 2031
2.2.2 Electroless Plating Solutions for Package Substrate Historic Market Size by Region (2020-2025)
2.2.3 Electroless Plating Solutions for Package Substrate Forecasted Market Size by Region (2026-2031)
2.3 Electroless Plating Solutions for Package Substrate Market Dynamics
2.3.1 Electroless Plating Solutions for Package Substrate Industry Trends
2.3.2 Electroless Plating Solutions for Package Substrate Market Drivers
2.3.3 Electroless Plating Solutions for Package Substrate Market Challenges
2.3.4 Electroless Plating Solutions for Package Substrate Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Electroless Plating Solutions for Package Substrate Players by Revenue
3.1.1 Global Top Electroless Plating Solutions for Package Substrate Players by Revenue (2020-2025)
3.1.2 Global Electroless Plating Solutions for Package Substrate Revenue Market Share by Players (2020-2025)
3.2 Global Electroless Plating Solutions for Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Electroless Plating Solutions for Package Substrate Revenue
3.4 Global Electroless Plating Solutions for Package Substrate Market Concentration Ratio
3.4.1 Global Electroless Plating Solutions for Package Substrate Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Electroless Plating Solutions for Package Substrate Revenue in 2024
3.5 Global Key Players of Electroless Plating Solutions for Package Substrate Head office and Area Served
3.6 Global Key Players of Electroless Plating Solutions for Package Substrate, Product and Application
3.7 Global Key Players of Electroless Plating Solutions for Package Substrate, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Electroless Plating Solutions for Package Substrate Breakdown Data by Type
4.1 Global Electroless Plating Solutions for Package Substrate Historic Market Size by Type (2020-2025)
4.2 Global Electroless Plating Solutions for Package Substrate Forecasted Market Size by Type (2026-2031)
5 Electroless Plating Solutions for Package Substrate Breakdown Data by Application
5.1 Global Electroless Plating Solutions for Package Substrate Historic Market Size by Application (2020-2025)
5.2 Global Electroless Plating Solutions for Package Substrate Forecasted Market Size by Application (2026-2031)
6 North America
6.1 North America Electroless Plating Solutions for Package Substrate Market Size (2020-2031)
6.2 North America Electroless Plating Solutions for Package Substrate Market Growth Rate by Country: 2020 VS 2024 VS 2031
6.3 North America Electroless Plating Solutions for Package Substrate Market Size by Country (2020-2025)
6.4 North America Electroless Plating Solutions for Package Substrate Market Size by Country (2026-2031)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Electroless Plating Solutions for Package Substrate Market Size (2020-2031)
7.2 Europe Electroless Plating Solutions for Package Substrate Market Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 Europe Electroless Plating Solutions for Package Substrate Market Size by Country (2020-2025)
7.4 Europe Electroless Plating Solutions for Package Substrate Market Size by Country (2026-2031)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Electroless Plating Solutions for Package Substrate Market Size (2020-2031)
8.2 Asia-Pacific Electroless Plating Solutions for Package Substrate Market Growth Rate by Region: 2020 VS 2024 VS 2031
8.3 Asia-Pacific Electroless Plating Solutions for Package Substrate Market Size by Region (2020-2025)
8.4 Asia-Pacific Electroless Plating Solutions for Package Substrate Market Size by Region (2026-2031)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Electroless Plating Solutions for Package Substrate Market Size (2020-2031)
