The global market for Photonics Integrated Circuit Packaging and Assembly Service was valued at US$ 636 million in the year 2024 and is projected to reach a revised size of US$ 1173 million by 2031, growing at a CAGR of 9.2% during the forecast period.

Photonics Integrated Circuit Packaging and Assembly Service Market

Photonics Integrated Circuit Packaging and Assembly Service provides high-precision back-end manufacturing solutions from wafers to functional modules for photonic chips (PICs). Its core task is to integrate and package the bare photonic chip with external optical fibers, electronic drive circuits, thermal management components, etc., and to build efficient and stable optical signal input/output interfaces (such as fiber array coupling), electrical signal interconnection, and heat dissipation structures through key technologies such as sub-micron optical alignment, micro-nano welding, and sealing protection. This type of service focuses on solving challenges such as high sensitivity, low-loss transmission, airtightness, and reliability of photonic devices, and ultimately forms a plug-and-play optical engine or subsystem that is widely used in high-speed optical communications, data center interconnection, lidar, biosensing, and quantum technology.

North American market for Photonics Integrated Circuit Packaging and Assembly Service is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

Asia-Pacific market for Photonics Integrated Circuit Packaging and Assembly Service is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

The global market for Photonics Integrated Circuit Packaging and Assembly Service in Data Center is estimated to increase from $ million in 2024 to $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

The major global companies of Photonics Integrated Circuit Packaging and Assembly Service include IMEC, Intel, TSMC, ASE, ALTER, GlobalFoundries, LioniX International, EUROPRACTICE, Phix, VLC Photonics, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

This report aims to provide a comprehensive presentation of the global market for Photonics Integrated Circuit Packaging and Assembly Service, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Photonics Integrated Circuit Packaging and Assembly Service.

The Photonics Integrated Circuit Packaging and Assembly Service market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Photonics Integrated Circuit Packaging and Assembly Service market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Photonics Integrated Circuit Packaging and Assembly Service companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Photonics Integrated Circuit Packaging and Assembly Service Market Report

Report Metric	Details
Report Name	Photonics Integrated Circuit Packaging and Assembly Service Market
Accounted market size in year	US$ 636 million
Forecasted market size in 2031	US$ 1173 million
CAGR	9.2%
Base Year	year
Forecasted years	2025 - 2031
Segment by Type	Optical Coupling & Interconnection Electrical Interconnection
Segment by Application	Data Center Communications Sensor Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	IMEC, Intel, TSMC, ASE, ALTER, GlobalFoundries, LioniX International, EUROPRACTICE, Phix, VLC Photonics, Skorpios Technologies, POET Technologies, PLC Connections, CMC Microsystems, AIM Photonics, Bay Photonics
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Photonics Integrated Circuit Packaging and Assembly Service company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Photonics Integrated Circuit Packaging and Assembly Service Market growing?

Ans: The Photonics Integrated Circuit Packaging and Assembly Service Market witnessing a CAGR of 9.2% during the forecast period 2025-2031.

What is the Photonics Integrated Circuit Packaging and Assembly Service Market size in 2031?

Ans: The Photonics Integrated Circuit Packaging and Assembly Service Market size in 2031 will be US$ 1173 million.

Who are the main players in the Photonics Integrated Circuit Packaging and Assembly Service Market report?

Ans: The main players in the Photonics Integrated Circuit Packaging and Assembly Service Market are IMEC, Intel, TSMC, ASE, ALTER, GlobalFoundries, LioniX International, EUROPRACTICE, Phix, VLC Photonics, Skorpios Technologies, POET Technologies, PLC Connections, CMC Microsystems, AIM Photonics, Bay Photonics

What are the Application segmentation covered in the Photonics Integrated Circuit Packaging and Assembly Service Market report?

Ans: The Applications covered in the Photonics Integrated Circuit Packaging and Assembly Service Market report are Data Center, Communications, Sensor, Others

What are the Type segmentation covered in the Photonics Integrated Circuit Packaging and Assembly Service Market report?

