The global SiC Wafer Laser Modified Cutting Equipment market was valued at US$ 102.6 million in 2023 and is anticipated to reach US$ 217.5 million by 2030, witnessing a CAGR of 12.0% during the forecast period 2024-2030.

SiC Wafer Laser Modified Cutting Equipment Market

According to our Semiconductor Research Center, in 2022, the global SiC wafer was valued at US$ 750 million, will grow rapidly in next six years, driven by the strong demand from electric vehicle (EV). Currently the 6 inch SiC substrates are dominating this market, and in next six years, more players will put into production the 8 inch SiC wafers. Currently the key players of SiC are mainly located headquartered United States, Europe, Japan and China, especially in China, more companies are entering the SiC market. It is predicted that, Chinese companies will play key roles in the SiC market in next ten years.

This report aims to provide a comprehensive presentation of the global market for SiC Wafer Laser Modified Cutting Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Laser Modified Cutting Equipment.

Report Scope

The SiC Wafer Laser Modified Cutting Equipment market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global SiC Wafer Laser Modified Cutting Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the SiC Wafer Laser Modified Cutting Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of SiC Wafer Laser Modified Cutting Equipment Market Report

Report Metric	Details
Report Name	SiC Wafer Laser Modified Cutting Equipment Market
Accounted market size in 2023	US$ 102.6 million
Forecasted market size in 2030	US$ 217.5 million
CAGR	12.0%
Base Year	2023
Forecasted years	2024 - 2030
Segment by Type	Processing Sizes up to 6 Inches Processing Sizes up to 8 Inches
Segment by Application	Foundry IDM
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	DISCO, Delphi Laser, Han's Laser, HGLaser, CHN.GIE, DR Laser, Lumi Laser
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of SiC Wafer Laser Modified Cutting Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of SiC Wafer Laser Modified Cutting Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of SiC Wafer Laser Modified Cutting Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is SiC Wafer Laser Modified Cutting Equipment Market growing?

Ans: The SiC Wafer Laser Modified Cutting Equipment Market witnessing a CAGR of 12.0% during the forecast period 2024-2030.

What is the SiC Wafer Laser Modified Cutting Equipment Market size in 2030?

Ans: The SiC Wafer Laser Modified Cutting Equipment Market size in 2030 will be US$ 217.5 million.

Who are the main players in the SiC Wafer Laser Modified Cutting Equipment Market report?

Ans: The main players in the SiC Wafer Laser Modified Cutting Equipment Market are DISCO, Delphi Laser, Han's Laser, HGLaser, CHN.GIE, DR Laser, Lumi Laser

What are the Application segmentation covered in the SiC Wafer Laser Modified Cutting Equipment Market report?

Ans: The Applications covered in the SiC Wafer Laser Modified Cutting Equipment Market report are Foundry, IDM

What are the Type segmentation covered in the SiC Wafer Laser Modified Cutting Equipment Market report?

Ans: The Types covered in the SiC Wafer Laser Modified Cutting Equipment Market report are Processing Sizes up to 6 Inches, Processing Sizes up to 8 Inches

1 SiC Wafer Laser Modified Cutting Equipment Market Overview

1.1 Product Definition

1.2 SiC Wafer Laser Modified Cutting Equipment Segment by Type

1.2.1 Global SiC Wafer Laser Modified Cutting Equipment Market Value Growth Rate Analysis by Type 2023 VS 2030

1.2.2 Processing Sizes up to 6 Inches

1.2.3 Processing Sizes up to 8 Inches

1.3 SiC Wafer Laser Modified Cutting Equipment Segment by Application

1.3.1 Global SiC Wafer Laser Modified Cutting Equipment Market Value Growth Rate Analysis by Application: 2023 VS 2030

1.3.2 Foundry

1.3.3 IDM

1.4 Global Market Growth Prospects

1.4.1 Global SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts (2019-2030)

1.4.2 Global SiC Wafer Laser Modified Cutting Equipment Production Capacity Estimates and Forecasts (2019-2030)

1.4.3 Global SiC Wafer Laser Modified Cutting Equipment Production Estimates and Forecasts (2019-2030)

1.4.4 Global SiC Wafer Laser Modified Cutting Equipment Market Average Price Estimates and Forecasts (2019-2030)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Manufacturers (2019-2024)

