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Global Precision Wafer Dicing Blade Market Research Report 2025
Published Date: May 2025
|
Report Code: QYRE-Auto-1M15101
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Global Precision Wafer Dicing Blade Market Research Report 2023
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Global Precision Wafer Dicing Blade Market Research Report 2025

Code: QYRE-Auto-1M15101
Report
May 2025
Pages:94
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Precision Wafer Dicing Blade Market Size

The global market for Precision Wafer Dicing Blade was valued at US$ 313 million in the year 2024 and is projected to reach a revised size of US$ 493 million by 2031, growing at a CAGR of 6.8% during the forecast period.

Precision Wafer Dicing Blade Market

Precision Wafer Dicing Blade Market

North American market for Precision Wafer Dicing Blade is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Precision Wafer Dicing Blade is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Precision Wafer Dicing Blade include DISCO Corporation, Thermocarbon Inc., Kulicke and Soffa, ADT, Shanghai Sinyang Semiconductor Materials, Shenzhen West Technology Co., Ltd., UKAM, Ceiba, Shanghai Xiyue Machinery Technology Co., Ltd., Zhengzhou Qisheng Precision Manufacturing Co., Ltd., etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Precision Wafer Dicing Blade, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Precision Wafer Dicing Blade.
The Precision Wafer Dicing Blade market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Precision Wafer Dicing Blade market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Precision Wafer Dicing Blade manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Precision Wafer Dicing Blade Market Report

Report Metric Details
Report Name Precision Wafer Dicing Blade Market
Accounted market size in year US$ 313 million
Forecasted market size in 2031 US$ 493 million
CAGR 6.8%
Base Year year
Forecasted years 2025 - 2031
by Type
by Application
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company DISCO Corporation, Thermocarbon Inc., Kulicke and Soffa, ADT, Shanghai Sinyang Semiconductor Materials, Shenzhen West Technology Co., Ltd., UKAM, Ceiba, Shanghai Xiyue Machinery Technology Co., Ltd., Zhengzhou Qisheng Precision Manufacturing Co., Ltd.
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Precision Wafer Dicing Blade manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Precision Wafer Dicing Blade by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Precision Wafer Dicing Blade in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Precision Wafer Dicing Blade Market growing?

Ans: The Precision Wafer Dicing Blade Market witnessing a CAGR of 6.8% during the forecast period 2025-2031.

What is the Precision Wafer Dicing Blade Market size in 2031?

Ans: The Precision Wafer Dicing Blade Market size in 2031 will be US$ 493 million.

Who are the main players in the Precision Wafer Dicing Blade Market report?

Ans: The main players in the Precision Wafer Dicing Blade Market are DISCO Corporation, Thermocarbon Inc., Kulicke and Soffa, ADT, Shanghai Sinyang Semiconductor Materials, Shenzhen West Technology Co., Ltd., UKAM, Ceiba, Shanghai Xiyue Machinery Technology Co., Ltd., Zhengzhou Qisheng Precision Manufacturing Co., Ltd.

What are the Application segmentation covered in the Precision Wafer Dicing Blade Market report?

Ans: The Applications covered in the Precision Wafer Dicing Blade Market report are IC, Discrete Devices, Others

What are the Type segmentation covered in the Precision Wafer Dicing Blade Market report?

Ans: The Types covered in the Precision Wafer Dicing Blade Market report are Metal Wafer Dicing Blade, Resin Wafer Dicing Blade, Electroplated Wafer Dicing Blade

