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Global Copper Electroplating for IC Substrates Market Research Report 2025

Published Date: January 2025

Report Code: QYRE-Auto-3Y13288

Global Copper Electroplating for IC Substrates Market Research Report 2023

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Global Copper Electroplating for IC Substrates Market Research Report 2025

Code: QYRE-Auto-3Y13288

Report

January 2025

Pages:103

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Heraeus

Tanaka

Sumitomo Metal Mining

MK Electron

Ametek Inc

MacDermid Enthone

Doublink Solders

Yantai Zhaojin Kanfort

Tatsuta Electric Wire & Cable

Kangqiang Electronics

The Prince & Izant

Guangzhou Sanfu New Material Technology

Shanghai Yongsheng Auxiliary Factory

Atotech

Jiangsu Mengde New Material Technology

Copper Electroplating for IC Substrates Market Size

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

Copper Electroplating for IC Substrates Market

The global market for Copper Electroplating for IC Substrates was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Copper Electroplating for IC Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Copper Electroplating for IC Substrates.

The Copper Electroplating for IC Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Copper Electroplating for IC Substrates market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Copper Electroplating for IC Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Copper Electroplating for IC Substrates Market Report

Report Metric	Details
Report Name	Copper Electroplating for IC Substrates Market
Accounted market size in year	US$ 579 billion
Forecasted market size in 2029	US$ 790 billion
CAGR	6%
Base Year	year
Forecasted years	2025 - 2029
by Type	Acid Plating Alkaline Plating
by Application	Semiconductor Packaging PCB Others
Production by Region	North America Europe China Japan South Korea
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, AMETEK, MacDermid Enthone, Doublink Solders, Yantai Zhaojin Kanfort, Tatsuta Electric Wire & Cable, Kangqiang Electronics, The Prince & Izant, Guangzhou Sanfu New Material Technology, Shanghai Yongsheng Auxiliary Factory, Atotech, Jiangsu Mengde New Material Technology
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Copper Electroplating for IC Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Copper Electroplating for IC Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Copper Electroplating for IC Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Copper Electroplating for IC Substrates Market growing?

Ans: The Copper Electroplating for IC Substrates Market witnessing a CAGR of 6% during the forecast period 2025-2029.

What is the Copper Electroplating for IC Substrates Market size in 2029?

Ans: The Copper Electroplating for IC Substrates Market size in 2029 will be US$ 790 billion.

What is the Copper Electroplating for IC Substrates Market share by region?

Ans: Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year.

Who are the main players in the Copper Electroplating for IC Substrates Market report?

Ans: The main players in the Copper Electroplating for IC Substrates Market are Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, AMETEK, MacDermid Enthone, Doublink Solders, Yantai Zhaojin Kanfort, Tatsuta Electric Wire & Cable, Kangqiang Electronics, The Prince & Izant, Guangzhou Sanfu New Material Technology, Shanghai Yongsheng Auxiliary Factory, Atotech, Jiangsu Mengde New Material Technology

What are the Application segmentation covered in the Copper Electroplating for IC Substrates Market report?

Ans: The Applications covered in the Copper Electroplating for IC Substrates Market report are Semiconductor Packaging, PCB, Others

What are the Type segmentation covered in the Copper Electroplating for IC Substrates Market report?

Ans: The Types covered in the Copper Electroplating for IC Substrates Market report are Acid Plating, Alkaline Plating

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Market trends :

Topic	Trends
Global	the copper electroplating for ic substrates market is experiencing growth driven by rising demand for iot-based electronics, increased analog ic applications, and ongoing technological advancements in semiconductor packaging.
Type	Acid Plating - acid plating remains a preferred method for high-density ic substrates due to its efficiency in producing fine circuit patterns for advanced semiconductor packaging. Alkaline Plating - alkaline plating is gaining traction for applications requiring uniform copper deposition and improved reliability in multilayer pcb manufacturing.
Application	Semiconductor Packaging - semiconductor packaging applications are expanding as demand grows for high-performance and miniaturized devices in automotive, communications, and consumer electronics. PCB - pcb applications are seeing increased adoption of copper electroplating to support complex circuit designs and higher integration in next-generation electronics.
Region	North America - north america is witnessing robust growth in copper electroplating for ic substrates, supported by strong semiconductor sales and investments in advanced packaging technologies. EMEA - emea region is experiencing steady growth in demand for copper electroplating driven by expansion in automotive and industrial electronics sectors. APAC - apac remains the largest market for copper electroplating for ic substrates despite a recent slight decline, with ongoing investments in semiconductor manufacturing and packaging. LATAM - latam is showing emerging opportunities for copper electroplating in ic substrates as electronics manufacturing gradually expands in the region.

