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Global Chip Packaging COF Substrate Market Research Report 2025
Published Date: May 2025
|
Report Code: QYRE-Auto-21X14810
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Global Chip Packaging COF Substrate Market Research Report 2023
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Global Chip Packaging COF Substrate Market Research Report 2025

Code: QYRE-Auto-21X14810
Report
May 2025
Pages:89
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Chip Packaging COF Substrate Market

The global market for Chip Packaging COF Substrate was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
The chip packaging COF substrate is the key to the current screen transformation. The main principle is to put the display driver IC chip into the flexible FPC cable, and then use the characteristics of the FPC itself to fold it to the bottom of the screen. Specifically, through thermocompression bonding, the gold bumps of the IC chip and the inner pins on the flexible substrate circuit will be combined. Since the space occupied by the IC chip is released, generally speaking, the width of the lower frame can be reduced by at least 1.5mm.
North American market for Chip Packaging COF Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Chip Packaging COF Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Chip Packaging COF Substrate include STEMCO, JMCT, LGIT, FLEXCEED, Chipbond, Shenzhen Danbond Technology Co.Ltd, Leader-Tech Electronics (Shenzhen) Co.,Ltd, Suzhou Hengmairui Material Technology Co., Ltd, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Chip Packaging COF Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Packaging COF Substrate.
The Chip Packaging COF Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Chip Packaging COF Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Packaging COF Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Chip Packaging COF Substrate Market Report

Report Metric Details
Report Name Chip Packaging COF Substrate Market
by Type
by Application
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company STEMCO, JMCT, LGIT, FLEXCEED, Chipbond, Shenzhen Danbond Technology Co.Ltd, Leader-Tech Electronics (Shenzhen) Co.,Ltd, Suzhou Hengmairui Material Technology Co., Ltd
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Chip Packaging COF Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Chip Packaging COF Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Chip Packaging COF Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the Chip Packaging COF Substrate Market report?

Ans: The main players in the Chip Packaging COF Substrate Market are STEMCO, JMCT, LGIT, FLEXCEED, Chipbond, Shenzhen Danbond Technology Co.Ltd, Leader-Tech Electronics (Shenzhen) Co.,Ltd, Suzhou Hengmairui Material Technology Co., Ltd

What are the Application segmentation covered in the Chip Packaging COF Substrate Market report?

Ans: The Applications covered in the Chip Packaging COF Substrate Market report are LCD TV, Laptop, Cell Phone, MP3, Others

What are the Type segmentation covered in the Chip Packaging COF Substrate Market report?

Ans: The Types covered in the Chip Packaging COF Substrate Market report are Single Layer, Double Layer