Ans: The Types covered in the Photonics Integrated Circuit Packaging and Assembly Service Market report are Optical Coupling & Interconnection, Electrical Interconnection

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Photonics Integrated Circuit Packaging and Assembly Service Market Size Growth Rate by Type: 2020 VS 2024 VS 2031

1.2.2 Optical Coupling & Interconnection

1.2.3 Electrical Interconnection

1.3 Market by Application

1.3.1 Global Photonics Integrated Circuit Packaging and Assembly Service Market Growth by Application: 2020 VS 2024 VS 2031

1.3.2 Data Center

1.3.3 Communications

1.3.4 Sensor

1.3.5 Others

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global Photonics Integrated Circuit Packaging and Assembly Service Market Perspective (2020-2031)

2.2 Global Photonics Integrated Circuit Packaging and Assembly Service Growth Trends by Region

2.2.1 Global Photonics Integrated Circuit Packaging and Assembly Service Market Size by Region: 2020 VS 2024 VS 2031

2.2.2 Photonics Integrated Circuit Packaging and Assembly Service Historic Market Size by Region (2020-2025)

2.2.3 Photonics Integrated Circuit Packaging and Assembly Service Forecasted Market Size by Region (2026-2031)

2.3 Photonics Integrated Circuit Packaging and Assembly Service Market Dynamics

2.3.1 Photonics Integrated Circuit Packaging and Assembly Service Industry Trends

2.3.2 Photonics Integrated Circuit Packaging and Assembly Service Market Drivers

2.3.3 Photonics Integrated Circuit Packaging and Assembly Service Market Challenges

2.3.4 Photonics Integrated Circuit Packaging and Assembly Service Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Photonics Integrated Circuit Packaging and Assembly Service Players by Revenue

3.1.1 Global Top Photonics Integrated Circuit Packaging and Assembly Service Players by Revenue (2020-2025)

3.1.2 Global Photonics Integrated Circuit Packaging and Assembly Service Revenue Market Share by Players (2020-2025)

3.2 Global Top Photonics Integrated Circuit Packaging and Assembly Service Players by Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by Photonics Integrated Circuit Packaging and Assembly Service Revenue

3.4 Global Photonics Integrated Circuit Packaging and Assembly Service Market Concentration Ratio

3.4.1 Global Photonics Integrated Circuit Packaging and Assembly Service Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Photonics Integrated Circuit Packaging and Assembly Service Revenue in 2024

3.5 Global Key Players of Photonics Integrated Circuit Packaging and Assembly Service Head office and Area Served

3.6 Global Key Players of Photonics Integrated Circuit Packaging and Assembly Service, Product and Application

3.7 Global Key Players of Photonics Integrated Circuit Packaging and Assembly Service, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 Photonics Integrated Circuit Packaging and Assembly Service Breakdown Data by Type

4.1 Global Photonics Integrated Circuit Packaging and Assembly Service Historic Market Size by Type (2020-2025)

4.2 Global Photonics Integrated Circuit Packaging and Assembly Service Forecasted Market Size by Type (2026-2031)

5 Photonics Integrated Circuit Packaging and Assembly Service Breakdown Data by Application

5.1 Global Photonics Integrated Circuit Packaging and Assembly Service Historic Market Size by Application (2020-2025)

5.2 Global Photonics Integrated Circuit Packaging and Assembly Service Forecasted Market Size by Application (2026-2031)

6 North America

6.1 North America Photonics Integrated Circuit Packaging and Assembly Service Market Size (2020-2031)

6.2 North America Photonics Integrated Circuit Packaging and Assembly Service Market Growth Rate by Country: 2020 VS 2024 VS 2031

6.3 North America Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2020-2025)

6.4 North America Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2026-2031)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Photonics Integrated Circuit Packaging and Assembly Service Market Size (2020-2031)

7.2 Europe Photonics Integrated Circuit Packaging and Assembly Service Market Growth Rate by Country: 2020 VS 2024 VS 2031

7.3 Europe Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2020-2025)

7.4 Europe Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2026-2031)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Photonics Integrated Circuit Packaging and Assembly Service Market Size (2020-2031)

8.2 Asia-Pacific Photonics Integrated Circuit Packaging and Assembly Service Market Growth Rate by Region: 2020 VS 2024 VS 2031

