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Global Semiconductor Dicing Saw Blade Market Research Report 2023
Published Date: October 2023
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Report Code: QYRE-Auto-4O13367
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Global Semiconductor Dicing Saw Blade Market Research Report 2023
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Global Semiconductor Dicing Saw Blade Market Research Report 2023

Code: QYRE-Auto-4O13367
Report
October 2023
Pages:90
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Semiconductor Dicing Saw Blade Market Size

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

Semiconductor Dicing Saw Blade Market

Semiconductor Dicing Saw Blade Market

Semiconductor dicing saw blade is a specialized cutting tool used in the semiconductor manufacturing process to dice semiconductor wafers into individual chips or dies. Dicing is a critical step in semiconductor fabrication, where the wafer is cut into individual pieces, each containing a single integrated circuit (IC) or multiple ICs, depending on the design.
According to new survey, global Semiconductor Dicing Saw Blade market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Semiconductor Dicing Saw Blade market research.
Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.117% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Semiconductor Dicing Saw Blade market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.

Scope of Semiconductor Dicing Saw Blade Market Report

Report Metric Details
Report Name Semiconductor Dicing Saw Blade Market
Accounted market size in year US$ 579 billion
Forecasted market size in 2029 US$ 790 billion
CAGR 6%
Base Year year
Forecasted years 2023 - 2029
Segment by Type
  • Hub Dicing Blade
  • Hubless Dicing Blade
Segment by Application
  • 200mm Wafer
  • 300mm Wafer
  • Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Disco Corporation, YMB, NDC International, UKAM Industrial, Thermocarbon, TOKYO SEIMITSU, ADT, Ceiba Technologies, Kinik Company, Kulicke & Soffa, Industrial Tools, Inc, Shanghai Sinyang
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

FAQ for this report

How fast is Semiconductor Dicing Saw Blade Market growing?

Ans: The Semiconductor Dicing Saw Blade Market witnessing a CAGR of 6% during the forecast period 2023-2029.

What is the Semiconductor Dicing Saw Blade Market size in 2029?

Ans: The Semiconductor Dicing Saw Blade Market size in 2029 will be US$ 790 billion.

Who are the main players in the Semiconductor Dicing Saw Blade Market report?

Ans: The main players in the Semiconductor Dicing Saw Blade Market are Disco Corporation, YMB, NDC International, UKAM Industrial, Thermocarbon, TOKYO SEIMITSU, ADT, Ceiba Technologies, Kinik Company, Kulicke & Soffa, Industrial Tools, Inc, Shanghai Sinyang

What are the Application segmentation covered in the Semiconductor Dicing Saw Blade Market report?

Ans: The Applications covered in the Semiconductor Dicing Saw Blade Market report are 200mm Wafer, 300mm Wafer, Others

What are the Type segmentation covered in the Semiconductor Dicing Saw Blade Market report?

Ans: The Types covered in the Semiconductor Dicing Saw Blade Market report are Hub Dicing Blade, Hubless Dicing Blade