Recommended Reports

Chip Packaging Substrates

IC and Glass Substrates

COF & Flip-Chip

1 Chip Packaging COF Substrate Market Overview
1.1 Product Definition
1.2 Chip Packaging COF Substrate by Type
1.2.1 Global Chip Packaging COF Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Single Layer
1.2.3 Double Layer
1.3 Chip Packaging COF Substrate by Application
1.3.1 Global Chip Packaging COF Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 LCD TV
1.3.3 Laptop
1.3.4 Cell Phone
1.3.5 MP3
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Chip Packaging COF Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Chip Packaging COF Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Chip Packaging COF Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global Chip Packaging COF Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Chip Packaging COF Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global Chip Packaging COF Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Chip Packaging COF Substrate, Industry Ranking, 2023 VS 2024
2.4 Global Chip Packaging COF Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Chip Packaging COF Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Chip Packaging COF Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Chip Packaging COF Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Chip Packaging COF Substrate, Date of Enter into This Industry
2.9 Chip Packaging COF Substrate Market Competitive Situation and Trends
2.9.1 Chip Packaging COF Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Chip Packaging COF Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Chip Packaging COF Substrate Production by Region
3.1 Global Chip Packaging COF Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Chip Packaging COF Substrate Production Value by Region (2020-2031)
3.2.1 Global Chip Packaging COF Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Chip Packaging COF Substrate by Region (2026-2031)
3.3 Global Chip Packaging COF Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Chip Packaging COF Substrate Production Volume by Region (2020-2031)
3.4.1 Global Chip Packaging COF Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Chip Packaging COF Substrate by Region (2026-2031)
3.5 Global Chip Packaging COF Substrate Market Price Analysis by Region (2020-2025)
3.6 Global Chip Packaging COF Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Chip Packaging COF Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Chip Packaging COF Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Chip Packaging COF Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Chip Packaging COF Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Chip Packaging COF Substrate Production Value Estimates and Forecasts (2020-2031)
4 Chip Packaging COF Substrate Consumption by Region
4.1 Global Chip Packaging COF Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Chip Packaging COF Substrate Consumption by Region (2020-2031)
4.2.1 Global Chip Packaging COF Substrate Consumption by Region (2020-2025)
4.2.2 Global Chip Packaging COF Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Chip Packaging COF Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Chip Packaging COF Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Chip Packaging COF Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Chip Packaging COF Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Chip Packaging COF Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Chip Packaging COF Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Chip Packaging COF Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Chip Packaging COF Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Chip Packaging COF Substrate Production by Type (2020-2031)
5.1.1 Global Chip Packaging COF Substrate Production by Type (2020-2025)
5.1.2 Global Chip Packaging COF Substrate Production by Type (2026-2031)
5.1.3 Global Chip Packaging COF Substrate Production Market Share by Type (2020-2031)
5.2 Global Chip Packaging COF Substrate Production Value by Type (2020-2031)
5.2.1 Global Chip Packaging COF Substrate Production Value by Type (2020-2025)
5.2.2 Global Chip Packaging COF Substrate Production Value by Type (2026-2031)
5.2.3 Global Chip Packaging COF Substrate Production Value Market Share by Type (2020-2031)
5.3 Global Chip Packaging COF Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global Chip Packaging COF Substrate Production by Application (2020-2031)
6.1.1 Global Chip Packaging COF Substrate Production by Application (2020-2025)
6.1.2 Global Chip Packaging COF Substrate Production by Application (2026-2031)
6.1.3 Global Chip Packaging COF Substrate Production Market Share by Application (2020-2031)
6.2 Global Chip Packaging COF Substrate Production Value by Application (2020-2031)
6.2.1 Global Chip Packaging COF Substrate Production Value by Application (2020-2025)
6.2.2 Global Chip Packaging COF Substrate Production Value by Application (2026-2031)
6.2.3 Global Chip Packaging COF Substrate Production Value Market Share by Application (2020-2031)
6.3 Global Chip Packaging COF Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 STEMCO
7.1.1 STEMCO Chip Packaging COF Substrate Company Information
7.1.2 STEMCO Chip Packaging COF Substrate Product Portfolio
7.1.3 STEMCO Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 STEMCO Main Business and Markets Served
7.1.5 STEMCO Recent Developments/Updates
7.2 JMCT
7.2.1 JMCT Chip Packaging COF Substrate Company Information
7.2.2 JMCT Chip Packaging COF Substrate Product Portfolio