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1 Precision Wafer Dicing Blade Market Overview
1.1 Product Definition
1.2 Precision Wafer Dicing Blade by Type
1.2.1 Global Precision Wafer Dicing Blade Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Metal Wafer Dicing Blade
1.2.3 Resin Wafer Dicing Blade
1.2.4 Electroplated Wafer Dicing Blade
1.3 Precision Wafer Dicing Blade by Application
1.3.1 Global Precision Wafer Dicing Blade Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 IC
1.3.3 Discrete Devices
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Precision Wafer Dicing Blade Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Precision Wafer Dicing Blade Production Estimates and Forecasts (2020-2031)
1.4.4 Global Precision Wafer Dicing Blade Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Precision Wafer Dicing Blade Production Market Share by Manufacturers (2020-2025)
2.2 Global Precision Wafer Dicing Blade Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Precision Wafer Dicing Blade, Industry Ranking, 2023 VS 2024
2.4 Global Precision Wafer Dicing Blade Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Precision Wafer Dicing Blade Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Precision Wafer Dicing Blade, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Precision Wafer Dicing Blade, Product Offered and Application
2.8 Global Key Manufacturers of Precision Wafer Dicing Blade, Date of Enter into This Industry
2.9 Precision Wafer Dicing Blade Market Competitive Situation and Trends
2.9.1 Precision Wafer Dicing Blade Market Concentration Rate
2.9.2 Global 5 and 10 Largest Precision Wafer Dicing Blade Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Precision Wafer Dicing Blade Production by Region
3.1 Global Precision Wafer Dicing Blade Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Precision Wafer Dicing Blade Production Value by Region (2020-2031)
3.2.1 Global Precision Wafer Dicing Blade Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Precision Wafer Dicing Blade by Region (2026-2031)
3.3 Global Precision Wafer Dicing Blade Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Precision Wafer Dicing Blade Production Volume by Region (2020-2031)
3.4.1 Global Precision Wafer Dicing Blade Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Precision Wafer Dicing Blade by Region (2026-2031)
3.5 Global Precision Wafer Dicing Blade Market Price Analysis by Region (2020-2025)
3.6 Global Precision Wafer Dicing Blade Production and Value, Year-over-Year Growth
3.6.1 North America Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Precision Wafer Dicing Blade Production Value Estimates and Forecasts (2020-2031)
4 Precision Wafer Dicing Blade Consumption by Region
4.1 Global Precision Wafer Dicing Blade Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Precision Wafer Dicing Blade Consumption by Region (2020-2031)
4.2.1 Global Precision Wafer Dicing Blade Consumption by Region (2020-2025)
4.2.2 Global Precision Wafer Dicing Blade Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Precision Wafer Dicing Blade Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Precision Wafer Dicing Blade Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Precision Wafer Dicing Blade Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Precision Wafer Dicing Blade Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Precision Wafer Dicing Blade Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Precision Wafer Dicing Blade Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Precision Wafer Dicing Blade Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Precision Wafer Dicing Blade Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Precision Wafer Dicing Blade Production by Type (2020-2031)
5.1.1 Global Precision Wafer Dicing Blade Production by Type (2020-2025)
5.1.2 Global Precision Wafer Dicing Blade Production by Type (2026-2031)
5.1.3 Global Precision Wafer Dicing Blade Production Market Share by Type (2020-2031)
5.2 Global Precision Wafer Dicing Blade Production Value by Type (2020-2031)
5.2.1 Global Precision Wafer Dicing Blade Production Value by Type (2020-2025)
5.2.2 Global Precision Wafer Dicing Blade Production Value by Type (2026-2031)
5.2.3 Global Precision Wafer Dicing Blade Production Value Market Share by Type (2020-2031)
5.3 Global Precision Wafer Dicing Blade Price by Type (2020-2031)
6 Segment by Application
6.1 Global Precision Wafer Dicing Blade Production by Application (2020-2031)
6.1.1 Global Precision Wafer Dicing Blade Production by Application (2020-2025)
6.1.2 Global Precision Wafer Dicing Blade Production by Application (2026-2031)
6.1.3 Global Precision Wafer Dicing Blade Production Market Share by Application (2020-2031)
6.2 Global Precision Wafer Dicing Blade Production Value by Application (2020-2031)
