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Global Through-Hole Electronics Packaging Market Research Report 2025
Published Date: March 2025
|
Report Code: QYRE-Auto-30U12645
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Global Through Hole Electronics Packaging Market Research Report 2023
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Global Through-Hole Electronics Packaging Market Research Report 2025

Code: QYRE-Auto-30U12645
Report
March 2025
Pages:115
QYResearch
Buy Now with 15% Discount
DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
Ametek Inc
DuPont
Osram
Kiva Container
Primex Plastics Corporation
Quality Foam Packaging, Inc.
Ameson packaging
Lithoflex Inc.
UFP Technologies
Intel Corporation
STMicroelectronics
Advanced Micro Devices Inc
SAMSUNG
GY Packaging
Taiwan Semiconductor
Dordan Mfg
The Plastiform Company

Through-Hole Electronics Packaging Market

The global market for Through-Hole Electronics Packaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Through-Hole Electronics Packaging is the process by which the component leads are packed into the drilled holes on a bare printed circuit board. The Through-Hole Electronics Packaging offers number of advantages such as high-reliability, easy to solder/desolder and test and others. It also provides interconnections between upper and lower layers (vias) in non-plated hole technologies.
The global through-hole electronics packaging market refers to the market for packaging and assembly solutions that involve the use of through-hole technology (THT) in the production of electronic components. Through-hole technology is a traditional method of mounting electronic components on printed circuit boards (PCBs) by inserting leads or pins of the components through holes in the PCB and soldering them on the opposite side.
The through-hole electronics packaging market is driven by several factors:
Demand from various industries: Through-hole technology is commonly used in industries such as automotive, aerospace, industrial automation, telecommunications, and consumer electronics. The demand for through-hole electronics packaging stems from the need for reliable and robust connections in applications that require resistance to extreme conditions, vibration, and high mechanical stress.
Long-term reliability: Through-hole technology offers excellent mechanical strength and stability, making it suitable for applications that require long-term reliability, such as automotive electronics and critical industrial equipment. Through-hole components have higher resistance to mechanical stress compared to surface mount technology (SMT), providing enhanced durability and longevity.
Compatibility with legacy systems: Through-hole electronics packaging is often preferred for products that need to be compatible with existing or older systems. Many legacy systems, particularly in the aerospace and defense sectors, still rely on through-hole components. The through-hole technology allows for easy replacement, repair, and upgrading of electronic components.
Enhanced thermal dissipation: Through-hole components typically have thicker leads or pins compared to SMT components, which helps improve thermal dissipation and enables efficient heat transfer. This thermal advantage makes through-hole technology suitable for applications that generate significant heat, such as power electronics and high-performance computing.
Regulatory requirements: Certain industries, such as aerospace, defense, and medical, have strict regulatory requirements regarding reliability, safety, and quality. Through-hole technology, with its proven track record and ability to withstand harsh environmental conditions, often meets the stringent regulatory standards of these industries.
However, it is important to note that the through-hole electronics packaging market is witnessing a gradual shift towards surface mount technology due to the increasing demand for miniaturization, higher component density, and improved production efficiency. Surface mount technology offers advantages such as smaller PCB footprints, higher production speeds, and cost savings. Nevertheless, through-hole technology continues to find its application in specific industries and areas where its unique advantages outweigh the benefits of surface mount technology.
In conclusion, the global through-hole electronics packaging market is driven by the demand from various industries, the need for long-term reliability, compatibility with legacy systems, enhanced thermal dissipation, and regulatory requirements. While surface mount technology is gaining popularity, through-hole technology remains relevant and indispensable for specific applications that require robustness, durability, and compatibility with legacy systems.The global through-hole electronics packaging market refers to the market for packaging and assembly solutions that involve the use of through-hole technology (THT) in the production of electronic components. Through-hole technology is a traditional method of mounting electronic components on printed circuit boards (PCBs) by inserting leads or pins of the components through holes in the PCB and soldering them on the opposite side.
The through-hole electronics packaging market is driven by several factors:
Demand from various industries: Through-hole technology is commonly used in industries such as automotive, aerospace, industrial automation, telecommunications, and consumer electronics. The demand for through-hole electronics packaging stems from the need for reliable and robust connections in applications that require resistance to extreme conditions, vibration, and high mechanical stress.