9.2 Latin America Electroless Plating Solutions for Package Substrate Market Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Latin America Electroless Plating Solutions for Package Substrate Market Size by Country (2020-2025)
9.4 Latin America Electroless Plating Solutions for Package Substrate Market Size by Country (2026-2031)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Electroless Plating Solutions for Package Substrate Market Size (2020-2031)
10.2 Middle East & Africa Electroless Plating Solutions for Package Substrate Market Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 Middle East & Africa Electroless Plating Solutions for Package Substrate Market Size by Country (2020-2025)
10.4 Middle East & Africa Electroless Plating Solutions for Package Substrate Market Size by Country (2026-2031)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 C. Uyemura & Co
11.1.1 C. Uyemura & Co Company Details
11.1.2 C. Uyemura & Co Business Overview
11.1.3 C. Uyemura & Co Electroless Plating Solutions for Package Substrate Introduction
11.1.4 C. Uyemura & Co Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025)
11.1.5 C. Uyemura & Co Recent Development
11.2 Atotech (MKS)
11.2.1 Atotech (MKS) Company Details
11.2.2 Atotech (MKS) Business Overview
11.2.3 Atotech (MKS) Electroless Plating Solutions for Package Substrate Introduction
11.2.4 Atotech (MKS) Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025)
11.2.5 Atotech (MKS) Recent Development
11.3 DOW Electronic Materials (Dupont)
11.3.1 DOW Electronic Materials (Dupont) Company Details
11.3.2 DOW Electronic Materials (Dupont) Business Overview
11.3.3 DOW Electronic Materials (Dupont) Electroless Plating Solutions for Package Substrate Introduction
11.3.4 DOW Electronic Materials (Dupont) Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025)
11.3.5 DOW Electronic Materials (Dupont) Recent Development
11.4 TANAKA
11.4.1 TANAKA Company Details
11.4.2 TANAKA Business Overview
11.4.3 TANAKA Electroless Plating Solutions for Package Substrate Introduction
11.4.4 TANAKA Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025)
11.4.5 TANAKA Recent Development
11.5 YMT
11.5.1 YMT Company Details
11.5.2 YMT Business Overview
11.5.3 YMT Electroless Plating Solutions for Package Substrate Introduction
11.5.4 YMT Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025)
11.5.5 YMT Recent Development
11.6 MK Chem & Tech Co., Ltd
11.6.1 MK Chem & Tech Co., Ltd Company Details
11.6.2 MK Chem & Tech Co., Ltd Business Overview
11.6.3 MK Chem & Tech Co., Ltd Electroless Plating Solutions for Package Substrate Introduction
11.6.4 MK Chem & Tech Co., Ltd Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025)
11.6.5 MK Chem & Tech Co., Ltd Recent Development
11.7 Shenzhen Yicheng Electronic
11.7.1 Shenzhen Yicheng Electronic Company Details
11.7.2 Shenzhen Yicheng Electronic Business Overview
11.7.3 Shenzhen Yicheng Electronic Electroless Plating Solutions for Package Substrate Introduction
11.7.4 Shenzhen Yicheng Electronic Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025)
11.7.5 Shenzhen Yicheng Electronic Recent Development
11.8 KPM Tech Vina
11.8.1 KPM Tech Vina Company Details
11.8.2 KPM Tech Vina Business Overview
11.8.3 KPM Tech Vina Electroless Plating Solutions for Package Substrate Introduction
11.8.4 KPM Tech Vina Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025)
11.8.5 KPM Tech Vina Recent Development
11.9 OKUNO Chemical Industries
11.9.1 OKUNO Chemical Industries Company Details
11.9.2 OKUNO Chemical Industries Business Overview
11.9.3 OKUNO Chemical Industries Electroless Plating Solutions for Package Substrate Introduction
11.9.4 OKUNO Chemical Industries Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025)
11.9.5 OKUNO Chemical Industries Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
FEATURED COMPANIES
C.Uyemura & Co.
