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Global Through Silicon Via (TSV) Packaging Market Research Report 2025

Published Date: July 2025

Report Code: QYRE-Auto-13V5969

Global Through Silicon Via TSV Packaging Market Insights Forecast to 2028

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Global Through Silicon Via (TSV) Packaging Market Research Report 2025

Code: QYRE-Auto-13V5969

Report

July 2025

Pages:72

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Applied Materials

STATS ChipPAC Ltd

Micralyne

Teledyne

DuPont

China Wafer Level CSP Co

Samsung Electronics

Amkor Technology

FRT

Through Silicon Via (TSV) Packaging Market Size

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

Through Silicon Via (TSV) Packaging Market

The global market for Through Silicon Via (TSV) Packaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

Through Silicon Via (TSV) packaging technology enables homogenous and heterogeneous integration of logic and memory co-located closely together in a small form-factor assembly.

Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

This report aims to provide a comprehensive presentation of the global market for Through Silicon Via (TSV) Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Through Silicon Via (TSV) Packaging.

The Through Silicon Via (TSV) Packaging market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Through Silicon Via (TSV) Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Through Silicon Via (TSV) Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Through Silicon Via (TSV) Packaging Market Report

Report Metric	Details
Report Name	Through Silicon Via (TSV) Packaging Market
Accounted market size in year	US$ 579 billion
Forecasted market size in 2029	US$ 790 billion
CAGR	6%
Base Year	year
Forecasted years	2025 - 2029
Segment by Type	2.5D 3D
Segment by Application	Memory Arrays Image Sensors Graphics Chips MPUs (Microprocessor Units) DRAM (Dynamic Random Access Memory) Integrated Circuits Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Applied Materials, STATS ChipPAC Ltd, Micralyne, Inc, Teledyne, DuPont, China Wafer Level CSP Co, Samsung Electronics, Amkor Technology, FRT GmbH
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Through Silicon Via (TSV) Packaging company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Through Silicon Via (TSV) Packaging Market growing?

Ans: The Through Silicon Via (TSV) Packaging Market witnessing a CAGR of 6% during the forecast period 2025-2029.

What is the Through Silicon Via (TSV) Packaging Market size in 2029?

Ans: The Through Silicon Via (TSV) Packaging Market size in 2029 will be US$ 790 billion.

Who are the main players in the Through Silicon Via (TSV) Packaging Market report?

Ans: The main players in the Through Silicon Via (TSV) Packaging Market are Applied Materials, STATS ChipPAC Ltd, Micralyne, Inc, Teledyne, DuPont, China Wafer Level CSP Co, Samsung Electronics, Amkor Technology, FRT GmbH

What are the Application segmentation covered in the Through Silicon Via (TSV) Packaging Market report?

Ans: The Applications covered in the Through Silicon Via (TSV) Packaging Market report are Memory Arrays, Image Sensors, Graphics Chips, MPUs (Microprocessor Units), DRAM (Dynamic Random Access Memory), Integrated Circuits, Others

What are the Type segmentation covered in the Through Silicon Via (TSV) Packaging Market report?

Ans: The Types covered in the Through Silicon Via (TSV) Packaging Market report are 2.5D, 3D

Recommended Reports

Semiconductor Packaging

Semiconductor Materials

Semiconductor Chips

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Through Silicon Via (TSV) Packaging Market Size Growth Rate by Type: 2020 VS 2024 VS 2031

1.2.2 2.5D

1.2.3 3D

1.3 Market by Application

1.3.1 Global Through Silicon Via (TSV) Packaging Market Growth by Application: 2020 VS 2024 VS 2031

1.3.2 Memory Arrays

1.3.3 Image Sensors

1.3.4 Graphics Chips

1.3.5 MPUs (Microprocessor Units)

1.3.6 DRAM (Dynamic Random Access Memory)

1.3.7 Integrated Circuits

1.3.8 Others

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global Through Silicon Via (TSV) Packaging Market Perspective (2020-2031)