6.2.1 Global Precision Wafer Dicing Blade Production Value by Application (2020-2025)
6.2.2 Global Precision Wafer Dicing Blade Production Value by Application (2026-2031)
6.2.3 Global Precision Wafer Dicing Blade Production Value Market Share by Application (2020-2031)
6.3 Global Precision Wafer Dicing Blade Price by Application (2020-2031)
7 Key Companies Profiled
7.1 DISCO Corporation
7.1.1 DISCO Corporation Precision Wafer Dicing Blade Company Information
7.1.2 DISCO Corporation Precision Wafer Dicing Blade Product Portfolio
7.1.3 DISCO Corporation Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2020-2025)
7.1.4 DISCO Corporation Main Business and Markets Served
7.1.5 DISCO Corporation Recent Developments/Updates
7.2 Thermocarbon Inc.
7.2.1 Thermocarbon Inc. Precision Wafer Dicing Blade Company Information
7.2.2 Thermocarbon Inc. Precision Wafer Dicing Blade Product Portfolio
7.2.3 Thermocarbon Inc. Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Thermocarbon Inc. Main Business and Markets Served
7.2.5 Thermocarbon Inc. Recent Developments/Updates
7.3 Kulicke and Soffa
7.3.1 Kulicke and Soffa Precision Wafer Dicing Blade Company Information
7.3.2 Kulicke and Soffa Precision Wafer Dicing Blade Product Portfolio
7.3.3 Kulicke and Soffa Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Kulicke and Soffa Main Business and Markets Served
7.3.5 Kulicke and Soffa Recent Developments/Updates
7.4 ADT
7.4.1 ADT Precision Wafer Dicing Blade Company Information
7.4.2 ADT Precision Wafer Dicing Blade Product Portfolio
7.4.3 ADT Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2020-2025)
7.4.4 ADT Main Business and Markets Served
7.4.5 ADT Recent Developments/Updates
7.5 Shanghai Sinyang Semiconductor Materials
7.5.1 Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Company Information
7.5.2 Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Product Portfolio
7.5.3 Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Shanghai Sinyang Semiconductor Materials Main Business and Markets Served
7.5.5 Shanghai Sinyang Semiconductor Materials Recent Developments/Updates
7.6 Shenzhen West Technology Co., Ltd.
7.6.1 Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Company Information
7.6.2 Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Product Portfolio
7.6.3 Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Shenzhen West Technology Co., Ltd. Main Business and Markets Served
7.6.5 Shenzhen West Technology Co., Ltd. Recent Developments/Updates
7.7 UKAM
7.7.1 UKAM Precision Wafer Dicing Blade Company Information
7.7.2 UKAM Precision Wafer Dicing Blade Product Portfolio
7.7.3 UKAM Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2020-2025)
7.7.4 UKAM Main Business and Markets Served
7.7.5 UKAM Recent Developments/Updates
7.8 Ceiba
7.8.1 Ceiba Precision Wafer Dicing Blade Company Information
7.8.2 Ceiba Precision Wafer Dicing Blade Product Portfolio
7.8.3 Ceiba Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Ceiba Main Business and Markets Served
7.8.5 Ceiba Recent Developments/Updates
7.9 Shanghai Xiyue Machinery Technology Co., Ltd.
7.9.1 Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Company Information
7.9.2 Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Product Portfolio
7.9.3 Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Shanghai Xiyue Machinery Technology Co., Ltd. Main Business and Markets Served
7.9.5 Shanghai Xiyue Machinery Technology Co., Ltd. Recent Developments/Updates
7.10 Zhengzhou Qisheng Precision Manufacturing Co., Ltd.
7.10.1 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Company Information
7.10.2 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Product Portfolio
7.10.3 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Main Business and Markets Served
7.10.5 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Precision Wafer Dicing Blade Industry Chain Analysis
8.2 Precision Wafer Dicing Blade Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Precision Wafer Dicing Blade Production Mode & Process Analysis
8.4 Precision Wafer Dicing Blade Sales and Marketing
8.4.1 Precision Wafer Dicing Blade Sales Channels
8.4.2 Precision Wafer Dicing Blade Distributors
8.5 Precision Wafer Dicing Blade Customer Analysis
9 Precision Wafer Dicing Blade Market Dynamics
9.1 Precision Wafer Dicing Blade Industry Trends
9.2 Precision Wafer Dicing Blade Market Drivers
9.3 Precision Wafer Dicing Blade Market Challenges
9.4 Precision Wafer Dicing Blade Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Precision Wafer Dicing Blade Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Precision Wafer Dicing Blade Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Precision Wafer Dicing Blade Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global Precision Wafer Dicing Blade Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global Precision Wafer Dicing Blade Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Precision Wafer Dicing Blade Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Precision Wafer Dicing Blade Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Precision Wafer Dicing Blade, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Precision Wafer Dicing Blade as of 2024)