1 Copper Electroplating for IC Substrates Market Overview

1.1 Product Definition

1.2 Copper Electroplating for IC Substrates by Type

1.2.1 Global Copper Electroplating for IC Substrates Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Acid Plating

1.2.3 Alkaline Plating

1.3 Copper Electroplating for IC Substrates by Application

1.3.1 Global Copper Electroplating for IC Substrates Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 Semiconductor Packaging

1.3.3 PCB

1.3.4 Others

1.4 Global Market Growth Prospects

1.4.1 Global Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Copper Electroplating for IC Substrates Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Copper Electroplating for IC Substrates Production Estimates and Forecasts (2020-2031)

1.4.4 Global Copper Electroplating for IC Substrates Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Copper Electroplating for IC Substrates Production Market Share by Manufacturers (2020-2025)

2.2 Global Copper Electroplating for IC Substrates Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Copper Electroplating for IC Substrates, Industry Ranking, 2023 VS 2024

2.4 Global Copper Electroplating for IC Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Copper Electroplating for IC Substrates Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Copper Electroplating for IC Substrates, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Copper Electroplating for IC Substrates, Product Offered and Application

2.8 Global Key Manufacturers of Copper Electroplating for IC Substrates, Date of Enter into This Industry

2.9 Copper Electroplating for IC Substrates Market Competitive Situation and Trends

2.9.1 Copper Electroplating for IC Substrates Market Concentration Rate

2.9.2 Global 5 and 10 Largest Copper Electroplating for IC Substrates Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Copper Electroplating for IC Substrates Production by Region

3.1 Global Copper Electroplating for IC Substrates Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Copper Electroplating for IC Substrates Production Value by Region (2020-2031)

3.2.1 Global Copper Electroplating for IC Substrates Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Copper Electroplating for IC Substrates by Region (2026-2031)

3.3 Global Copper Electroplating for IC Substrates Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Copper Electroplating for IC Substrates Production Volume by Region (2020-2031)

3.4.1 Global Copper Electroplating for IC Substrates Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Copper Electroplating for IC Substrates by Region (2026-2031)

3.5 Global Copper Electroplating for IC Substrates Market Price Analysis by Region (2020-2025)

3.6 Global Copper Electroplating for IC Substrates Production and Value, Year-over-Year Growth

3.6.1 North America Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2020-2031)

3.6.5 South Korea Copper Electroplating for IC Substrates Production Value Estimates and Forecasts (2020-2031)

4 Copper Electroplating for IC Substrates Consumption by Region

4.1 Global Copper Electroplating for IC Substrates Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Copper Electroplating for IC Substrates Consumption by Region (2020-2031)

4.2.1 Global Copper Electroplating for IC Substrates Consumption by Region (2020-2025)

4.2.2 Global Copper Electroplating for IC Substrates Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Copper Electroplating for IC Substrates Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Copper Electroplating for IC Substrates Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Copper Electroplating for IC Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Copper Electroplating for IC Substrates Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Israel