8.3 Asia-Pacific Photonics Integrated Circuit Packaging and Assembly Service Market Size by Region (2020-2025)

8.4 Asia-Pacific Photonics Integrated Circuit Packaging and Assembly Service Market Size by Region (2026-2031)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Photonics Integrated Circuit Packaging and Assembly Service Market Size (2020-2031)

9.2 Latin America Photonics Integrated Circuit Packaging and Assembly Service Market Growth Rate by Country: 2020 VS 2024 VS 2031

9.3 Latin America Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2020-2025)

9.4 Latin America Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2026-2031)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Photonics Integrated Circuit Packaging and Assembly Service Market Size (2020-2031)

10.2 Middle East & Africa Photonics Integrated Circuit Packaging and Assembly Service Market Growth Rate by Country: 2020 VS 2024 VS 2031

10.3 Middle East & Africa Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2020-2025)

10.4 Middle East & Africa Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2026-2031)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 IMEC

11.1.1 IMEC Company Details

11.1.2 IMEC Business Overview

11.1.3 IMEC Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.1.4 IMEC Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.1.5 IMEC Recent Development

11.2 Intel

11.2.1 Intel Company Details

11.2.2 Intel Business Overview

11.2.3 Intel Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.2.4 Intel Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.2.5 Intel Recent Development

11.3 TSMC

11.3.1 TSMC Company Details

11.3.2 TSMC Business Overview

11.3.3 TSMC Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.3.4 TSMC Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.3.5 TSMC Recent Development

11.4 ASE

11.4.1 ASE Company Details

11.4.2 ASE Business Overview

11.4.3 ASE Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.4.4 ASE Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.4.5 ASE Recent Development

11.5 ALTER

11.5.1 ALTER Company Details

11.5.2 ALTER Business Overview

11.5.3 ALTER Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.5.4 ALTER Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.5.5 ALTER Recent Development

11.6 GlobalFoundries

11.6.1 GlobalFoundries Company Details

11.6.2 GlobalFoundries Business Overview

11.6.3 GlobalFoundries Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.6.4 GlobalFoundries Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.6.5 GlobalFoundries Recent Development

11.7 LioniX International

11.7.1 LioniX International Company Details

11.7.2 LioniX International Business Overview

11.7.3 LioniX International Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.7.4 LioniX International Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.7.5 LioniX International Recent Development

11.8 EUROPRACTICE

11.8.1 EUROPRACTICE Company Details

11.8.2 EUROPRACTICE Business Overview

11.8.3 EUROPRACTICE Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.8.4 EUROPRACTICE Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.8.5 EUROPRACTICE Recent Development

11.9 Phix

11.9.1 Phix Company Details

11.9.2 Phix Business Overview

11.9.3 Phix Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.9.4 Phix Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.9.5 Phix Recent Development

11.10 VLC Photonics

11.10.1 VLC Photonics Company Details

11.10.2 VLC Photonics Business Overview

11.10.3 VLC Photonics Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.10.4 VLC Photonics Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.10.5 VLC Photonics Recent Development

11.11 Skorpios Technologies

11.11.1 Skorpios Technologies Company Details

11.11.2 Skorpios Technologies Business Overview

11.11.3 Skorpios Technologies Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.11.4 Skorpios Technologies Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.11.5 Skorpios Technologies Recent Development

11.12 POET Technologies

11.12.1 POET Technologies Company Details

11.12.2 POET Technologies Business Overview

11.12.3 POET Technologies Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.12.4 POET Technologies Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.12.5 POET Technologies Recent Development

11.13 PLC Connections

11.13.1 PLC Connections Company Details

11.13.2 PLC Connections Business Overview

11.13.3 PLC Connections Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.13.4 PLC Connections Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.13.5 PLC Connections Recent Development

11.14 CMC Microsystems

11.14.1 CMC Microsystems Company Details

11.14.2 CMC Microsystems Business Overview

11.14.3 CMC Microsystems Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.14.4 CMC Microsystems Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.14.5 CMC Microsystems Recent Development

11.15 AIM Photonics

11.15.1 AIM Photonics Company Details

11.15.2 AIM Photonics Business Overview

11.15.3 AIM Photonics Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.15.4 AIM Photonics Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.15.5 AIM Photonics Recent Development