Long-term reliability: Through-hole technology offers excellent mechanical strength and stability, making it suitable for applications that require long-term reliability, such as automotive electronics and critical industrial equipment. Through-hole components have higher resistance to mechanical stress compared to surface mount technology (SMT), providing enhanced durability and longevity.
Compatibility with legacy systems: Through-hole electronics packaging is often preferred for products that need to be compatible with existing or older systems. Many legacy systems, particularly in the aerospace and defense sectors, still rely on through-hole components. The through-hole technology allows for easy replacement, repair, and upgrading of electronic components.
Enhanced thermal dissipation: Through-hole components typically have thicker leads or pins compared to SMT components, which helps improve thermal dissipation and enables efficient heat transfer. This thermal advantage makes through-hole technology suitable for applications that generate significant heat, such as power electronics and high-performance computing.
Regulatory requirements: Certain industries, such as aerospace, defense, and medical, have strict regulatory requirements regarding reliability, safety, and quality. Through-hole technology, with its proven track record and ability to withstand harsh environmental conditions, often meets the stringent regulatory standards of these industries.
However, it is important to note that the through-hole electronics packaging market is witnessing a gradual shift towards surface mount technology due to the increasing demand for miniaturization, higher component density, and improved production efficiency. Surface mount technology offers advantages such as smaller PCB footprints, higher production speeds, and cost savings. Nevertheless, through-hole technology continues to find its application in specific industries and areas where its unique advantages outweigh the benefits of surface mount technology.
In conclusion, the global through-hole electronics packaging market is driven by the demand from various industries, the need for long-term reliability, compatibility with legacy systems, enhanced thermal dissipation, and regulatory requirements. While surface mount technology is gaining popularity, through-hole technology remains relevant and indispensable for specific applications that require robustness, durability, and compatibility with legacy systems.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Through-Hole Electronics Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through-Hole Electronics Packaging.
The Through-Hole Electronics Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Through-Hole Electronics Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Through-Hole Electronics Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Through-Hole Electronics Packaging Market Report

Report Metric Details
Report Name Through-Hole Electronics Packaging Market
by Type
  • Plastic
  • Metal
  • Glass
  • Others
by Application
  • Consumer Electronics
  • Aerospace and Defense
  • Automotive
  • Telecommunications
  • Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company AMETEK, Inc., Dordan Mfg, Dupont, Osram, The Plastiform Company, Kiva Container, Primex Plastics Corporation., Quality Foam Packaging Inc, Ameson Packaging, Lithoflex, Inc., UFP Technologies, Intel Corporation, STMicroelectronics, Advanced Micro Devices, Inc, SAMSUNG, GY Packaging, Taiwan Semiconductor
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Through-Hole Electronics Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Through-Hole Electronics Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Through-Hole Electronics Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the Through-Hole Electronics Packaging Market report?

Ans: The main players in the Through-Hole Electronics Packaging Market are AMETEK, Inc., Dordan Mfg, Dupont, Osram, The Plastiform Company, Kiva Container, Primex Plastics Corporation., Quality Foam Packaging Inc, Ameson Packaging, Lithoflex, Inc., UFP Technologies, Intel Corporation, STMicroelectronics, Advanced Micro Devices, Inc, SAMSUNG, GY Packaging, Taiwan Semiconductor

What are the Application segmentation covered in the Through-Hole Electronics Packaging Market report?

Ans: The Applications covered in the Through-Hole Electronics Packaging Market report are Consumer Electronics, Aerospace and Defense, Automotive, Telecommunications, Others

What are the Type segmentation covered in the Through-Hole Electronics Packaging Market report?

