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Wafer Cutting Scribing Machine - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Published Date: December 2024
|
Report Code: QYRE-Auto-4H14761
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Global Wafer Cutting Scribing Machine Market Research Report 2023
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Wafer Cutting Scribing Machine - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Code: QYRE-Auto-4H14761
Report
December 2024
Pages:123
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Wafer Cutting Scribing Machine - Market

Wafer Cutting Scribing Machine is a tool used in semiconductor manufacturing to cut and separate wafers into individual chips. Scribing machines use a diamond-tipped blade or laser to make precise cuts on the surface of the wafer, creating lines that weaken the material and allow it to be broken cleanly along the cut lines.
The global market for Wafer Cutting Scribing Machine was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
North American market for Wafer Cutting Scribing Machine was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Wafer Cutting Scribing Machine was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Europe market for Wafer Cutting Scribing Machine was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global key companies of Wafer Cutting Scribing Machine include DISCO, Genesem, Tokyo Seimitsu, ASMPT, EO Technics, 3D-Micromac AG, Fujitsu Microelectronics, GL Tech and Han's Laser Technology, etc. In 2023, the global five largest players hold a share approximately % in terms of revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Wafer Cutting Scribing Machine, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Wafer Cutting Scribing Machine by region & country, by Type, and by Application.
The Wafer Cutting Scribing Machine market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Cutting Scribing Machine.
Market Segmentation

Scope of Wafer Cutting Scribing Machine - Market Report

Report Metric Details
Report Name Wafer Cutting Scribing Machine - Market
Segment by Type:
  • Grinding Wheel Scribing Machine
  • Laser Scribing Machine
Segment by Application
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company DISCO, Genesem, Tokyo Seimitsu, ASMPT, EO Technics, 3D-Micromac AG, Fujitsu Microelectronics, GL Tech, Han's Laser Technology, China Electronics Technology Group, JCET Group, Wuxi Autowell Technology, Suzhou Delphi Laser, Shenzhen Guangyuan Intelligent
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 2: Detailed analysis of Wafer Cutting Scribing Machine manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 5: Sales, revenue of Wafer Cutting Scribing Machine in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
  • Chapter 6: Sales, revenue of Wafer Cutting Scribing Machine in country level. It provides sigmate data by Type, and by Application for each country/region.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Conclusion.

FAQ for this report

Who are the main players in the Wafer Cutting Scribing Machine - Market report?

Ans: The main players in the Wafer Cutting Scribing Machine - Market are DISCO, Genesem, Tokyo Seimitsu, ASMPT, EO Technics, 3D-Micromac AG, Fujitsu Microelectronics, GL Tech, Han's Laser Technology, China Electronics Technology Group, JCET Group, Wuxi Autowell Technology, Suzhou Delphi Laser, Shenzhen Guangyuan Intelligent

What are the Application segmentation covered in the Wafer Cutting Scribing Machine - Market report?

Ans: The Applications covered in the Wafer Cutting Scribing Machine - Market report are Semiconductor Packaging and Testing, EMC Leadframe, Ceramic Sheet, Others

What are the Type segmentation covered in the Wafer Cutting Scribing Machine - Market report?

Ans: The Types covered in the Wafer Cutting Scribing Machine - Market report are Grinding Wheel Scribing Machine, Laser Scribing Machine

