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Global SiC Wafer Laser Modified Cutting Equipment Market Research Report 2025
Published Date: April 2025
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Report Code: QYRE-Auto-21Y14218
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Global SiC Wafer Laser Modified Cutting Equipment Market Research Report 2025

Code: QYRE-Auto-21Y14218
Report
April 2025
Pages:86
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

SiC Wafer Laser Modified Cutting Equipment Market Size

The global market for SiC Wafer Laser Modified Cutting Equipment was valued at US$ 122 million in the year 2024 and is projected to reach a revised size of US$ 267 million by 2031, growing at a CAGR of 12.0% during the forecast period.

SiC Wafer Laser Modified Cutting Equipment Market

SiC Wafer Laser Modified Cutting Equipment Market

According to our Semiconductor Research Center, in 2022, the global SiC wafer was valued at US$ 750 million, will grow rapidly in next six years, driven by the strong demand from electric vehicle (EV). Currently the 6 inch SiC substrates are dominating this market, and in next six years, more players will put into production the 8 inch SiC wafers. Currently the key players of SiC are mainly located headquartered United States, Europe, Japan and China, especially in China, more companies are entering the SiC market. It is predicted that, Chinese companies will play key roles in the SiC market in next ten years.

Report Scope

This report aims to provide a comprehensive presentation of the global market for SiC Wafer Laser Modified Cutting Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Laser Modified Cutting Equipment.
The SiC Wafer Laser Modified Cutting Equipment market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global SiC Wafer Laser Modified Cutting Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the SiC Wafer Laser Modified Cutting Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of SiC Wafer Laser Modified Cutting Equipment Market Report

Report Metric Details
Report Name SiC Wafer Laser Modified Cutting Equipment Market
Accounted market size in year US$ 122 million
Forecasted market size in 2031 US$ 267 million
CAGR 12.0%
Base Year year
Forecasted years 2025 - 2031
by Type
by Application
Production by Region
  • North America
  • Europe
  • China
  • Japan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company DISCO, Delphi Laser, Han's Laser, HGLaser, CHN.GIE, DR Laser, Lumi Laser
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of SiC Wafer Laser Modified Cutting Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of SiC Wafer Laser Modified Cutting Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of SiC Wafer Laser Modified Cutting Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is SiC Wafer Laser Modified Cutting Equipment Market growing?

Ans: The SiC Wafer Laser Modified Cutting Equipment Market witnessing a CAGR of 12.0% during the forecast period 2025-2031.

What is the SiC Wafer Laser Modified Cutting Equipment Market size in 2031?

Ans: The SiC Wafer Laser Modified Cutting Equipment Market size in 2031 will be US$ 267 million.

Who are the main players in the SiC Wafer Laser Modified Cutting Equipment Market report?

Ans: The main players in the SiC Wafer Laser Modified Cutting Equipment Market are DISCO, Delphi Laser, Han's Laser, HGLaser, CHN.GIE, DR Laser, Lumi Laser

What are the Application segmentation covered in the SiC Wafer Laser Modified Cutting Equipment Market report?

Ans: The Applications covered in the SiC Wafer Laser Modified Cutting Equipment Market report are Foundry, IDM

What are the Type segmentation covered in the SiC Wafer Laser Modified Cutting Equipment Market report?

Ans: The Types covered in the SiC Wafer Laser Modified Cutting Equipment Market report are Processing Sizes up to 6 Inches, Processing Sizes up to 8 Inches