Ans: The Types covered in the Through-Hole Electronics Packaging Market report are Plastic, Metal, Glass, Others

1 Through-Hole Electronics Packaging Market Overview
1.1 Product Definition
1.2 Through-Hole Electronics Packaging by Type
1.2.1 Global Through-Hole Electronics Packaging Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Plastic
1.2.3 Metal
1.2.4 Glass
1.2.5 Others
1.3 Through-Hole Electronics Packaging by Application
1.3.1 Global Through-Hole Electronics Packaging Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Aerospace and Defense
1.3.4 Automotive
1.3.5 Telecommunications
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Through-Hole Electronics Packaging Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Through-Hole Electronics Packaging Production Estimates and Forecasts (2020-2031)
1.4.4 Global Through-Hole Electronics Packaging Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Through-Hole Electronics Packaging Production Market Share by Manufacturers (2020-2025)
2.2 Global Through-Hole Electronics Packaging Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Through-Hole Electronics Packaging, Industry Ranking, 2023 VS 2024
2.4 Global Through-Hole Electronics Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Through-Hole Electronics Packaging Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Through-Hole Electronics Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Through-Hole Electronics Packaging, Product Offered and Application
2.8 Global Key Manufacturers of Through-Hole Electronics Packaging, Date of Enter into This Industry
2.9 Through-Hole Electronics Packaging Market Competitive Situation and Trends
2.9.1 Through-Hole Electronics Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest Through-Hole Electronics Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Through-Hole Electronics Packaging Production by Region
3.1 Global Through-Hole Electronics Packaging Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Through-Hole Electronics Packaging Production Value by Region (2020-2031)
3.2.1 Global Through-Hole Electronics Packaging Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Through-Hole Electronics Packaging by Region (2026-2031)
3.3 Global Through-Hole Electronics Packaging Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Through-Hole Electronics Packaging Production Volume by Region (2020-2031)
3.4.1 Global Through-Hole Electronics Packaging Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Through-Hole Electronics Packaging by Region (2026-2031)
3.5 Global Through-Hole Electronics Packaging Market Price Analysis by Region (2020-2025)
3.6 Global Through-Hole Electronics Packaging Production and Value, Year-over-Year Growth
3.6.1 North America Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Through-Hole Electronics Packaging Production Value Estimates and Forecasts (2020-2031)
4 Through-Hole Electronics Packaging Consumption by Region
4.1 Global Through-Hole Electronics Packaging Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Through-Hole Electronics Packaging Consumption by Region (2020-2031)
4.2.1 Global Through-Hole Electronics Packaging Consumption by Region (2020-2025)
4.2.2 Global Through-Hole Electronics Packaging Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Through-Hole Electronics Packaging Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Through-Hole Electronics Packaging Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Through-Hole Electronics Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Through-Hole Electronics Packaging Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Through-Hole Electronics Packaging Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Through-Hole Electronics Packaging Production by Type (2020-2031)