Recommended Reports

Wafer Cutting Equipment

Wafer Dicing Systems

Wafer Processing Machinery

1 Market Overview
1.1 Wafer Cutting Scribing Machine Product Introduction
1.2 Global Wafer Cutting Scribing Machine Market Size Forecast
1.2.1 Global Wafer Cutting Scribing Machine Sales Value (2019-2030)
1.2.2 Global Wafer Cutting Scribing Machine Sales Volume (2019-2030)
1.2.3 Global Wafer Cutting Scribing Machine Sales Price (2019-2030)
1.3 Wafer Cutting Scribing Machine Market Trends & Drivers
1.3.1 Wafer Cutting Scribing Machine Industry Trends
1.3.2 Wafer Cutting Scribing Machine Market Drivers & Opportunity
1.3.3 Wafer Cutting Scribing Machine Market Challenges
1.3.4 Wafer Cutting Scribing Machine Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Wafer Cutting Scribing Machine Players Revenue Ranking (2023)
2.2 Global Wafer Cutting Scribing Machine Revenue by Company (2019-2024)
2.3 Global Wafer Cutting Scribing Machine Players Sales Volume Ranking (2023)
2.4 Global Wafer Cutting Scribing Machine Sales Volume by Company Players (2019-2024)
2.5 Global Wafer Cutting Scribing Machine Average Price by Company (2019-2024)
2.6 Key Manufacturers Wafer Cutting Scribing Machine Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Wafer Cutting Scribing Machine Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Wafer Cutting Scribing Machine
2.9 Wafer Cutting Scribing Machine Market Competitive Analysis
2.9.1 Wafer Cutting Scribing Machine Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Wafer Cutting Scribing Machine Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Cutting Scribing Machine as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Grinding Wheel Scribing Machine
3.1.2 Laser Scribing Machine
3.2 Global Wafer Cutting Scribing Machine Sales Value by Type
3.2.1 Global Wafer Cutting Scribing Machine Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Wafer Cutting Scribing Machine Sales Value, by Type (2019-2030)
3.2.3 Global Wafer Cutting Scribing Machine Sales Value, by Type (%) (2019-2030)
3.3 Global Wafer Cutting Scribing Machine Sales Volume by Type
3.3.1 Global Wafer Cutting Scribing Machine Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Wafer Cutting Scribing Machine Sales Volume, by Type (2019-2030)
3.3.3 Global Wafer Cutting Scribing Machine Sales Volume, by Type (%) (2019-2030)
3.4 Global Wafer Cutting Scribing Machine Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Semiconductor Packaging and Testing
4.1.2 EMC Leadframe
4.1.3 Ceramic Sheet
4.1.4 Others
4.2 Global Wafer Cutting Scribing Machine Sales Value by Application
4.2.1 Global Wafer Cutting Scribing Machine Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Wafer Cutting Scribing Machine Sales Value, by Application (2019-2030)
4.2.3 Global Wafer Cutting Scribing Machine Sales Value, by Application (%) (2019-2030)
4.3 Global Wafer Cutting Scribing Machine Sales Volume by Application
4.3.1 Global Wafer Cutting Scribing Machine Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Wafer Cutting Scribing Machine Sales Volume, by Application (2019-2030)
4.3.3 Global Wafer Cutting Scribing Machine Sales Volume, by Application (%) (2019-2030)
4.4 Global Wafer Cutting Scribing Machine Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Wafer Cutting Scribing Machine Sales Value by Region
5.1.1 Global Wafer Cutting Scribing Machine Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Wafer Cutting Scribing Machine Sales Value by Region (2019-2024)
5.1.3 Global Wafer Cutting Scribing Machine Sales Value by Region (2025-2030)
5.1.4 Global Wafer Cutting Scribing Machine Sales Value by Region (%), (2019-2030)
5.2 Global Wafer Cutting Scribing Machine Sales Volume by Region
5.2.1 Global Wafer Cutting Scribing Machine Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Wafer Cutting Scribing Machine Sales Volume by Region (2019-2024)
5.2.3 Global Wafer Cutting Scribing Machine Sales Volume by Region (2025-2030)