5 Segment by Type

5.1 Global Copper Electroplating for IC Substrates Production by Type (2020-2031)

5.1.1 Global Copper Electroplating for IC Substrates Production by Type (2020-2025)

5.1.2 Global Copper Electroplating for IC Substrates Production by Type (2026-2031)

5.1.3 Global Copper Electroplating for IC Substrates Production Market Share by Type (2020-2031)

5.2 Global Copper Electroplating for IC Substrates Production Value by Type (2020-2031)

5.2.1 Global Copper Electroplating for IC Substrates Production Value by Type (2020-2025)

5.2.2 Global Copper Electroplating for IC Substrates Production Value by Type (2026-2031)

5.2.3 Global Copper Electroplating for IC Substrates Production Value Market Share by Type (2020-2031)

5.3 Global Copper Electroplating for IC Substrates Price by Type (2020-2031)

6 Segment by Application

6.1 Global Copper Electroplating for IC Substrates Production by Application (2020-2031)

6.1.1 Global Copper Electroplating for IC Substrates Production by Application (2020-2025)

6.1.2 Global Copper Electroplating for IC Substrates Production by Application (2026-2031)

6.1.3 Global Copper Electroplating for IC Substrates Production Market Share by Application (2020-2031)

6.2 Global Copper Electroplating for IC Substrates Production Value by Application (2020-2031)

6.2.1 Global Copper Electroplating for IC Substrates Production Value by Application (2020-2025)

6.2.2 Global Copper Electroplating for IC Substrates Production Value by Application (2026-2031)

6.2.3 Global Copper Electroplating for IC Substrates Production Value Market Share by Application (2020-2031)

6.3 Global Copper Electroplating for IC Substrates Price by Application (2020-2031)

7 Key Companies Profiled

7.1 Heraeus

7.1.1 Heraeus Copper Electroplating for IC Substrates Company Information

7.1.2 Heraeus Copper Electroplating for IC Substrates Product Portfolio

7.1.3 Heraeus Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.1.4 Heraeus Main Business and Markets Served

7.1.5 Heraeus Recent Developments/Updates

7.2 Tanaka

7.2.1 Tanaka Copper Electroplating for IC Substrates Company Information

7.2.2 Tanaka Copper Electroplating for IC Substrates Product Portfolio

7.2.3 Tanaka Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.2.4 Tanaka Main Business and Markets Served

7.2.5 Tanaka Recent Developments/Updates

7.3 Sumitomo Metal Mining

7.3.1 Sumitomo Metal Mining Copper Electroplating for IC Substrates Company Information

7.3.2 Sumitomo Metal Mining Copper Electroplating for IC Substrates Product Portfolio

7.3.3 Sumitomo Metal Mining Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.3.4 Sumitomo Metal Mining Main Business and Markets Served

7.3.5 Sumitomo Metal Mining Recent Developments/Updates

7.4 MK Electron

7.4.1 MK Electron Copper Electroplating for IC Substrates Company Information

7.4.2 MK Electron Copper Electroplating for IC Substrates Product Portfolio

7.4.3 MK Electron Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.4.4 MK Electron Main Business and Markets Served

7.4.5 MK Electron Recent Developments/Updates

7.5 AMETEK

7.5.1 AMETEK Copper Electroplating for IC Substrates Company Information

7.5.2 AMETEK Copper Electroplating for IC Substrates Product Portfolio

7.5.3 AMETEK Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.5.4 AMETEK Main Business and Markets Served

7.5.5 AMETEK Recent Developments/Updates

7.6 MacDermid Enthone

7.6.1 MacDermid Enthone Copper Electroplating for IC Substrates Company Information

7.6.2 MacDermid Enthone Copper Electroplating for IC Substrates Product Portfolio

7.6.3 MacDermid Enthone Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.6.4 MacDermid Enthone Main Business and Markets Served

7.6.5 MacDermid Enthone Recent Developments/Updates

7.7 Doublink Solders

7.7.1 Doublink Solders Copper Electroplating for IC Substrates Company Information

7.7.2 Doublink Solders Copper Electroplating for IC Substrates Product Portfolio

7.7.3 Doublink Solders Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.7.4 Doublink Solders Main Business and Markets Served

7.7.5 Doublink Solders Recent Developments/Updates

7.8 Yantai Zhaojin Kanfort

7.8.1 Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Company Information

7.8.2 Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Product Portfolio

7.8.3 Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.8.4 Yantai Zhaojin Kanfort Main Business and Markets Served

7.8.5 Yantai Zhaojin Kanfort Recent Developments/Updates

7.9 Tatsuta Electric Wire & Cable

7.9.1 Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Company Information

7.9.2 Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Product Portfolio

7.9.3 Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Tatsuta Electric Wire & Cable Main Business and Markets Served

7.9.5 Tatsuta Electric Wire & Cable Recent Developments/Updates

7.10 Kangqiang Electronics

7.10.1 Kangqiang Electronics Copper Electroplating for IC Substrates Company Information

7.10.2 Kangqiang Electronics Copper Electroplating for IC Substrates Product Portfolio

7.10.3 Kangqiang Electronics Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.10.4 Kangqiang Electronics Main Business and Markets Served