2.2 Global Through Silicon Via (TSV) Packaging Growth Trends by Region

2.2.1 Global Through Silicon Via (TSV) Packaging Market Size by Region: 2020 VS 2024 VS 2031

2.2.2 Through Silicon Via (TSV) Packaging Historic Market Size by Region (2020-2025)

2.2.3 Through Silicon Via (TSV) Packaging Forecasted Market Size by Region (2026-2031)

2.3 Through Silicon Via (TSV) Packaging Market Dynamics

2.3.1 Through Silicon Via (TSV) Packaging Industry Trends

2.3.2 Through Silicon Via (TSV) Packaging Market Drivers

2.3.3 Through Silicon Via (TSV) Packaging Market Challenges

2.3.4 Through Silicon Via (TSV) Packaging Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Through Silicon Via (TSV) Packaging Players by Revenue

3.1.1 Global Top Through Silicon Via (TSV) Packaging Players by Revenue (2020-2025)

3.1.2 Global Through Silicon Via (TSV) Packaging Revenue Market Share by Players (2020-2025)

3.2 Global Through Silicon Via (TSV) Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by Through Silicon Via (TSV) Packaging Revenue

3.4 Global Through Silicon Via (TSV) Packaging Market Concentration Ratio

3.4.1 Global Through Silicon Via (TSV) Packaging Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Through Silicon Via (TSV) Packaging Revenue in 2024

3.5 Global Key Players of Through Silicon Via (TSV) Packaging Head office and Area Served

3.6 Global Key Players of Through Silicon Via (TSV) Packaging, Product and Application

3.7 Global Key Players of Through Silicon Via (TSV) Packaging, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 Through Silicon Via (TSV) Packaging Breakdown Data by Type

4.1 Global Through Silicon Via (TSV) Packaging Historic Market Size by Type (2020-2025)

4.2 Global Through Silicon Via (TSV) Packaging Forecasted Market Size by Type (2026-2031)

5 Through Silicon Via (TSV) Packaging Breakdown Data by Application

5.1 Global Through Silicon Via (TSV) Packaging Historic Market Size by Application (2020-2025)

5.2 Global Through Silicon Via (TSV) Packaging Forecasted Market Size by Application (2026-2031)

6 North America

6.1 North America Through Silicon Via (TSV) Packaging Market Size (2020-2031)

6.2 North America Through Silicon Via (TSV) Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031

6.3 North America Through Silicon Via (TSV) Packaging Market Size by Country (2020-2025)

6.4 North America Through Silicon Via (TSV) Packaging Market Size by Country (2026-2031)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Through Silicon Via (TSV) Packaging Market Size (2020-2031)

7.2 Europe Through Silicon Via (TSV) Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031

7.3 Europe Through Silicon Via (TSV) Packaging Market Size by Country (2020-2025)

7.4 Europe Through Silicon Via (TSV) Packaging Market Size by Country (2026-2031)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Through Silicon Via (TSV) Packaging Market Size (2020-2031)

8.2 Asia-Pacific Through Silicon Via (TSV) Packaging Market Growth Rate by Region: 2020 VS 2024 VS 2031

8.3 Asia-Pacific Through Silicon Via (TSV) Packaging Market Size by Region (2020-2025)

8.4 Asia-Pacific Through Silicon Via (TSV) Packaging Market Size by Region (2026-2031)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Through Silicon Via (TSV) Packaging Market Size (2020-2031)

9.2 Latin America Through Silicon Via (TSV) Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031

9.3 Latin America Through Silicon Via (TSV) Packaging Market Size by Country (2020-2025)

9.4 Latin America Through Silicon Via (TSV) Packaging Market Size by Country (2026-2031)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Through Silicon Via (TSV) Packaging Market Size (2020-2031)

10.2 Middle East & Africa Through Silicon Via (TSV) Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031

10.3 Middle East & Africa Through Silicon Via (TSV) Packaging Market Size by Country (2020-2025)

10.4 Middle East & Africa Through Silicon Via (TSV) Packaging Market Size by Country (2026-2031)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 Applied Materials

