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Global Semiconductor Advanced Packaging Market Research Report 2024

Published Date: February 2024

Report Code: QYRE-Othe-2W335

Global Semiconductor Advanced Packaging Market Insights and Forecast to 2028

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Global Semiconductor Advanced Packaging Market Research Report 2024

Code: QYRE-Othe-2W335

Report

February 2024

Pages:99

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Amkor Technology

China Wafer Level CSP

ChipMOS TECHNOLOGIES

FlipChip International

Hana Micron

Interconnect Systems (Molex)

UTAC Group

SAMSUNG

Advanced Semiconductor Engineering (ASE)

TSMC (Taiwan Semiconductor Manufacturing Company)

Jiangsu Changjiang Electronics Technology (JCET)

King Yuan ELECTRONICS

Tongfu Microelectronics

Nepes

Powertech Technology (PTI)

Signetics

Tianshui Huatian

Veeco/CNT

Semiconductor Advanced Packaging Market Size

The global Semiconductor Advanced Packaging market was valued at US$ 15670 million in 2023 and is anticipated to reach US$ 26270 million by 2030, witnessing a CAGR of 7.5% during the forecast period 2024-2030.

Semiconductor Advanced Packaging Market

Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

This report aims to provide a comprehensive presentation of the global market for Semiconductor Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Advanced Packaging.

Report Scope

The Semiconductor Advanced Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Advanced Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Semiconductor Advanced Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Semiconductor Advanced Packaging Market Report

Report Metric	Details
Report Name	Semiconductor Advanced Packaging Market
Accounted market size in 2023	US$ 15670 million
Forecasted market size in 2030	US$ 26270 million
CAGR	7.5%
Base Year	2023
Forecasted years	2024 - 2030
Segment by Type	Fan-Out Wafer-Level Packaging (FO WLP) Fan-In Wafer-Level Packaging (FI WLP) Flip Chip (FC) 2.5D/3D
Segment by Application	Telecommunications Automotive Aerospace and Defense Medical Devices Consumer Electronics Other
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Advanced Semiconductor Engineering (ASE), Amkor Technology, Samsung, TSMC (Taiwan Semiconductor Manufacturing Company), China Wafer Level CSP, ChipMOS Technologies, FlipChip International, HANA Micron, Interconnect Systems (Molex), Jiangsu Changjiang Electronics Technology (JCET), King Yuan Electronics, Tongfu Microelectronics, Nepes, Powertech Technology (PTI), Signetics, Tianshui Huatian, Veeco/CNT, UTAC Group
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Advanced Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Semiconductor Advanced Packaging Market growing?

Ans: The Semiconductor Advanced Packaging Market witnessing a CAGR of 7.5% during the forecast period 2024-2030.

What is the Semiconductor Advanced Packaging Market size in 2030?

Ans: The Semiconductor Advanced Packaging Market size in 2030 will be US$ 26270 million.

What is the Semiconductor Advanced Packaging Market share by region?

Ans: Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year.

Who are the main players in the Semiconductor Advanced Packaging Market report?

Ans: The main players in the Semiconductor Advanced Packaging Market are Advanced Semiconductor Engineering (ASE), Amkor Technology, Samsung, TSMC (Taiwan Semiconductor Manufacturing Company), China Wafer Level CSP, ChipMOS Technologies, FlipChip International, HANA Micron, Interconnect Systems (Molex), Jiangsu Changjiang Electronics Technology (JCET), King Yuan Electronics, Tongfu Microelectronics, Nepes, Powertech Technology (PTI), Signetics, Tianshui Huatian, Veeco/CNT, UTAC Group

What are the Application segmentation covered in the Semiconductor Advanced Packaging Market report?

Ans: The Applications covered in the Semiconductor Advanced Packaging Market report are Telecommunications, Automotive, Aerospace and Defense, Medical Devices, Consumer Electronics, Other

What are the Type segmentation covered in the Semiconductor Advanced Packaging Market report?

