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Global Through-Silicon Vias (TSVs) Market Size, Manufacturers, Supply Chain, Sales Channel and Clients, 2025-2031

Published Date: June 2025

Report Code: QYRE-Auto-10M9183

Global Through Silicon Vias TSVs Market Size Status and Forecast 2022

BUY CHAPTERS

Global Through-Silicon Vias (TSVs) Market Size, Manufacturers, Supply Chain, Sales Channel and Clients, 2025-2031

Code: QYRE-Auto-10M9183

Report

June 2025

Pages:127

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

ASE Technology Holding

Amkor Technology

GlobalFoundries

JCET Group

SAMSUNG

TSMC

Intel

HT-tech

Through-Silicon Vias (TSVs) Market Size

In 2024, the global market size of Through-Silicon Vias (TSVs) was estimated to be worth US$ 3510 million and is forecast to reach approximately US$ 8942 million by 2031 with a CAGR of 14.5% during the forecast period 2025-2031.

Through-Silicon Vias (TSVs) Market

Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.

At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 25% of the global market. Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. These major enterprises account for more than 80% of the total share.

The global Through-Silicon Vias (TSVs) market is poised for significant growth due to the rising demand for high-performance, compact, and energy-efficient electronic devices. TSV technology is a critical enabler of 3D integrated circuits (ICs) and advanced packaging solutions, making it essential for applications like artificial intelligence (AI), 5G, automotive electronics, and high-performance computing (HPC).

Market Growth Drivers

Demand for 3D Integration:

TSVs enable vertical stacking of chips, reducing the interconnect length and enhancing performance, making them indispensable for 3D ICs and heterogeneous integration.

Applications in logic-memory integration, MEMS, and CMOS image sensors are key contributors.

Proliferation of AI and 5G:

TSVs are critical for high-bandwidth memory (HBM), used in AI accelerators and 5G base stations.

These technologies require higher data transfer rates, lower latency, and reduced power consumption, driving TSV adoption.

Miniaturization and High-Density Packaging:

The trend towards smaller, lighter, and more functional devices necessitates the use of TSVs for high-density interconnects.

Growth in Automotive Electronics:

The demand for advanced driver-assistance systems (ADAS), autonomous driving, and in-vehicle sensors is spurring the adoption of TSV-enabled components.

Expansion in Data Centers and HPC:

High-performance TSV-based packaging solutions are essential for the increasing processing power demands in cloud computing and data centers.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Through-Silicon Vias (TSVs), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through-Silicon Vias (TSVs).

The Through-Silicon Vias (TSVs) market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Through-Silicon Vias (TSVs) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Through-Silicon Vias (TSVs) companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.

Market Segmentation

Scope of Through-Silicon Vias (TSVs) Market Report

Report Metric	Details
Report Name	Through-Silicon Vias (TSVs) Market
CAGR	14.5%
Segment by Type	2.5D TSV 3D TSV
Segment by Application	Mobile and Consumer Electronics Communication Equipment Automotive Electronics Other
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	ASE Technology Holding, Amkor Technology, TSMC, Intel, GlobalFoundries, JCET Group, Samsung, HT-tech
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on.
Chapter 2: Revenue of Through-Silicon Vias (TSVs) in global and regional level.
Chapter 3: Detailed analysis of Through-Silicon Vias (TSVs) company competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Through-Silicon Vias (TSVs) revenue, gross margin, and recent development, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, revenue for each segment.
Chapter 9: Asia Pacific by Type, by Application and by region, revenue for each segment.
Chapter 10: Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Middle East and Africa, by Type, by Application and by country, revenue for each segment.
Chapter 12: Analysis of industrial chain, sales channel, key raw materials, distributors, and customers.
Chapter 13: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 14: Research Findings and Conclusion

FAQ for this report

Who are the main players in the Through-Silicon Vias (TSVs) Market report?

Ans: The main players in the Through-Silicon Vias (TSVs) Market are ASE Technology Holding, Amkor Technology, TSMC, Intel, GlobalFoundries, JCET Group, Samsung, HT-tech

What are the Application segmentation covered in the Through-Silicon Vias (TSVs) Market report?