5.1.1 Global Through-Hole Electronics Packaging Production by Type (2020-2025)
5.1.2 Global Through-Hole Electronics Packaging Production by Type (2026-2031)
5.1.3 Global Through-Hole Electronics Packaging Production Market Share by Type (2020-2031)
5.2 Global Through-Hole Electronics Packaging Production Value by Type (2020-2031)
5.2.1 Global Through-Hole Electronics Packaging Production Value by Type (2020-2025)
5.2.2 Global Through-Hole Electronics Packaging Production Value by Type (2026-2031)
5.2.3 Global Through-Hole Electronics Packaging Production Value Market Share by Type (2020-2031)
5.3 Global Through-Hole Electronics Packaging Price by Type (2020-2031)
6 Segment by Application
6.1 Global Through-Hole Electronics Packaging Production by Application (2020-2031)
6.1.1 Global Through-Hole Electronics Packaging Production by Application (2020-2025)
6.1.2 Global Through-Hole Electronics Packaging Production by Application (2026-2031)
6.1.3 Global Through-Hole Electronics Packaging Production Market Share by Application (2020-2031)
6.2 Global Through-Hole Electronics Packaging Production Value by Application (2020-2031)
6.2.1 Global Through-Hole Electronics Packaging Production Value by Application (2020-2025)
6.2.2 Global Through-Hole Electronics Packaging Production Value by Application (2026-2031)
6.2.3 Global Through-Hole Electronics Packaging Production Value Market Share by Application (2020-2031)
6.3 Global Through-Hole Electronics Packaging Price by Application (2020-2031)
7 Key Companies Profiled
7.1 AMETEK, Inc.
7.1.1 AMETEK, Inc. Through-Hole Electronics Packaging Company Information
7.1.2 AMETEK, Inc. Through-Hole Electronics Packaging Product Portfolio
7.1.3 AMETEK, Inc. Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.1.4 AMETEK, Inc. Main Business and Markets Served
7.1.5 AMETEK, Inc. Recent Developments/Updates
7.2 Dordan Mfg
7.2.1 Dordan Mfg Through-Hole Electronics Packaging Company Information
7.2.2 Dordan Mfg Through-Hole Electronics Packaging Product Portfolio
7.2.3 Dordan Mfg Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Dordan Mfg Main Business and Markets Served
7.2.5 Dordan Mfg Recent Developments/Updates
7.3 Dupont
7.3.1 Dupont Through-Hole Electronics Packaging Company Information
7.3.2 Dupont Through-Hole Electronics Packaging Product Portfolio
7.3.3 Dupont Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Dupont Main Business and Markets Served
7.3.5 Dupont Recent Developments/Updates
7.4 Osram
7.4.1 Osram Through-Hole Electronics Packaging Company Information
7.4.2 Osram Through-Hole Electronics Packaging Product Portfolio
7.4.3 Osram Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Osram Main Business and Markets Served
7.4.5 Osram Recent Developments/Updates
7.5 The Plastiform Company
7.5.1 The Plastiform Company Through-Hole Electronics Packaging Company Information
7.5.2 The Plastiform Company Through-Hole Electronics Packaging Product Portfolio
7.5.3 The Plastiform Company Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.5.4 The Plastiform Company Main Business and Markets Served
7.5.5 The Plastiform Company Recent Developments/Updates
7.6 Kiva Container
7.6.1 Kiva Container Through-Hole Electronics Packaging Company Information
7.6.2 Kiva Container Through-Hole Electronics Packaging Product Portfolio
7.6.3 Kiva Container Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Kiva Container Main Business and Markets Served
7.6.5 Kiva Container Recent Developments/Updates
7.7 Primex Plastics Corporation.
7.7.1 Primex Plastics Corporation. Through-Hole Electronics Packaging Company Information
7.7.2 Primex Plastics Corporation. Through-Hole Electronics Packaging Product Portfolio
7.7.3 Primex Plastics Corporation. Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Primex Plastics Corporation. Main Business and Markets Served
7.7.5 Primex Plastics Corporation. Recent Developments/Updates
7.8 Quality Foam Packaging Inc
7.8.1 Quality Foam Packaging Inc Through-Hole Electronics Packaging Company Information
7.8.2 Quality Foam Packaging Inc Through-Hole Electronics Packaging Product Portfolio
7.8.3 Quality Foam Packaging Inc Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Quality Foam Packaging Inc Main Business and Markets Served
7.8.5 Quality Foam Packaging Inc Recent Developments/Updates
7.9 Ameson Packaging
7.9.1 Ameson Packaging Through-Hole Electronics Packaging Company Information
7.9.2 Ameson Packaging Through-Hole Electronics Packaging Product Portfolio
7.9.3 Ameson Packaging Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Ameson Packaging Main Business and Markets Served
7.9.5 Ameson Packaging Recent Developments/Updates
7.10 Lithoflex, Inc.
7.10.1 Lithoflex, Inc. Through-Hole Electronics Packaging Company Information
7.10.2 Lithoflex, Inc. Through-Hole Electronics Packaging Product Portfolio
7.10.3 Lithoflex, Inc. Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Lithoflex, Inc. Main Business and Markets Served
7.10.5 Lithoflex, Inc. Recent Developments/Updates
7.11 UFP Technologies
7.11.1 UFP Technologies Through-Hole Electronics Packaging Company Information
7.11.2 UFP Technologies Through-Hole Electronics Packaging Product Portfolio
7.11.3 UFP Technologies Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.11.4 UFP Technologies Main Business and Markets Served
