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Global Thermal Copper Pillar Bump Market Research Report 2025
Published Date: March 2025
|
Report Code: QYRE-Auto-22M13485
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Global Thermal Copper Pillar Bump Market Research Report 2023
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Global Thermal Copper Pillar Bump Market Research Report 2025

Code: QYRE-Auto-22M13485
Report
March 2025
Pages:105
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Thermal Copper Pillar Bump Market Size

The global market for Thermal Copper Pillar Bump was valued at US$ 1460 million in the year 2024 and is projected to reach a revised size of US$ 2226 million by 2031, growing at a CAGR of 6.3% during the forecast period.

Thermal Copper Pillar Bump Market

Thermal Copper Pillar Bump Market

The Thermal Copper Pillar Bump, also known as the thermal bump or TCPB, is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular Copper Pillar Bumps) for use in electronics and optoelectronic packaging, including flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semi-conductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical structure for connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality on the surface of a chip or other electrical component...
Some of the market drivers for TCPB are:
The increasing demand for smaller, thinner, and faster electronic devices with higher performance and lower power consumption.
The need for effective thermal management solutions to deal with the heat dissipation and hotspot cooling challenges in high-end chips such as CPU and GPU.
The potential for energy harvesting and power generation from waste heat in various applications such as wireless sensor networks and battery-operated systems.
Some of the constraints of TCPB are:
The high cost and complexity of manufacturing thin-film thermoelectric materials and integrating them into copper pillar bumps.
The trade-off between the coefficient of performance (COP) and the temperature difference that the device produces, which limits the cooling efficiency and power output of TCP.
The reliability issues such as voids, cracks, and solder-creeping defects that may arise in the solder joints due to the thermal cycling and mechanical stress during the reflow soldering process.
Some of the future opportunities for TCPB are:
The development of new thin-film thermoelectric materials with higher figure of merit (ZT) and lower thermal conductivity that can enhance the performance and functionality of TCPB.
The optimization of reflow profile parameters such as ramp rate, soak time, and time above liquidus to minimize the defects and improve the quality of solder joints in TCPB packages.
The exploration of new applications and markets for TCPB such as 3D stack packages, flexible electronics, biomedical devices, and wearable sensors.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Thermal Copper Pillar Bump, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thermal Copper Pillar Bump.
The Thermal Copper Pillar Bump market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Thermal Copper Pillar Bump market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Thermal Copper Pillar Bump manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Thermal Copper Pillar Bump Market Report

Report Metric Details
Report Name Thermal Copper Pillar Bump Market
Accounted market size in year US$ 1460 million
Forecasted market size in 2031 US$ 2226 million
CAGR 6.3%
Base Year year
Forecasted years 2025 - 2031
by Type
by Application
  • Consumer Electronics
  • Automobile
  • Industrial Equipment
  • Medical Insurance
  • Military and Defense
  • Aeronautics and Astronautics
  • Telecom
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Intel, Samsung, LB Semicon Inc, DuPont, FINECS, Amkor Technology, SHINKO ELECTRIC INDUSTRIES CO.,LTD., ASE, Raytek Semiconductor,Inc., Sigurd Microelectronics Corporation, Nepes, SJ Group Co Ltd, ChipMOS TECHNOLOGIES, Element Solutions, Jiangsu Changjiang Electronics Tech Co
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Thermal Copper Pillar Bump manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Thermal Copper Pillar Bump by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Thermal Copper Pillar Bump in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Thermal Copper Pillar Bump Market growing?

Ans: The Thermal Copper Pillar Bump Market witnessing a CAGR of 6.3% during the forecast period 2025-2031.

What is the Thermal Copper Pillar Bump Market size in 2031?

Ans: The Thermal Copper Pillar Bump Market size in 2031 will be US$ 2226 million.

Who are the main players in the Thermal Copper Pillar Bump Market report?

Ans: The main players in the Thermal Copper Pillar Bump Market are Intel, Samsung, LB Semicon Inc, DuPont, FINECS, Amkor Technology, SHINKO ELECTRIC INDUSTRIES CO.,LTD., ASE, Raytek Semiconductor,Inc., Sigurd Microelectronics Corporation, Nepes, SJ Group Co Ltd, ChipMOS TECHNOLOGIES, Element Solutions, Jiangsu Changjiang Electronics Tech Co

What are the Application segmentation covered in the Thermal Copper Pillar Bump Market report?

Ans: The Applications covered in the Thermal Copper Pillar Bump Market report are Consumer Electronics, Automobile, Industrial Equipment, Medical Insurance, Military and Defense, Aeronautics and Astronautics, Telecom

What are the Type segmentation covered in the Thermal Copper Pillar Bump Market report?