1 Semiconductor Dicing Saw Blade Market Overview
1.1 Product Definition
1.2 Semiconductor Dicing Saw Blade Segment by Type
1.2.1 Global Semiconductor Dicing Saw Blade Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Hub Dicing Blade
1.2.3 Hubless Dicing Blade
1.3 Semiconductor Dicing Saw Blade Segment by Application
1.3.1 Global Semiconductor Dicing Saw Blade Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 200mm Wafer
1.3.3 300mm Wafer
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Semiconductor Dicing Saw Blade Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Semiconductor Dicing Saw Blade Production Estimates and Forecasts (2018-2029)
1.4.4 Global Semiconductor Dicing Saw Blade Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Dicing Saw Blade Production Market Share by Manufacturers (2018-2023)
2.2 Global Semiconductor Dicing Saw Blade Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Semiconductor Dicing Saw Blade, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Semiconductor Dicing Saw Blade Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Semiconductor Dicing Saw Blade Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Semiconductor Dicing Saw Blade, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Dicing Saw Blade, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Dicing Saw Blade, Date of Enter into This Industry
2.9 Semiconductor Dicing Saw Blade Market Competitive Situation and Trends
2.9.1 Semiconductor Dicing Saw Blade Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Dicing Saw Blade Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Dicing Saw Blade Production by Region
3.1 Global Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Semiconductor Dicing Saw Blade Production Value by Region (2018-2029)
3.2.1 Global Semiconductor Dicing Saw Blade Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Semiconductor Dicing Saw Blade by Region (2024-2029)
3.3 Global Semiconductor Dicing Saw Blade Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Semiconductor Dicing Saw Blade Production by Region (2018-2029)
3.4.1 Global Semiconductor Dicing Saw Blade Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Semiconductor Dicing Saw Blade by Region (2024-2029)
3.5 Global Semiconductor Dicing Saw Blade Market Price Analysis by Region (2018-2023)
3.6 Global Semiconductor Dicing Saw Blade Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Semiconductor Dicing Saw Blade Production Value Estimates and Forecasts (2018-2029)
4 Semiconductor Dicing Saw Blade Consumption by Region
4.1 Global Semiconductor Dicing Saw Blade Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Semiconductor Dicing Saw Blade Consumption by Region (2018-2029)
4.2.1 Global Semiconductor Dicing Saw Blade Consumption by Region (2018-2023)
4.2.2 Global Semiconductor Dicing Saw Blade Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Semiconductor Dicing Saw Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Semiconductor Dicing Saw Blade Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Dicing Saw Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Semiconductor Dicing Saw Blade Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Dicing Saw Blade Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Semiconductor Dicing Saw Blade Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Dicing Saw Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Semiconductor Dicing Saw Blade Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Semiconductor Dicing Saw Blade Production by Type (2018-2029)
5.1.1 Global Semiconductor Dicing Saw Blade Production by Type (2018-2023)
5.1.2 Global Semiconductor Dicing Saw Blade Production by Type (2024-2029)
5.1.3 Global Semiconductor Dicing Saw Blade Production Market Share by Type (2018-2029)
5.2 Global Semiconductor Dicing Saw Blade Production Value by Type (2018-2029)
5.2.1 Global Semiconductor Dicing Saw Blade Production Value by Type (2018-2023)
5.2.2 Global Semiconductor Dicing Saw Blade Production Value by Type (2024-2029)
5.2.3 Global Semiconductor Dicing Saw Blade Production Value Market Share by Type (2018-2029)
5.3 Global Semiconductor Dicing Saw Blade Price by Type (2018-2029)
6 Segment by Application
6.1 Global Semiconductor Dicing Saw Blade Production by Application (2018-2029)
6.1.1 Global Semiconductor Dicing Saw Blade Production by Application (2018-2023)