7.11.5 UFP Technologies Recent Developments/Updates
7.12 Intel Corporation
7.12.1 Intel Corporation Through-Hole Electronics Packaging Company Information
7.12.2 Intel Corporation Through-Hole Electronics Packaging Product Portfolio
7.12.3 Intel Corporation Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Intel Corporation Main Business and Markets Served
7.12.5 Intel Corporation Recent Developments/Updates
7.13 STMicroelectronics
7.13.1 STMicroelectronics Through-Hole Electronics Packaging Company Information
7.13.2 STMicroelectronics Through-Hole Electronics Packaging Product Portfolio
7.13.3 STMicroelectronics Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.13.4 STMicroelectronics Main Business and Markets Served
7.13.5 STMicroelectronics Recent Developments/Updates
7.14 Advanced Micro Devices, Inc
7.14.1 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Company Information
7.14.2 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Product Portfolio
7.14.3 Advanced Micro Devices, Inc Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Advanced Micro Devices, Inc Main Business and Markets Served
7.14.5 Advanced Micro Devices, Inc Recent Developments/Updates
7.15 SAMSUNG
7.15.1 SAMSUNG Through-Hole Electronics Packaging Company Information
7.15.2 SAMSUNG Through-Hole Electronics Packaging Product Portfolio
7.15.3 SAMSUNG Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.15.4 SAMSUNG Main Business and Markets Served
7.15.5 SAMSUNG Recent Developments/Updates
7.16 GY Packaging
7.16.1 GY Packaging Through-Hole Electronics Packaging Company Information
7.16.2 GY Packaging Through-Hole Electronics Packaging Product Portfolio
7.16.3 GY Packaging Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.16.4 GY Packaging Main Business and Markets Served
7.16.5 GY Packaging Recent Developments/Updates
7.17 Taiwan Semiconductor
7.17.1 Taiwan Semiconductor Through-Hole Electronics Packaging Company Information
7.17.2 Taiwan Semiconductor Through-Hole Electronics Packaging Product Portfolio
7.17.3 Taiwan Semiconductor Through-Hole Electronics Packaging Production, Value, Price and Gross Margin (2020-2025)
7.17.4 Taiwan Semiconductor Main Business and Markets Served
7.17.5 Taiwan Semiconductor Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Through-Hole Electronics Packaging Industry Chain Analysis
8.2 Through-Hole Electronics Packaging Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Through-Hole Electronics Packaging Production Mode & Process Analysis
8.4 Through-Hole Electronics Packaging Sales and Marketing
8.4.1 Through-Hole Electronics Packaging Sales Channels
8.4.2 Through-Hole Electronics Packaging Distributors
8.5 Through-Hole Electronics Packaging Customer Analysis
9 Through-Hole Electronics Packaging Market Dynamics
9.1 Through-Hole Electronics Packaging Industry Trends
9.2 Through-Hole Electronics Packaging Market Drivers
9.3 Through-Hole Electronics Packaging Market Challenges
9.4 Through-Hole Electronics Packaging Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
Ametek Inc
DuPont
Osram
Kiva Container
Primex Plastics Corporation
Quality Foam Packaging, Inc.
Ameson packaging
Lithoflex Inc.
UFP Technologies
Intel Corporation
STMicroelectronics
Advanced Micro Devices Inc
SAMSUNG
GY Packaging
Taiwan Semiconductor
Dordan Mfg
The Plastiform Company
List of Tables
 Table 1. Global Through-Hole Electronics Packaging Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Through-Hole Electronics Packaging Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Through-Hole Electronics Packaging Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global Through-Hole Electronics Packaging Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global Through-Hole Electronics Packaging Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Through-Hole Electronics Packaging Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Through-Hole Electronics Packaging Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Through-Hole Electronics Packaging, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Through-Hole Electronics Packaging as of 2024)
 Table 10. Global Market Through-Hole Electronics Packaging Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Through-Hole Electronics Packaging, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Through-Hole Electronics Packaging, Product Offered and Application
 Table 13. Global Key Manufacturers of Through-Hole Electronics Packaging, Date of Enter into This Industry
 Table 14. Global Through-Hole Electronics Packaging Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Through-Hole Electronics Packaging Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Through-Hole Electronics Packaging Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Through-Hole Electronics Packaging Production Value Market Share by Region (2020-2025)
 Table 19. Global Through-Hole Electronics Packaging Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Through-Hole Electronics Packaging Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Through-Hole Electronics Packaging Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global Through-Hole Electronics Packaging Production (K Units) by Region (2020-2025)
 Table 23. Global Through-Hole Electronics Packaging Production Market Share by Region (2020-2025)