Ans: The Types covered in the Semiconductor Advanced Packaging Market report are Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), Flip Chip (FC), 2.5D/3D

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Semiconductor Advanced Packaging Market Size Growth Rate by Type: 2019 VS 2023 VS 2030

1.2.2 Fan-Out Wafer-Level Packaging (FO WLP)

1.2.3 Fan-In Wafer-Level Packaging (FI WLP)

1.2.4 Flip Chip (FC)

1.2.5 2.5D/3D

1.3 Market by Application

1.3.1 Global Semiconductor Advanced Packaging Market Growth by Application: 2019 VS 2023 VS 2030

1.3.2 Telecommunications

1.3.3 Automotive

1.3.4 Aerospace and Defense

1.3.5 Medical Devices

1.3.6 Consumer Electronics

1.3.7 Other

1.4 Study Objectives

1.5 Years Considered

1.6 Years Considered

2 Global Growth Trends

2.1 Global Semiconductor Advanced Packaging Market Perspective (2019-2030)

2.2 Semiconductor Advanced Packaging Growth Trends by Region

2.2.1 Global Semiconductor Advanced Packaging Market Size by Region: 2019 VS 2023 VS 2030

2.2.2 Semiconductor Advanced Packaging Historic Market Size by Region (2019-2024)

2.2.3 Semiconductor Advanced Packaging Forecasted Market Size by Region (2025-2030)

2.3 Semiconductor Advanced Packaging Market Dynamics

2.3.1 Semiconductor Advanced Packaging Industry Trends

2.3.2 Semiconductor Advanced Packaging Market Drivers

2.3.3 Semiconductor Advanced Packaging Market Challenges

2.3.4 Semiconductor Advanced Packaging Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Semiconductor Advanced Packaging Players by Revenue

3.1.1 Global Top Semiconductor Advanced Packaging Players by Revenue (2019-2024)

3.1.2 Global Semiconductor Advanced Packaging Revenue Market Share by Players (2019-2024)

3.2 Global Semiconductor Advanced Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Players Covered: Ranking by Semiconductor Advanced Packaging Revenue

3.4 Global Semiconductor Advanced Packaging Market Concentration Ratio

3.4.1 Global Semiconductor Advanced Packaging Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Semiconductor Advanced Packaging Revenue in 2023

3.5 Semiconductor Advanced Packaging Key Players Head office and Area Served

3.6 Key Players Semiconductor Advanced Packaging Product Solution and Service

3.7 Date of Enter into Semiconductor Advanced Packaging Market

3.8 Mergers & Acquisitions, Expansion Plans

4 Semiconductor Advanced Packaging Breakdown Data by Type

4.1 Global Semiconductor Advanced Packaging Historic Market Size by Type (2019-2024)

4.2 Global Semiconductor Advanced Packaging Forecasted Market Size by Type (2025-2030)

5 Semiconductor Advanced Packaging Breakdown Data by Application

5.1 Global Semiconductor Advanced Packaging Historic Market Size by Application (2019-2024)

5.2 Global Semiconductor Advanced Packaging Forecasted Market Size by Application (2025-2030)

6 North America

6.1 North America Semiconductor Advanced Packaging Market Size (2019-2030)

6.2 North America Semiconductor Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030

6.3 North America Semiconductor Advanced Packaging Market Size by Country (2019-2024)

6.4 North America Semiconductor Advanced Packaging Market Size by Country (2025-2030)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Semiconductor Advanced Packaging Market Size (2019-2030)

7.2 Europe Semiconductor Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030

7.3 Europe Semiconductor Advanced Packaging Market Size by Country (2019-2024)

7.4 Europe Semiconductor Advanced Packaging Market Size by Country (2025-2030)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Semiconductor Advanced Packaging Market Size (2019-2030)

8.2 Asia-Pacific Semiconductor Advanced Packaging Market Growth Rate by Region: 2019 VS 2023 VS 2030

8.3 Asia-Pacific Semiconductor Advanced Packaging Market Size by Region (2019-2024)

8.4 Asia-Pacific Semiconductor Advanced Packaging Market Size by Region (2025-2030)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Semiconductor Advanced Packaging Market Size (2019-2030)