6.1.2 Global Semiconductor Dicing Saw Blade Production by Application (2024-2029)
6.1.3 Global Semiconductor Dicing Saw Blade Production Market Share by Application (2018-2029)
6.2 Global Semiconductor Dicing Saw Blade Production Value by Application (2018-2029)
6.2.1 Global Semiconductor Dicing Saw Blade Production Value by Application (2018-2023)
6.2.2 Global Semiconductor Dicing Saw Blade Production Value by Application (2024-2029)
6.2.3 Global Semiconductor Dicing Saw Blade Production Value Market Share by Application (2018-2029)
6.3 Global Semiconductor Dicing Saw Blade Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Disco Corporation
7.1.1 Disco Corporation Semiconductor Dicing Saw Blade Corporation Information
7.1.2 Disco Corporation Semiconductor Dicing Saw Blade Product Portfolio
7.1.3 Disco Corporation Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Disco Corporation Main Business and Markets Served
7.1.5 Disco Corporation Recent Developments/Updates
7.2 YMB
7.2.1 YMB Semiconductor Dicing Saw Blade Corporation Information
7.2.2 YMB Semiconductor Dicing Saw Blade Product Portfolio
7.2.3 YMB Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.2.4 YMB Main Business and Markets Served
7.2.5 YMB Recent Developments/Updates
7.3 NDC International
7.3.1 NDC International Semiconductor Dicing Saw Blade Corporation Information
7.3.2 NDC International Semiconductor Dicing Saw Blade Product Portfolio
7.3.3 NDC International Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.3.4 NDC International Main Business and Markets Served
7.3.5 NDC International Recent Developments/Updates
7.4 UKAM Industrial
7.4.1 UKAM Industrial Semiconductor Dicing Saw Blade Corporation Information
7.4.2 UKAM Industrial Semiconductor Dicing Saw Blade Product Portfolio
7.4.3 UKAM Industrial Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.4.4 UKAM Industrial Main Business and Markets Served
7.4.5 UKAM Industrial Recent Developments/Updates
7.5 Thermocarbon
7.5.1 Thermocarbon Semiconductor Dicing Saw Blade Corporation Information
7.5.2 Thermocarbon Semiconductor Dicing Saw Blade Product Portfolio
7.5.3 Thermocarbon Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Thermocarbon Main Business and Markets Served
7.5.5 Thermocarbon Recent Developments/Updates
7.6 TOKYO SEIMITSU
7.6.1 TOKYO SEIMITSU Semiconductor Dicing Saw Blade Corporation Information
7.6.2 TOKYO SEIMITSU Semiconductor Dicing Saw Blade Product Portfolio
7.6.3 TOKYO SEIMITSU Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.6.4 TOKYO SEIMITSU Main Business and Markets Served
7.6.5 TOKYO SEIMITSU Recent Developments/Updates
7.7 ADT
7.7.1 ADT Semiconductor Dicing Saw Blade Corporation Information
7.7.2 ADT Semiconductor Dicing Saw Blade Product Portfolio
7.7.3 ADT Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.7.4 ADT Main Business and Markets Served
7.7.5 ADT Recent Developments/Updates
7.8 Ceiba Technologies
7.8.1 Ceiba Technologies Semiconductor Dicing Saw Blade Corporation Information
7.8.2 Ceiba Technologies Semiconductor Dicing Saw Blade Product Portfolio
7.8.3 Ceiba Technologies Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Ceiba Technologies Main Business and Markets Served
7.7.5 Ceiba Technologies Recent Developments/Updates
7.9 Kinik Company
7.9.1 Kinik Company Semiconductor Dicing Saw Blade Corporation Information
7.9.2 Kinik Company Semiconductor Dicing Saw Blade Product Portfolio
7.9.3 Kinik Company Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Kinik Company Main Business and Markets Served
7.9.5 Kinik Company Recent Developments/Updates
7.10 Kulicke & Soffa
7.10.1 Kulicke & Soffa Semiconductor Dicing Saw Blade Corporation Information
7.10.2 Kulicke & Soffa Semiconductor Dicing Saw Blade Product Portfolio
7.10.3 Kulicke & Soffa Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Kulicke & Soffa Main Business and Markets Served
7.10.5 Kulicke & Soffa Recent Developments/Updates
7.11 Industrial Tools, Inc
7.11.1 Industrial Tools, Inc Semiconductor Dicing Saw Blade Corporation Information
7.11.2 Industrial Tools, Inc Semiconductor Dicing Saw Blade Product Portfolio
7.11.3 Industrial Tools, Inc Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Industrial Tools, Inc Main Business and Markets Served
7.11.5 Industrial Tools, Inc Recent Developments/Updates
7.12 Shanghai Sinyang
7.12.1 Shanghai Sinyang Semiconductor Dicing Saw Blade Corporation Information