11.16 Bay Photonics

11.16.1 Bay Photonics Company Details

11.16.2 Bay Photonics Business Overview

11.16.3 Bay Photonics Photonics Integrated Circuit Packaging and Assembly Service Introduction

11.16.4 Bay Photonics Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

11.16.5 Bay Photonics Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

Skorpios Technologies

List of Tables

Table 1. Global Photonics Integrated Circuit Packaging and Assembly Service Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031

Table 2. Key Players of Optical Coupling & Interconnection

Table 3. Key Players of Electrical Interconnection

Table 4. Global Photonics Integrated Circuit Packaging and Assembly Service Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031

Table 5. Global Photonics Integrated Circuit Packaging and Assembly Service Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Table 6. Global Photonics Integrated Circuit Packaging and Assembly Service Market Size by Region (2020-2025) & (US$ Million)

Table 7. Global Photonics Integrated Circuit Packaging and Assembly Service Market Share by Region (2020-2025)

Table 8. Global Photonics Integrated Circuit Packaging and Assembly Service Forecasted Market Size by Region (2026-2031) & (US$ Million)

Table 9. Global Photonics Integrated Circuit Packaging and Assembly Service Market Share by Region (2026-2031)

Table 10. Photonics Integrated Circuit Packaging and Assembly Service Market Trends

Table 11. Photonics Integrated Circuit Packaging and Assembly Service Market Drivers

Table 12. Photonics Integrated Circuit Packaging and Assembly Service Market Challenges

Table 13. Photonics Integrated Circuit Packaging and Assembly Service Market Restraints

Table 14. Global Photonics Integrated Circuit Packaging and Assembly Service Revenue by Players (2020-2025) & (US$ Million)

Table 15. Global Photonics Integrated Circuit Packaging and Assembly Service Market Share by Players (2020-2025)

Table 16. Global Top Photonics Integrated Circuit Packaging and Assembly Service Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Photonics Integrated Circuit Packaging and Assembly Service as of 2024)

Table 17. Ranking of Global Top Photonics Integrated Circuit Packaging and Assembly Service Companies by Revenue (US$ Million) in 2024

Table 18. Global 5 Largest Players Market Share by Photonics Integrated Circuit Packaging and Assembly Service Revenue (CR5 and HHI) & (2020-2025)

Table 19. Global Key Players of Photonics Integrated Circuit Packaging and Assembly Service, Headquarters and Area Served

Table 20. Global Key Players of Photonics Integrated Circuit Packaging and Assembly Service, Product and Application

Table 21. Global Key Players of Photonics Integrated Circuit Packaging and Assembly Service, Date of Enter into This Industry

Table 22. Mergers & Acquisitions, Expansion Plans

Table 23. Global Photonics Integrated Circuit Packaging and Assembly Service Market Size by Type (2020-2025) & (US$ Million)

Table 24. Global Photonics Integrated Circuit Packaging and Assembly Service Revenue Market Share by Type (2020-2025)

Table 25. Global Photonics Integrated Circuit Packaging and Assembly Service Forecasted Market Size by Type (2026-2031) & (US$ Million)

Table 26. Global Photonics Integrated Circuit Packaging and Assembly Service Revenue Market Share by Type (2026-2031)

Table 27. Global Photonics Integrated Circuit Packaging and Assembly Service Market Size by Application (2020-2025) & (US$ Million)

Table 28. Global Photonics Integrated Circuit Packaging and Assembly Service Revenue Market Share by Application (2020-2025)

Table 29. Global Photonics Integrated Circuit Packaging and Assembly Service Forecasted Market Size by Application (2026-2031) & (US$ Million)

Table 30. Global Photonics Integrated Circuit Packaging and Assembly Service Revenue Market Share by Application (2026-2031)

Table 31. North America Photonics Integrated Circuit Packaging and Assembly Service Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 32. North America Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2020-2025) & (US$ Million)

Table 33. North America Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2026-2031) & (US$ Million)

Table 34. Europe Photonics Integrated Circuit Packaging and Assembly Service Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 35. Europe Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2020-2025) & (US$ Million)

Table 36. Europe Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2026-2031) & (US$ Million)

Table 37. Asia-Pacific Photonics Integrated Circuit Packaging and Assembly Service Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031