9.2 Latin America Semiconductor Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030

9.3 Latin America Semiconductor Advanced Packaging Market Size by Country (2019-2024)

9.4 Latin America Semiconductor Advanced Packaging Market Size by Country (2025-2030)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Semiconductor Advanced Packaging Market Size (2019-2030)

10.2 Middle East & Africa Semiconductor Advanced Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030

10.3 Middle East & Africa Semiconductor Advanced Packaging Market Size by Country (2019-2024)

10.4 Middle East & Africa Semiconductor Advanced Packaging Market Size by Country (2025-2030)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 Advanced Semiconductor Engineering (ASE)

11.1.1 Advanced Semiconductor Engineering (ASE) Company Detail

11.1.2 Advanced Semiconductor Engineering (ASE) Business Overview

11.1.3 Advanced Semiconductor Engineering (ASE) Semiconductor Advanced Packaging Introduction

11.1.4 Advanced Semiconductor Engineering (ASE) Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.1.5 Advanced Semiconductor Engineering (ASE) Recent Development

11.2 Amkor Technology

11.2.1 Amkor Technology Company Detail

11.2.2 Amkor Technology Business Overview

11.2.3 Amkor Technology Semiconductor Advanced Packaging Introduction

11.2.4 Amkor Technology Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.2.5 Amkor Technology Recent Development

11.3 Samsung

11.3.1 Samsung Company Detail

11.3.2 Samsung Business Overview

11.3.3 Samsung Semiconductor Advanced Packaging Introduction

11.3.4 Samsung Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.3.5 Samsung Recent Development

11.4 TSMC (Taiwan Semiconductor Manufacturing Company)

11.4.1 TSMC (Taiwan Semiconductor Manufacturing Company) Company Detail

11.4.2 TSMC (Taiwan Semiconductor Manufacturing Company) Business Overview

11.4.3 TSMC (Taiwan Semiconductor Manufacturing Company) Semiconductor Advanced Packaging Introduction

11.4.4 TSMC (Taiwan Semiconductor Manufacturing Company) Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.4.5 TSMC (Taiwan Semiconductor Manufacturing Company) Recent Development

11.5 China Wafer Level CSP

11.5.1 China Wafer Level CSP Company Detail

11.5.2 China Wafer Level CSP Business Overview

11.5.3 China Wafer Level CSP Semiconductor Advanced Packaging Introduction

11.5.4 China Wafer Level CSP Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.5.5 China Wafer Level CSP Recent Development

11.6 ChipMOS Technologies

11.6.1 ChipMOS Technologies Company Detail

11.6.2 ChipMOS Technologies Business Overview

11.6.3 ChipMOS Technologies Semiconductor Advanced Packaging Introduction

11.6.4 ChipMOS Technologies Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.6.5 ChipMOS Technologies Recent Development

11.7 FlipChip International

11.7.1 FlipChip International Company Detail

11.7.2 FlipChip International Business Overview

11.7.3 FlipChip International Semiconductor Advanced Packaging Introduction

11.7.4 FlipChip International Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.7.5 FlipChip International Recent Development

11.8 HANA Micron

11.8.1 HANA Micron Company Detail

11.8.2 HANA Micron Business Overview

11.8.3 HANA Micron Semiconductor Advanced Packaging Introduction

11.8.4 HANA Micron Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.8.5 HANA Micron Recent Development

11.9 Interconnect Systems (Molex)

11.9.1 Interconnect Systems (Molex) Company Detail

11.9.2 Interconnect Systems (Molex) Business Overview

11.9.3 Interconnect Systems (Molex) Semiconductor Advanced Packaging Introduction

11.9.4 Interconnect Systems (Molex) Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.9.5 Interconnect Systems (Molex) Recent Development

11.10 Jiangsu Changjiang Electronics Technology (JCET)

11.10.1 Jiangsu Changjiang Electronics Technology (JCET) Company Detail

11.10.2 Jiangsu Changjiang Electronics Technology (JCET) Business Overview

11.10.3 Jiangsu Changjiang Electronics Technology (JCET) Semiconductor Advanced Packaging Introduction

11.10.4 Jiangsu Changjiang Electronics Technology (JCET) Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.10.5 Jiangsu Changjiang Electronics Technology (JCET) Recent Development