Recommended Reports

SiC Wafer Equipment

Laser Cutting & Dicing

SiC & Silicon Wafers

1 SiC Wafer Laser Modified Cutting Equipment Market Overview
1.1 Product Definition
1.2 SiC Wafer Laser Modified Cutting Equipment by Type
1.2.1 Global SiC Wafer Laser Modified Cutting Equipment Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Processing Sizes up to 6 Inches
1.2.3 Processing Sizes up to 8 Inches
1.3 SiC Wafer Laser Modified Cutting Equipment by Application
1.3.1 Global SiC Wafer Laser Modified Cutting Equipment Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Foundry
1.3.3 IDM
1.4 Global Market Growth Prospects
1.4.1 Global SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global SiC Wafer Laser Modified Cutting Equipment Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global SiC Wafer Laser Modified Cutting Equipment Production Estimates and Forecasts (2020-2031)
1.4.4 Global SiC Wafer Laser Modified Cutting Equipment Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Manufacturers (2020-2025)
2.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of SiC Wafer Laser Modified Cutting Equipment, Industry Ranking, 2023 VS 2024
2.4 Global SiC Wafer Laser Modified Cutting Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global SiC Wafer Laser Modified Cutting Equipment Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of SiC Wafer Laser Modified Cutting Equipment, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of SiC Wafer Laser Modified Cutting Equipment, Product Offered and Application
2.8 Global Key Manufacturers of SiC Wafer Laser Modified Cutting Equipment, Date of Enter into This Industry
2.9 SiC Wafer Laser Modified Cutting Equipment Market Competitive Situation and Trends
2.9.1 SiC Wafer Laser Modified Cutting Equipment Market Concentration Rate
2.9.2 Global 5 and 10 Largest SiC Wafer Laser Modified Cutting Equipment Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 SiC Wafer Laser Modified Cutting Equipment Production by Region
3.1 Global SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Region (2020-2031)
3.2.1 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of SiC Wafer Laser Modified Cutting Equipment by Region (2026-2031)
3.3 Global SiC Wafer Laser Modified Cutting Equipment Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global SiC Wafer Laser Modified Cutting Equipment Production Volume by Region (2020-2031)
3.4.1 Global SiC Wafer Laser Modified Cutting Equipment Production by Region (2020-2025)
3.4.2 Global Forecasted Production of SiC Wafer Laser Modified Cutting Equipment by Region (2026-2031)
3.5 Global SiC Wafer Laser Modified Cutting Equipment Market Price Analysis by Region (2020-2025)
3.6 Global SiC Wafer Laser Modified Cutting Equipment Production and Value, Year-over-Year Growth
3.6.1 North America SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts (2020-2031)
3.6.3 China SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan SiC Wafer Laser Modified Cutting Equipment Production Value Estimates and Forecasts (2020-2031)
4 SiC Wafer Laser Modified Cutting Equipment Consumption by Region
4.1 Global SiC Wafer Laser Modified Cutting Equipment Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2020-2031)
4.2.1 Global SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2020-2025)
4.2.2 Global SiC Wafer Laser Modified Cutting Equipment Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global SiC Wafer Laser Modified Cutting Equipment Production by Type (2020-2031)
5.1.1 Global SiC Wafer Laser Modified Cutting Equipment Production by Type (2020-2025)
5.1.2 Global SiC Wafer Laser Modified Cutting Equipment Production by Type (2026-2031)
5.1.3 Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Type (2020-2031)
5.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Type (2020-2031)
5.2.1 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Type (2020-2025)
5.2.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Type (2026-2031)
5.2.3 Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Type (2020-2031)
5.3 Global SiC Wafer Laser Modified Cutting Equipment Price by Type (2020-2031)
6 Segment by Application
6.1 Global SiC Wafer Laser Modified Cutting Equipment Production by Application (2020-2031)
6.1.1 Global SiC Wafer Laser Modified Cutting Equipment Production by Application (2020-2025)
6.1.2 Global SiC Wafer Laser Modified Cutting Equipment Production by Application (2026-2031)
6.1.3 Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Application (2020-2031)
6.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Application (2020-2031)
6.2.1 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Application (2020-2025)
6.2.2 Global SiC Wafer Laser Modified Cutting Equipment Production Value by Application (2026-2031)
6.2.3 Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Application (2020-2031)
6.3 Global SiC Wafer Laser Modified Cutting Equipment Price by Application (2020-2031)
7 Key Companies Profiled
7.1 DISCO
7.1.1 DISCO SiC Wafer Laser Modified Cutting Equipment Company Information