5.2.4 Global Wafer Cutting Scribing Machine Sales Volume by Region (%), (2019-2030)
5.3 Global Wafer Cutting Scribing Machine Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Wafer Cutting Scribing Machine Sales Value, 2019-2030
5.4.2 North America Wafer Cutting Scribing Machine Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Wafer Cutting Scribing Machine Sales Value, 2019-2030
5.5.2 Europe Wafer Cutting Scribing Machine Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Wafer Cutting Scribing Machine Sales Value, 2019-2030
5.6.2 Asia Pacific Wafer Cutting Scribing Machine Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Wafer Cutting Scribing Machine Sales Value, 2019-2030
5.7.2 South America Wafer Cutting Scribing Machine Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Wafer Cutting Scribing Machine Sales Value, 2019-2030
5.8.2 Middle East & Africa Wafer Cutting Scribing Machine Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Wafer Cutting Scribing Machine Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Wafer Cutting Scribing Machine Sales Value
6.2.1 Key Countries/Regions Wafer Cutting Scribing Machine Sales Value, 2019-2030
6.2.2 Key Countries/Regions Wafer Cutting Scribing Machine Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Wafer Cutting Scribing Machine Sales Value, 2019-2030
6.3.2 United States Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Wafer Cutting Scribing Machine Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Wafer Cutting Scribing Machine Sales Value, 2019-2030
6.4.2 Europe Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Wafer Cutting Scribing Machine Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Wafer Cutting Scribing Machine Sales Value, 2019-2030
6.5.2 China Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
6.5.3 China Wafer Cutting Scribing Machine Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Wafer Cutting Scribing Machine Sales Value, 2019-2030
6.6.2 Japan Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Wafer Cutting Scribing Machine Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Wafer Cutting Scribing Machine Sales Value, 2019-2030
6.7.2 South Korea Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Wafer Cutting Scribing Machine Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Wafer Cutting Scribing Machine Sales Value, 2019-2030
6.8.2 Southeast Asia Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Wafer Cutting Scribing Machine Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Wafer Cutting Scribing Machine Sales Value, 2019-2030
6.9.2 India Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
6.9.3 India Wafer Cutting Scribing Machine Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 DISCO
7.1.1 DISCO Company Information
7.1.2 DISCO Introduction and Business Overview
7.1.3 DISCO Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.1.4 DISCO Wafer Cutting Scribing Machine Product Offerings
7.1.5 DISCO Recent Development
7.2 Genesem
7.2.1 Genesem Company Information
7.2.2 Genesem Introduction and Business Overview
7.2.3 Genesem Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Genesem Wafer Cutting Scribing Machine Product Offerings
7.2.5 Genesem Recent Development
7.3 Tokyo Seimitsu
7.3.1 Tokyo Seimitsu Company Information
7.3.2 Tokyo Seimitsu Introduction and Business Overview
7.3.3 Tokyo Seimitsu Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Tokyo Seimitsu Wafer Cutting Scribing Machine Product Offerings
7.3.5 Tokyo Seimitsu Recent Development
7.4 ASMPT
7.4.1 ASMPT Company Information
7.4.2 ASMPT Introduction and Business Overview
7.4.3 ASMPT Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.4.4 ASMPT Wafer Cutting Scribing Machine Product Offerings
7.4.5 ASMPT Recent Development
7.5 EO Technics
7.5.1 EO Technics Company Information
7.5.2 EO Technics Introduction and Business Overview
7.5.3 EO Technics Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.5.4 EO Technics Wafer Cutting Scribing Machine Product Offerings