Table 38. Asia-Pacific Photonics Integrated Circuit Packaging and Assembly Service Market Size by Region (2020-2025) & (US$ Million)

Table 39. Asia-Pacific Photonics Integrated Circuit Packaging and Assembly Service Market Size by Region (2026-2031) & (US$ Million)

Table 40. Latin America Photonics Integrated Circuit Packaging and Assembly Service Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 41. Latin America Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2020-2025) & (US$ Million)

Table 42. Latin America Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2026-2031) & (US$ Million)

Table 43. Middle East & Africa Photonics Integrated Circuit Packaging and Assembly Service Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 44. Middle East & Africa Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2020-2025) & (US$ Million)

Table 45. Middle East & Africa Photonics Integrated Circuit Packaging and Assembly Service Market Size by Country (2026-2031) & (US$ Million)

Table 46. IMEC Company Details

Table 47. IMEC Business Overview

Table 48. IMEC Photonics Integrated Circuit Packaging and Assembly Service Product

Table 49. IMEC Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 50. IMEC Recent Development

Table 51. Intel Company Details

Table 52. Intel Business Overview

Table 53. Intel Photonics Integrated Circuit Packaging and Assembly Service Product

Table 54. Intel Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 55. Intel Recent Development

Table 56. TSMC Company Details

Table 57. TSMC Business Overview

Table 58. TSMC Photonics Integrated Circuit Packaging and Assembly Service Product

Table 59. TSMC Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 60. TSMC Recent Development

Table 61. ASE Company Details

Table 62. ASE Business Overview

Table 63. ASE Photonics Integrated Circuit Packaging and Assembly Service Product

Table 64. ASE Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 65. ASE Recent Development

Table 66. ALTER Company Details

Table 67. ALTER Business Overview

Table 68. ALTER Photonics Integrated Circuit Packaging and Assembly Service Product

Table 69. ALTER Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 70. ALTER Recent Development

Table 71. GlobalFoundries Company Details

Table 72. GlobalFoundries Business Overview

Table 73. GlobalFoundries Photonics Integrated Circuit Packaging and Assembly Service Product

Table 74. GlobalFoundries Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 75. GlobalFoundries Recent Development

Table 76. LioniX International Company Details

Table 77. LioniX International Business Overview

Table 78. LioniX International Photonics Integrated Circuit Packaging and Assembly Service Product

Table 79. LioniX International Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 80. LioniX International Recent Development

Table 81. EUROPRACTICE Company Details

Table 82. EUROPRACTICE Business Overview

Table 83. EUROPRACTICE Photonics Integrated Circuit Packaging and Assembly Service Product

Table 84. EUROPRACTICE Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 85. EUROPRACTICE Recent Development

Table 86. Phix Company Details

Table 87. Phix Business Overview

Table 88. Phix Photonics Integrated Circuit Packaging and Assembly Service Product

Table 89. Phix Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 90. Phix Recent Development

Table 91. VLC Photonics Company Details

Table 92. VLC Photonics Business Overview

Table 93. VLC Photonics Photonics Integrated Circuit Packaging and Assembly Service Product

Table 94. VLC Photonics Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 95. VLC Photonics Recent Development

Table 96. Skorpios Technologies Company Details

Table 97. Skorpios Technologies Business Overview

Table 98. Skorpios Technologies Photonics Integrated Circuit Packaging and Assembly Service Product

Table 99. Skorpios Technologies Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 100. Skorpios Technologies Recent Development

Table 101. POET Technologies Company Details

Table 102. POET Technologies Business Overview

Table 103. POET Technologies Photonics Integrated Circuit Packaging and Assembly Service Product

Table 104. POET Technologies Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 105. POET Technologies Recent Development

Table 106. PLC Connections Company Details

Table 107. PLC Connections Business Overview

Table 108. PLC Connections Photonics Integrated Circuit Packaging and Assembly Service Product

Table 109. PLC Connections Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 110. PLC Connections Recent Development

Table 111. CMC Microsystems Company Details

Table 112. CMC Microsystems Business Overview

Table 113. CMC Microsystems Photonics Integrated Circuit Packaging and Assembly Service Product

Table 114. CMC Microsystems Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 115. CMC Microsystems Recent Development