11.1.1 Applied Materials Company Details

11.1.2 Applied Materials Business Overview

11.1.3 Applied Materials Through Silicon Via (TSV) Packaging Introduction

11.1.4 Applied Materials Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025)

11.1.5 Applied Materials Recent Development

11.2 STATS ChipPAC Ltd

11.2.1 STATS ChipPAC Ltd Company Details

11.2.2 STATS ChipPAC Ltd Business Overview

11.2.3 STATS ChipPAC Ltd Through Silicon Via (TSV) Packaging Introduction

11.2.4 STATS ChipPAC Ltd Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025)

11.2.5 STATS ChipPAC Ltd Recent Development

11.3 Micralyne, Inc

11.3.1 Micralyne, Inc Company Details

11.3.2 Micralyne, Inc Business Overview

11.3.3 Micralyne, Inc Through Silicon Via (TSV) Packaging Introduction

11.3.4 Micralyne, Inc Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025)

11.3.5 Micralyne, Inc Recent Development

11.4 Teledyne

11.4.1 Teledyne Company Details

11.4.2 Teledyne Business Overview

11.4.3 Teledyne Through Silicon Via (TSV) Packaging Introduction

11.4.4 Teledyne Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025)

11.4.5 Teledyne Recent Development

11.5 DuPont

11.5.1 DuPont Company Details

11.5.2 DuPont Business Overview

11.5.3 DuPont Through Silicon Via (TSV) Packaging Introduction

11.5.4 DuPont Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025)

11.5.5 DuPont Recent Development

11.6 China Wafer Level CSP Co

11.6.1 China Wafer Level CSP Co Company Details

11.6.2 China Wafer Level CSP Co Business Overview

11.6.3 China Wafer Level CSP Co Through Silicon Via (TSV) Packaging Introduction

11.6.4 China Wafer Level CSP Co Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025)

11.6.5 China Wafer Level CSP Co Recent Development

11.7 Samsung Electronics

11.7.1 Samsung Electronics Company Details

11.7.2 Samsung Electronics Business Overview

11.7.3 Samsung Electronics Through Silicon Via (TSV) Packaging Introduction

11.7.4 Samsung Electronics Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025)

11.7.5 Samsung Electronics Recent Development

11.8 Amkor Technology

11.8.1 Amkor Technology Company Details

11.8.2 Amkor Technology Business Overview

11.8.3 Amkor Technology Through Silicon Via (TSV) Packaging Introduction

11.8.4 Amkor Technology Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025)

11.8.5 Amkor Technology Recent Development

11.9 FRT GmbH

11.9.1 FRT GmbH Company Details

11.9.2 FRT GmbH Business Overview

11.9.3 FRT GmbH Through Silicon Via (TSV) Packaging Introduction

11.9.4 FRT GmbH Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025)

11.9.5 FRT GmbH Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

Applied Materials

STATS ChipPAC Ltd

Micralyne

Teledyne

DuPont

China Wafer Level CSP Co

Samsung Electronics

Amkor Technology

FRT

List of Tables

Table 1. Global Through Silicon Via (TSV) Packaging Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031

Table 2. Key Players of 2.5D

Table 3. Key Players of 3D

Table 4. Global Through Silicon Via (TSV) Packaging Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031

Table 5. Global Through Silicon Via (TSV) Packaging Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Table 6. Global Through Silicon Via (TSV) Packaging Market Size by Region (2020-2025) & (US$ Million)

Table 7. Global Through Silicon Via (TSV) Packaging Market Share by Region (2020-2025)

Table 8. Global Through Silicon Via (TSV) Packaging Forecasted Market Size by Region (2026-2031) & (US$ Million)

Table 9. Global Through Silicon Via (TSV) Packaging Market Share by Region (2026-2031)