7.5.5 EO Technics Recent Development
7.6 3D-Micromac AG
7.6.1 3D-Micromac AG Company Information
7.6.2 3D-Micromac AG Introduction and Business Overview
7.6.3 3D-Micromac AG Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.6.4 3D-Micromac AG Wafer Cutting Scribing Machine Product Offerings
7.6.5 3D-Micromac AG Recent Development
7.7 Fujitsu Microelectronics
7.7.1 Fujitsu Microelectronics Company Information
7.7.2 Fujitsu Microelectronics Introduction and Business Overview
7.7.3 Fujitsu Microelectronics Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Fujitsu Microelectronics Wafer Cutting Scribing Machine Product Offerings
7.7.5 Fujitsu Microelectronics Recent Development
7.8 GL Tech
7.8.1 GL Tech Company Information
7.8.2 GL Tech Introduction and Business Overview
7.8.3 GL Tech Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.8.4 GL Tech Wafer Cutting Scribing Machine Product Offerings
7.8.5 GL Tech Recent Development
7.9 Han's Laser Technology
7.9.1 Han's Laser Technology Company Information
7.9.2 Han's Laser Technology Introduction and Business Overview
7.9.3 Han's Laser Technology Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Han's Laser Technology Wafer Cutting Scribing Machine Product Offerings
7.9.5 Han's Laser Technology Recent Development
7.10 China Electronics Technology Group
7.10.1 China Electronics Technology Group Company Information
7.10.2 China Electronics Technology Group Introduction and Business Overview
7.10.3 China Electronics Technology Group Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.10.4 China Electronics Technology Group Wafer Cutting Scribing Machine Product Offerings
7.10.5 China Electronics Technology Group Recent Development
7.11 JCET Group
7.11.1 JCET Group Company Information
7.11.2 JCET Group Introduction and Business Overview
7.11.3 JCET Group Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.11.4 JCET Group Wafer Cutting Scribing Machine Product Offerings
7.11.5 JCET Group Recent Development
7.12 Wuxi Autowell Technology
7.12.1 Wuxi Autowell Technology Company Information
7.12.2 Wuxi Autowell Technology Introduction and Business Overview
7.12.3 Wuxi Autowell Technology Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.12.4 Wuxi Autowell Technology Wafer Cutting Scribing Machine Product Offerings
7.12.5 Wuxi Autowell Technology Recent Development
7.13 Suzhou Delphi Laser
7.13.1 Suzhou Delphi Laser Company Information
7.13.2 Suzhou Delphi Laser Introduction and Business Overview
7.13.3 Suzhou Delphi Laser Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.13.4 Suzhou Delphi Laser Wafer Cutting Scribing Machine Product Offerings
7.13.5 Suzhou Delphi Laser Recent Development
7.14 Shenzhen Guangyuan Intelligent
7.14.1 Shenzhen Guangyuan Intelligent Company Information
7.14.2 Shenzhen Guangyuan Intelligent Introduction and Business Overview
7.14.3 Shenzhen Guangyuan Intelligent Wafer Cutting Scribing Machine Sales, Revenue and Gross Margin (2019-2024)
7.14.4 Shenzhen Guangyuan Intelligent Wafer Cutting Scribing Machine Product Offerings
7.14.5 Shenzhen Guangyuan Intelligent Recent Development
8 Industry Chain Analysis
8.1 Wafer Cutting Scribing Machine Industrial Chain
8.2 Wafer Cutting Scribing Machine Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Wafer Cutting Scribing Machine Sales Model
8.5.2 Sales Channel
8.5.3 Wafer Cutting Scribing Machine Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
List of Tables
    Table 1. Wafer Cutting Scribing Machine Market Trends
    Table 2. Wafer Cutting Scribing Machine Market Drivers & Opportunity
    Table 3. Wafer Cutting Scribing Machine Market Challenges
    Table 4. Wafer Cutting Scribing Machine Market Restraints
    Table 5. Global Wafer Cutting Scribing Machine Revenue by Company (2019-2024) & (US$ Million)
    Table 6. Global Wafer Cutting Scribing Machine Revenue Market Share by Company (2019-2024)