Table 116. AIM Photonics Company Details

Table 117. AIM Photonics Business Overview

Table 118. AIM Photonics Photonics Integrated Circuit Packaging and Assembly Service Product

Table 119. AIM Photonics Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 120. AIM Photonics Recent Development

Table 121. Bay Photonics Company Details

Table 122. Bay Photonics Business Overview

Table 123. Bay Photonics Photonics Integrated Circuit Packaging and Assembly Service Product

Table 124. Bay Photonics Revenue in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025) & (US$ Million)

Table 125. Bay Photonics Recent Development

Table 126. Research Programs/Design for This Report

Table 127. Key Data Information from Secondary Sources

Table 128. Key Data Information from Primary Sources

Table 129. Authors List of This Report

List of Figures

Figure 1. Photonics Integrated Circuit Packaging and Assembly Service Picture

Figure 2. Global Photonics Integrated Circuit Packaging and Assembly Service Market Size Comparison by Type (2020-2031) & (US$ Million)

Figure 3. Global Photonics Integrated Circuit Packaging and Assembly Service Market Share by Type: 2024 VS 2031

Figure 4. Optical Coupling & Interconnection Features

Figure 5. Electrical Interconnection Features

Figure 6. Global Photonics Integrated Circuit Packaging and Assembly Service Market Size by Application (2020-2031) & (US$ Million)

Figure 7. Global Photonics Integrated Circuit Packaging and Assembly Service Market Share by Application: 2024 VS 2031

Figure 8. Data Center Case Studies

Figure 9. Communications Case Studies

Figure 10. Sensor Case Studies

Figure 11. Others Case Studies

Figure 12. Photonics Integrated Circuit Packaging and Assembly Service Report Years Considered

Figure 13. Global Photonics Integrated Circuit Packaging and Assembly Service Market Size (US$ Million), Year-over-Year: 2020-2031

Figure 14. Global Photonics Integrated Circuit Packaging and Assembly Service Market Size, (US$ Million), 2020 VS 2024 VS 2031

Figure 15. Global Photonics Integrated Circuit Packaging and Assembly Service Market Share by Region: 2024 VS 2031

Figure 16. Global Photonics Integrated Circuit Packaging and Assembly Service Market Share by Players in 2024

Figure 17. Global Photonics Integrated Circuit Packaging and Assembly Service Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

Figure 18. The Top 10 and 5 Players Market Share by Photonics Integrated Circuit Packaging and Assembly Service Revenue in 2024

Figure 19. North America Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 20. North America Photonics Integrated Circuit Packaging and Assembly Service Market Share by Country (2020-2031)

Figure 21. United States Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 22. Canada Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 23. Europe Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 24. Europe Photonics Integrated Circuit Packaging and Assembly Service Market Share by Country (2020-2031)

Figure 25. Germany Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 26. France Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 27. U.K. Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 28. Italy Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 29. Russia Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 30. Nordic Countries Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 31. Asia-Pacific Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 32. Asia-Pacific Photonics Integrated Circuit Packaging and Assembly Service Market Share by Region (2020-2031)

Figure 33. China Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 34. Japan Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 35. South Korea Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 36. Southeast Asia Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 37. India Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 38. Australia Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 39. Latin America Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 40. Latin America Photonics Integrated Circuit Packaging and Assembly Service Market Share by Country (2020-2031)

Figure 41. Mexico Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 42. Brazil Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 43. Middle East & Africa Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 44. Middle East & Africa Photonics Integrated Circuit Packaging and Assembly Service Market Share by Country (2020-2031)

Figure 45. Turkey Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 46. Saudi Arabia Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 47. UAE Photonics Integrated Circuit Packaging and Assembly Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 48. IMEC Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 49. Intel Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 50. TSMC Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 51. ASE Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 52. ALTER Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 53. GlobalFoundries Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 54. LioniX International Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 55. EUROPRACTICE Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 56. Phix Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 57. VLC Photonics Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 58. Skorpios Technologies Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 59. POET Technologies Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 60. PLC Connections Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 61. CMC Microsystems Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 62. AIM Photonics Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 63. Bay Photonics Revenue Growth Rate in Photonics Integrated Circuit Packaging and Assembly Service Business (2020-2025)

Figure 64. Bottom-up and Top-down Approaches for This Report

Figure 65. Data Triangulation

Figure 66. Key Executives Interviewed

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