 Table 10. Global Market Precision Wafer Dicing Blade Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Precision Wafer Dicing Blade, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Precision Wafer Dicing Blade, Product Offered and Application
 Table 13. Global Key Manufacturers of Precision Wafer Dicing Blade, Date of Enter into This Industry
 Table 14. Global Precision Wafer Dicing Blade Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Precision Wafer Dicing Blade Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Precision Wafer Dicing Blade Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Precision Wafer Dicing Blade Production Value Market Share by Region (2020-2025)
 Table 19. Global Precision Wafer Dicing Blade Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Precision Wafer Dicing Blade Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Precision Wafer Dicing Blade Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global Precision Wafer Dicing Blade Production (K Units) by Region (2020-2025)
 Table 23. Global Precision Wafer Dicing Blade Production Market Share by Region (2020-2025)
 Table 24. Global Precision Wafer Dicing Blade Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global Precision Wafer Dicing Blade Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Precision Wafer Dicing Blade Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global Precision Wafer Dicing Blade Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global Precision Wafer Dicing Blade Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global Precision Wafer Dicing Blade Consumption by Region (2020-2025) & (K Units)
 Table 30. Global Precision Wafer Dicing Blade Consumption Market Share by Region (2020-2025)
 Table 31. Global Precision Wafer Dicing Blade Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global Precision Wafer Dicing Blade Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Precision Wafer Dicing Blade Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America Precision Wafer Dicing Blade Consumption by Country (2020-2025) & (K Units)
 Table 35. North America Precision Wafer Dicing Blade Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe Precision Wafer Dicing Blade Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe Precision Wafer Dicing Blade Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe Precision Wafer Dicing Blade Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific Precision Wafer Dicing Blade Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific Precision Wafer Dicing Blade Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific Precision Wafer Dicing Blade Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa Precision Wafer Dicing Blade Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa Precision Wafer Dicing Blade Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa Precision Wafer Dicing Blade Consumption by Country (2026-2031) & (K Units)
 Table 45. Global Precision Wafer Dicing Blade Production (K Units) by Type (2020-2025)
 Table 46. Global Precision Wafer Dicing Blade Production (K Units) by Type (2026-2031)
 Table 47. Global Precision Wafer Dicing Blade Production Market Share by Type (2020-2025)
 Table 48. Global Precision Wafer Dicing Blade Production Market Share by Type (2026-2031)
 Table 49. Global Precision Wafer Dicing Blade Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Precision Wafer Dicing Blade Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Precision Wafer Dicing Blade Production Value Market Share by Type (2020-2025)
 Table 52. Global Precision Wafer Dicing Blade Production Value Market Share by Type (2026-2031)
 Table 53. Global Precision Wafer Dicing Blade Price (US$/Unit) by Type (2020-2025)
 Table 54. Global Precision Wafer Dicing Blade Price (US$/Unit) by Type (2026-2031)
 Table 55. Global Precision Wafer Dicing Blade Production (K Units) by Application (2020-2025)
 Table 56. Global Precision Wafer Dicing Blade Production (K Units) by Application (2026-2031)
 Table 57. Global Precision Wafer Dicing Blade Production Market Share by Application (2020-2025)
 Table 58. Global Precision Wafer Dicing Blade Production Market Share by Application (2026-2031)
 Table 59. Global Precision Wafer Dicing Blade Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Precision Wafer Dicing Blade Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Precision Wafer Dicing Blade Production Value Market Share by Application (2020-2025)