2.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Manufacturers (2019-2024)

2.3 Global Key Players of SiC Wafer Laser Modified Cutting Equipment, Industry Ranking, 2022 VS 2023 VS 2024

2.4 Global SiC Wafer Laser Modified Cutting Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)

2.5 Global SiC Wafer Laser Modified Cutting Equipment Average Price by Manufacturers (2019-2024)

2.6 Global Key Manufacturers of SiC Wafer Laser Modified Cutting Equipment, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of SiC Wafer Laser Modified Cutting Equipment, Product Offered and Application

2.8 Global Key Manufacturers of SiC Wafer Laser Modified Cutting Equipment, Date of Enter into This Industry

2.9 SiC Wafer Laser Modified Cutting Equipment Market Competitive Situation and Trends

2.9.1 SiC Wafer Laser Modified Cutting Equipment Market Concentration Rate

2.9.2 Global 5 and 10 Largest SiC Wafer Laser Modified Cutting Equipment Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 SiC Wafer Laser Modified Cutting Equipment Production by Region

3.1 Global SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030

3.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Region (2019-2030)

3.2.1 Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Region (2019-2024)

3.2.2 Global Forecasted Production Value of SiC Wafer Laser Modified Cutting Equipment by Region (2025-2030)

3.3 Global SiC Wafer Laser Modified Cutting Equipment Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030

3.4 Global SiC Wafer Laser Modified Cutting Equipment Production by Region (2019-2030)

3.4.1 Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Region (2019-2024)

3.4.2 Global Forecasted Production of SiC Wafer Laser Modified Cutting Equipment by Region (2025-2030)

3.5 Global SiC Wafer Laser Modified Cutting Equipment Market Price Analysis by Region (2019-2024)

3.6 Global SiC Wafer Laser Modified Cutting Equipment Production and Value, Year-over-Year Growth

3.6.1 North America SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts (2019-2030)

3.6.2 Europe SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts (2019-2030)

3.6.3 China SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts (2019-2030)

3.6.4 Japan SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts (2019-2030)

4 SiC Wafer Laser Modified Cutting Equipment Consumption by Region

4.1 Global SiC Wafer Laser Modified Cutting Equipment Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030

4.2 Global SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2019-2030)

4.2.1 Global SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2019-2024)

4.2.2 Global SiC Wafer Laser Modified Cutting Equipment Forecasted Consumption by Region (2025-2030)

4.3 North America

4.3.1 North America SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030

4.3.2 North America SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2019-2030)

4.3.3 United States

4.3.4 Canada

4.4 Europe

4.4.1 Europe SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030

4.4.2 Europe SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2019-2030)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Russia

4.5 Asia Pacific

4.5.1 Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Region: 2019 VS 2023 VS 2030

4.5.2 Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2019-2030)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030

4.6.2 Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2019-2030)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global SiC Wafer Laser Modified Cutting Equipment Production by Type (2019-2030)

5.1.1 Global SiC Wafer Laser Modified Cutting Equipment Production by Type (2019-2024)

5.1.2 Global SiC Wafer Laser Modified Cutting Equipment Production by Type (2025-2030)

5.1.3 Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Type (2019-2030)

5.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Type (2019-2030)

5.2.1 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Type (2019-2024)

5.2.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Type (2025-2030)

5.2.3 Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Type (2019-2030)

5.3 Global SiC Wafer Laser Modified Cutting Equipment Price by Type (2019-2030)

6 Segment by Application

6.1 Global SiC Wafer Laser Modified Cutting Equipment Production by Application (2019-2030)

6.1.1 Global SiC Wafer Laser Modified Cutting Equipment Production by Application (2019-2024)

6.1.2 Global SiC Wafer Laser Modified Cutting Equipment Production by Application (2025-2030)

6.1.3 Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Application (2019-2030)