11.11 King Yuan Electronics

11.11.1 King Yuan Electronics Company Detail

11.11.2 King Yuan Electronics Business Overview

11.11.3 King Yuan Electronics Semiconductor Advanced Packaging Introduction

11.11.4 King Yuan Electronics Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.11.5 King Yuan Electronics Recent Development

11.12 Tongfu Microelectronics

11.12.1 Tongfu Microelectronics Company Detail

11.12.2 Tongfu Microelectronics Business Overview

11.12.3 Tongfu Microelectronics Semiconductor Advanced Packaging Introduction

11.12.4 Tongfu Microelectronics Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.12.5 Tongfu Microelectronics Recent Development

11.13 Nepes

11.13.1 Nepes Company Detail

11.13.2 Nepes Business Overview

11.13.3 Nepes Semiconductor Advanced Packaging Introduction

11.13.4 Nepes Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.13.5 Nepes Recent Development

11.14 Powertech Technology (PTI)

11.14.1 Powertech Technology (PTI) Company Detail

11.14.2 Powertech Technology (PTI) Business Overview

11.14.3 Powertech Technology (PTI) Semiconductor Advanced Packaging Introduction

11.14.4 Powertech Technology (PTI) Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.14.5 Powertech Technology (PTI) Recent Development

11.15 Signetics

11.15.1 Signetics Company Detail

11.15.2 Signetics Business Overview

11.15.3 Signetics Semiconductor Advanced Packaging Introduction

11.15.4 Signetics Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.15.5 Signetics Recent Development

11.16 Tianshui Huatian

11.16.1 Tianshui Huatian Company Detail

11.16.2 Tianshui Huatian Business Overview

11.16.3 Tianshui Huatian Semiconductor Advanced Packaging Introduction

11.16.4 Tianshui Huatian Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.16.5 Tianshui Huatian Recent Development

11.17 Veeco/CNT

11.17.1 Veeco/CNT Company Detail

11.17.2 Veeco/CNT Business Overview

11.17.3 Veeco/CNT Semiconductor Advanced Packaging Introduction

11.17.4 Veeco/CNT Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.17.5 Veeco/CNT Recent Development

11.18 UTAC Group

11.18.1 UTAC Group Company Detail

11.18.2 UTAC Group Business Overview

11.18.3 UTAC Group Semiconductor Advanced Packaging Introduction

11.18.4 UTAC Group Revenue in Semiconductor Advanced Packaging Business (2019-2024)

11.18.5 UTAC Group Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.2 Data Source

13.2 Disclaimer

13.3 Author Details

FEATURED COMPANIES

Amkor Technology

China Wafer Level CSP

ChipMOS TECHNOLOGIES

FlipChip International

Hana Micron

Interconnect Systems (Molex)

UTAC Group

SAMSUNG

Advanced Semiconductor Engineering (ASE)

TSMC (Taiwan Semiconductor Manufacturing Company)

Jiangsu Changjiang Electronics Technology (JCET)

King Yuan ELECTRONICS

Tongfu Microelectronics

Nepes

Powertech Technology (PTI)

Signetics

Tianshui Huatian

Veeco/CNT

List of Tables

Table 1. Global Semiconductor Advanced Packaging Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030

Table 2. Key Players of Fan-Out Wafer-Level Packaging (FO WLP)

Table 3. Key Players of Fan-In Wafer-Level Packaging (FI WLP)

Table 4. Key Players of Flip Chip (FC)

Table 5. Key Players of 2.5D/3D

Table 6. Global Semiconductor Advanced Packaging Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030

Table 7. Global Semiconductor Advanced Packaging Market Size by Region (US$ Million): 2019 VS 2023 VS 2030

Table 8. Global Semiconductor Advanced Packaging Market Size by Region (2019-2024) & (US$ Million)

Table 9. Global Semiconductor Advanced Packaging Market Share by Region (2019-2024)

Table 10. Global Semiconductor Advanced Packaging Forecasted Market Size by Region (2025-2030) & (US$ Million)

Table 11. Global Semiconductor Advanced Packaging Market Share by Region (2025-2030)