 Table 62. Global Precision Wafer Dicing Blade Production Value Market Share by Application (2026-2031)
 Table 63. Global Precision Wafer Dicing Blade Price (US$/Unit) by Application (2020-2025)
 Table 64. Global Precision Wafer Dicing Blade Price (US$/Unit) by Application (2026-2031)
 Table 65. DISCO Corporation Precision Wafer Dicing Blade Company Information
 Table 66. DISCO Corporation Precision Wafer Dicing Blade Specification and Application
 Table 67. DISCO Corporation Precision Wafer Dicing Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. DISCO Corporation Main Business and Markets Served
 Table 69. DISCO Corporation Recent Developments/Updates
 Table 70. Thermocarbon Inc. Precision Wafer Dicing Blade Company Information
 Table 71. Thermocarbon Inc. Precision Wafer Dicing Blade Specification and Application
 Table 72. Thermocarbon Inc. Precision Wafer Dicing Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. Thermocarbon Inc. Main Business and Markets Served
 Table 74. Thermocarbon Inc. Recent Developments/Updates
 Table 75. Kulicke and Soffa Precision Wafer Dicing Blade Company Information
 Table 76. Kulicke and Soffa Precision Wafer Dicing Blade Specification and Application
 Table 77. Kulicke and Soffa Precision Wafer Dicing Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. Kulicke and Soffa Main Business and Markets Served
 Table 79. Kulicke and Soffa Recent Developments/Updates
 Table 80. ADT Precision Wafer Dicing Blade Company Information
 Table 81. ADT Precision Wafer Dicing Blade Specification and Application
 Table 82. ADT Precision Wafer Dicing Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. ADT Main Business and Markets Served
 Table 84. ADT Recent Developments/Updates
 Table 85. Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Company Information
 Table 86. Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Specification and Application
 Table 87. Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. Shanghai Sinyang Semiconductor Materials Main Business and Markets Served
 Table 89. Shanghai Sinyang Semiconductor Materials Recent Developments/Updates
 Table 90. Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Company Information
 Table 91. Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Specification and Application
 Table 92. Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. Shenzhen West Technology Co., Ltd. Main Business and Markets Served
 Table 94. Shenzhen West Technology Co., Ltd. Recent Developments/Updates
 Table 95. UKAM Precision Wafer Dicing Blade Company Information
 Table 96. UKAM Precision Wafer Dicing Blade Specification and Application
 Table 97. UKAM Precision Wafer Dicing Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. UKAM Main Business and Markets Served
 Table 99. UKAM Recent Developments/Updates
 Table 100. Ceiba Precision Wafer Dicing Blade Company Information
 Table 101. Ceiba Precision Wafer Dicing Blade Specification and Application
 Table 102. Ceiba Precision Wafer Dicing Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 103. Ceiba Main Business and Markets Served
 Table 104. Ceiba Recent Developments/Updates
 Table 105. Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Company Information
 Table 106. Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Specification and Application
 Table 107. Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 108. Shanghai Xiyue Machinery Technology Co., Ltd. Main Business and Markets Served
 Table 109. Shanghai Xiyue Machinery Technology Co., Ltd. Recent Developments/Updates
 Table 110. Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Company Information
 Table 111. Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Specification and Application
 Table 112. Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 113. Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Main Business and Markets Served
 Table 114. Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Recent Developments/Updates
 Table 115. Key Raw Materials Lists
 Table 116. Raw Materials Key Suppliers Lists
 Table 117. Precision Wafer Dicing Blade Distributors List
 Table 118. Precision Wafer Dicing Blade Customers List
 Table 119. Precision Wafer Dicing Blade Market Trends
 Table 120. Precision Wafer Dicing Blade Market Drivers
 Table 121. Precision Wafer Dicing Blade Market Challenges
 Table 122. Precision Wafer Dicing Blade Market Restraints
 Table 123. Research Programs/Design for This Report
 Table 124. Key Data Information from Secondary Sources
 Table 125. Key Data Information from Primary Sources
 Table 126. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Precision Wafer Dicing Blade
 Figure 2. Global Precision Wafer Dicing Blade Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Precision Wafer Dicing Blade Market Share by Type: 2024 VS 2031
 Figure 4. Metal Wafer Dicing Blade Product Picture