6.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Application (2019-2030)

6.2.1 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Application (2019-2024)

6.2.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Application (2025-2030)

6.2.3 Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Application (2019-2030)

6.3 Global SiC Wafer Laser Modified Cutting Equipment Price by Application (2019-2030)

7 Key Companies Profiled

7.1 DISCO

7.1.1 DISCO SiC Wafer Laser Modified Cutting Equipment Corporation Information

7.1.2 DISCO SiC Wafer Laser Modified Cutting Equipment Product Portfolio

7.1.3 DISCO SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)

7.1.4 DISCO Main Business and Markets Served

7.1.5 DISCO Recent Developments/Updates

7.2 Delphi Laser

7.2.1 Delphi Laser SiC Wafer Laser Modified Cutting Equipment Corporation Information

7.2.2 Delphi Laser SiC Wafer Laser Modified Cutting Equipment Product Portfolio

7.2.3 Delphi Laser SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)

7.2.4 Delphi Laser Main Business and Markets Served

7.2.5 Delphi Laser Recent Developments/Updates

7.3 Han's Laser

7.3.1 Han's Laser SiC Wafer Laser Modified Cutting Equipment Corporation Information

7.3.2 Han's Laser SiC Wafer Laser Modified Cutting Equipment Product Portfolio

7.3.3 Han's Laser SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)

7.3.4 Han's Laser Main Business and Markets Served

7.3.5 Han's Laser Recent Developments/Updates

7.4 HGLaser

7.4.1 HGLaser SiC Wafer Laser Modified Cutting Equipment Corporation Information

7.4.2 HGLaser SiC Wafer Laser Modified Cutting Equipment Product Portfolio

7.4.3 HGLaser SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)

7.4.4 HGLaser Main Business and Markets Served

7.4.5 HGLaser Recent Developments/Updates

7.5 CHN.GIE

7.5.1 CHN.GIE SiC Wafer Laser Modified Cutting Equipment Corporation Information

7.5.2 CHN.GIE SiC Wafer Laser Modified Cutting Equipment Product Portfolio

7.5.3 CHN.GIE SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)

7.5.4 CHN.GIE Main Business and Markets Served

7.5.5 CHN.GIE Recent Developments/Updates

7.6 DR Laser

7.6.1 DR Laser SiC Wafer Laser Modified Cutting Equipment Corporation Information

7.6.2 DR Laser SiC Wafer Laser Modified Cutting Equipment Product Portfolio

7.6.3 DR Laser SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)

7.6.4 DR Laser Main Business and Markets Served

7.6.5 DR Laser Recent Developments/Updates

7.7 Lumi Laser

7.7.1 Lumi Laser SiC Wafer Laser Modified Cutting Equipment Corporation Information

7.7.2 Lumi Laser SiC Wafer Laser Modified Cutting Equipment Product Portfolio

7.7.3 Lumi Laser SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)

7.7.4 Lumi Laser Main Business and Markets Served

7.7.5 Lumi Laser Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 SiC Wafer Laser Modified Cutting Equipment Industry Chain Analysis

8.2 SiC Wafer Laser Modified Cutting Equipment Key Raw Materials

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 SiC Wafer Laser Modified Cutting Equipment Production Mode & Process

8.4 SiC Wafer Laser Modified Cutting Equipment Sales and Marketing

8.4.1 SiC Wafer Laser Modified Cutting Equipment Sales Channels

8.4.2 SiC Wafer Laser Modified Cutting Equipment Distributors

8.5 SiC Wafer Laser Modified Cutting Equipment Customers

9 SiC Wafer Laser Modified Cutting Equipment Market Dynamics

9.1 SiC Wafer Laser Modified Cutting Equipment Industry Trends

9.2 SiC Wafer Laser Modified Cutting Equipment Market Drivers

9.3 SiC Wafer Laser Modified Cutting Equipment Market Challenges

9.4 SiC Wafer Laser Modified Cutting Equipment Market Restraints

10 Research Finding and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

List of Tables

Table 1. Global SiC Wafer Laser Modified Cutting Equipment Market Value by Type, (US$ Million) & (2023 VS 2030)