7.12.2 Shanghai Sinyang Semiconductor Dicing Saw Blade Product Portfolio
7.12.3 Shanghai Sinyang Semiconductor Dicing Saw Blade Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Shanghai Sinyang Main Business and Markets Served
7.12.5 Shanghai Sinyang Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Dicing Saw Blade Industry Chain Analysis
8.2 Semiconductor Dicing Saw Blade Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Dicing Saw Blade Production Mode & Process
8.4 Semiconductor Dicing Saw Blade Sales and Marketing
8.4.1 Semiconductor Dicing Saw Blade Sales Channels
8.4.2 Semiconductor Dicing Saw Blade Distributors
8.5 Semiconductor Dicing Saw Blade Customers
9 Semiconductor Dicing Saw Blade Market Dynamics
9.1 Semiconductor Dicing Saw Blade Industry Trends
9.2 Semiconductor Dicing Saw Blade Market Drivers
9.3 Semiconductor Dicing Saw Blade Market Challenges
9.4 Semiconductor Dicing Saw Blade Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
    Table 1. Global Semiconductor Dicing Saw Blade Market Value by Type, (US$ Million) & (2022 VS 2029)
    Table 2. Global Semiconductor Dicing Saw Blade Market Value by Application, (US$ Million) & (2022 VS 2029)
    Table 3. Global Semiconductor Dicing Saw Blade Production Capacity (K Units) by Manufacturers in 2022
    Table 4. Global Semiconductor Dicing Saw Blade Production by Manufacturers (2018-2023) & (K Units)
    Table 5. Global Semiconductor Dicing Saw Blade Production Market Share by Manufacturers (2018-2023)
    Table 6. Global Semiconductor Dicing Saw Blade Production Value by Manufacturers (2018-2023) & (US$ Million)
    Table 7. Global Semiconductor Dicing Saw Blade Production Value Share by Manufacturers (2018-2023)
    Table 8. Global Semiconductor Dicing Saw Blade Industry Ranking 2021 VS 2022 VS 2023
    Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Semiconductor Dicing Saw Blade as of 2022)
    Table 10. Global Market Semiconductor Dicing Saw Blade Average Price by Manufacturers (US$/Unit) & (2018-2023)
    Table 11. Manufacturers Semiconductor Dicing Saw Blade Production Sites and Area Served
    Table 12. Manufacturers Semiconductor Dicing Saw Blade Product Types
    Table 13. Global Semiconductor Dicing Saw Blade Manufacturers Market Concentration Ratio (CR5 and HHI)
    Table 14. Mergers & Acquisitions, Expansion
    Table 15. Global Semiconductor Dicing Saw Blade Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
    Table 16. Global Semiconductor Dicing Saw Blade Production Value (US$ Million) by Region (2018-2023)
    Table 17. Global Semiconductor Dicing Saw Blade Production Value Market Share by Region (2018-2023)
    Table 18. Global Semiconductor Dicing Saw Blade Production Value (US$ Million) Forecast by Region (2024-2029)
    Table 19. Global Semiconductor Dicing Saw Blade Production Value Market Share Forecast by Region (2024-2029)
    Table 20. Global Semiconductor Dicing Saw Blade Production Comparison by Region: 2018 VS 2022 VS 2029 (K Units)
    Table 21. Global Semiconductor Dicing Saw Blade Production (K Units) by Region (2018-2023)
    Table 22. Global Semiconductor Dicing Saw Blade Production Market Share by Region (2018-2023)
    Table 23. Global Semiconductor Dicing Saw Blade Production (K Units) Forecast by Region (2024-2029)
    Table 24. Global Semiconductor Dicing Saw Blade Production Market Share Forecast by Region (2024-2029)
    Table 25. Global Semiconductor Dicing Saw Blade Market Average Price (US$/Unit) by Region (2018-2023)
    Table 26. Global Semiconductor Dicing Saw Blade Market Average Price (US$/Unit) by Region (2024-2029)
    Table 27. Global Semiconductor Dicing Saw Blade Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (K Units)
    Table 28. Global Semiconductor Dicing Saw Blade Consumption by Region (2018-2023) & (K Units)
    Table 29. Global Semiconductor Dicing Saw Blade Consumption Market Share by Region (2018-2023)
    Table 30. Global Semiconductor Dicing Saw Blade Forecasted Consumption by Region (2024-2029) & (K Units)
    Table 31. Global Semiconductor Dicing Saw Blade Forecasted Consumption Market Share by Region (2018-2023)
    Table 32. North America Semiconductor Dicing Saw Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
    Table 33. North America Semiconductor Dicing Saw Blade Consumption by Country (2018-2023) & (K Units)
    Table 34. North America Semiconductor Dicing Saw Blade Consumption by Country (2024-2029) & (K Units)