7.10.5 Kangqiang Electronics Recent Developments/Updates

7.11 The Prince & Izant

7.11.1 The Prince & Izant Copper Electroplating for IC Substrates Company Information

7.11.2 The Prince & Izant Copper Electroplating for IC Substrates Product Portfolio

7.11.3 The Prince & Izant Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.11.4 The Prince & Izant Main Business and Markets Served

7.11.5 The Prince & Izant Recent Developments/Updates

7.12 Guangzhou Sanfu New Material Technology

7.12.1 Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Company Information

7.12.2 Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Product Portfolio

7.12.3 Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.12.4 Guangzhou Sanfu New Material Technology Main Business and Markets Served

7.12.5 Guangzhou Sanfu New Material Technology Recent Developments/Updates

7.13 Shanghai Yongsheng Auxiliary Factory

7.13.1 Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Company Information

7.13.2 Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Product Portfolio

7.13.3 Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.13.4 Shanghai Yongsheng Auxiliary Factory Main Business and Markets Served

7.13.5 Shanghai Yongsheng Auxiliary Factory Recent Developments/Updates

7.14 Atotech

7.14.1 Atotech Copper Electroplating for IC Substrates Company Information

7.14.2 Atotech Copper Electroplating for IC Substrates Product Portfolio

7.14.3 Atotech Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.14.4 Atotech Main Business and Markets Served

7.14.5 Atotech Recent Developments/Updates

7.15 Jiangsu Mengde New Material Technology

7.15.1 Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Company Information

7.15.2 Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Product Portfolio

7.15.3 Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Production, Value, Price and Gross Margin (2020-2025)

7.15.4 Jiangsu Mengde New Material Technology Main Business and Markets Served

7.15.5 Jiangsu Mengde New Material Technology Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Copper Electroplating for IC Substrates Industry Chain Analysis

8.2 Copper Electroplating for IC Substrates Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Copper Electroplating for IC Substrates Production Mode & Process Analysis

8.4 Copper Electroplating for IC Substrates Sales and Marketing

8.4.1 Copper Electroplating for IC Substrates Sales Channels

8.4.2 Copper Electroplating for IC Substrates Distributors

8.5 Copper Electroplating for IC Substrates Customer Analysis

9 Copper Electroplating for IC Substrates Market Dynamics

9.1 Copper Electroplating for IC Substrates Industry Trends

9.2 Copper Electroplating for IC Substrates Market Drivers

9.3 Copper Electroplating for IC Substrates Market Challenges

9.4 Copper Electroplating for IC Substrates Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

Heraeus

Tanaka

Sumitomo Metal Mining

MK Electron

Ametek Inc

MacDermid Enthone

Doublink Solders

Yantai Zhaojin Kanfort

Tatsuta Electric Wire & Cable

Kangqiang Electronics

The Prince & Izant

Guangzhou Sanfu New Material Technology

Shanghai Yongsheng Auxiliary Factory

Atotech

Jiangsu Mengde New Material Technology

List of Tables

Table 1. Global Copper Electroplating for IC Substrates Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Copper Electroplating for IC Substrates Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Copper Electroplating for IC Substrates Production Capacity (K Units) by Manufacturers in 2024

Table 4. Global Copper Electroplating for IC Substrates Production by Manufacturers (2020-2025) & (K Units)

Table 5. Global Copper Electroplating for IC Substrates Production Market Share by Manufacturers (2020-2025)

Table 6. Global Copper Electroplating for IC Substrates Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Copper Electroplating for IC Substrates Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Copper Electroplating for IC Substrates, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Copper Electroplating for IC Substrates as of 2024)

Table 10. Global Market Copper Electroplating for IC Substrates Average Price by Manufacturers (US$/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of Copper Electroplating for IC Substrates, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Copper Electroplating for IC Substrates, Product Offered and Application

Table 13. Global Key Manufacturers of Copper Electroplating for IC Substrates, Date of Enter into This Industry

Table 14. Global Copper Electroplating for IC Substrates Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Copper Electroplating for IC Substrates Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Copper Electroplating for IC Substrates Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Copper Electroplating for IC Substrates Production Value Market Share by Region (2020-2025)

Table 19. Global Copper Electroplating for IC Substrates Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Copper Electroplating for IC Substrates Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Copper Electroplating for IC Substrates Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)

Table 22. Global Copper Electroplating for IC Substrates Production (K Units) by Region (2020-2025)