Table 2. Global SiC Wafer Laser Modified Cutting Equipment Market Value by Application, (US$ Million) & (2023 VS 2030)

Table 3. Global SiC Wafer Laser Modified Cutting Equipment Production Capacity (K Units) by Manufacturers in 2023

Table 4. Global SiC Wafer Laser Modified Cutting Equipment Production by Manufacturers (2019-2024) & (K Units)

Table 5. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Manufacturers (2019-2024)

Table 6. Global SiC Wafer Laser Modified Cutting Equipment Production Value by Manufacturers (2019-2024) & (US$ Million)

Table 7. Global SiC Wafer Laser Modified Cutting Equipment Production Value Share by Manufacturers (2019-2024)

Table 8. Global SiC Wafer Laser Modified Cutting Equipment Industry Ranking 2022 VS 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in SiC Wafer Laser Modified Cutting Equipment as of 2023)

Table 10. Global Market SiC Wafer Laser Modified Cutting Equipment Average Price by Manufacturers (US$/Unit) & (2019-2024)

Table 11. Manufacturers SiC Wafer Laser Modified Cutting Equipment Production Sites and Area Served

Table 12. Manufacturers SiC Wafer Laser Modified Cutting Equipment Product Types

Table 13. Global SiC Wafer Laser Modified Cutting Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 14. Mergers & Acquisitions, Expansion

Table 15. Global SiC Wafer Laser Modified Cutting Equipment Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)

Table 16. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) by Region (2019-2024)

Table 17. Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Region (2019-2024)

Table 18. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) Forecast by Region (2025-2030)

Table 19. Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share Forecast by Region (2025-2030)

Table 20. Global SiC Wafer Laser Modified Cutting Equipment Production Comparison by Region: 2019 VS 2023 VS 2030 (K Units)

Table 21. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) by Region (2019-2024)

Table 22. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Region (2019-2024)

Table 23. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) Forecast by Region (2025-2030)

Table 24. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share Forecast by Region (2025-2030)

Table 25. Global SiC Wafer Laser Modified Cutting Equipment Market Average Price (US$/Unit) by Region (2019-2024)

Table 26. Global SiC Wafer Laser Modified Cutting Equipment Market Average Price (US$/Unit) by Region (2025-2030)

Table 27. Global SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K Units)

Table 28. Global SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2019-2024) & (K Units)

Table 29. Global SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Region (2019-2024)

Table 30. Global SiC Wafer Laser Modified Cutting Equipment Forecasted Consumption by Region (2025-2030) & (K Units)

Table 31. Global SiC Wafer Laser Modified Cutting Equipment Forecasted Consumption Market Share by Region (2019-2024)

Table 32. North America SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Units)

Table 33. North America SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2019-2024) & (K Units)

Table 34. North America SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2025-2030) & (K Units)

Table 35. Europe SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Units)

Table 36. Europe SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2019-2024) & (K Units)

Table 37. Europe SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2025-2030) & (K Units)

Table 38. Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K Units)

Table 39. Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2019-2024) & (K Units)

Table 40. Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2025-2030) & (K Units)

Table 41. Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Units)

Table 42. Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2019-2024) & (K Units)

Table 43. Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2025-2030) & (K Units)

Table 44. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) by Type (2019-2024)

Table 45. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) by Type (2025-2030)

Table 46. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Type (2019-2024)

Table 47. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Type (2025-2030)

Table 48. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) by Type (2019-2024)

Table 49. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) by Type (2025-2030)

Table 50. Global SiC Wafer Laser Modified Cutting Equipment Production Value Share by Type (2019-2024)

Table 51. Global SiC Wafer Laser Modified Cutting Equipment Production Value Share by Type (2025-2030)