Ans: The Applications covered in the Through-Silicon Vias (TSVs) Market report are Mobile and Consumer Electronics, Communication Equipment, Automotive Electronics, Other

What are the Type segmentation covered in the Through-Silicon Vias (TSVs) Market report?

Ans: The Types covered in the Through-Silicon Vias (TSVs) Market report are 2.5D TSV, 3D TSV

Recommended Reports

TSV Technologies

3D & Glass Vias

Semiconductor Packaging

1 Study Coverage

1.1 Through-Silicon Vias (TSVs) Product Introduction

1.2 Market by Type

1.2.1 Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Type (2020 VS 2024 VS 2031)

1.2.2 2.5D TSV

1.2.3 3D TSV

1.3 Market by Application

1.3.1 Global Through-Silicon Vias (TSVs) Market Size Growth Rate by Application (2020 VS 2024 VS 2031)

1.3.2 Mobile and Consumer Electronics

1.3.3 Communication Equipment

1.3.4 Automotive Electronics

1.3.5 Other

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Executive Summary

2.1 Global Through-Silicon Vias (TSVs) Market Size Estimates and Forecasts

2.2 Through-Silicon Vias (TSVs) Market Size by Region: 2024 Versus 2031

2.2.1 Global Through-Silicon Vias (TSVs) Revenue by Region: 2020-2025

2.2.2 Global Through-Silicon Vias (TSVs) Revenue Forecast by Region (2026-2031)

2.2.3 Global Through-Silicon Vias (TSVs) Revenue Market Share by Region (2020-2031)

3 Market Segments

3.1 Breakdown Data by Type

3.1.1 Global Through-Silicon Vias (TSVs) Revenue by Type (2020-2031)

3.1.2 Global Through-Silicon Vias (TSVs) Revenue Market Share by Type (2020-2031)

3.2 Breakdown Data by Application

3.2.1 Global Through-Silicon Vias (TSVs) Revenue by Application (2020-2031)

3.2.2 Global Through-Silicon Vias (TSVs) Revenue Market Share by Application (2020-2031)

3.3 by Type and by Application Crossing Analysis

3.3.1 2.5D TSV of Through-Silicon Vias (TSVs) Revenue Market Share by Application

3.3.2 3D TSV of Through-Silicon Vias (TSVs) Revenue Market Share by Application

4 Global Through-Silicon Vias (TSVs) by Company

4.1 Global Through-Silicon Vias (TSVs) Revenue by Company (2020-2025)

4.2 Global Through-Silicon Vias (TSVs) Revenue Share by Company (2020-2025)

4.3 Competitive Landscape

4.3.1 Key Through-Silicon Vias (TSVs) Companies around the World: Ranking by Revenue

4.3.2 Global Through-Silicon Vias (TSVs) Market Concentration Ratio (CR5 and HHI) & (2020-2025)

4.3.3 Global Through-Silicon Vias (TSVs) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

4.4 Global Through-Silicon Vias (TSVs) Companies Headquarters & Product Type

4.4.1 Global Through-Silicon Vias (TSVs) Companies Headquarters

4.4.2 Date of International Companies Enter into Through-Silicon Vias (TSVs) Market

4.4.3 Global Through-Silicon Vias (TSVs) Companies Product & Service

4.4.4 2.5D TSV Revenue Market Share of Through-Silicon Vias (TSVs) by Company

4.4.5 3D TSV Revenue Market Share of Through-Silicon Vias (TSVs) by Company

4.5 Global Through-Silicon Vias (TSVs) Mergers & Acquisitions, Expansion Plans

5 Company Profiles

5.1 ASE Technology Holding

5.1.1 ASE Technology Holding Corporation Information

5.1.2 ASE Technology Holding Description, Business Overview

5.1.3 ASE Technology Holding Through-Silicon Vias (TSVs) Products Offered

5.1.4 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue and Gross Margin (2020-2025)

5.1.5 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue by Product in 2024

5.1.6 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue by Application in 2024