 Table 24. Global Through-Hole Electronics Packaging Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global Through-Hole Electronics Packaging Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Through-Hole Electronics Packaging Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global Through-Hole Electronics Packaging Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global Through-Hole Electronics Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global Through-Hole Electronics Packaging Consumption by Region (2020-2025) & (K Units)
 Table 30. Global Through-Hole Electronics Packaging Consumption Market Share by Region (2020-2025)
 Table 31. Global Through-Hole Electronics Packaging Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global Through-Hole Electronics Packaging Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America Through-Hole Electronics Packaging Consumption by Country (2020-2025) & (K Units)
 Table 35. North America Through-Hole Electronics Packaging Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe Through-Hole Electronics Packaging Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe Through-Hole Electronics Packaging Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific Through-Hole Electronics Packaging Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific Through-Hole Electronics Packaging Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific Through-Hole Electronics Packaging Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa Through-Hole Electronics Packaging Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa Through-Hole Electronics Packaging Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa Through-Hole Electronics Packaging Consumption by Country (2026-2031) & (K Units)
 Table 45. Global Through-Hole Electronics Packaging Production (K Units) by Type (2020-2025)
 Table 46. Global Through-Hole Electronics Packaging Production (K Units) by Type (2026-2031)
 Table 47. Global Through-Hole Electronics Packaging Production Market Share by Type (2020-2025)
 Table 48. Global Through-Hole Electronics Packaging Production Market Share by Type (2026-2031)
 Table 49. Global Through-Hole Electronics Packaging Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Through-Hole Electronics Packaging Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Through-Hole Electronics Packaging Production Value Market Share by Type (2020-2025)
 Table 52. Global Through-Hole Electronics Packaging Production Value Market Share by Type (2026-2031)
 Table 53. Global Through-Hole Electronics Packaging Price (US$/Unit) by Type (2020-2025)
 Table 54. Global Through-Hole Electronics Packaging Price (US$/Unit) by Type (2026-2031)
 Table 55. Global Through-Hole Electronics Packaging Production (K Units) by Application (2020-2025)
 Table 56. Global Through-Hole Electronics Packaging Production (K Units) by Application (2026-2031)
 Table 57. Global Through-Hole Electronics Packaging Production Market Share by Application (2020-2025)
 Table 58. Global Through-Hole Electronics Packaging Production Market Share by Application (2026-2031)
 Table 59. Global Through-Hole Electronics Packaging Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Through-Hole Electronics Packaging Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Through-Hole Electronics Packaging Production Value Market Share by Application (2020-2025)
 Table 62. Global Through-Hole Electronics Packaging Production Value Market Share by Application (2026-2031)
 Table 63. Global Through-Hole Electronics Packaging Price (US$/Unit) by Application (2020-2025)
 Table 64. Global Through-Hole Electronics Packaging Price (US$/Unit) by Application (2026-2031)
 Table 65. AMETEK, Inc. Through-Hole Electronics Packaging Company Information
 Table 66. AMETEK, Inc. Through-Hole Electronics Packaging Specification and Application
 Table 67. AMETEK, Inc. Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. AMETEK, Inc. Main Business and Markets Served
 Table 69. AMETEK, Inc. Recent Developments/Updates
 Table 70. Dordan Mfg Through-Hole Electronics Packaging Company Information
 Table 71. Dordan Mfg Through-Hole Electronics Packaging Specification and Application
 Table 72. Dordan Mfg Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. Dordan Mfg Main Business and Markets Served
 Table 74. Dordan Mfg Recent Developments/Updates
 Table 75. Dupont Through-Hole Electronics Packaging Company Information
 Table 76. Dupont Through-Hole Electronics Packaging Specification and Application
 Table 77. Dupont Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. Dupont Main Business and Markets Served
 Table 79. Dupont Recent Developments/Updates
 Table 80. Osram Through-Hole Electronics Packaging Company Information
 Table 81. Osram Through-Hole Electronics Packaging Specification and Application
 Table 82. Osram Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. Osram Main Business and Markets Served
 Table 84. Osram Recent Developments/Updates
 Table 85. The Plastiform Company Through-Hole Electronics Packaging Company Information
 Table 86. The Plastiform Company Through-Hole Electronics Packaging Specification and Application
 Table 87. The Plastiform Company Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. The Plastiform Company Main Business and Markets Served
 Table 89. The Plastiform Company Recent Developments/Updates