Table 52. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Type (2019-2024)

Table 53. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Type (2025-2030)

Table 54. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) by Application (2019-2024)

Table 55. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) by Application (2025-2030)

Table 56. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Application (2019-2024)

Table 57. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Application (2025-2030)

Table 58. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) by Application (2019-2024)

Table 59. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) by Application (2025-2030)

Table 60. Global SiC Wafer Laser Modified Cutting Equipment Production Value Share by Application (2019-2024)

Table 61. Global SiC Wafer Laser Modified Cutting Equipment Production Value Share by Application (2025-2030)

Table 62. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Application (2019-2024)

Table 63. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Application (2025-2030)

Table 64. DISCO SiC Wafer Laser Modified Cutting Equipment Corporation Information

Table 65. DISCO Specification and Application

Table 66. DISCO SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)

Table 67. DISCO Main Business and Markets Served

Table 68. DISCO Recent Developments/Updates

Table 69. Delphi Laser SiC Wafer Laser Modified Cutting Equipment Corporation Information

Table 70. Delphi Laser Specification and Application

Table 71. Delphi Laser SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)

Table 72. Delphi Laser Main Business and Markets Served

Table 73. Delphi Laser Recent Developments/Updates

Table 74. Han's Laser SiC Wafer Laser Modified Cutting Equipment Corporation Information

Table 75. Han's Laser Specification and Application

Table 76. Han's Laser SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)

Table 77. Han's Laser Main Business and Markets Served

Table 78. Han's Laser Recent Developments/Updates

Table 79. HGLaser SiC Wafer Laser Modified Cutting Equipment Corporation Information

Table 80. HGLaser Specification and Application

Table 81. HGLaser SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)

Table 82. HGLaser Main Business and Markets Served

Table 83. HGLaser Recent Developments/Updates

Table 84. CHN.GIE SiC Wafer Laser Modified Cutting Equipment Corporation Information

Table 85. CHN.GIE Specification and Application

Table 86. CHN.GIE SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)

Table 87. CHN.GIE Main Business and Markets Served

Table 88. CHN.GIE Recent Developments/Updates

Table 89. DR Laser SiC Wafer Laser Modified Cutting Equipment Corporation Information

Table 90. DR Laser Specification and Application

Table 91. DR Laser SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)

Table 92. DR Laser Main Business and Markets Served

Table 93. DR Laser Recent Developments/Updates

Table 94. Lumi Laser SiC Wafer Laser Modified Cutting Equipment Corporation Information

Table 95. Lumi Laser Specification and Application

Table 96. Lumi Laser SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2019-2024)

Table 97. Lumi Laser Main Business and Markets Served

Table 98. Lumi Laser Recent Developments/Updates

Table 99. Key Raw Materials Lists

Table 100. Raw Materials Key Suppliers Lists

Table 101. SiC Wafer Laser Modified Cutting Equipment Distributors List

Table 102. SiC Wafer Laser Modified Cutting Equipment Customers List

Table 103. SiC Wafer Laser Modified Cutting Equipment Market Trends

Table 104. SiC Wafer Laser Modified Cutting Equipment Market Drivers

Table 105. SiC Wafer Laser Modified Cutting Equipment Market Challenges

Table 106. SiC Wafer Laser Modified Cutting Equipment Market Restraints

Table 107. Research Programs/Design for This Report

Table 108. Key Data Information from Secondary Sources

Table 109. Key Data Information from Primary Sources

List of Figures

Figure 1. Product Picture of SiC Wafer Laser Modified Cutting Equipment

Figure 2. Global SiC Wafer Laser Modified Cutting Equipment Market Value by Type, (US$ Million) & (2023 VS 2030)

Figure 3. Global SiC Wafer Laser Modified Cutting Equipment Market Share by Type: 2023 VS 2030

Figure 4. Processing Sizes up to 6 Inches Product Picture

Figure 5. Processing Sizes up to 8 Inches Product Picture

Figure 6. Global SiC Wafer Laser Modified Cutting Equipment Market Value by Application, (US$ Million) & (2023 VS 2030)