Table 23. Global Copper Electroplating for IC Substrates Production Market Share by Region (2020-2025)

Table 24. Global Copper Electroplating for IC Substrates Production (K Units) Forecast by Region (2026-2031)

Table 25. Global Copper Electroplating for IC Substrates Production Market Share Forecast by Region (2026-2031)

Table 26. Global Copper Electroplating for IC Substrates Market Average Price (US$/Unit) by Region (2020-2025)

Table 27. Global Copper Electroplating for IC Substrates Market Average Price (US$/Unit) by Region (2026-2031)

Table 28. Global Copper Electroplating for IC Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)

Table 29. Global Copper Electroplating for IC Substrates Consumption by Region (2020-2025) & (K Units)

Table 30. Global Copper Electroplating for IC Substrates Consumption Market Share by Region (2020-2025)

Table 31. Global Copper Electroplating for IC Substrates Forecasted Consumption by Region (2026-2031) & (K Units)

Table 32. Global Copper Electroplating for IC Substrates Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 34. North America Copper Electroplating for IC Substrates Consumption by Country (2020-2025) & (K Units)

Table 35. North America Copper Electroplating for IC Substrates Consumption by Country (2026-2031) & (K Units)

Table 36. Europe Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 37. Europe Copper Electroplating for IC Substrates Consumption by Country (2020-2025) & (K Units)

Table 38. Europe Copper Electroplating for IC Substrates Consumption by Country (2026-2031) & (K Units)

Table 39. Asia Pacific Copper Electroplating for IC Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)

Table 40. Asia Pacific Copper Electroplating for IC Substrates Consumption by Region (2020-2025) & (K Units)

Table 41. Asia Pacific Copper Electroplating for IC Substrates Consumption by Region (2026-2031) & (K Units)

Table 42. Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 43. Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption by Country (2020-2025) & (K Units)

Table 44. Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption by Country (2026-2031) & (K Units)

Table 45. Global Copper Electroplating for IC Substrates Production (K Units) by Type (2020-2025)

Table 46. Global Copper Electroplating for IC Substrates Production (K Units) by Type (2026-2031)

Table 47. Global Copper Electroplating for IC Substrates Production Market Share by Type (2020-2025)

Table 48. Global Copper Electroplating for IC Substrates Production Market Share by Type (2026-2031)

Table 49. Global Copper Electroplating for IC Substrates Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Copper Electroplating for IC Substrates Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Copper Electroplating for IC Substrates Production Value Market Share by Type (2020-2025)

Table 52. Global Copper Electroplating for IC Substrates Production Value Market Share by Type (2026-2031)

Table 53. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Type (2020-2025)

Table 54. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Type (2026-2031)

Table 55. Global Copper Electroplating for IC Substrates Production (K Units) by Application (2020-2025)

Table 56. Global Copper Electroplating for IC Substrates Production (K Units) by Application (2026-2031)

Table 57. Global Copper Electroplating for IC Substrates Production Market Share by Application (2020-2025)

Table 58. Global Copper Electroplating for IC Substrates Production Market Share by Application (2026-2031)

Table 59. Global Copper Electroplating for IC Substrates Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Copper Electroplating for IC Substrates Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Copper Electroplating for IC Substrates Production Value Market Share by Application (2020-2025)

Table 62. Global Copper Electroplating for IC Substrates Production Value Market Share by Application (2026-2031)

Table 63. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Application (2020-2025)

Table 64. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Application (2026-2031)

Table 65. Heraeus Copper Electroplating for IC Substrates Company Information

Table 66. Heraeus Copper Electroplating for IC Substrates Specification and Application

Table 67. Heraeus Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 68. Heraeus Main Business and Markets Served

Table 69. Heraeus Recent Developments/Updates

Table 70. Tanaka Copper Electroplating for IC Substrates Company Information

Table 71. Tanaka Copper Electroplating for IC Substrates Specification and Application

Table 72. Tanaka Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 73. Tanaka Main Business and Markets Served

Table 74. Tanaka Recent Developments/Updates

Table 75. Sumitomo Metal Mining Copper Electroplating for IC Substrates Company Information

Table 76. Sumitomo Metal Mining Copper Electroplating for IC Substrates Specification and Application

Table 77. Sumitomo Metal Mining Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 78. Sumitomo Metal Mining Main Business and Markets Served