 Table 90. Kiva Container Through-Hole Electronics Packaging Company Information
 Table 91. Kiva Container Through-Hole Electronics Packaging Specification and Application
 Table 92. Kiva Container Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. Kiva Container Main Business and Markets Served
 Table 94. Kiva Container Recent Developments/Updates
 Table 95. Primex Plastics Corporation. Through-Hole Electronics Packaging Company Information
 Table 96. Primex Plastics Corporation. Through-Hole Electronics Packaging Specification and Application
 Table 97. Primex Plastics Corporation. Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. Primex Plastics Corporation. Main Business and Markets Served
 Table 99. Primex Plastics Corporation. Recent Developments/Updates
 Table 100. Quality Foam Packaging Inc Through-Hole Electronics Packaging Company Information
 Table 101. Quality Foam Packaging Inc Through-Hole Electronics Packaging Specification and Application
 Table 102. Quality Foam Packaging Inc Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 103. Quality Foam Packaging Inc Main Business and Markets Served
 Table 104. Quality Foam Packaging Inc Recent Developments/Updates
 Table 105. Ameson Packaging Through-Hole Electronics Packaging Company Information
 Table 106. Ameson Packaging Through-Hole Electronics Packaging Specification and Application
 Table 107. Ameson Packaging Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 108. Ameson Packaging Main Business and Markets Served
 Table 109. Ameson Packaging Recent Developments/Updates
 Table 110. Lithoflex, Inc. Through-Hole Electronics Packaging Company Information
 Table 111. Lithoflex, Inc. Through-Hole Electronics Packaging Specification and Application
 Table 112. Lithoflex, Inc. Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 113. Lithoflex, Inc. Main Business and Markets Served
 Table 114. Lithoflex, Inc. Recent Developments/Updates
 Table 115. UFP Technologies Through-Hole Electronics Packaging Company Information
 Table 116. UFP Technologies Through-Hole Electronics Packaging Specification and Application
 Table 117. UFP Technologies Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 118. UFP Technologies Main Business and Markets Served
 Table 119. UFP Technologies Recent Developments/Updates
 Table 120. Intel Corporation Through-Hole Electronics Packaging Company Information
 Table 121. Intel Corporation Through-Hole Electronics Packaging Specification and Application
 Table 122. Intel Corporation Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 123. Intel Corporation Main Business and Markets Served
 Table 124. Intel Corporation Recent Developments/Updates
 Table 125. STMicroelectronics Through-Hole Electronics Packaging Company Information
 Table 126. STMicroelectronics Through-Hole Electronics Packaging Specification and Application
 Table 127. STMicroelectronics Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 128. STMicroelectronics Main Business and Markets Served
 Table 129. STMicroelectronics Recent Developments/Updates
 Table 130. Advanced Micro Devices, Inc Through-Hole Electronics Packaging Company Information
 Table 131. Advanced Micro Devices, Inc Through-Hole Electronics Packaging Specification and Application
 Table 132. Advanced Micro Devices, Inc Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 133. Advanced Micro Devices, Inc Main Business and Markets Served
 Table 134. Advanced Micro Devices, Inc Recent Developments/Updates
 Table 135. SAMSUNG Through-Hole Electronics Packaging Company Information
 Table 136. SAMSUNG Through-Hole Electronics Packaging Specification and Application
 Table 137. SAMSUNG Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 138. SAMSUNG Main Business and Markets Served
 Table 139. SAMSUNG Recent Developments/Updates
 Table 140. GY Packaging Through-Hole Electronics Packaging Company Information
 Table 141. GY Packaging Through-Hole Electronics Packaging Specification and Application
 Table 142. GY Packaging Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 143. GY Packaging Main Business and Markets Served
 Table 144. GY Packaging Recent Developments/Updates
 Table 145. Taiwan Semiconductor Through-Hole Electronics Packaging Company Information
 Table 146. Taiwan Semiconductor Through-Hole Electronics Packaging Specification and Application
 Table 147. Taiwan Semiconductor Through-Hole Electronics Packaging Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 148. Taiwan Semiconductor Main Business and Markets Served
 Table 149. Taiwan Semiconductor Recent Developments/Updates
 Table 150. Key Raw Materials Lists
 Table 151. Raw Materials Key Suppliers Lists
 Table 152. Through-Hole Electronics Packaging Distributors List
 Table 153. Through-Hole Electronics Packaging Customers List
 Table 154. Through-Hole Electronics Packaging Market Trends
 Table 155. Through-Hole Electronics Packaging Market Drivers
 Table 156. Through-Hole Electronics Packaging Market Challenges
 Table 157. Through-Hole Electronics Packaging Market Restraints
 Table 158. Research Programs/Design for This Report
 Table 159. Key Data Information from Secondary Sources
 Table 160. Key Data Information from Primary Sources
 Table 161. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Through-Hole Electronics Packaging