    Table 7. Global Wafer Cutting Scribing Machine Sales Volume by Company (2019-2024) & (Units)
    Table 8. Global Wafer Cutting Scribing Machine Sales Volume Market Share by Company (2019-2024)
    Table 9. Global Market Wafer Cutting Scribing Machine Price by Company (2019-2024) & (US$/Unit)
    Table 10. Key Manufacturers Wafer Cutting Scribing Machine Manufacturing Base Distribution and Headquarters
    Table 11. Key Manufacturers Wafer Cutting Scribing Machine Product Type
    Table 12. Key Manufacturers Time to Begin Mass Production of Wafer Cutting Scribing Machine
    Table 13. Global Wafer Cutting Scribing Machine Manufacturers Market Concentration Ratio (CR5 and HHI)
    Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Cutting Scribing Machine as of 2023)
    Table 15. Mergers & Acquisitions, Expansion Plans
    Table 16. Global Wafer Cutting Scribing Machine Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million)
    Table 17. Global Wafer Cutting Scribing Machine Sales Value by Type (2019-2024) & (US$ Million)
    Table 18. Global Wafer Cutting Scribing Machine Sales Value by Type (2025-2030) & (US$ Million)
    Table 19. Global Wafer Cutting Scribing Machine Sales Market Share in Value by Type (2019-2024) & (%)
    Table 20. Global Wafer Cutting Scribing Machine Sales Market Share in Value by Type (2025-2030) & (%)
    Table 21. Global Wafer Cutting Scribing Machine Sales Volume by Type: 2019 VS 2023 VS 2030 (Units)
    Table 22. Global Wafer Cutting Scribing Machine Sales Volume by Type (2019-2024) & (Units)
    Table 23. Global Wafer Cutting Scribing Machine Sales Volume by Type (2025-2030) & (Units)
    Table 24. Global Wafer Cutting Scribing Machine Sales Market Share in Volume by Type (2019-2024) & (%)
    Table 25. Global Wafer Cutting Scribing Machine Sales Market Share in Volume by Type (2025-2030) & (%)
    Table 26. Global Wafer Cutting Scribing Machine Price by Type (2019-2024) & (US$/Unit)
    Table 27. Global Wafer Cutting Scribing Machine Price by Type (2025-2030) & (US$/Unit)
    Table 28. Global Wafer Cutting Scribing Machine Sales Value by Application: 2019 VS 2023 VS 2030 (US$ Million)
    Table 29. Global Wafer Cutting Scribing Machine Sales Value by Application (2019-2024) & (US$ Million)
    Table 30. Global Wafer Cutting Scribing Machine Sales Value by Application (2025-2030) & (US$ Million)
    Table 31. Global Wafer Cutting Scribing Machine Sales Market Share in Value by Application (2019-2024) & (%)
    Table 32. Global Wafer Cutting Scribing Machine Sales Market Share in Value by Application (2025-2030) & (%)
    Table 33. Global Wafer Cutting Scribing Machine Sales Volume by Application: 2019 VS 2023 VS 2030 (Units)
    Table 34. Global Wafer Cutting Scribing Machine Sales Volume by Application (2019-2024) & (Units)
    Table 35. Global Wafer Cutting Scribing Machine Sales Volume by Application (2025-2030) & (Units)
    Table 36. Global Wafer Cutting Scribing Machine Sales Market Share in Volume by Application (2019-2024) & (%)
    Table 37. Global Wafer Cutting Scribing Machine Sales Market Share in Volume by Application (2025-2030) & (%)
    Table 38. Global Wafer Cutting Scribing Machine Price by Application (2019-2024) & (US$/Unit)
    Table 39. Global Wafer Cutting Scribing Machine Price by Application (2025-2030) & (US$/Unit)
    Table 40. Global Wafer Cutting Scribing Machine Sales Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
    Table 41. Global Wafer Cutting Scribing Machine Sales Value by Region (2019-2024) & (US$ Million)
    Table 42. Global Wafer Cutting Scribing Machine Sales Value by Region (2025-2030) & (US$ Million)
    Table 43. Global Wafer Cutting Scribing Machine Sales Value by Region (2019-2024) & (%)
    Table 44. Global Wafer Cutting Scribing Machine Sales Value by Region (2025-2030) & (%)
    Table 45. Global Wafer Cutting Scribing Machine Sales Volume by Region (Units): 2019 VS 2023 VS 2030