7.1.2 DISCO SiC Wafer Laser Modified Cutting Equipment Product Portfolio
7.1.3 DISCO SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)
7.1.4 DISCO Main Business and Markets Served
7.1.5 DISCO Recent Developments/Updates
7.2 Delphi Laser
7.2.1 Delphi Laser SiC Wafer Laser Modified Cutting Equipment Company Information
7.2.2 Delphi Laser SiC Wafer Laser Modified Cutting Equipment Product Portfolio
7.2.3 Delphi Laser SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Delphi Laser Main Business and Markets Served
7.2.5 Delphi Laser Recent Developments/Updates
7.3 Han's Laser
7.3.1 Han's Laser SiC Wafer Laser Modified Cutting Equipment Company Information
7.3.2 Han's Laser SiC Wafer Laser Modified Cutting Equipment Product Portfolio
7.3.3 Han's Laser SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Han's Laser Main Business and Markets Served
7.3.5 Han's Laser Recent Developments/Updates
7.4 HGLaser
7.4.1 HGLaser SiC Wafer Laser Modified Cutting Equipment Company Information
7.4.2 HGLaser SiC Wafer Laser Modified Cutting Equipment Product Portfolio
7.4.3 HGLaser SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)
7.4.4 HGLaser Main Business and Markets Served
7.4.5 HGLaser Recent Developments/Updates
7.5 CHN.GIE
7.5.1 CHN.GIE SiC Wafer Laser Modified Cutting Equipment Company Information
7.5.2 CHN.GIE SiC Wafer Laser Modified Cutting Equipment Product Portfolio
7.5.3 CHN.GIE SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)
7.5.4 CHN.GIE Main Business and Markets Served
7.5.5 CHN.GIE Recent Developments/Updates
7.6 DR Laser
7.6.1 DR Laser SiC Wafer Laser Modified Cutting Equipment Company Information
7.6.2 DR Laser SiC Wafer Laser Modified Cutting Equipment Product Portfolio
7.6.3 DR Laser SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)
7.6.4 DR Laser Main Business and Markets Served
7.6.5 DR Laser Recent Developments/Updates
7.7 Lumi Laser
7.7.1 Lumi Laser SiC Wafer Laser Modified Cutting Equipment Company Information
7.7.2 Lumi Laser SiC Wafer Laser Modified Cutting Equipment Product Portfolio
7.7.3 Lumi Laser SiC Wafer Laser Modified Cutting Equipment Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Lumi Laser Main Business and Markets Served
7.7.5 Lumi Laser Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 SiC Wafer Laser Modified Cutting Equipment Industry Chain Analysis
8.2 SiC Wafer Laser Modified Cutting Equipment Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 SiC Wafer Laser Modified Cutting Equipment Production Mode & Process Analysis
8.4 SiC Wafer Laser Modified Cutting Equipment Sales and Marketing
8.4.1 SiC Wafer Laser Modified Cutting Equipment Sales Channels
8.4.2 SiC Wafer Laser Modified Cutting Equipment Distributors
8.5 SiC Wafer Laser Modified Cutting Equipment Customer Analysis
9 SiC Wafer Laser Modified Cutting Equipment Market Dynamics
9.1 SiC Wafer Laser Modified Cutting Equipment Industry Trends
9.2 SiC Wafer Laser Modified Cutting Equipment Market Drivers
9.3 SiC Wafer Laser Modified Cutting Equipment Market Challenges
9.4 SiC Wafer Laser Modified Cutting Equipment Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global SiC Wafer Laser Modified Cutting Equipment Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global SiC Wafer Laser Modified Cutting Equipment Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global SiC Wafer Laser Modified Cutting Equipment Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global SiC Wafer Laser Modified Cutting Equipment Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Manufacturers (2020-2025)
 Table 6. Global SiC Wafer Laser Modified Cutting Equipment Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global SiC Wafer Laser Modified Cutting Equipment Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of SiC Wafer Laser Modified Cutting Equipment, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in SiC Wafer Laser Modified Cutting Equipment as of 2024)
 Table 10. Global Market SiC Wafer Laser Modified Cutting Equipment Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of SiC Wafer Laser Modified Cutting Equipment, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of SiC Wafer Laser Modified Cutting Equipment, Product Offered and Application
 Table 13. Global Key Manufacturers of SiC Wafer Laser Modified Cutting Equipment, Date of Enter into This Industry
 Table 14. Global SiC Wafer Laser Modified Cutting Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global SiC Wafer Laser Modified Cutting Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Region (2020-2025)
 Table 19. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global SiC Wafer Laser Modified Cutting Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) by Region (2020-2025)
 Table 23. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Region (2020-2025)
 Table 24. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share Forecast by Region (2026-2031)
 Table 26. Global SiC Wafer Laser Modified Cutting Equipment Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global SiC Wafer Laser Modified Cutting Equipment Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2020-2025) & (K Units)