    Table 35. Europe Semiconductor Dicing Saw Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
    Table 36. Europe Semiconductor Dicing Saw Blade Consumption by Country (2018-2023) & (K Units)
    Table 37. Europe Semiconductor Dicing Saw Blade Consumption by Country (2024-2029) & (K Units)
    Table 38. Asia Pacific Semiconductor Dicing Saw Blade Consumption Growth Rate by Region: 2018 VS 2022 VS 2029 (K Units)
    Table 39. Asia Pacific Semiconductor Dicing Saw Blade Consumption by Region (2018-2023) & (K Units)
    Table 40. Asia Pacific Semiconductor Dicing Saw Blade Consumption by Region (2024-2029) & (K Units)
    Table 41. Latin America, Middle East & Africa Semiconductor Dicing Saw Blade Consumption Growth Rate by Country: 2018 VS 2022 VS 2029 (K Units)
    Table 42. Latin America, Middle East & Africa Semiconductor Dicing Saw Blade Consumption by Country (2018-2023) & (K Units)
    Table 43. Latin America, Middle East & Africa Semiconductor Dicing Saw Blade Consumption by Country (2024-2029) & (K Units)
    Table 44. Global Semiconductor Dicing Saw Blade Production (K Units) by Type (2018-2023)
    Table 45. Global Semiconductor Dicing Saw Blade Production (K Units) by Type (2024-2029)
    Table 46. Global Semiconductor Dicing Saw Blade Production Market Share by Type (2018-2023)
    Table 47. Global Semiconductor Dicing Saw Blade Production Market Share by Type (2024-2029)
    Table 48. Global Semiconductor Dicing Saw Blade Production Value (US$ Million) by Type (2018-2023)
    Table 49. Global Semiconductor Dicing Saw Blade Production Value (US$ Million) by Type (2024-2029)
    Table 50. Global Semiconductor Dicing Saw Blade Production Value Share by Type (2018-2023)
    Table 51. Global Semiconductor Dicing Saw Blade Production Value Share by Type (2024-2029)
    Table 52. Global Semiconductor Dicing Saw Blade Price (US$/Unit) by Type (2018-2023)
    Table 53. Global Semiconductor Dicing Saw Blade Price (US$/Unit) by Type (2024-2029)
    Table 54. Global Semiconductor Dicing Saw Blade Production (K Units) by Application (2018-2023)
    Table 55. Global Semiconductor Dicing Saw Blade Production (K Units) by Application (2024-2029)
    Table 56. Global Semiconductor Dicing Saw Blade Production Market Share by Application (2018-2023)
    Table 57. Global Semiconductor Dicing Saw Blade Production Market Share by Application (2024-2029)
    Table 58. Global Semiconductor Dicing Saw Blade Production Value (US$ Million) by Application (2018-2023)
    Table 59. Global Semiconductor Dicing Saw Blade Production Value (US$ Million) by Application (2024-2029)
    Table 60. Global Semiconductor Dicing Saw Blade Production Value Share by Application (2018-2023)
    Table 61. Global Semiconductor Dicing Saw Blade Production Value Share by Application (2024-2029)
    Table 62. Global Semiconductor Dicing Saw Blade Price (US$/Unit) by Application (2018-2023)
    Table 63. Global Semiconductor Dicing Saw Blade Price (US$/Unit) by Application (2024-2029)
    Table 64. Disco Corporation Semiconductor Dicing Saw Blade Corporation Information
    Table 65. Disco Corporation Specification and Application
    Table 66. Disco Corporation Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 67. Disco Corporation Main Business and Markets Served
    Table 68. Disco Corporation Recent Developments/Updates
    Table 69. YMB Semiconductor Dicing Saw Blade Corporation Information
    Table 70. YMB Specification and Application
    Table 71. YMB Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 72. YMB Main Business and Markets Served
    Table 73. YMB Recent Developments/Updates
    Table 74. NDC International Semiconductor Dicing Saw Blade Corporation Information
    Table 75. NDC International Specification and Application
    Table 76. NDC International Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 77. NDC International Main Business and Markets Served
    Table 78. NDC International Recent Developments/Updates
    Table 79. UKAM Industrial Semiconductor Dicing Saw Blade Corporation Information
    Table 80. UKAM Industrial Specification and Application
    Table 81. UKAM Industrial Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 82. UKAM Industrial Main Business and Markets Served
    Table 83. UKAM Industrial Recent Developments/Updates