    Table 46. Global Wafer Cutting Scribing Machine Sales Volume by Region (2019-2024) & (Units)
    Table 47. Global Wafer Cutting Scribing Machine Sales Volume by Region (2025-2030) & (Units)
    Table 48. Global Wafer Cutting Scribing Machine Sales Volume by Region (2019-2024) & (%)
    Table 49. Global Wafer Cutting Scribing Machine Sales Volume by Region (2025-2030) & (%)
    Table 50. Global Wafer Cutting Scribing Machine Average Price by Region (2019-2024) & (US$/Unit)
    Table 51. Global Wafer Cutting Scribing Machine Average Price by Region (2025-2030) & (US$/Unit)
    Table 52. Key Countries/Regions Wafer Cutting Scribing Machine Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030
    Table 53. Key Countries/Regions Wafer Cutting Scribing Machine Sales Value, (2019-2024) & (US$ Million)
    Table 54. Key Countries/Regions Wafer Cutting Scribing Machine Sales Value, (2025-2030) & (US$ Million)
    Table 55. Key Countries/Regions Wafer Cutting Scribing Machine Sales Volume, (2019-2024) & (Units)
    Table 56. Key Countries/Regions Wafer Cutting Scribing Machine Sales Volume, (2025-2030) & (Units)
    Table 57. DISCO Company Information
    Table 58. DISCO Introduction and Business Overview
    Table 59. DISCO Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 60. DISCO Wafer Cutting Scribing Machine Product Offerings
    Table 61. DISCO Recent Development
    Table 62. Genesem Company Information
    Table 63. Genesem Introduction and Business Overview
    Table 64. Genesem Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 65. Genesem Wafer Cutting Scribing Machine Product Offerings
    Table 66. Genesem Recent Development
    Table 67. Tokyo Seimitsu Company Information
    Table 68. Tokyo Seimitsu Introduction and Business Overview
    Table 69. Tokyo Seimitsu Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 70. Tokyo Seimitsu Wafer Cutting Scribing Machine Product Offerings
    Table 71. Tokyo Seimitsu Recent Development
    Table 72. ASMPT Company Information
    Table 73. ASMPT Introduction and Business Overview
    Table 74. ASMPT Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 75. ASMPT Wafer Cutting Scribing Machine Product Offerings
    Table 76. ASMPT Recent Development
    Table 77. EO Technics Company Information
    Table 78. EO Technics Introduction and Business Overview
    Table 79. EO Technics Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 80. EO Technics Wafer Cutting Scribing Machine Product Offerings
    Table 81. EO Technics Recent Development
    Table 82. 3D-Micromac AG Company Information
    Table 83. 3D-Micromac AG Introduction and Business Overview
    Table 84. 3D-Micromac AG Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 85. 3D-Micromac AG Wafer Cutting Scribing Machine Product Offerings
    Table 86. 3D-Micromac AG Recent Development
    Table 87. Fujitsu Microelectronics Company Information
    Table 88. Fujitsu Microelectronics Introduction and Business Overview
    Table 89. Fujitsu Microelectronics Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 90. Fujitsu Microelectronics Wafer Cutting Scribing Machine Product Offerings
    Table 91. Fujitsu Microelectronics Recent Development
    Table 92. GL Tech Company Information
    Table 93. GL Tech Introduction and Business Overview
    Table 94. GL Tech Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 95. GL Tech Wafer Cutting Scribing Machine Product Offerings
    Table 96. GL Tech Recent Development
    Table 97. Han's Laser Technology Company Information
    Table 98. Han's Laser Technology Introduction and Business Overview
    Table 99. Han's Laser Technology Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 100. Han's Laser Technology Wafer Cutting Scribing Machine Product Offerings
    Table 101. Han's Laser Technology Recent Development
    Table 102. China Electronics Technology Group Company Information
    Table 103. China Electronics Technology Group Introduction and Business Overview