7.2.3 JMCT Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 JMCT Main Business and Markets Served
7.2.5 JMCT Recent Developments/Updates
7.3 LGIT
7.3.1 LGIT Chip Packaging COF Substrate Company Information
7.3.2 LGIT Chip Packaging COF Substrate Product Portfolio
7.3.3 LGIT Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 LGIT Main Business and Markets Served
7.3.5 LGIT Recent Developments/Updates
7.4 FLEXCEED
7.4.1 FLEXCEED Chip Packaging COF Substrate Company Information
7.4.2 FLEXCEED Chip Packaging COF Substrate Product Portfolio
7.4.3 FLEXCEED Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 FLEXCEED Main Business and Markets Served
7.4.5 FLEXCEED Recent Developments/Updates
7.5 Chipbond
7.5.1 Chipbond Chip Packaging COF Substrate Company Information
7.5.2 Chipbond Chip Packaging COF Substrate Product Portfolio
7.5.3 Chipbond Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Chipbond Main Business and Markets Served
7.5.5 Chipbond Recent Developments/Updates
7.6 Shenzhen Danbond Technology Co.Ltd
7.6.1 Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Company Information
7.6.2 Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Product Portfolio
7.6.3 Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Shenzhen Danbond Technology Co.Ltd Main Business and Markets Served
7.6.5 Shenzhen Danbond Technology Co.Ltd Recent Developments/Updates
7.7 Leader-Tech Electronics (Shenzhen) Co.,Ltd
7.7.1 Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Company Information
7.7.2 Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Product Portfolio
7.7.3 Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Leader-Tech Electronics (Shenzhen) Co.,Ltd Main Business and Markets Served
7.7.5 Leader-Tech Electronics (Shenzhen) Co.,Ltd Recent Developments/Updates
7.8 Suzhou Hengmairui Material Technology Co., Ltd
7.8.1 Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Company Information
7.8.2 Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Product Portfolio
7.8.3 Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Suzhou Hengmairui Material Technology Co., Ltd Main Business and Markets Served
7.8.5 Suzhou Hengmairui Material Technology Co., Ltd Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Chip Packaging COF Substrate Industry Chain Analysis
8.2 Chip Packaging COF Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Chip Packaging COF Substrate Production Mode & Process Analysis
8.4 Chip Packaging COF Substrate Sales and Marketing
8.4.1 Chip Packaging COF Substrate Sales Channels
8.4.2 Chip Packaging COF Substrate Distributors
8.5 Chip Packaging COF Substrate Customer Analysis
9 Chip Packaging COF Substrate Market Dynamics
9.1 Chip Packaging COF Substrate Industry Trends
9.2 Chip Packaging COF Substrate Market Drivers
9.3 Chip Packaging COF Substrate Market Challenges
9.4 Chip Packaging COF Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Chip Packaging COF Substrate Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Chip Packaging COF Substrate Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Chip Packaging COF Substrate Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global Chip Packaging COF Substrate Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global Chip Packaging COF Substrate Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Chip Packaging COF Substrate Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Chip Packaging COF Substrate Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Chip Packaging COF Substrate, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Chip Packaging COF Substrate as of 2024)
 Table 10. Global Market Chip Packaging COF Substrate Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Chip Packaging COF Substrate, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Chip Packaging COF Substrate, Product Offered and Application
 Table 13. Global Key Manufacturers of Chip Packaging COF Substrate, Date of Enter into This Industry
 Table 14. Global Chip Packaging COF Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Chip Packaging COF Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Chip Packaging COF Substrate Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Chip Packaging COF Substrate Production Value Market Share by Region (2020-2025)
 Table 19. Global Chip Packaging COF Substrate Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Chip Packaging COF Substrate Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Chip Packaging COF Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global Chip Packaging COF Substrate Production (K Units) by Region (2020-2025)
 Table 23. Global Chip Packaging COF Substrate Production Market Share by Region (2020-2025)
 Table 24. Global Chip Packaging COF Substrate Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global Chip Packaging COF Substrate Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Chip Packaging COF Substrate Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global Chip Packaging COF Substrate Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global Chip Packaging COF Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global Chip Packaging COF Substrate Consumption by Region (2020-2025) & (K Units)
 Table 30. Global Chip Packaging COF Substrate Consumption Market Share by Region (2020-2025)
 Table 31. Global Chip Packaging COF Substrate Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global Chip Packaging COF Substrate Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Chip Packaging COF Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America Chip Packaging COF Substrate Consumption by Country (2020-2025) & (K Units)