Table 12. Semiconductor Advanced Packaging Market Trends

Table 13. Semiconductor Advanced Packaging Market Drivers

Table 14. Semiconductor Advanced Packaging Market Challenges

Table 15. Semiconductor Advanced Packaging Market Restraints

Table 16. Global Semiconductor Advanced Packaging Revenue by Players (2019-2024) & (US$ Million)

Table 17. Global Semiconductor Advanced Packaging Market Share by Players (2019-2024)

Table 18. Global Top Semiconductor Advanced Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Advanced Packaging as of 2023)

Table 19. Ranking of Global Top Semiconductor Advanced Packaging Companies by Revenue (US$ Million) in 2023

Table 20. Global 5 Largest Players Market Share by Semiconductor Advanced Packaging Revenue (CR5 and HHI) & (2019-2024)

Table 21. Key Players Headquarters and Area Served

Table 22. Key Players Semiconductor Advanced Packaging Product Solution and Service

Table 23. Date of Enter into Semiconductor Advanced Packaging Market

Table 24. Mergers & Acquisitions, Expansion Plans

Table 25. Global Semiconductor Advanced Packaging Market Size by Type (2019-2024) & (US$ Million)

Table 26. Global Semiconductor Advanced Packaging Revenue Market Share by Type (2019-2024)

Table 27. Global Semiconductor Advanced Packaging Forecasted Market Size by Type (2025-2030) & (US$ Million)

Table 28. Global Semiconductor Advanced Packaging Revenue Market Share by Type (2025-2030)

Table 29. Global Semiconductor Advanced Packaging Market Size by Application (2019-2024) & (US$ Million)

Table 30. Global Semiconductor Advanced Packaging Revenue Market Share by Application (2019-2024)

Table 31. Global Semiconductor Advanced Packaging Forecasted Market Size by Application (2025-2030) & (US$ Million)

Table 32. Global Semiconductor Advanced Packaging Revenue Market Share by Application (2025-2030)

Table 33. North America Semiconductor Advanced Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 34. North America Semiconductor Advanced Packaging Market Size by Country (2019-2024) & (US$ Million)

Table 35. North America Semiconductor Advanced Packaging Market Size by Country (2025-2030) & (US$ Million)

Table 36. Europe Semiconductor Advanced Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 37. Europe Semiconductor Advanced Packaging Market Size by Country (2019-2024) & (US$ Million)

Table 38. Europe Semiconductor Advanced Packaging Market Size by Country (2025-2030) & (US$ Million)

Table 39. Asia-Pacific Semiconductor Advanced Packaging Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030

Table 40. Asia-Pacific Semiconductor Advanced Packaging Market Size by Region (2019-2024) & (US$ Million)

Table 41. Asia-Pacific Semiconductor Advanced Packaging Market Size by Region (2025-2030) & (US$ Million)

Table 42. Latin America Semiconductor Advanced Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 43. Latin America Semiconductor Advanced Packaging Market Size by Country (2019-2024) & (US$ Million)

Table 44. Latin America Semiconductor Advanced Packaging Market Size by Country (2025-2030) & (US$ Million)

Table 45. Middle East & Africa Semiconductor Advanced Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 46. Middle East & Africa Semiconductor Advanced Packaging Market Size by Country (2019-2024) & (US$ Million)

Table 47. Middle East & Africa Semiconductor Advanced Packaging Market Size by Country (2025-2030) & (US$ Million)

Table 48. Advanced Semiconductor Engineering (ASE) Company Detail

Table 49. Advanced Semiconductor Engineering (ASE) Business Overview

Table 50. Advanced Semiconductor Engineering (ASE) Semiconductor Advanced Packaging Product

Table 51. Advanced Semiconductor Engineering (ASE) Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 52. Advanced Semiconductor Engineering (ASE) Recent Development

Table 53. Amkor Technology Company Detail

Table 54. Amkor Technology Business Overview

Table 55. Amkor Technology Semiconductor Advanced Packaging Product

Table 56. Amkor Technology Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 57. Amkor Technology Recent Development