Figure 7. Global SiC Wafer Laser Modified Cutting Equipment Market Share by Application: 2023 VS 2030

Figure 8. Foundry

Figure 9. IDM

Figure 10. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million), 2019 VS 2023 VS 2030

Figure 11. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) & (2019-2030)

Figure 12. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) & (2019-2030)

Figure 13. Global SiC Wafer Laser Modified Cutting Equipment Average Price (US$/Unit) & (2019-2030)

Figure 14. SiC Wafer Laser Modified Cutting Equipment Report Years Considered

Figure 15. SiC Wafer Laser Modified Cutting Equipment Production Share by Manufacturers in 2023

Figure 16. SiC Wafer Laser Modified Cutting Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023

Figure 17. The Global 5 and 10 Largest Players: Market Share by SiC Wafer Laser Modified Cutting Equipment Revenue in 2023

Figure 18. Global SiC Wafer Laser Modified Cutting Equipment Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)

Figure 19. Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Region: 2019 VS 2023 VS 2030

Figure 20. Global SiC Wafer Laser Modified Cutting Equipment Production Comparison by Region: 2019 VS 2023 VS 2030 (K Units)

Figure 21. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Region: 2019 VS 2023 VS 2030

Figure 22. North America SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) Growth Rate (2019-2030)

Figure 23. Europe SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) Growth Rate (2019-2030)

Figure 24. China SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) Growth Rate (2019-2030)

Figure 25. Japan SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) Growth Rate (2019-2030)

Figure 26. Global SiC Wafer Laser Modified Cutting Equipment Consumption by Region: 2019 VS 2023 VS 2030 (K Units)

Figure 27. Global SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Region: 2019 VS 2023 VS 2030

Figure 28. North America SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 29. North America SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Country (2019-2030)

Figure 30. Canada SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 31. U.S. SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 32. Europe SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 33. Europe SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Country (2019-2030)

Figure 34. Germany SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 35. France SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 36. U.K. SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 37. Italy SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 38. Russia SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 39. Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 40. Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Regions (2019-2030)

Figure 41. China SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 42. Japan SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 43. South Korea SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 44. China Taiwan SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 45. Southeast Asia SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 46. India SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 47. Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 48. Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Country (2019-2030)

Figure 49. Mexico SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 50. Brazil SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 51. Turkey SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 52. GCC Countries SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2019-2024) & (K Units)

Figure 53. Global Production Market Share of SiC Wafer Laser Modified Cutting Equipment by Type (2019-2030)

Figure 54. Global Production Value Market Share of SiC Wafer Laser Modified Cutting Equipment by Type (2019-2030)

Figure 55. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Type (2019-2030)

Figure 56. Global Production Market Share of SiC Wafer Laser Modified Cutting Equipment by Application (2019-2030)

Figure 57. Global Production Value Market Share of SiC Wafer Laser Modified Cutting Equipment by Application (2019-2030)

Figure 58. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Application (2019-2030)

Figure 59. SiC Wafer Laser Modified Cutting Equipment Value Chain

Figure 60. SiC Wafer Laser Modified Cutting Equipment Production Process

Figure 61. Channels of Distribution (Direct Vs Distribution)

Figure 62. Distributors Profiles

Figure 63. Bottom-up and Top-down Approaches for This Report

Figure 64. Data Triangulation

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Global SiC Wafer Laser Modified Cutting Equipment Market Research Report 2024

Published Date: August 2024

Report Code: QYRE-Auto-21Y14218

Global SiC Wafer Laser Modified Cutting Equipment Market Research Report 2024

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SiC Wafer Laser Modified Cutting Equipment Market Size

SiC Wafer Laser Modified Cutting Equipment Market

Report Scope

Scope of SiC Wafer Laser Modified Cutting Equipment Market Report

Chapter Outline

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How fast is SiC Wafer Laser Modified Cutting Equipment Market growing?

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