 Table 35. North America Chip Packaging COF Substrate Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe Chip Packaging COF Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe Chip Packaging COF Substrate Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe Chip Packaging COF Substrate Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific Chip Packaging COF Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific Chip Packaging COF Substrate Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific Chip Packaging COF Substrate Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa Chip Packaging COF Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa Chip Packaging COF Substrate Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa Chip Packaging COF Substrate Consumption by Country (2026-2031) & (K Units)
 Table 45. Global Chip Packaging COF Substrate Production (K Units) by Type (2020-2025)
 Table 46. Global Chip Packaging COF Substrate Production (K Units) by Type (2026-2031)
 Table 47. Global Chip Packaging COF Substrate Production Market Share by Type (2020-2025)
 Table 48. Global Chip Packaging COF Substrate Production Market Share by Type (2026-2031)
 Table 49. Global Chip Packaging COF Substrate Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Chip Packaging COF Substrate Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Chip Packaging COF Substrate Production Value Market Share by Type (2020-2025)
 Table 52. Global Chip Packaging COF Substrate Production Value Market Share by Type (2026-2031)
 Table 53. Global Chip Packaging COF Substrate Price (US$/Unit) by Type (2020-2025)
 Table 54. Global Chip Packaging COF Substrate Price (US$/Unit) by Type (2026-2031)
 Table 55. Global Chip Packaging COF Substrate Production (K Units) by Application (2020-2025)
 Table 56. Global Chip Packaging COF Substrate Production (K Units) by Application (2026-2031)
 Table 57. Global Chip Packaging COF Substrate Production Market Share by Application (2020-2025)
 Table 58. Global Chip Packaging COF Substrate Production Market Share by Application (2026-2031)
 Table 59. Global Chip Packaging COF Substrate Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Chip Packaging COF Substrate Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Chip Packaging COF Substrate Production Value Market Share by Application (2020-2025)
 Table 62. Global Chip Packaging COF Substrate Production Value Market Share by Application (2026-2031)
 Table 63. Global Chip Packaging COF Substrate Price (US$/Unit) by Application (2020-2025)
 Table 64. Global Chip Packaging COF Substrate Price (US$/Unit) by Application (2026-2031)
 Table 65. STEMCO Chip Packaging COF Substrate Company Information
 Table 66. STEMCO Chip Packaging COF Substrate Specification and Application
 Table 67. STEMCO Chip Packaging COF Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. STEMCO Main Business and Markets Served
 Table 69. STEMCO Recent Developments/Updates
 Table 70. JMCT Chip Packaging COF Substrate Company Information
 Table 71. JMCT Chip Packaging COF Substrate Specification and Application
 Table 72. JMCT Chip Packaging COF Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. JMCT Main Business and Markets Served
 Table 74. JMCT Recent Developments/Updates
 Table 75. LGIT Chip Packaging COF Substrate Company Information
 Table 76. LGIT Chip Packaging COF Substrate Specification and Application
 Table 77. LGIT Chip Packaging COF Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. LGIT Main Business and Markets Served
 Table 79. LGIT Recent Developments/Updates
 Table 80. FLEXCEED Chip Packaging COF Substrate Company Information
 Table 81. FLEXCEED Chip Packaging COF Substrate Specification and Application
 Table 82. FLEXCEED Chip Packaging COF Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. FLEXCEED Main Business and Markets Served
 Table 84. FLEXCEED Recent Developments/Updates
 Table 85. Chipbond Chip Packaging COF Substrate Company Information
 Table 86. Chipbond Chip Packaging COF Substrate Specification and Application
 Table 87. Chipbond Chip Packaging COF Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. Chipbond Main Business and Markets Served
 Table 89. Chipbond Recent Developments/Updates
 Table 90. Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Company Information
 Table 91. Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Specification and Application
 Table 92. Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. Shenzhen Danbond Technology Co.Ltd Main Business and Markets Served
 Table 94. Shenzhen Danbond Technology Co.Ltd Recent Developments/Updates
 Table 95. Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Company Information
 Table 96. Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Specification and Application
 Table 97. Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. Leader-Tech Electronics (Shenzhen) Co.,Ltd Main Business and Markets Served
 Table 99. Leader-Tech Electronics (Shenzhen) Co.,Ltd Recent Developments/Updates
 Table 100. Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Company Information
 Table 101. Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Specification and Application
 Table 102. Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 103. Suzhou Hengmairui Material Technology Co., Ltd Main Business and Markets Served
 Table 104. Suzhou Hengmairui Material Technology Co., Ltd Recent Developments/Updates
 Table 105. Key Raw Materials Lists
 Table 106. Raw Materials Key Suppliers Lists