Table 58. Samsung Company Detail

Table 59. Samsung Business Overview

Table 60. Samsung Semiconductor Advanced Packaging Product

Table 61. Samsung Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 62. Samsung Recent Development

Table 63. TSMC (Taiwan Semiconductor Manufacturing Company) Company Detail

Table 64. TSMC (Taiwan Semiconductor Manufacturing Company) Business Overview

Table 65. TSMC (Taiwan Semiconductor Manufacturing Company) Semiconductor Advanced Packaging Product

Table 66. TSMC (Taiwan Semiconductor Manufacturing Company) Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 67. TSMC (Taiwan Semiconductor Manufacturing Company) Recent Development

Table 68. China Wafer Level CSP Company Detail

Table 69. China Wafer Level CSP Business Overview

Table 70. China Wafer Level CSP Semiconductor Advanced Packaging Product

Table 71. China Wafer Level CSP Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 72. China Wafer Level CSP Recent Development

Table 73. ChipMOS Technologies Company Detail

Table 74. ChipMOS Technologies Business Overview

Table 75. ChipMOS Technologies Semiconductor Advanced Packaging Product

Table 76. ChipMOS Technologies Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 77. ChipMOS Technologies Recent Development

Table 78. FlipChip International Company Detail

Table 79. FlipChip International Business Overview

Table 80. FlipChip International Semiconductor Advanced Packaging Product

Table 81. FlipChip International Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 82. FlipChip International Recent Development

Table 83. HANA Micron Company Detail

Table 84. HANA Micron Business Overview

Table 85. HANA Micron Semiconductor Advanced Packaging Product

Table 86. HANA Micron Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 87. HANA Micron Recent Development

Table 88. Interconnect Systems (Molex) Company Detail

Table 89. Interconnect Systems (Molex) Business Overview

Table 90. Interconnect Systems (Molex) Semiconductor Advanced Packaging Product

Table 91. Interconnect Systems (Molex) Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 92. Interconnect Systems (Molex) Recent Development

Table 93. Jiangsu Changjiang Electronics Technology (JCET) Company Detail

Table 94. Jiangsu Changjiang Electronics Technology (JCET) Business Overview

Table 95. Jiangsu Changjiang Electronics Technology (JCET) Semiconductor Advanced Packaging Product

Table 96. Jiangsu Changjiang Electronics Technology (JCET) Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 97. Jiangsu Changjiang Electronics Technology (JCET) Recent Development

Table 98. King Yuan Electronics Company Detail

Table 99. King Yuan Electronics Business Overview

Table 100. King Yuan Electronics Semiconductor Advanced Packaging Product

Table 101. King Yuan Electronics Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 102. King Yuan Electronics Recent Development

Table 103. Tongfu Microelectronics Company Detail

Table 104. Tongfu Microelectronics Business Overview

Table 105. Tongfu Microelectronics Semiconductor Advanced Packaging Product

Table 106. Tongfu Microelectronics Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 107. Tongfu Microelectronics Recent Development

Table 108. Nepes Company Detail

Table 109. Nepes Business Overview

Table 110. Nepes Semiconductor Advanced Packaging Product

Table 111. Nepes Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 112. Nepes Recent Development

Table 113. Powertech Technology (PTI) Company Detail

Table 114. Powertech Technology (PTI) Business Overview

Table 115. Powertech Technology (PTI) Semiconductor Advanced Packaging Product

Table 116. Powertech Technology (PTI) Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 117. Powertech Technology (PTI) Recent Development

Table 118. Signetics Company Detail

Table 119. Signetics Business Overview

Table 120. Signetics Semiconductor Advanced Packaging Product

Table 121. Signetics Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 122. Signetics Recent Development

Table 123. Tianshui Huatian Company Detail

Table 124. Tianshui Huatian Business Overview

Table 125. Tianshui Huatian Semiconductor Advanced Packaging Product

Table 126. Tianshui Huatian Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 127. Tianshui Huatian Recent Development

Table 128. Veeco/CNT Company Detail

Table 129. Veeco/CNT Business Overview

Table 130. Veeco/CNT Semiconductor Advanced Packaging Product

Table 131. Veeco/CNT Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 132. Veeco/CNT Recent Development