    Table 104. China Electronics Technology Group Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 105. China Electronics Technology Group Wafer Cutting Scribing Machine Product Offerings
    Table 106. China Electronics Technology Group Recent Development
    Table 107. JCET Group Company Information
    Table 108. JCET Group Introduction and Business Overview
    Table 109. JCET Group Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 110. JCET Group Wafer Cutting Scribing Machine Product Offerings
    Table 111. JCET Group Recent Development
    Table 112. Wuxi Autowell Technology Company Information
    Table 113. Wuxi Autowell Technology Introduction and Business Overview
    Table 114. Wuxi Autowell Technology Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 115. Wuxi Autowell Technology Wafer Cutting Scribing Machine Product Offerings
    Table 116. Wuxi Autowell Technology Recent Development
    Table 117. Suzhou Delphi Laser Company Information
    Table 118. Suzhou Delphi Laser Introduction and Business Overview
    Table 119. Suzhou Delphi Laser Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 120. Suzhou Delphi Laser Wafer Cutting Scribing Machine Product Offerings
    Table 121. Suzhou Delphi Laser Recent Development
    Table 122. Shenzhen Guangyuan Intelligent Company Information
    Table 123. Shenzhen Guangyuan Intelligent Introduction and Business Overview
    Table 124. Shenzhen Guangyuan Intelligent Wafer Cutting Scribing Machine Sales (Units), Revenue (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)
    Table 125. Shenzhen Guangyuan Intelligent Wafer Cutting Scribing Machine Product Offerings
    Table 126. Shenzhen Guangyuan Intelligent Recent Development
    Table 127. Key Raw Materials Lists
    Table 128. Raw Materials Key Suppliers Lists
    Table 129. Wafer Cutting Scribing Machine Downstream Customers
    Table 130. Wafer Cutting Scribing Machine Distributors List
    Table 131. Research Programs/Design for This Report
    Table 132. Key Data Information from Secondary Sources
    Table 133. Key Data Information from Primary Sources
List of Figures
    Figure 1. Wafer Cutting Scribing Machine Product Picture
    Figure 2. Global Wafer Cutting Scribing Machine Sales Value, 2019 VS 2023 VS 2030 (US$ Million)
    Figure 3. Global Wafer Cutting Scribing Machine Sales Value (2019-2030) & (US$ Million)
    Figure 4. Global Wafer Cutting Scribing Machine Sales Volume (2019-2030) & (Units)
    Figure 5. Global Wafer Cutting Scribing Machine Sales Price (2019-2030) & (US$/Unit)
    Figure 6. Wafer Cutting Scribing Machine Report Years Considered
    Figure 7. Global Wafer Cutting Scribing Machine Players Revenue Ranking (2023) & (US$ Million)
    Figure 8. Global Wafer Cutting Scribing Machine Players Sales Volume Ranking (2023) & (Units)
    Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Wafer Cutting Scribing Machine Revenue in 2023
    Figure 10. Wafer Cutting Scribing Machine Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
    Figure 11. Grinding Wheel Scribing Machine Picture
    Figure 12. Laser Scribing Machine Picture
    Figure 13. Global Wafer Cutting Scribing Machine Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 14. Global Wafer Cutting Scribing Machine Sales Value Market Share by Type, 2023 & 2030
    Figure 15. Global Wafer Cutting Scribing Machine Sales Volume by Type (2019 VS 2023 VS 2030) & (Units)
    Figure 16. Global Wafer Cutting Scribing Machine Sales Volume Market Share by Type, 2023 & 2030
    Figure 17. Global Wafer Cutting Scribing Machine Price by Type (2019-2030) & (US$/Unit)
    Figure 18. Product Picture of Semiconductor Packaging and Testing
    Figure 19. Product Picture of EMC Leadframe
    Figure 20. Product Picture of Ceramic Sheet
    Figure 21. Product Picture of Others
    Figure 22. Global Wafer Cutting Scribing Machine Sales Value by Application (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 23. Global Wafer Cutting Scribing Machine Sales Value Market Share by Application, 2023 & 2030