    Table 84. Thermocarbon Semiconductor Dicing Saw Blade Corporation Information
    Table 85. Thermocarbon Specification and Application
    Table 86. Thermocarbon Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 87. Thermocarbon Main Business and Markets Served
    Table 88. Thermocarbon Recent Developments/Updates
    Table 89. TOKYO SEIMITSU Semiconductor Dicing Saw Blade Corporation Information
    Table 90. TOKYO SEIMITSU Specification and Application
    Table 91. TOKYO SEIMITSU Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 92. TOKYO SEIMITSU Main Business and Markets Served
    Table 93. TOKYO SEIMITSU Recent Developments/Updates
    Table 94. ADT Semiconductor Dicing Saw Blade Corporation Information
    Table 95. ADT Specification and Application
    Table 96. ADT Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 97. ADT Main Business and Markets Served
    Table 98. ADT Recent Developments/Updates
    Table 99. Ceiba Technologies Semiconductor Dicing Saw Blade Corporation Information
    Table 100. Ceiba Technologies Specification and Application
    Table 101. Ceiba Technologies Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 102. Ceiba Technologies Main Business and Markets Served
    Table 103. Ceiba Technologies Recent Developments/Updates
    Table 104. Kinik Company Semiconductor Dicing Saw Blade Corporation Information
    Table 105. Kinik Company Specification and Application
    Table 106. Kinik Company Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 107. Kinik Company Main Business and Markets Served
    Table 108. Kinik Company Recent Developments/Updates
    Table 109. Kulicke & Soffa Semiconductor Dicing Saw Blade Corporation Information
    Table 110. Kulicke & Soffa Specification and Application
    Table 111. Kulicke & Soffa Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 112. Kulicke & Soffa Main Business and Markets Served
    Table 113. Kulicke & Soffa Recent Developments/Updates
    Table 114. Industrial Tools, Inc Semiconductor Dicing Saw Blade Corporation Information
    Table 115. Industrial Tools, Inc Specification and Application
    Table 116. Industrial Tools, Inc Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 117. Industrial Tools, Inc Main Business and Markets Served
    Table 118. Industrial Tools, Inc Recent Developments/Updates
    Table 119. Shanghai Sinyang Semiconductor Dicing Saw Blade Corporation Information
    Table 120. Shanghai Sinyang Specification and Application
    Table 121. Shanghai Sinyang Semiconductor Dicing Saw Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2018-2023)
    Table 122. Shanghai Sinyang Main Business and Markets Served
    Table 123. Shanghai Sinyang Recent Developments/Updates
    Table 124. Key Raw Materials Lists
    Table 125. Raw Materials Key Suppliers Lists
    Table 126. Semiconductor Dicing Saw Blade Distributors List
    Table 127. Semiconductor Dicing Saw Blade Customers List
    Table 128. Semiconductor Dicing Saw Blade Market Trends
    Table 129. Semiconductor Dicing Saw Blade Market Drivers
    Table 130. Semiconductor Dicing Saw Blade Market Challenges
    Table 131. Semiconductor Dicing Saw Blade Market Restraints
    Table 132. Research Programs/Design for This Report
    Table 133. Key Data Information from Secondary Sources
    Table 134. Key Data Information from Primary Sources
List of Figures
    Figure 1. Product Picture of Semiconductor Dicing Saw Blade
    Figure 2. Global Semiconductor Dicing Saw Blade Market Value by Type, (US$ Million) & (2022 VS 2029)
    Figure 3. Global Semiconductor Dicing Saw Blade Market Share by Type: 2022 VS 2029
    Figure 4. Hub Dicing Blade Product Picture
    Figure 5. Hubless Dicing Blade Product Picture
    Figure 6. Global Semiconductor Dicing Saw Blade Market Value by Application, (US$ Million) & (2022 VS 2029)
    Figure 7. Global Semiconductor Dicing Saw Blade Market Share by Application: 2022 VS 2029
    Figure 8. 200mm Wafer
    Figure 9. 300mm Wafer
    Figure 10. Others
    Figure 11. Global Semiconductor Dicing Saw Blade Production Value (US$ Million), 2018 VS 2022 VS 2029
    Figure 12. Global Semiconductor Dicing Saw Blade Production Value (US$ Million) & (2018-2029)
    Figure 13. Global Semiconductor Dicing Saw Blade Production (K Units) & (2018-2029)
    Figure 14. Global Semiconductor Dicing Saw Blade Average Price (US$/Unit) & (2018-2029)