 Table 30. Global SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Region (2020-2025)
 Table 31. Global SiC Wafer Laser Modified Cutting Equipment Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global SiC Wafer Laser Modified Cutting Equipment Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2020-2025) & (K Units)
 Table 35. North America SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption by Country (2026-2031) & (K Units)
 Table 45. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) by Type (2020-2025)
 Table 46. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) by Type (2026-2031)
 Table 47. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Type (2020-2025)
 Table 48. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Type (2026-2031)
 Table 49. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Type (2020-2025)
 Table 52. Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Type (2026-2031)
 Table 53. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Type (2020-2025)
 Table 54. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Type (2026-2031)
 Table 55. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) by Application (2020-2025)
 Table 56. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) by Application (2026-2031)
 Table 57. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Application (2020-2025)
 Table 58. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Application (2026-2031)
 Table 59. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Application (2020-2025)
 Table 62. Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Application (2026-2031)
 Table 63. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Application (2020-2025)
 Table 64. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Application (2026-2031)
 Table 65. DISCO SiC Wafer Laser Modified Cutting Equipment Company Information
 Table 66. DISCO SiC Wafer Laser Modified Cutting Equipment Specification and Application
 Table 67. DISCO SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. DISCO Main Business and Markets Served
 Table 69. DISCO Recent Developments/Updates
 Table 70. Delphi Laser SiC Wafer Laser Modified Cutting Equipment Company Information
 Table 71. Delphi Laser SiC Wafer Laser Modified Cutting Equipment Specification and Application
 Table 72. Delphi Laser SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. Delphi Laser Main Business and Markets Served
 Table 74. Delphi Laser Recent Developments/Updates
 Table 75. Han's Laser SiC Wafer Laser Modified Cutting Equipment Company Information
 Table 76. Han's Laser SiC Wafer Laser Modified Cutting Equipment Specification and Application
 Table 77. Han's Laser SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. Han's Laser Main Business and Markets Served
 Table 79. Han's Laser Recent Developments/Updates
 Table 80. HGLaser SiC Wafer Laser Modified Cutting Equipment Company Information
 Table 81. HGLaser SiC Wafer Laser Modified Cutting Equipment Specification and Application
 Table 82. HGLaser SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. HGLaser Main Business and Markets Served
 Table 84. HGLaser Recent Developments/Updates
 Table 85. CHN.GIE SiC Wafer Laser Modified Cutting Equipment Company Information
 Table 86. CHN.GIE SiC Wafer Laser Modified Cutting Equipment Specification and Application
 Table 87. CHN.GIE SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. CHN.GIE Main Business and Markets Served
 Table 89. CHN.GIE Recent Developments/Updates
 Table 90. DR Laser SiC Wafer Laser Modified Cutting Equipment Company Information
 Table 91. DR Laser SiC Wafer Laser Modified Cutting Equipment Specification and Application
 Table 92. DR Laser SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. DR Laser Main Business and Markets Served
 Table 94. DR Laser Recent Developments/Updates
 Table 95. Lumi Laser SiC Wafer Laser Modified Cutting Equipment Company Information
 Table 96. Lumi Laser SiC Wafer Laser Modified Cutting Equipment Specification and Application
 Table 97. Lumi Laser SiC Wafer Laser Modified Cutting Equipment Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. Lumi Laser Main Business and Markets Served
 Table 99. Lumi Laser Recent Developments/Updates
 Table 100. Key Raw Materials Lists
 Table 101. Raw Materials Key Suppliers Lists
 Table 102. SiC Wafer Laser Modified Cutting Equipment Distributors List
 Table 103. SiC Wafer Laser Modified Cutting Equipment Customers List
 Table 104. SiC Wafer Laser Modified Cutting Equipment Market Trends
 Table 105. SiC Wafer Laser Modified Cutting Equipment Market Drivers
 Table 106. SiC Wafer Laser Modified Cutting Equipment Market Challenges
 Table 107. SiC Wafer Laser Modified Cutting Equipment Market Restraints
 Table 108. Research Programs/Design for This Report
 Table 109. Key Data Information from Secondary Sources
 Table 110. Key Data Information from Primary Sources
 Table 111. Authors List of This Report