Table 10. Through Silicon Via (TSV) Packaging Market Trends

Table 11. Through Silicon Via (TSV) Packaging Market Drivers

Table 12. Through Silicon Via (TSV) Packaging Market Challenges

Table 13. Through Silicon Via (TSV) Packaging Market Restraints

Table 14. Global Through Silicon Via (TSV) Packaging Revenue by Players (2020-2025) & (US$ Million)

Table 15. Global Through Silicon Via (TSV) Packaging Market Share by Players (2020-2025)

Table 16. Global Top Through Silicon Via (TSV) Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through Silicon Via (TSV) Packaging as of 2024)

Table 17. Ranking of Global Top Through Silicon Via (TSV) Packaging Companies by Revenue (US$ Million) in 2024

Table 18. Global 5 Largest Players Market Share by Through Silicon Via (TSV) Packaging Revenue (CR5 and HHI) & (2020-2025)

Table 19. Global Key Players of Through Silicon Via (TSV) Packaging, Headquarters and Area Served

Table 20. Global Key Players of Through Silicon Via (TSV) Packaging, Product and Application

Table 21. Global Key Players of Through Silicon Via (TSV) Packaging, Date of Enter into This Industry

Table 22. Mergers & Acquisitions, Expansion Plans

Table 23. Global Through Silicon Via (TSV) Packaging Market Size by Type (2020-2025) & (US$ Million)

Table 24. Global Through Silicon Via (TSV) Packaging Revenue Market Share by Type (2020-2025)

Table 25. Global Through Silicon Via (TSV) Packaging Forecasted Market Size by Type (2026-2031) & (US$ Million)

Table 26. Global Through Silicon Via (TSV) Packaging Revenue Market Share by Type (2026-2031)

Table 27. Global Through Silicon Via (TSV) Packaging Market Size by Application (2020-2025) & (US$ Million)

Table 28. Global Through Silicon Via (TSV) Packaging Revenue Market Share by Application (2020-2025)

Table 29. Global Through Silicon Via (TSV) Packaging Forecasted Market Size by Application (2026-2031) & (US$ Million)

Table 30. Global Through Silicon Via (TSV) Packaging Revenue Market Share by Application (2026-2031)

Table 31. North America Through Silicon Via (TSV) Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 32. North America Through Silicon Via (TSV) Packaging Market Size by Country (2020-2025) & (US$ Million)

Table 33. North America Through Silicon Via (TSV) Packaging Market Size by Country (2026-2031) & (US$ Million)

Table 34. Europe Through Silicon Via (TSV) Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 35. Europe Through Silicon Via (TSV) Packaging Market Size by Country (2020-2025) & (US$ Million)

Table 36. Europe Through Silicon Via (TSV) Packaging Market Size by Country (2026-2031) & (US$ Million)

Table 37. Asia-Pacific Through Silicon Via (TSV) Packaging Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031

Table 38. Asia-Pacific Through Silicon Via (TSV) Packaging Market Size by Region (2020-2025) & (US$ Million)

Table 39. Asia-Pacific Through Silicon Via (TSV) Packaging Market Size by Region (2026-2031) & (US$ Million)

Table 40. Latin America Through Silicon Via (TSV) Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 41. Latin America Through Silicon Via (TSV) Packaging Market Size by Country (2020-2025) & (US$ Million)

Table 42. Latin America Through Silicon Via (TSV) Packaging Market Size by Country (2026-2031) & (US$ Million)

Table 43. Middle East & Africa Through Silicon Via (TSV) Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 44. Middle East & Africa Through Silicon Via (TSV) Packaging Market Size by Country (2020-2025) & (US$ Million)

Table 45. Middle East & Africa Through Silicon Via (TSV) Packaging Market Size by Country (2026-2031) & (US$ Million)

Table 46. Applied Materials Company Details

Table 47. Applied Materials Business Overview

Table 48. Applied Materials Through Silicon Via (TSV) Packaging Product

Table 49. Applied Materials Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025) & (US$ Million)