5.1.7 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2024

5.1.8 ASE Technology Holding Recent Developments

5.2 Amkor Technology

5.2.1 Amkor Technology Corporation Information

5.2.2 Amkor Technology Description, Business Overview

5.2.3 Amkor Technology Through-Silicon Vias (TSVs) Products Offered

5.2.4 Amkor Technology Through-Silicon Vias (TSVs) Revenue and Gross Margin (2020-2025)

5.2.5 Amkor Technology Through-Silicon Vias (TSVs) Revenue by Product in 2024

5.2.6 Amkor Technology Through-Silicon Vias (TSVs) Revenue by Application in 2024

5.2.7 Amkor Technology Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2024

5.2.8 Amkor Technology Recent Developments

5.3 TSMC

5.3.1 TSMC Corporation Information

5.3.2 TSMC Description, Business Overview

5.3.3 TSMC Through-Silicon Vias (TSVs) Products Offered

5.3.4 TSMC Through-Silicon Vias (TSVs) Revenue and Gross Margin (2020-2025)

5.3.5 TSMC Through-Silicon Vias (TSVs) Revenue by Product in 2024

5.3.6 TSMC Through-Silicon Vias (TSVs) Revenue by Application in 2024

5.3.7 TSMC Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2024

5.3.8 TSMC Recent Developments

5.4 Intel

5.4.1 Intel Corporation Information

5.4.2 Intel Description, Business Overview

5.4.3 Intel Through-Silicon Vias (TSVs) Products Offered

5.4.4 Intel Through-Silicon Vias (TSVs) Revenue and Gross Margin (2020-2025)

5.4.5 Intel Through-Silicon Vias (TSVs) Revenue by Product in 2024

5.4.6 Intel Through-Silicon Vias (TSVs) Revenue by Application in 2024

5.4.7 Intel Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2024

5.4.8 Intel Recent Developments

5.5 GlobalFoundries

5.5.1 GlobalFoundries Corporation Information

5.5.2 GlobalFoundries Description, Business Overview

5.5.3 GlobalFoundries Through-Silicon Vias (TSVs) Products Offered

5.5.4 GlobalFoundries Through-Silicon Vias (TSVs) Revenue and Gross Margin (2020-2025)

5.5.5 GlobalFoundries Through-Silicon Vias (TSVs) Revenue by Product in 2024

5.5.6 GlobalFoundries Through-Silicon Vias (TSVs) Revenue by Application in 2024

5.5.7 GlobalFoundries Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2024

5.5.8 GlobalFoundries Recent Developments

5.6 JCET Group

5.6.1 JCET Group Corporation Information

5.6.2 JCET Group Description, Business Overview

5.6.3 JCET Group Through-Silicon Vias (TSVs) Products Offered

5.6.4 JCET Group Through-Silicon Vias (TSVs) Revenue and Gross Margin (2020-2025)

5.6.5 JCET Group Through-Silicon Vias (TSVs) Revenue by Product in 2024

5.6.6 JCET Group Through-Silicon Vias (TSVs) Revenue by Application in 2024

5.6.7 JCET Group Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2024

5.6.8 JCET Group Recent Developments

5.7 Samsung

5.7.1 Samsung Corporation Information

5.7.2 Samsung Description, Business Overview

5.7.3 Samsung Through-Silicon Vias (TSVs) Products Offered

5.7.4 Samsung Through-Silicon Vias (TSVs) Revenue and Gross Margin (2020-2025)

5.7.5 Samsung Through-Silicon Vias (TSVs) Revenue by Product in 2024

5.7.6 Samsung Through-Silicon Vias (TSVs) Revenue by Application in 2024

5.7.7 Samsung Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2024

5.7.8 Samsung Recent Developments

5.8 HT-tech

5.8.1 HT-tech Corporation Information

5.8.2 HT-tech Description, Business Overview

5.8.3 HT-tech Through-Silicon Vias (TSVs) Products Offered

5.8.4 HT-tech Through-Silicon Vias (TSVs) Revenue and Gross Margin (2020-2025)

5.8.5 HT-tech Through-Silicon Vias (TSVs) Revenue by Product in 2024

5.8.6 HT-tech Through-Silicon Vias (TSVs) Revenue by Application in 2024

5.8.7 HT-tech Through-Silicon Vias (TSVs) Revenue by Geographic Area in 2024

5.8.8 HT-tech Recent Developments

6 North America

6.1 North America Through-Silicon Vias (TSVs) Market Size YoY Growth 2020-2031

6.2 North America Through-Silicon Vias (TSVs) Market Facts & Figures by Country (2020-2031)

6.3 North America Through-Silicon Vias (TSVs) Revenue by Type (2020-2025)

6.4 North America Through-Silicon Vias (TSVs) Revenue by Application (2020-2025)

7 Asia-Pacific

7.1 Asia-Pacific Through-Silicon Vias (TSVs) Market Size YoY Growth 2020-2031

7.2 Asia-Pacific Through-Silicon Vias (TSVs) Market Facts & Figures by Region (2020-2031)

7.3 Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Type (2020-2025)