Atotech (MKS)
Tanaka
YMT
Shenzhen Yicheng Electronic
okuno chemical industries
DOW Electronic Materials (Dupont)
MK Chem & Tech Co., Ltd
KPM Tech Vina
List of Tables
 Table 1. Global Electroless Plating Solutions for Package Substrate Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031
 Table 2. Key Players of ENEPIG
 Table 3. Key Players of ENIG
 Table 4. Key Players of Others
 Table 5. Global Electroless Plating Solutions for Package Substrate Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031
 Table 6. Global Electroless Plating Solutions for Package Substrate Market Size by Region (US$ Million): 2020 VS 2024 VS 2031
 Table 7. Global Electroless Plating Solutions for Package Substrate Market Size by Region (2020-2025) & (US$ Million)
 Table 8. Global Electroless Plating Solutions for Package Substrate Market Share by Region (2020-2025)
 Table 9. Global Electroless Plating Solutions for Package Substrate Forecasted Market Size by Region (2026-2031) & (US$ Million)
 Table 10. Global Electroless Plating Solutions for Package Substrate Market Share by Region (2026-2031)
 Table 11. Electroless Plating Solutions for Package Substrate Market Trends
 Table 12. Electroless Plating Solutions for Package Substrate Market Drivers
 Table 13. Electroless Plating Solutions for Package Substrate Market Challenges
 Table 14. Electroless Plating Solutions for Package Substrate Market Restraints
 Table 15. Global Electroless Plating Solutions for Package Substrate Revenue by Players (2020-2025) & (US$ Million)
 Table 16. Global Electroless Plating Solutions for Package Substrate Market Share by Players (2020-2025)
 Table 17. Global Top Electroless Plating Solutions for Package Substrate Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Electroless Plating Solutions for Package Substrate as of 2024)
 Table 18. Ranking of Global Top Electroless Plating Solutions for Package Substrate Companies by Revenue (US$ Million) in 2024
 Table 19. Global 5 Largest Players Market Share by Electroless Plating Solutions for Package Substrate Revenue (CR5 and HHI) & (2020-2025)
 Table 20. Global Key Players of Electroless Plating Solutions for Package Substrate, Headquarters and Area Served
 Table 21. Global Key Players of Electroless Plating Solutions for Package Substrate, Product and Application
 Table 22. Global Key Players of Electroless Plating Solutions for Package Substrate, Date of Enter into This Industry
 Table 23. Mergers & Acquisitions, Expansion Plans
 Table 24. Global Electroless Plating Solutions for Package Substrate Market Size by Type (2020-2025) & (US$ Million)
 Table 25. Global Electroless Plating Solutions for Package Substrate Revenue Market Share by Type (2020-2025)
 Table 26. Global Electroless Plating Solutions for Package Substrate Forecasted Market Size by Type (2026-2031) & (US$ Million)
 Table 27. Global Electroless Plating Solutions for Package Substrate Revenue Market Share by Type (2026-2031)
 Table 28. Global Electroless Plating Solutions for Package Substrate Market Size by Application (2020-2025) & (US$ Million)
 Table 29. Global Electroless Plating Solutions for Package Substrate Revenue Market Share by Application (2020-2025)
 Table 30. Global Electroless Plating Solutions for Package Substrate Forecasted Market Size by Application (2026-2031) & (US$ Million)
 Table 31. Global Electroless Plating Solutions for Package Substrate Revenue Market Share by Application (2026-2031)
 Table 32. North America Electroless Plating Solutions for Package Substrate Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 33. North America Electroless Plating Solutions for Package Substrate Market Size by Country (2020-2025) & (US$ Million)
 Table 34. North America Electroless Plating Solutions for Package Substrate Market Size by Country (2026-2031) & (US$ Million)
 Table 35. Europe Electroless Plating Solutions for Package Substrate Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 36. Europe Electroless Plating Solutions for Package Substrate Market Size by Country (2020-2025) & (US$ Million)
 Table 37. Europe Electroless Plating Solutions for Package Substrate Market Size by Country (2026-2031) & (US$ Million)
 Table 38. Asia-Pacific Electroless Plating Solutions for Package Substrate Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031
 Table 39. Asia-Pacific Electroless Plating Solutions for Package Substrate Market Size by Region (2020-2025) & (US$ Million)
 Table 40. Asia-Pacific Electroless Plating Solutions for Package Substrate Market Size by Region (2026-2031) & (US$ Million)