    Figure 15. Semiconductor Dicing Saw Blade Report Years Considered
    Figure 16. Semiconductor Dicing Saw Blade Production Share by Manufacturers in 2022
    Figure 17. Semiconductor Dicing Saw Blade Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2018 VS 2022
    Figure 18. The Global 5 and 10 Largest Players: Market Share by Semiconductor Dicing Saw Blade Revenue in 2022
    Figure 19. Global Semiconductor Dicing Saw Blade Production Value by Region: 2018 VS 2022 VS 2029 (US$ Million)
    Figure 20. Global Semiconductor Dicing Saw Blade Production Value Market Share by Region: 2018 VS 2022 VS 2029
    Figure 21. Global Semiconductor Dicing Saw Blade Production Comparison by Region: 2018 VS 2022 VS 2029 (K Units)
    Figure 22. Global Semiconductor Dicing Saw Blade Production Market Share by Region: 2018 VS 2022 VS 2029
    Figure 23. North America Semiconductor Dicing Saw Blade Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 24. Europe Semiconductor Dicing Saw Blade Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 25. China Semiconductor Dicing Saw Blade Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 26. Japan Semiconductor Dicing Saw Blade Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 27. South Korea Semiconductor Dicing Saw Blade Production Value (US$ Million) Growth Rate (2018-2029)
    Figure 28. Global Semiconductor Dicing Saw Blade Consumption by Region: 2018 VS 2022 VS 2029 (K Units)
    Figure 29. Global Semiconductor Dicing Saw Blade Consumption Market Share by Region: 2018 VS 2022 VS 2029
    Figure 30. North America Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 31. North America Semiconductor Dicing Saw Blade Consumption Market Share by Country (2018-2029)
    Figure 32. Canada Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 33. U.S. Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 34. Europe Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 35. Europe Semiconductor Dicing Saw Blade Consumption Market Share by Country (2018-2029)
    Figure 36. Germany Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 37. France Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 38. U.K. Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 39. Italy Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 40. Russia Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 41. Asia Pacific Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 42. Asia Pacific Semiconductor Dicing Saw Blade Consumption Market Share by Regions (2018-2029)
    Figure 43. China Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 44. Japan Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 45. South Korea Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 46. China Taiwan Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 47. Southeast Asia Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 48. India Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 49. Latin America, Middle East & Africa Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 50. Latin America, Middle East & Africa Semiconductor Dicing Saw Blade Consumption Market Share by Country (2018-2029)
    Figure 51. Mexico Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 52. Brazil Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 53. Turkey Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 54. GCC Countries Semiconductor Dicing Saw Blade Consumption and Growth Rate (2018-2023) & (K Units)
    Figure 55. Global Production Market Share of Semiconductor Dicing Saw Blade by Type (2018-2029)
    Figure 56. Global Production Value Market Share of Semiconductor Dicing Saw Blade by Type (2018-2029)
    Figure 57. Global Semiconductor Dicing Saw Blade Price (US$/Unit) by Type (2018-2029)
    Figure 58. Global Production Market Share of Semiconductor Dicing Saw Blade by Application (2018-2029)
    Figure 59. Global Production Value Market Share of Semiconductor Dicing Saw Blade by Application (2018-2029)
    Figure 60. Global Semiconductor Dicing Saw Blade Price (US$/Unit) by Application (2018-2029)
    Figure 61. Semiconductor Dicing Saw Blade Value Chain
    Figure 62. Semiconductor Dicing Saw Blade Production Process
    Figure 63. Channels of Distribution (Direct Vs Distribution)
    Figure 64. Distributors Profiles
    Figure 65. Bottom-up and Top-down Approaches for This Report
    Figure 66. Data Triangulation
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