7.4 Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Application (2020-2025)

8 Europe

8.1 Europe Through-Silicon Vias (TSVs) Market Size YoY Growth 2020-2031

8.2 Europe Through-Silicon Vias (TSVs) Market Facts & Figures by Country (2020-2031)

8.3 Europe Through-Silicon Vias (TSVs) Revenue by Type (2020-2025)

8.4 Europe Through-Silicon Vias (TSVs) Revenue by Application (2020-2025)

9 Latin America

9.1 Latin America Through-Silicon Vias (TSVs) Market Size YoY Growth 2020-2031

9.2 Latin America Through-Silicon Vias (TSVs) Market Facts & Figures by Country (2020-2031)

9.3 Latin America Through-Silicon Vias (TSVs) Revenue by Type (2020-2025)

9.4 Latin America Through-Silicon Vias (TSVs) Revenue by Application (2020-2025)

10 Middle East and Africa

10.1 Latin America Through-Silicon Vias (TSVs) Market Size YoY Growth 2020-2031

10.2 Middle East and Africa Through-Silicon Vias (TSVs) Market Facts & Figures by Country (2020-2031)

10.3 Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Type (2020-2025)

10.4 Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Application (2020-2025)

11 Supply Chain and Sales Channel analysis

11.1 Through-Silicon Vias (TSVs) Supply Chain Analysis

11.2 Through-Silicon Vias (TSVs) Key Raw Materials and Upstream Suppliers

11.3 Through-Silicon Vias (TSVs) Clients Analysis

11.4 Through-Silicon Vias (TSVs) Sales Channel and Sales Model Analysis

11.4.1 Through-Silicon Vias (TSVs) Distribution Channel Analysis: Indirect Sales VS Direct Sales

11.4.2 Through-Silicon Vias (TSVs) Distribution Channel Analysis: Online Sales VS Offline Sales

11.4.3 Through-Silicon Vias (TSVs) Distributors

12 Through-Silicon Vias (TSVs) Market Dynamics

12.1 Through-Silicon Vias (TSVs) Industry Trends

12.2 Through-Silicon Vias (TSVs) Market Drivers

12.3 Through-Silicon Vias (TSVs) Market Challenges

12.4 Through-Silicon Vias (TSVs) Market Restraints

13 Research Findings and Conclusion

14 Appendix

14.1 Research Methodology

14.1.1 Methodology/Research Approach

14.1.1.1 Research Programs/Design

14.1.1.2 Market Size Estimation

14.1.1.3 Market Breakdown and Data Triangulation

14.1.2 Data Source

14.1.2.1 Secondary Sources

14.1.2.2 Primary Sources

14.2 Author Details

14.3 Disclaimer

FEATURED COMPANIES

ASE Technology Holding

Amkor Technology

GlobalFoundries

JCET Group

SAMSUNG

TSMC

Intel

HT-tech

List of Tables

Table 1. Global Through-Silicon Vias (TSVs) Market Size Growth Rate (CAGR) by Type (US$ Million): 2020 VS 2024 VS 2031

Table 2. Global Through-Silicon Vias (TSVs) Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031

Table 3. Global Through-Silicon Vias (TSVs) Market Size by Region (US$ Million): 2024 VS 2031

Table 4. Global Through-Silicon Vias (TSVs) Revenue by Region (2020-2025) & (US$ Million)

Table 5. Global Through-Silicon Vias (TSVs) Revenue Forecast by Region (2026-2031) & (US$ Million)

Table 6. Global Through-Silicon Vias (TSVs) Revenue by Type (2020-2025) & (US$ Million)