Table 50. Applied Materials Recent Development

Table 51. STATS ChipPAC Ltd Company Details

Table 52. STATS ChipPAC Ltd Business Overview

Table 53. STATS ChipPAC Ltd Through Silicon Via (TSV) Packaging Product

Table 54. STATS ChipPAC Ltd Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025) & (US$ Million)

Table 55. STATS ChipPAC Ltd Recent Development

Table 56. Micralyne, Inc Company Details

Table 57. Micralyne, Inc Business Overview

Table 58. Micralyne, Inc Through Silicon Via (TSV) Packaging Product

Table 59. Micralyne, Inc Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025) & (US$ Million)

Table 60. Micralyne, Inc Recent Development

Table 61. Teledyne Company Details

Table 62. Teledyne Business Overview

Table 63. Teledyne Through Silicon Via (TSV) Packaging Product

Table 64. Teledyne Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025) & (US$ Million)

Table 65. Teledyne Recent Development

Table 66. DuPont Company Details

Table 67. DuPont Business Overview

Table 68. DuPont Through Silicon Via (TSV) Packaging Product

Table 69. DuPont Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025) & (US$ Million)

Table 70. DuPont Recent Development

Table 71. China Wafer Level CSP Co Company Details

Table 72. China Wafer Level CSP Co Business Overview

Table 73. China Wafer Level CSP Co Through Silicon Via (TSV) Packaging Product

Table 74. China Wafer Level CSP Co Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025) & (US$ Million)

Table 75. China Wafer Level CSP Co Recent Development

Table 76. Samsung Electronics Company Details

Table 77. Samsung Electronics Business Overview

Table 78. Samsung Electronics Through Silicon Via (TSV) Packaging Product

Table 79. Samsung Electronics Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025) & (US$ Million)

Table 80. Samsung Electronics Recent Development

Table 81. Amkor Technology Company Details

Table 82. Amkor Technology Business Overview

Table 83. Amkor Technology Through Silicon Via (TSV) Packaging Product

Table 84. Amkor Technology Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025) & (US$ Million)

Table 85. Amkor Technology Recent Development

Table 86. FRT GmbH Company Details

Table 87. FRT GmbH Business Overview

Table 88. FRT GmbH Through Silicon Via (TSV) Packaging Product

Table 89. FRT GmbH Revenue in Through Silicon Via (TSV) Packaging Business (2020-2025) & (US$ Million)

Table 90. FRT GmbH Recent Development

Table 91. Research Programs/Design for This Report

Table 92. Key Data Information from Secondary Sources

Table 93. Key Data Information from Primary Sources

Table 94. Authors List of This Report

List of Figures

Figure 1. Through Silicon Via (TSV) Packaging Picture

Figure 2. Global Through Silicon Via (TSV) Packaging Market Size Comparison by Type (2020-2031) & (US$ Million)

Figure 3. Global Through Silicon Via (TSV) Packaging Market Share by Type: 2024 VS 2031

Figure 4. 2.5D Features

Figure 5. 3D Features

Figure 6. Global Through Silicon Via (TSV) Packaging Market Size by Application (2020-2031) & (US$ Million)

Figure 7. Global Through Silicon Via (TSV) Packaging Market Share by Application: 2024 VS 2031

Figure 8. Memory Arrays Case Studies

Figure 9. Image Sensors Case Studies

Figure 10. Graphics Chips Case Studies

Figure 11. MPUs (Microprocessor Units) Case Studies

Figure 12. DRAM (Dynamic Random Access Memory) Case Studies

Figure 13. Integrated Circuits Case Studies

Figure 14. Others Case Studies

Figure 15. Through Silicon Via (TSV) Packaging Report Years Considered

Figure 16. Global Through Silicon Via (TSV) Packaging Market Size (US$ Million), Year-over-Year: 2020-2031

Figure 17. Global Through Silicon Via (TSV) Packaging Market Size, (US$ Million), 2020 VS 2024 VS 2031