List of Figures
 Figure 1. Product Picture of SiC Wafer Laser Modified Cutting Equipment
 Figure 2. Global SiC Wafer Laser Modified Cutting Equipment Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global SiC Wafer Laser Modified Cutting Equipment Market Share by Type: 2024 VS 2031
 Figure 4. Processing Sizes up to 6 Inches Product Picture
 Figure 5. Processing Sizes up to 8 Inches Product Picture
 Figure 6. Global SiC Wafer Laser Modified Cutting Equipment Market Value by Application, (US$ Million) & (2020-2031)
 Figure 7. Global SiC Wafer Laser Modified Cutting Equipment Market Share by Application: 2024 VS 2031
 Figure 8. Foundry
 Figure 9. IDM
 Figure 10. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 11. Global SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) & (2020-2031)
 Figure 12. Global SiC Wafer Laser Modified Cutting Equipment Production Capacity (K Units) & (2020-2031)
 Figure 13. Global SiC Wafer Laser Modified Cutting Equipment Production (K Units) & (2020-2031)
 Figure 14. Global SiC Wafer Laser Modified Cutting Equipment Average Price (US$/Unit) & (2020-2031)
 Figure 15. SiC Wafer Laser Modified Cutting Equipment Report Years Considered
 Figure 16. SiC Wafer Laser Modified Cutting Equipment Production Share by Manufacturers in 2024
 Figure 17. Global SiC Wafer Laser Modified Cutting Equipment Production Value Share by Manufacturers (2024)
 Figure 18. SiC Wafer Laser Modified Cutting Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 19. The Global 5 and 10 Largest Players: Market Share by SiC Wafer Laser Modified Cutting Equipment Revenue in 2024
 Figure 20. Global SiC Wafer Laser Modified Cutting Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 21. Global SiC Wafer Laser Modified Cutting Equipment Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 22. Global SiC Wafer Laser Modified Cutting Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 23. Global SiC Wafer Laser Modified Cutting Equipment Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 24. North America SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 25. Europe SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 26. China SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 27. Japan SiC Wafer Laser Modified Cutting Equipment Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. Global SiC Wafer Laser Modified Cutting Equipment Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 29. Global SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 30. North America SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 31. North America SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Country (2020-2031)
 Figure 32. U.S. SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 33. Canada SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 34. Europe SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 35. Europe SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Country (2020-2031)
 Figure 36. Germany SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 37. France SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 38. U.K. SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 39. Italy SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 40. Netherlands SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 41. Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 42. Asia Pacific SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Region (2020-2031)
 Figure 43. China SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. Japan SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. South Korea SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 46. China Taiwan SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Southeast Asia SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 48. India SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 49. Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. Latin America, Middle East & Africa SiC Wafer Laser Modified Cutting Equipment Consumption Market Share by Country (2020-2031)
 Figure 51. Mexico SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. Brazil SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. Turkey SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 54. GCC Countries SiC Wafer Laser Modified Cutting Equipment Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Global Production Market Share of SiC Wafer Laser Modified Cutting Equipment by Type (2020-2031)
 Figure 56. Global Production Value Market Share of SiC Wafer Laser Modified Cutting Equipment by Type (2020-2031)
 Figure 57. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Type (2020-2031)
 Figure 58. Global Production Market Share of SiC Wafer Laser Modified Cutting Equipment by Application (2020-2031)
 Figure 59. Global Production Value Market Share of SiC Wafer Laser Modified Cutting Equipment by Application (2020-2031)
 Figure 60. Global SiC Wafer Laser Modified Cutting Equipment Price (US$/Unit) by Application (2020-2031)
 Figure 61. SiC Wafer Laser Modified Cutting Equipment Value Chain
 Figure 62. Channels of Distribution (Direct Vs Distribution)
 Figure 63. Bottom-up and Top-down Approaches for This Report
 Figure 64. Data Triangulation
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