Table 7. Global Through-Silicon Vias (TSVs) Revenue Forecast by Type (2026-2031) & (US$ Million)

Table 8. Global Through-Silicon Vias (TSVs) Revenue by Application (2020-2025) & (US$ Million)

Table 9. Global Through-Silicon Vias (TSVs) Revenue Forecast by Application (2026-2031) & (US$ Million)

Table 10. Through-Silicon Vias (TSVs) Revenue by Company (2020-2025) & (US$ Million)

Table 11. Through-Silicon Vias (TSVs) Revenue Share by Company (2020-2025)

Table 12. Ranking of Global Top Through-Silicon Vias (TSVs) Players by Revenue (US$ Million) in 2024

Table 13. Global Through-Silicon Vias (TSVs) Companies Market Concentration Ratio (CR5 and HHI) & (2020-2025)

Table 14. Global Through-Silicon Vias (TSVs) by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through-Silicon Vias (TSVs) as of 2024)

Table 15. Global Through-Silicon Vias (TSVs) Companies Headquarters

Table 16. Date of International Companies Enter into Through-Silicon Vias (TSVs) Market

Table 17. Global Through-Silicon Vias (TSVs) Companies Product & Service

Table 18. Global Through-Silicon Vias (TSVs) Mergers & Acquisitions, Expansion Plans

Table 19. ASE Technology Holding Corporation Information

Table 20. ASE Technology Holding Description and Business Overview

Table 21. ASE Technology Holding Through-Silicon Vias (TSVs) Product

Table 22. ASE Technology Holding Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2020-2025)

Table 23. ASE Technology Holding Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2024

Table 24. ASE Technology Holding Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2024

Table 25. ASE Technology Holding Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2024

Table 26. ASE Technology Holding Recent Developments

Table 27. Amkor Technology Corporation Information

Table 28. Amkor Technology Description and Business Overview

Table 29. Amkor Technology Through-Silicon Vias (TSVs) Product

Table 30. Amkor Technology Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2020-2025)

Table 31. Amkor Technology Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2024

Table 32. Amkor Technology Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2024

Table 33. Amkor Technology Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2024

Table 34. Amkor Technology Recent Developments

Table 35. TSMC Corporation Information

Table 36. TSMC Description and Business Overview

Table 37. TSMC Through-Silicon Vias (TSVs) Product

Table 38. TSMC Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2020-2025)

Table 39. TSMC Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2024

Table 40. TSMC Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2024

Table 41. TSMC Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2024

Table 42. TSMC Recent Developments

Table 43. Intel Corporation Information

Table 44. Intel Description and Business Overview

Table 45. Intel Through-Silicon Vias (TSVs) Product

Table 46. Intel Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2020-2025)

Table 47. Intel Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2024

Table 48. Intel Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2024

Table 49. Intel Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2024

Table 50. Intel Recent Developments

Table 51. GlobalFoundries Corporation Information

Table 52. GlobalFoundries Description and Business Overview

Table 53. GlobalFoundries Through-Silicon Vias (TSVs) Product

Table 54. GlobalFoundries Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2020-2025)

Table 55. GlobalFoundries Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2024

Table 56. GlobalFoundries Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2024

Table 57. GlobalFoundries Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2024

Table 58. GlobalFoundries Recent Developments

Table 59. JCET Group Corporation Information

Table 60. JCET Group Description and Business Overview

Table 61. JCET Group Through-Silicon Vias (TSVs) Product

Table 62. JCET Group Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2020-2025)

Table 63. JCET Group Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2024

Table 64. JCET Group Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2024

Table 65. JCET Group Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2024

Table 66. JCET Group Recent Developments

Table 67. Samsung Corporation Information

Table 68. Samsung Description and Business Overview

Table 69. Samsung Through-Silicon Vias (TSVs) Product

Table 70. Samsung Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2020-2025)

Table 71. Samsung Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2024

Table 72. Samsung Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2024

Table 73. Samsung Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2024

Table 74. Samsung Recent Developments

Table 75. HT-tech Corporation Information

Table 76. HT-tech Description and Business Overview

Table 77. HT-tech Through-Silicon Vias (TSVs) Product

Table 78. HT-tech Through-Silicon Vias (TSVs) Revenue (US$ Million) and Gross Margin (2020-2025)