Ans: The Types covered in the Thermal Copper Pillar Bump Market report are Standard Cu Pillar, Fine Pitch Cu Pillar, Micro-Bumps, Others

Recommended Reports

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1 Thermal Copper Pillar Bump Market Overview
1.1 Product Definition
1.2 Thermal Copper Pillar Bump by Type
1.2.1 Global Thermal Copper Pillar Bump Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Standard Cu Pillar
1.2.3 Fine Pitch Cu Pillar
1.2.4 Micro-Bumps
1.2.5 Others
1.3 Thermal Copper Pillar Bump by Application
1.3.1 Global Thermal Copper Pillar Bump Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Automobile
1.3.4 Industrial Equipment
1.3.5 Medical Insurance
1.3.6 Military and Defense
1.3.7 Aeronautics and Astronautics
1.3.8 Telecom
1.4 Global Market Growth Prospects
1.4.1 Global Thermal Copper Pillar Bump Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Thermal Copper Pillar Bump Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Thermal Copper Pillar Bump Production Estimates and Forecasts (2020-2031)
1.4.4 Global Thermal Copper Pillar Bump Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Thermal Copper Pillar Bump Production Market Share by Manufacturers (2020-2025)
2.2 Global Thermal Copper Pillar Bump Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Thermal Copper Pillar Bump, Industry Ranking, 2023 VS 2024
2.4 Global Thermal Copper Pillar Bump Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Thermal Copper Pillar Bump Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Thermal Copper Pillar Bump, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Thermal Copper Pillar Bump, Product Offered and Application
2.8 Global Key Manufacturers of Thermal Copper Pillar Bump, Date of Enter into This Industry
2.9 Thermal Copper Pillar Bump Market Competitive Situation and Trends
2.9.1 Thermal Copper Pillar Bump Market Concentration Rate
2.9.2 Global 5 and 10 Largest Thermal Copper Pillar Bump Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Thermal Copper Pillar Bump Production by Region
3.1 Global Thermal Copper Pillar Bump Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Thermal Copper Pillar Bump Production Value by Region (2020-2031)
3.2.1 Global Thermal Copper Pillar Bump Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Thermal Copper Pillar Bump by Region (2026-2031)
3.3 Global Thermal Copper Pillar Bump Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Thermal Copper Pillar Bump Production Volume by Region (2020-2031)
3.4.1 Global Thermal Copper Pillar Bump Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Thermal Copper Pillar Bump by Region (2026-2031)
3.5 Global Thermal Copper Pillar Bump Market Price Analysis by Region (2020-2025)
3.6 Global Thermal Copper Pillar Bump Production and Value, Year-over-Year Growth
3.6.1 North America Thermal Copper Pillar Bump Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Thermal Copper Pillar Bump Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Thermal Copper Pillar Bump Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Thermal Copper Pillar Bump Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Thermal Copper Pillar Bump Production Value Estimates and Forecasts (2020-2031)
4 Thermal Copper Pillar Bump Consumption by Region
4.1 Global Thermal Copper Pillar Bump Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Thermal Copper Pillar Bump Consumption by Region (2020-2031)
4.2.1 Global Thermal Copper Pillar Bump Consumption by Region (2020-2025)
4.2.2 Global Thermal Copper Pillar Bump Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Thermal Copper Pillar Bump Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Thermal Copper Pillar Bump Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Thermal Copper Pillar Bump Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Thermal Copper Pillar Bump Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Thermal Copper Pillar Bump Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Thermal Copper Pillar Bump Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Thermal Copper Pillar Bump Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Thermal Copper Pillar Bump Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Thermal Copper Pillar Bump Production by Type (2020-2031)
5.1.1 Global Thermal Copper Pillar Bump Production by Type (2020-2025)
5.1.2 Global Thermal Copper Pillar Bump Production by Type (2026-2031)
5.1.3 Global Thermal Copper Pillar Bump Production Market Share by Type (2020-2031)
5.2 Global Thermal Copper Pillar Bump Production Value by Type (2020-2031)