Table 79. Sumitomo Metal Mining Recent Developments/Updates

Table 80. MK Electron Copper Electroplating for IC Substrates Company Information

Table 81. MK Electron Copper Electroplating for IC Substrates Specification and Application

Table 82. MK Electron Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 83. MK Electron Main Business and Markets Served

Table 84. MK Electron Recent Developments/Updates

Table 85. AMETEK Copper Electroplating for IC Substrates Company Information

Table 86. AMETEK Copper Electroplating for IC Substrates Specification and Application

Table 87. AMETEK Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 88. AMETEK Main Business and Markets Served

Table 89. AMETEK Recent Developments/Updates

Table 90. MacDermid Enthone Copper Electroplating for IC Substrates Company Information

Table 91. MacDermid Enthone Copper Electroplating for IC Substrates Specification and Application

Table 92. MacDermid Enthone Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 93. MacDermid Enthone Main Business and Markets Served

Table 94. MacDermid Enthone Recent Developments/Updates

Table 95. Doublink Solders Copper Electroplating for IC Substrates Company Information

Table 96. Doublink Solders Copper Electroplating for IC Substrates Specification and Application

Table 97. Doublink Solders Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 98. Doublink Solders Main Business and Markets Served

Table 99. Doublink Solders Recent Developments/Updates

Table 100. Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Company Information

Table 101. Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Specification and Application

Table 102. Yantai Zhaojin Kanfort Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 103. Yantai Zhaojin Kanfort Main Business and Markets Served

Table 104. Yantai Zhaojin Kanfort Recent Developments/Updates

Table 105. Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Company Information

Table 106. Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Specification and Application

Table 107. Tatsuta Electric Wire & Cable Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 108. Tatsuta Electric Wire & Cable Main Business and Markets Served

Table 109. Tatsuta Electric Wire & Cable Recent Developments/Updates

Table 110. Kangqiang Electronics Copper Electroplating for IC Substrates Company Information

Table 111. Kangqiang Electronics Copper Electroplating for IC Substrates Specification and Application

Table 112. Kangqiang Electronics Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 113. Kangqiang Electronics Main Business and Markets Served

Table 114. Kangqiang Electronics Recent Developments/Updates

Table 115. The Prince & Izant Copper Electroplating for IC Substrates Company Information

Table 116. The Prince & Izant Copper Electroplating for IC Substrates Specification and Application

Table 117. The Prince & Izant Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 118. The Prince & Izant Main Business and Markets Served

Table 119. The Prince & Izant Recent Developments/Updates

Table 120. Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Company Information

Table 121. Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Specification and Application

Table 122. Guangzhou Sanfu New Material Technology Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 123. Guangzhou Sanfu New Material Technology Main Business and Markets Served

Table 124. Guangzhou Sanfu New Material Technology Recent Developments/Updates

Table 125. Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Company Information

Table 126. Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Specification and Application

Table 127. Shanghai Yongsheng Auxiliary Factory Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 128. Shanghai Yongsheng Auxiliary Factory Main Business and Markets Served

Table 129. Shanghai Yongsheng Auxiliary Factory Recent Developments/Updates

Table 130. Atotech Copper Electroplating for IC Substrates Company Information

Table 131. Atotech Copper Electroplating for IC Substrates Specification and Application

Table 132. Atotech Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 133. Atotech Main Business and Markets Served

Table 134. Atotech Recent Developments/Updates

Table 135. Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Company Information

Table 136. Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Specification and Application

Table 137. Jiangsu Mengde New Material Technology Copper Electroplating for IC Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 138. Jiangsu Mengde New Material Technology Main Business and Markets Served

Table 139. Jiangsu Mengde New Material Technology Recent Developments/Updates

Table 140. Key Raw Materials Lists

Table 141. Raw Materials Key Suppliers Lists

Table 142. Copper Electroplating for IC Substrates Distributors List

Table 143. Copper Electroplating for IC Substrates Customers List

Table 144. Copper Electroplating for IC Substrates Market Trends

Table 145. Copper Electroplating for IC Substrates Market Drivers

Table 146. Copper Electroplating for IC Substrates Market Challenges

Table 147. Copper Electroplating for IC Substrates Market Restraints

Table 148. Research Programs/Design for This Report

Table 149. Key Data Information from Secondary Sources

Table 150. Key Data Information from Primary Sources

Table 151. Authors List of This Report

List of Figures

Figure 1. Product Picture of Copper Electroplating for IC Substrates

Figure 2. Global Copper Electroplating for IC Substrates Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Copper Electroplating for IC Substrates Market Share by Type: 2024 VS 2031