Table 79. HT-tech Revenue Proportion of Through-Silicon Vias (TSVs) by Product in 2024

Table 80. HT-tech Revenue Proportion of Through-Silicon Vias (TSVs) by Application in 2024

Table 81. HT-tech Revenue Proportion of Through-Silicon Vias (TSVs) by Geographic Area in 2024

Table 82. HT-tech Recent Developments

Table 83. North America Through-Silicon Vias (TSVs) Revenue by Country (2020-2025) & (US$ Million)

Table 84. North America Through-Silicon Vias (TSVs) Revenue by Country (2026-2031) & (US$ Million)

Table 85. North America Through-Silicon Vias (TSVs) Revenue by Type (2020-2025) & (US$ Million)

Table 86. North America Through-Silicon Vias (TSVs) Revenue by Application (2020-2025) & (US$ Million)

Table 87. Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Region (2020-2025) & (US$ Million)

Table 88. Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Region (2026-2031) & (US$ Million)

Table 89. Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Type (2020-2025) & (US$ Million)

Table 90. Asia-Pacific Through-Silicon Vias (TSVs) Revenue by Application (2020-2025) & (US$ Million)

Table 91. Europe Through-Silicon Vias (TSVs) Revenue by Country (2020-2025) & (US$ Million)

Table 92. Europe Through-Silicon Vias (TSVs) Revenue by Country (2026-2031) & (US$ Million)

Table 93. Europe Through-Silicon Vias (TSVs) Revenue by Type (2020-2025) & (US$ Million)

Table 94. Europe Through-Silicon Vias (TSVs) Revenue by Application (2020-2025) & (US$ Million)

Table 95. Latin America Through-Silicon Vias (TSVs) Revenue by Country (2020-2025) & (US$ Million)

Table 96. Latin America Through-Silicon Vias (TSVs) Revenue by Country (2026-2031) & (US$ Million)

Table 97. Latin America Through-Silicon Vias (TSVs) Revenue by Type (2020-2025) & (US$ Million)

Table 98. Latin America Through-Silicon Vias (TSVs) Revenue by Application (2020-2025) & (US$ Million)

Table 99. Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Country (2020-2025) & (US$ Million)

Table 100. Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Country (2026-2031) & (US$ Million)

Table 101. Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Type (2020-2025) & (US$ Million)

Table 102. Middle East and Africa Through-Silicon Vias (TSVs) Revenue by Application (2020-2025) & (US$ Million)

Table 103. Through-Silicon Vias (TSVs) Key Raw Materials, Industry Status and Trend

Table 104. Through-Silicon Vias (TSVs) Key Raw Materials and Upstream Suppliers

Table 105. Through-Silicon Vias (TSVs) Clients Status and Trend

Table 106. Through-Silicon Vias (TSVs) Typical Clients

Table 107. Through-Silicon Vias (TSVs) Distributors

Table 108. Through-Silicon Vias (TSVs) Market Trends

Table 109. Through-Silicon Vias (TSVs) Market Drivers

Table 110. Through-Silicon Vias (TSVs) Market Challenges

Table 111. Through-Silicon Vias (TSVs) Market Restraints

Table 112. Research Programs/Design for This Report

Table 113. Key Data Information from Secondary Sources

Table 114. Key Data Information from Primary Sources

List of Figures

Figure 1. Through-Silicon Vias (TSVs) Product Picture

Figure 2. Global Through-Silicon Vias (TSVs) Market Size by Type (US$ Million): 2020 VS 2024 VS 2031

Figure 3. Global Through-Silicon Vias (TSVs) Revenue Market Share by Type in 2024 & 2031

Figure 4. 2.5D TSV Product Picture

Figure 5. 3D TSV Product Picture

Figure 6. Global Through-Silicon Vias (TSVs) Market Size by Application (US$ Million): 2020 VS 2024 VS 2031

Figure 7. Global Through-Silicon Vias (TSVs) Revenue Market Share by Application in 2024 & 2031

Figure 8. Mobile and Consumer Electronics

Figure 9. Communication Equipment

Figure 10. Automotive Electronics

Figure 11. Other

Figure 12. Through-Silicon Vias (TSVs) Report Years Considered

Figure 13. Global Through-Silicon Vias (TSVs) Revenue, (US$ Million), 2020 VS 2024 VS 2031