 Table 107. Chip Packaging COF Substrate Distributors List
 Table 108. Chip Packaging COF Substrate Customers List
 Table 109. Chip Packaging COF Substrate Market Trends
 Table 110. Chip Packaging COF Substrate Market Drivers
 Table 111. Chip Packaging COF Substrate Market Challenges
 Table 112. Chip Packaging COF Substrate Market Restraints
 Table 113. Research Programs/Design for This Report
 Table 114. Key Data Information from Secondary Sources
 Table 115. Key Data Information from Primary Sources
 Table 116. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Chip Packaging COF Substrate
 Figure 2. Global Chip Packaging COF Substrate Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Chip Packaging COF Substrate Market Share by Type: 2024 VS 2031
 Figure 4. Single Layer Product Picture
 Figure 5. Double Layer Product Picture
 Figure 6. Global Chip Packaging COF Substrate Market Value by Application, (US$ Million) & (2020-2031)
 Figure 7. Global Chip Packaging COF Substrate Market Share by Application: 2024 VS 2031
 Figure 8. LCD TV
 Figure 9. Laptop
 Figure 10. Cell Phone
 Figure 11. MP3
 Figure 12. Others
 Figure 13. Global Chip Packaging COF Substrate Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 14. Global Chip Packaging COF Substrate Production Value (US$ Million) & (2020-2031)
 Figure 15. Global Chip Packaging COF Substrate Production Capacity (K Units) & (2020-2031)
 Figure 16. Global Chip Packaging COF Substrate Production (K Units) & (2020-2031)
 Figure 17. Global Chip Packaging COF Substrate Average Price (US$/Unit) & (2020-2031)
 Figure 18. Chip Packaging COF Substrate Report Years Considered
 Figure 19. Chip Packaging COF Substrate Production Share by Manufacturers in 2024
 Figure 20. Global Chip Packaging COF Substrate Production Value Share by Manufacturers (2024)
 Figure 21. Chip Packaging COF Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 22. The Global 5 and 10 Largest Players: Market Share by Chip Packaging COF Substrate Revenue in 2024
 Figure 23. Global Chip Packaging COF Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 24. Global Chip Packaging COF Substrate Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 25. Global Chip Packaging COF Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 26. Global Chip Packaging COF Substrate Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 27. North America Chip Packaging COF Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. Europe Chip Packaging COF Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. China Chip Packaging COF Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Japan Chip Packaging COF Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. South Korea Chip Packaging COF Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. Global Chip Packaging COF Substrate Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 33. Global Chip Packaging COF Substrate Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 34. North America Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 35. North America Chip Packaging COF Substrate Consumption Market Share by Country (2020-2031)
 Figure 36. U.S. Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 37. Canada Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 38. Europe Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 39. Europe Chip Packaging COF Substrate Consumption Market Share by Country (2020-2031)
 Figure 40. Germany Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 41. France Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 42. U.K. Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. Italy Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. Netherlands Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. Asia Pacific Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 46. Asia Pacific Chip Packaging COF Substrate Consumption Market Share by Region (2020-2031)
 Figure 47. China Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 48. Japan Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 49. South Korea Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. China Taiwan Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 51. Southeast Asia Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. India Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. Latin America, Middle East & Africa Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 54. Latin America, Middle East & Africa Chip Packaging COF Substrate Consumption Market Share by Country (2020-2031)
 Figure 55. Mexico Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 56. Brazil Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 57. Israel Chip Packaging COF Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 58. Global Production Market Share of Chip Packaging COF Substrate by Type (2020-2031)
 Figure 59. Global Production Value Market Share of Chip Packaging COF Substrate by Type (2020-2031)
 Figure 60. Global Chip Packaging COF Substrate Price (US$/Unit) by Type (2020-2031)
 Figure 61. Global Production Market Share of Chip Packaging COF Substrate by Application (2020-2031)
 Figure 62. Global Production Value Market Share of Chip Packaging COF Substrate by Application (2020-2031)
 Figure 63. Global Chip Packaging COF Substrate Price (US$/Unit) by Application (2020-2031)
 Figure 64. Chip Packaging COF Substrate Value Chain
 Figure 65. Channels of Distribution (Direct Vs Distribution)
 Figure 66. Bottom-up and Top-down Approaches for This Report
 Figure 67. Data Triangulation
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