 Figure 5. Resin Wafer Dicing Blade Product Picture
 Figure 6. Electroplated Wafer Dicing Blade Product Picture
 Figure 7. Global Precision Wafer Dicing Blade Market Value by Application, (US$ Million) & (2020-2031)
 Figure 8. Global Precision Wafer Dicing Blade Market Share by Application: 2024 VS 2031
 Figure 9. IC
 Figure 10. Discrete Devices
 Figure 11. Others
 Figure 12. Global Precision Wafer Dicing Blade Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 13. Global Precision Wafer Dicing Blade Production Value (US$ Million) & (2020-2031)
 Figure 14. Global Precision Wafer Dicing Blade Production Capacity (K Units) & (2020-2031)
 Figure 15. Global Precision Wafer Dicing Blade Production (K Units) & (2020-2031)
 Figure 16. Global Precision Wafer Dicing Blade Average Price (US$/Unit) & (2020-2031)
 Figure 17. Precision Wafer Dicing Blade Report Years Considered
 Figure 18. Precision Wafer Dicing Blade Production Share by Manufacturers in 2024
 Figure 19. Global Precision Wafer Dicing Blade Production Value Share by Manufacturers (2024)
 Figure 20. Precision Wafer Dicing Blade Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 21. The Global 5 and 10 Largest Players: Market Share by Precision Wafer Dicing Blade Revenue in 2024
 Figure 22. Global Precision Wafer Dicing Blade Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 23. Global Precision Wafer Dicing Blade Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 24. Global Precision Wafer Dicing Blade Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 25. Global Precision Wafer Dicing Blade Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 26. North America Precision Wafer Dicing Blade Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 27. Europe Precision Wafer Dicing Blade Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. China Precision Wafer Dicing Blade Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Japan Precision Wafer Dicing Blade Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. South Korea Precision Wafer Dicing Blade Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. Global Precision Wafer Dicing Blade Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 32. Global Precision Wafer Dicing Blade Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 33. North America Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 34. North America Precision Wafer Dicing Blade Consumption Market Share by Country (2020-2031)
 Figure 35. U.S. Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 36. Canada Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 37. Europe Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 38. Europe Precision Wafer Dicing Blade Consumption Market Share by Country (2020-2031)
 Figure 39. Germany Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 40. France Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 41. U.K. Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 42. Italy Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. Netherlands Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. Asia Pacific Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. Asia Pacific Precision Wafer Dicing Blade Consumption Market Share by Region (2020-2031)
 Figure 46. China Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Japan Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 48. South Korea Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 49. China Taiwan Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. Southeast Asia Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 51. India Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. Latin America, Middle East & Africa Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. Latin America, Middle East & Africa Precision Wafer Dicing Blade Consumption Market Share by Country (2020-2031)
 Figure 54. Mexico Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Brazil Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 56. Israel Precision Wafer Dicing Blade Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 57. Global Production Market Share of Precision Wafer Dicing Blade by Type (2020-2031)
 Figure 58. Global Production Value Market Share of Precision Wafer Dicing Blade by Type (2020-2031)
 Figure 59. Global Precision Wafer Dicing Blade Price (US$/Unit) by Type (2020-2031)
 Figure 60. Global Production Market Share of Precision Wafer Dicing Blade by Application (2020-2031)
 Figure 61. Global Production Value Market Share of Precision Wafer Dicing Blade by Application (2020-2031)
 Figure 62. Global Precision Wafer Dicing Blade Price (US$/Unit) by Application (2020-2031)
 Figure 63. Precision Wafer Dicing Blade Value Chain
 Figure 64. Channels of Distribution (Direct Vs Distribution)
 Figure 65. Bottom-up and Top-down Approaches for This Report
 Figure 66. Data Triangulation
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