 Figure 2. Global Through-Hole Electronics Packaging Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Through-Hole Electronics Packaging Market Share by Type: 2024 VS 2031
 Figure 4. Plastic Product Picture
 Figure 5. Metal Product Picture
 Figure 6. Glass Product Picture
 Figure 7. Others Product Picture
 Figure 8. Global Through-Hole Electronics Packaging Market Value by Application, (US$ Million) & (2020-2031)
 Figure 9. Global Through-Hole Electronics Packaging Market Share by Application: 2024 VS 2031
 Figure 10. Consumer Electronics
 Figure 11. Aerospace and Defense
 Figure 12. Automotive
 Figure 13. Telecommunications
 Figure 14. Others
 Figure 15. Global Through-Hole Electronics Packaging Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 16. Global Through-Hole Electronics Packaging Production Value (US$ Million) & (2020-2031)
 Figure 17. Global Through-Hole Electronics Packaging Production Capacity (K Units) & (2020-2031)
 Figure 18. Global Through-Hole Electronics Packaging Production (K Units) & (2020-2031)
 Figure 19. Global Through-Hole Electronics Packaging Average Price (US$/Unit) & (2020-2031)
 Figure 20. Through-Hole Electronics Packaging Report Years Considered
 Figure 21. Through-Hole Electronics Packaging Production Share by Manufacturers in 2024
 Figure 22. Global Through-Hole Electronics Packaging Production Value Share by Manufacturers (2024)
 Figure 23. Through-Hole Electronics Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 24. The Global 5 and 10 Largest Players: Market Share by Through-Hole Electronics Packaging Revenue in 2024
 Figure 25. Global Through-Hole Electronics Packaging Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 26. Global Through-Hole Electronics Packaging Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 27. Global Through-Hole Electronics Packaging Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 28. Global Through-Hole Electronics Packaging Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 29. North America Through-Hole Electronics Packaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Europe Through-Hole Electronics Packaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. China Through-Hole Electronics Packaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. Japan Through-Hole Electronics Packaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 33. South Korea Through-Hole Electronics Packaging Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 34. Global Through-Hole Electronics Packaging Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 35. Global Through-Hole Electronics Packaging Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 36. North America Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 37. North America Through-Hole Electronics Packaging Consumption Market Share by Country (2020-2031)
 Figure 38. U.S. Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 39. Canada Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 40. Europe Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 41. Europe Through-Hole Electronics Packaging Consumption Market Share by Country (2020-2031)
 Figure 42. Germany Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. France Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. U.K. Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. Italy Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 46. Netherlands Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Asia Pacific Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 48. Asia Pacific Through-Hole Electronics Packaging Consumption Market Share by Region (2020-2031)
 Figure 49. China Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. Japan Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 51. South Korea Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. China Taiwan Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. Southeast Asia Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 54. India Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Latin America, Middle East & Africa Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 56. Latin America, Middle East & Africa Through-Hole Electronics Packaging Consumption Market Share by Country (2020-2031)
 Figure 57. Mexico Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 58. Brazil Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 59. Israel Through-Hole Electronics Packaging Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 60. Global Production Market Share of Through-Hole Electronics Packaging by Type (2020-2031)
 Figure 61. Global Production Value Market Share of Through-Hole Electronics Packaging by Type (2020-2031)
 Figure 62. Global Through-Hole Electronics Packaging Price (US$/Unit) by Type (2020-2031)
 Figure 63. Global Production Market Share of Through-Hole Electronics Packaging by Application (2020-2031)
 Figure 64. Global Production Value Market Share of Through-Hole Electronics Packaging by Application (2020-2031)
 Figure 65. Global Through-Hole Electronics Packaging Price (US$/Unit) by Application (2020-2031)
 Figure 66. Through-Hole Electronics Packaging Value Chain
 Figure 67. Channels of Distribution (Direct Vs Distribution)
 Figure 68. Bottom-up and Top-down Approaches for This Report
 Figure 69. Data Triangulation
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