Figure 4. Acid Plating Product Picture

Figure 5. Alkaline Plating Product Picture

Figure 6. Global Copper Electroplating for IC Substrates Market Value by Application, (US$ Million) & (2020-2031)

Figure 7. Global Copper Electroplating for IC Substrates Market Share by Application: 2024 VS 2031

Figure 8. Semiconductor Packaging

Figure 9. PCB

Figure 10. Others

Figure 11. Global Copper Electroplating for IC Substrates Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 12. Global Copper Electroplating for IC Substrates Production Value (US$ Million) & (2020-2031)

Figure 13. Global Copper Electroplating for IC Substrates Production Capacity (K Units) & (2020-2031)

Figure 14. Global Copper Electroplating for IC Substrates Production (K Units) & (2020-2031)

Figure 15. Global Copper Electroplating for IC Substrates Average Price (US$/Unit) & (2020-2031)

Figure 16. Copper Electroplating for IC Substrates Report Years Considered

Figure 17. Copper Electroplating for IC Substrates Production Share by Manufacturers in 2024

Figure 18. Global Copper Electroplating for IC Substrates Production Value Share by Manufacturers (2024)

Figure 19. Copper Electroplating for IC Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 20. The Global 5 and 10 Largest Players: Market Share by Copper Electroplating for IC Substrates Revenue in 2024

Figure 21. Global Copper Electroplating for IC Substrates Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 22. Global Copper Electroplating for IC Substrates Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 23. Global Copper Electroplating for IC Substrates Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)

Figure 24. Global Copper Electroplating for IC Substrates Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 25. North America Copper Electroplating for IC Substrates Production Value (US$ Million) Growth Rate (2020-2031)

Figure 26. Europe Copper Electroplating for IC Substrates Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. China Copper Electroplating for IC Substrates Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Japan Copper Electroplating for IC Substrates Production Value (US$ Million) Growth Rate (2020-2031)

Figure 29. South Korea Copper Electroplating for IC Substrates Production Value (US$ Million) Growth Rate (2020-2031)

Figure 30. Global Copper Electroplating for IC Substrates Consumption by Region: 2020 VS 2024 VS 2031 (K Units)

Figure 31. Global Copper Electroplating for IC Substrates Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 32. North America Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 33. North America Copper Electroplating for IC Substrates Consumption Market Share by Country (2020-2031)

Figure 34. U.S. Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 35. Canada Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 36. Europe Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 37. Europe Copper Electroplating for IC Substrates Consumption Market Share by Country (2020-2031)

Figure 38. Germany Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 39. France Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 40. U.K. Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 41. Italy Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 42. Netherlands Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 43. Asia Pacific Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 44. Asia Pacific Copper Electroplating for IC Substrates Consumption Market Share by Region (2020-2031)

Figure 45. China Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 46. Japan Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 47. South Korea Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 48. China Taiwan Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 49. Southeast Asia Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 50. India Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 51. Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 52. Latin America, Middle East & Africa Copper Electroplating for IC Substrates Consumption Market Share by Country (2020-2031)

Figure 53. Mexico Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 54. Brazil Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 55. Israel Copper Electroplating for IC Substrates Consumption and Growth Rate (2020-2031) & (K Units)

Figure 56. Global Production Market Share of Copper Electroplating for IC Substrates by Type (2020-2031)

Figure 57. Global Production Value Market Share of Copper Electroplating for IC Substrates by Type (2020-2031)

Figure 58. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Type (2020-2031)

Figure 59. Global Production Market Share of Copper Electroplating for IC Substrates by Application (2020-2031)

Figure 60. Global Production Value Market Share of Copper Electroplating for IC Substrates by Application (2020-2031)

Figure 61. Global Copper Electroplating for IC Substrates Price (US$/Unit) by Application (2020-2031)

Figure 62. Copper Electroplating for IC Substrates Value Chain

Figure 63. Channels of Distribution (Direct Vs Distribution)

Figure 64. Bottom-up and Top-down Approaches for This Report

Figure 65. Data Triangulation

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