 Table 41. Latin America Electroless Plating Solutions for Package Substrate Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 42. Latin America Electroless Plating Solutions for Package Substrate Market Size by Country (2020-2025) & (US$ Million)
 Table 43. Latin America Electroless Plating Solutions for Package Substrate Market Size by Country (2026-2031) & (US$ Million)
 Table 44. Middle East & Africa Electroless Plating Solutions for Package Substrate Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 45. Middle East & Africa Electroless Plating Solutions for Package Substrate Market Size by Country (2020-2025) & (US$ Million)
 Table 46. Middle East & Africa Electroless Plating Solutions for Package Substrate Market Size by Country (2026-2031) & (US$ Million)
 Table 47. C. Uyemura & Co Company Details
 Table 48. C. Uyemura & Co Business Overview
 Table 49. C. Uyemura & Co Electroless Plating Solutions for Package Substrate Product
 Table 50. C. Uyemura & Co Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025) & (US$ Million)
 Table 51. C. Uyemura & Co Recent Development
 Table 52. Atotech (MKS) Company Details
 Table 53. Atotech (MKS) Business Overview
 Table 54. Atotech (MKS) Electroless Plating Solutions for Package Substrate Product
 Table 55. Atotech (MKS) Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025) & (US$ Million)
 Table 56. Atotech (MKS) Recent Development
 Table 57. DOW Electronic Materials (Dupont) Company Details
 Table 58. DOW Electronic Materials (Dupont) Business Overview
 Table 59. DOW Electronic Materials (Dupont) Electroless Plating Solutions for Package Substrate Product
 Table 60. DOW Electronic Materials (Dupont) Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025) & (US$ Million)
 Table 61. DOW Electronic Materials (Dupont) Recent Development
 Table 62. TANAKA Company Details
 Table 63. TANAKA Business Overview
 Table 64. TANAKA Electroless Plating Solutions for Package Substrate Product
 Table 65. TANAKA Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025) & (US$ Million)
 Table 66. TANAKA Recent Development
 Table 67. YMT Company Details
 Table 68. YMT Business Overview
 Table 69. YMT Electroless Plating Solutions for Package Substrate Product
 Table 70. YMT Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025) & (US$ Million)
 Table 71. YMT Recent Development
 Table 72. MK Chem & Tech Co., Ltd Company Details
 Table 73. MK Chem & Tech Co., Ltd Business Overview
 Table 74. MK Chem & Tech Co., Ltd Electroless Plating Solutions for Package Substrate Product
 Table 75. MK Chem & Tech Co., Ltd Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025) & (US$ Million)
 Table 76. MK Chem & Tech Co., Ltd Recent Development
 Table 77. Shenzhen Yicheng Electronic Company Details
 Table 78. Shenzhen Yicheng Electronic Business Overview
 Table 79. Shenzhen Yicheng Electronic Electroless Plating Solutions for Package Substrate Product
 Table 80. Shenzhen Yicheng Electronic Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025) & (US$ Million)
 Table 81. Shenzhen Yicheng Electronic Recent Development
 Table 82. KPM Tech Vina Company Details
 Table 83. KPM Tech Vina Business Overview
 Table 84. KPM Tech Vina Electroless Plating Solutions for Package Substrate Product
 Table 85. KPM Tech Vina Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025) & (US$ Million)
 Table 86. KPM Tech Vina Recent Development
 Table 87. OKUNO Chemical Industries Company Details
 Table 88. OKUNO Chemical Industries Business Overview
 Table 89. OKUNO Chemical Industries Electroless Plating Solutions for Package Substrate Product
 Table 90. OKUNO Chemical Industries Revenue in Electroless Plating Solutions for Package Substrate Business (2020-2025) & (US$ Million)
 Table 91. OKUNO Chemical Industries Recent Development
 Table 92. Research Programs/Design for This Report
 Table 93. Key Data Information from Secondary Sources
 Table 94. Key Data Information from Primary Sources
 Table 95. Authors List of This Report


List of Figures
 Figure 1. Electroless Plating Solutions for Package Substrate Picture
 Figure 2. Global Electroless Plating Solutions for Package Substrate Market Size Comparison by Type (2020-2031) & (US$ Million)
 Figure 3. Global Electroless Plating Solutions for Package Substrate Market Share by Type: 2024 VS 2031
 Figure 4. ENEPIG Features
 Figure 5. ENIG Features
 Figure 6. Others Features
 Figure 7. Global Electroless Plating Solutions for Package Substrate Market Size by Application (2020-2031) & (US$ Million)
