Global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market Insights, Forecast to 2025

The Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market was valued at 23000 Million USD in 2018 and is projected to reach 26700 Million USD by 2025, at a CAGR of 1.9% during the forecast period.

Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.

Most PCB manufacturers are finding the demand for multilayer boards increasing by leaps and bounds. This growing demand is fed by the need for smaller, lighter boards for use in electrical devices, military equipment, healthcare miniaturization, and an expanding market for smart devices incorporated in home automation systems. Smartphones and computers are perfect applications for multilayer PCBs with their need for compactness and light weight, yet sophisticated functionality. Within the PCB market, the communication industry is expected to remain the largest market. Continuous innovations in smartphones and increasing demand from emerging economies are expected to spur growth for this segment over the forecast period.

In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Multilayer Printed Circuit Board (Multilayer Printed-wiring Board). 

This report presents the worldwide Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.

This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis. 

The following manufacturers are covered in this report:

• Nippon Mektron
• ZD Tech
• TTM Technologies
• Unimicron
• Sumitomo Denko
• Compeq
• Tripod
• Samsung E-M
• Young Poong Group
• HannStar
• Ibiden
• Nanya PCB
• KBC PCB Group
• Daeduck Group
• AT&S
• Fujikura
• Meiko
• Multek
• Kinsus
• Chin Poon
• P.T.
• Shinko Denski
• Wus Group
• Simmtech
• Mflex
• CMK
• LG Innotek
• Gold Circuit
• Shennan Circuit
• Ellington
• Kinwong
• Founder Tech
• Dynamic
• Aoshikang
• Wuzhou
• CCTC
• SZ Fast Print
• Guangdong Xinda
• Shenzhen Suntak
• Redboard 

Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Breakdown Data by Type

• Layer 4-6
• Layer 8-10
• Layer 10+

Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Breakdown Data by Application

• Consumer Electronics
• Communications
• Computer Related Industry
• Automotive Industry
• Other 

Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Production by Region

• United States
• Europe
• China
• Japan
• South Korea
• Other Region 

Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Consumption by Region

    North America

• United States
• Canada
• Mexico

    Asia-Pacific

• China
• India
• Japan
• South Korea
• Australia
• Indonesia
• Malaysia
• Philippines
• Thailand
• Vietnam

    Europe

• Germany
• France
• UK
• Italy
• Russia
• Rest of Europe

    Central & South America

• Brazil
• Rest of South America

    Middle East & Africa

• GCC Countries
• Turkey
• Egypt
• South Africa
• Rest of Middle East & Africa 

The study objectives are:

• To analyze and research the global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) status and future forecast，involving, production, revenue, consumption, historical and forecast.
• To present the key Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) manufacturers, production, revenue, market share, and recent development.
• To split the breakdown data by regions, type, manufacturers and applications.
• To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
• To identify significant trends, drivers, influence factors in global and regions.
• To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) :

• History Year: 2014 - 2018
• Base Year: 2018
• Estimated Year: 2019
• Forecast Year: 2019 - 2025

This report includes the estimation of market size for value (million USD) and volume (K sqm). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.