Table 133. UTAC Group Company Detail

Table 134. UTAC Group Business Overview

Table 135. UTAC Group Semiconductor Advanced Packaging Product

Table 136. UTAC Group Revenue in Semiconductor Advanced Packaging Business (2019-2024) & (US$ Million)

Table 137. UTAC Group Recent Development

Table 138. Research Programs/Design for This Report

Table 139. Key Data Information from Secondary Sources

Table 140. Key Data Information from Primary Sources

List of Figures

Figure 1. Global Semiconductor Advanced Packaging Market Size Comparison by Type (2024-2030) & (US$ Million)

Figure 2. Global Semiconductor Advanced Packaging Market Share by Type: 2023 VS 2030

Figure 3. Fan-Out Wafer-Level Packaging (FO WLP) Features

Figure 4. Fan-In Wafer-Level Packaging (FI WLP) Features

Figure 5. Flip Chip (FC) Features

Figure 6. 2.5D/3D Features

Figure 7. Global Semiconductor Advanced Packaging Market Size Comparison by Application (2024-2030) & (US$ Million)

Figure 8. Global Semiconductor Advanced Packaging Market Share by Application: 2023 VS 2030

Figure 9. Telecommunications Case Studies

Figure 10. Automotive Case Studies

Figure 11. Aerospace and Defense Case Studies

Figure 12. Medical Devices Case Studies

Figure 13. Consumer Electronics Case Studies

Figure 14. Other Case Studies

Figure 15. Semiconductor Advanced Packaging Report Years Considered

Figure 16. Global Semiconductor Advanced Packaging Market Size (US$ Million), Year-over-Year: 2019-2030

Figure 17. Global Semiconductor Advanced Packaging Market Size, (US$ Million), 2019 VS 2023 VS 2030

Figure 18. Global Semiconductor Advanced Packaging Market Share by Region: 2023 VS 2030

Figure 19. Global Semiconductor Advanced Packaging Market Share by Players in 2023

Figure 20. Global Top Semiconductor Advanced Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Advanced Packaging as of 2023)

Figure 21. The Top 10 and 5 Players Market Share by Semiconductor Advanced Packaging Revenue in 2023

Figure 22. North America Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 23. North America Semiconductor Advanced Packaging Market Share by Country (2019-2030)

Figure 24. United States Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 25. Canada Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 26. Europe Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 27. Europe Semiconductor Advanced Packaging Market Share by Country (2019-2030)

Figure 28. Germany Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 29. France Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 30. U.K. Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 31. Italy Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 32. Russia Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 33. Nordic Countries Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 34. Asia-Pacific Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 35. Asia-Pacific Semiconductor Advanced Packaging Market Share by Region (2019-2030)

Figure 36. China Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 37. Japan Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 38. South Korea Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 39. Southeast Asia Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 40. India Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 41. Australia Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 42. Latin America Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 43. Latin America Semiconductor Advanced Packaging Market Share by Country (2019-2030)

Figure 44. Mexico Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 45. Brazil Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 46. Middle East & Africa Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 47. Middle East & Africa Semiconductor Advanced Packaging Market Share by Country (2019-2030)

Figure 48. Turkey Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 49. Saudi Arabia Semiconductor Advanced Packaging Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 50. Advanced Semiconductor Engineering (ASE) Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 51. Amkor Technology Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 52. Samsung Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 53. TSMC (Taiwan Semiconductor Manufacturing Company) Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 54. China Wafer Level CSP Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 55. ChipMOS Technologies Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 56. FlipChip International Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 57. HANA Micron Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 58. Interconnect Systems (Molex) Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 59. Jiangsu Changjiang Electronics Technology (JCET) Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 60. King Yuan Electronics Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 61. Tongfu Microelectronics Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 62. Nepes Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 63. Powertech Technology (PTI) Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 64. Signetics Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 65. Tianshui Huatian Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 66. Veeco/CNT Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 67. UTAC Group Revenue Growth Rate in Semiconductor Advanced Packaging Business (2019-2024)

Figure 68. Bottom-up and Top-down Approaches for This Report

Figure 69. Data Triangulation

Figure 70. Key Executives Interviewed

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