    Figure 24. Global Wafer Cutting Scribing Machine Sales Volume by Application (2019 VS 2023 VS 2030) & (Units)
    Figure 25. Global Wafer Cutting Scribing Machine Sales Volume Market Share by Application, 2023 & 2030
    Figure 26. Global Wafer Cutting Scribing Machine Price by Application (2019-2030) & (US$/Unit)
    Figure 27. North America Wafer Cutting Scribing Machine Sales Value (2019-2030) & (US$ Million)
    Figure 28. North America Wafer Cutting Scribing Machine Sales Value by Country (%), 2023 VS 2030
    Figure 29. Europe Wafer Cutting Scribing Machine Sales Value (2019-2030) & (US$ Million)
    Figure 30. Europe Wafer Cutting Scribing Machine Sales Value by Country (%), 2023 VS 2030
    Figure 31. Asia Pacific Wafer Cutting Scribing Machine Sales Value (2019-2030) & (US$ Million)
    Figure 32. Asia Pacific Wafer Cutting Scribing Machine Sales Value by Country (%), 2023 VS 2030
    Figure 33. South America Wafer Cutting Scribing Machine Sales Value (2019-2030) & (US$ Million)
    Figure 34. South America Wafer Cutting Scribing Machine Sales Value by Country (%), 2023 VS 2030
    Figure 35. Middle East & Africa Wafer Cutting Scribing Machine Sales Value (2019-2030) & (US$ Million)
    Figure 36. Middle East & Africa Wafer Cutting Scribing Machine Sales Value by Country (%), 2023 VS 2030
    Figure 37. Key Countries/Regions Wafer Cutting Scribing Machine Sales Value (%), (2019-2030)
    Figure 38. Key Countries/Regions Wafer Cutting Scribing Machine Sales Volume (%), (2019-2030)
    Figure 39. United States Wafer Cutting Scribing Machine Sales Value, (2019-2030) & (US$ Million)
    Figure 40. United States Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
    Figure 41. United States Wafer Cutting Scribing Machine Sales Value by Application (%), 2023 VS 2030
    Figure 42. Europe Wafer Cutting Scribing Machine Sales Value, (2019-2030) & (US$ Million)
    Figure 43. Europe Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
    Figure 44. Europe Wafer Cutting Scribing Machine Sales Value by Application (%), 2023 VS 2030
    Figure 45. China Wafer Cutting Scribing Machine Sales Value, (2019-2030) & (US$ Million)
    Figure 46. China Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
    Figure 47. China Wafer Cutting Scribing Machine Sales Value by Application (%), 2023 VS 2030
    Figure 48. Japan Wafer Cutting Scribing Machine Sales Value, (2019-2030) & (US$ Million)
    Figure 49. Japan Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
    Figure 50. Japan Wafer Cutting Scribing Machine Sales Value by Application (%), 2023 VS 2030
    Figure 51. South Korea Wafer Cutting Scribing Machine Sales Value, (2019-2030) & (US$ Million)
    Figure 52. South Korea Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
    Figure 53. South Korea Wafer Cutting Scribing Machine Sales Value by Application (%), 2023 VS 2030
    Figure 54. Southeast Asia Wafer Cutting Scribing Machine Sales Value, (2019-2030) & (US$ Million)
    Figure 55. Southeast Asia Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
    Figure 56. Southeast Asia Wafer Cutting Scribing Machine Sales Value by Application (%), 2023 VS 2030
    Figure 57. India Wafer Cutting Scribing Machine Sales Value, (2019-2030) & (US$ Million)
    Figure 58. India Wafer Cutting Scribing Machine Sales Value by Type (%), 2023 VS 2030
    Figure 59. India Wafer Cutting Scribing Machine Sales Value by Application (%), 2023 VS 2030
    Figure 60. Wafer Cutting Scribing Machine Industrial Chain
    Figure 61. Wafer Cutting Scribing Machine Manufacturing Cost Structure
    Figure 62. Channels of Distribution (Direct Sales, and Distribution)
    Figure 63. Bottom-up and Top-down Approaches for This Report
    Figure 64. Data Triangulation
    Figure 65. Key Executives Interviewed
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