Figure 18. Global Through Silicon Via (TSV) Packaging Market Share by Region: 2024 VS 2031

Figure 19. Global Through Silicon Via (TSV) Packaging Market Share by Players in 2024

Figure 20. Global Top Through Silicon Via (TSV) Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Through Silicon Via (TSV) Packaging as of 2024)

Figure 21. The Top 10 and 5 Players Market Share by Through Silicon Via (TSV) Packaging Revenue in 2024

Figure 22. North America Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 23. North America Through Silicon Via (TSV) Packaging Market Share by Country (2020-2031)

Figure 24. United States Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 25. Canada Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 26. Europe Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 27. Europe Through Silicon Via (TSV) Packaging Market Share by Country (2020-2031)

Figure 28. Germany Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 29. France Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 30. U.K. Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 31. Italy Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 32. Russia Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 33. Nordic Countries Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 34. Asia-Pacific Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 35. Asia-Pacific Through Silicon Via (TSV) Packaging Market Share by Region (2020-2031)

Figure 36. China Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 37. Japan Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 38. South Korea Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 39. Southeast Asia Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 40. India Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 41. Australia Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 42. Latin America Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 43. Latin America Through Silicon Via (TSV) Packaging Market Share by Country (2020-2031)

Figure 44. Mexico Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 45. Brazil Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 46. Middle East & Africa Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 47. Middle East & Africa Through Silicon Via (TSV) Packaging Market Share by Country (2020-2031)

Figure 48. Turkey Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 49. Saudi Arabia Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 50. UAE Through Silicon Via (TSV) Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 51. Applied Materials Revenue Growth Rate in Through Silicon Via (TSV) Packaging Business (2020-2025)

Figure 52. STATS ChipPAC Ltd Revenue Growth Rate in Through Silicon Via (TSV) Packaging Business (2020-2025)

Figure 53. Micralyne, Inc Revenue Growth Rate in Through Silicon Via (TSV) Packaging Business (2020-2025)

Figure 54. Teledyne Revenue Growth Rate in Through Silicon Via (TSV) Packaging Business (2020-2025)

Figure 55. DuPont Revenue Growth Rate in Through Silicon Via (TSV) Packaging Business (2020-2025)

Figure 56. China Wafer Level CSP Co Revenue Growth Rate in Through Silicon Via (TSV) Packaging Business (2020-2025)

Figure 57. Samsung Electronics Revenue Growth Rate in Through Silicon Via (TSV) Packaging Business (2020-2025)

Figure 58. Amkor Technology Revenue Growth Rate in Through Silicon Via (TSV) Packaging Business (2020-2025)

Figure 59. FRT GmbH Revenue Growth Rate in Through Silicon Via (TSV) Packaging Business (2020-2025)

Figure 60. Bottom-up and Top-down Approaches for This Report

Figure 61. Data Triangulation

Figure 62. Key Executives Interviewed

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Global 3D Through Silicon Via TSV Device Market Research Report 2025

Global Through Silicon Vias Solutions Market Research Report 2024

Through Chip Via TSV Packaging Technology Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030

Global Through Silicon Vias TSVs Market Research Report 2024

Global Through Silicon Via TSV Equipment Market Research Report 2024

3D TSV Package Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030

Global 3D TSV Technology Market Research Report 2025

Global 3D TSV Device Market Research Report 2024

Global Through Glass Vias TGV Packaging Solution Market Research Report 2025

Global TSV Electroplating Systems Market Research Report 2025

Global 3D TSV and 2 5D Market Insights Forecast to 2030

Global 2D Silicon Interposer Market Research Report 2025

Semiconductor Grade Packaging Encapsulants Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030

Global Semiconductor IC Packaging Market Research Report 2025

Global 3D TSV Equipment Market Research Report 2024

TGV Substrate for Semiconductor Packaging Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030

Global Advanced Packaging Technologies Market Insights Forecast to 2030

Global TSV Fill Material Market Research Report 2024

Global TSV Silicon Interposer Market Research Report 2025

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