Figure 14. Global Through-Silicon Vias (TSVs) Market Size (2020-2031) & (US$ Million)

Figure 15. Global Through-Silicon Vias (TSVs) Market Size Market Share by Region: 2024 Versus 2031

Figure 16. Global Through-Silicon Vias (TSVs) Revenue Market Share by Region (2020-2031)

Figure 17. Global Through-Silicon Vias (TSVs) Revenue Market Share Forecast by Type (2020-2031)

Figure 18. Global Through-Silicon Vias (TSVs) Revenue Market Share Forecast by Application (2020-2031)

Figure 19. 2.5D TSV of Through-Silicon Vias (TSVs) Revenue Market Share by Application, 2024 VS 2031

Figure 20. 3D TSV of Through-Silicon Vias (TSVs) Revenue Market Share by Application, 2024 VS 2031

Figure 21. Through-Silicon Vias (TSVs) Revenue Share by Company (2024)

Figure 22. Through-Silicon Vias (TSVs) Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 23. 2.5D TSV Revenue Proportion by Company in 2024

Figure 24. 3D TSV Revenue Proportion by Company in 2024

Figure 25. North America Through-Silicon Vias (TSVs) Revenue 2020-2031 (US$ Million)

Figure 26. North America Through-Silicon Vias (TSVs) Revenue Market Share by Type (2020-2025)

Figure 27. North America Through-Silicon Vias (TSVs) Revenue Market Share by Application (2020-2025)

Figure 28. Asia-Pacific Through-Silicon Vias (TSVs) Revenue 2020-2031 (US$ Million)

Figure 29. Asia-Pacific Through-Silicon Vias (TSVs) Revenue Market Share by Region (2020-2031)

Figure 30. Asia-Pacific Through-Silicon Vias (TSVs) Revenue Market Share by Type (2020-2025)

Figure 31. Asia-Pacific Through-Silicon Vias (TSVs) Revenue Market Share by Application (2020-2025)

Figure 32. Europe Through-Silicon Vias (TSVs) Revenue Growth Rate 2020-2031 (US$ Million)

Figure 33. Europe Through-Silicon Vias (TSVs) Revenue Market Share by Country (2020-2031)

Figure 34. Europe Through-Silicon Vias (TSVs) Revenue Market Share by Type (2020-2025)

Figure 35. Europe Through-Silicon Vias (TSVs) Revenue Market Share by Application (2020-2025)

Figure 36. Latin America Through-Silicon Vias (TSVs) Revenue Growth Rate 2020-2031 (US$ Million)

Figure 37. Latin America Through-Silicon Vias (TSVs) Revenue Market Share by Country (2020-2031)

Figure 38. Latin America Through-Silicon Vias (TSVs) Revenue Market Share by Type (2020-2025)

Figure 39. Latin America Through-Silicon Vias (TSVs) Revenue Market Share by Application (2020-2025)

Figure 40. Middle East and Africa Through-Silicon Vias (TSVs) Revenue Growth Rate 2020-2031 (US$ Million)

Figure 41. Middle East and Africa Through-Silicon Vias (TSVs) Revenue Market Share by Country (2020-2031)

Figure 42. Middle East and Africa Through-Silicon Vias (TSVs) Revenue Market Share by Type (2020-2025)

Figure 43. Middle East and Africa Through-Silicon Vias (TSVs) Revenue Market Share by Application (2020-2025)

Figure 44. Through-Silicon Vias (TSVs) Supply Chain (Upstream and Downstream Market)

Figure 45. Global Production Market Share of Through-Silicon Vias (TSVs) Raw Materials by Region in 2024

Figure 46. Through-Silicon Vias (TSVs) Distribution Channels

Figure 47. Global Through-Silicon Vias (TSVs) Percentage 2020-2031: Indirect Sales VS Direct Sales

Figure 48. Global Through-Silicon Vias (TSVs) Percentage 2020-2031: Online Sales VS Offline Sales

Figure 49. Bottom-up and Top-down Approaches for This Report

Figure 50. Data Triangulation

Figure 51. Key Executives Interviewed

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