 Figure 8. Global Electroless Plating Solutions for Package Substrate Market Share by Application: 2024 VS 2031
 Figure 9. FC Package Substrate Case Studies
 Figure 10. WB Package Substrate Case Studies
 Figure 11. Electroless Plating Solutions for Package Substrate Report Years Considered
 Figure 12. Global Electroless Plating Solutions for Package Substrate Market Size (US$ Million), Year-over-Year: 2020-2031
 Figure 13. Global Electroless Plating Solutions for Package Substrate Market Size, (US$ Million), 2020 VS 2024 VS 2031
 Figure 14. Global Electroless Plating Solutions for Package Substrate Market Share by Region: 2024 VS 2031
 Figure 15. Global Electroless Plating Solutions for Package Substrate Market Share by Players in 2024
 Figure 16. Global Top Electroless Plating Solutions for Package Substrate Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Electroless Plating Solutions for Package Substrate as of 2024)
 Figure 17. The Top 10 and 5 Players Market Share by Electroless Plating Solutions for Package Substrate Revenue in 2024
 Figure 18. North America Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 19. North America Electroless Plating Solutions for Package Substrate Market Share by Country (2020-2031)
 Figure 20. United States Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 21. Canada Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 22. Europe Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 23. Europe Electroless Plating Solutions for Package Substrate Market Share by Country (2020-2031)
 Figure 24. Germany Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 25. France Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 26. U.K. Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 27. Italy Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 28. Russia Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 29. Nordic Countries Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 30. Asia-Pacific Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 31. Asia-Pacific Electroless Plating Solutions for Package Substrate Market Share by Region (2020-2031)
 Figure 32. China Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 33. Japan Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 34. South Korea Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 35. Southeast Asia Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 36. India Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 37. Australia Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 38. Latin America Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 39. Latin America Electroless Plating Solutions for Package Substrate Market Share by Country (2020-2031)
 Figure 40. Mexico Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 41. Brazil Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 42. Middle East & Africa Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 43. Middle East & Africa Electroless Plating Solutions for Package Substrate Market Share by Country (2020-2031)
 Figure 44. Turkey Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 45. Saudi Arabia Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 46. UAE Electroless Plating Solutions for Package Substrate Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 47. C. Uyemura & Co Revenue Growth Rate in Electroless Plating Solutions for Package Substrate Business (2020-2025)
 Figure 48. Atotech (MKS) Revenue Growth Rate in Electroless Plating Solutions for Package Substrate Business (2020-2025)
 Figure 49. DOW Electronic Materials (Dupont) Revenue Growth Rate in Electroless Plating Solutions for Package Substrate Business (2020-2025)
 Figure 50. TANAKA Revenue Growth Rate in Electroless Plating Solutions for Package Substrate Business (2020-2025)
 Figure 51. YMT Revenue Growth Rate in Electroless Plating Solutions for Package Substrate Business (2020-2025)
 Figure 52. MK Chem & Tech Co., Ltd Revenue Growth Rate in Electroless Plating Solutions for Package Substrate Business (2020-2025)
 Figure 53. Shenzhen Yicheng Electronic Revenue Growth Rate in Electroless Plating Solutions for Package Substrate Business (2020-2025)
 Figure 54. KPM Tech Vina Revenue Growth Rate in Electroless Plating Solutions for Package Substrate Business (2020-2025)
 Figure 55. OKUNO Chemical Industries Revenue Growth Rate in Electroless Plating Solutions for Package Substrate Business (2020-2025)
 Figure 56. Bottom-up and Top-down Approaches for This Report
 Figure 57. Data Triangulation
 Figure 58. Key Executives Interviewed
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