5.2.1 Global Thermal Copper Pillar Bump Production Value by Type (2020-2025)
5.2.2 Global Thermal Copper Pillar Bump Production Value by Type (2026-2031)
5.2.3 Global Thermal Copper Pillar Bump Production Value Market Share by Type (2020-2031)
5.3 Global Thermal Copper Pillar Bump Price by Type (2020-2031)
6 Segment by Application
6.1 Global Thermal Copper Pillar Bump Production by Application (2020-2031)
6.1.1 Global Thermal Copper Pillar Bump Production by Application (2020-2025)
6.1.2 Global Thermal Copper Pillar Bump Production by Application (2026-2031)
6.1.3 Global Thermal Copper Pillar Bump Production Market Share by Application (2020-2031)
6.2 Global Thermal Copper Pillar Bump Production Value by Application (2020-2031)
6.2.1 Global Thermal Copper Pillar Bump Production Value by Application (2020-2025)
6.2.2 Global Thermal Copper Pillar Bump Production Value by Application (2026-2031)
6.2.3 Global Thermal Copper Pillar Bump Production Value Market Share by Application (2020-2031)
6.3 Global Thermal Copper Pillar Bump Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Intel
7.1.1 Intel Thermal Copper Pillar Bump Company Information
7.1.2 Intel Thermal Copper Pillar Bump Product Portfolio
7.1.3 Intel Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Intel Main Business and Markets Served
7.1.5 Intel Recent Developments/Updates
7.2 Samsung
7.2.1 Samsung Thermal Copper Pillar Bump Company Information
7.2.2 Samsung Thermal Copper Pillar Bump Product Portfolio
7.2.3 Samsung Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Samsung Main Business and Markets Served
7.2.5 Samsung Recent Developments/Updates
7.3 LB Semicon Inc
7.3.1 LB Semicon Inc Thermal Copper Pillar Bump Company Information
7.3.2 LB Semicon Inc Thermal Copper Pillar Bump Product Portfolio
7.3.3 LB Semicon Inc Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.3.4 LB Semicon Inc Main Business and Markets Served
7.3.5 LB Semicon Inc Recent Developments/Updates
7.4 DuPont
7.4.1 DuPont Thermal Copper Pillar Bump Company Information
7.4.2 DuPont Thermal Copper Pillar Bump Product Portfolio
7.4.3 DuPont Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.4.4 DuPont Main Business and Markets Served
7.4.5 DuPont Recent Developments/Updates
7.5 FINECS
7.5.1 FINECS Thermal Copper Pillar Bump Company Information
7.5.2 FINECS Thermal Copper Pillar Bump Product Portfolio
7.5.3 FINECS Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.5.4 FINECS Main Business and Markets Served
7.5.5 FINECS Recent Developments/Updates
7.6 Amkor Technology
7.6.1 Amkor Technology Thermal Copper Pillar Bump Company Information
7.6.2 Amkor Technology Thermal Copper Pillar Bump Product Portfolio
7.6.3 Amkor Technology Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Amkor Technology Main Business and Markets Served
7.6.5 Amkor Technology Recent Developments/Updates
7.7 SHINKO ELECTRIC INDUSTRIES CO.,LTD.
7.7.1 SHINKO ELECTRIC INDUSTRIES CO.,LTD. Thermal Copper Pillar Bump Company Information
7.7.2 SHINKO ELECTRIC INDUSTRIES CO.,LTD. Thermal Copper Pillar Bump Product Portfolio
7.7.3 SHINKO ELECTRIC INDUSTRIES CO.,LTD. Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.7.4 SHINKO ELECTRIC INDUSTRIES CO.,LTD. Main Business and Markets Served
7.7.5 SHINKO ELECTRIC INDUSTRIES CO.,LTD. Recent Developments/Updates
7.8 ASE
7.8.1 ASE Thermal Copper Pillar Bump Company Information
7.8.2 ASE Thermal Copper Pillar Bump Product Portfolio
7.8.3 ASE Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.8.4 ASE Main Business and Markets Served
7.8.5 ASE Recent Developments/Updates
7.9 Raytek Semiconductor,Inc.
7.9.1 Raytek Semiconductor,Inc. Thermal Copper Pillar Bump Company Information
7.9.2 Raytek Semiconductor,Inc. Thermal Copper Pillar Bump Product Portfolio
7.9.3 Raytek Semiconductor,Inc. Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Raytek Semiconductor,Inc. Main Business and Markets Served
7.9.5 Raytek Semiconductor,Inc. Recent Developments/Updates
7.10 Sigurd Microelectronics Corporation
7.10.1 Sigurd Microelectronics Corporation Thermal Copper Pillar Bump Company Information
7.10.2 Sigurd Microelectronics Corporation Thermal Copper Pillar Bump Product Portfolio
7.10.3 Sigurd Microelectronics Corporation Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Sigurd Microelectronics Corporation Main Business and Markets Served
7.10.5 Sigurd Microelectronics Corporation Recent Developments/Updates
7.11 Nepes
7.11.1 Nepes Thermal Copper Pillar Bump Company Information
7.11.2 Nepes Thermal Copper Pillar Bump Product Portfolio
7.11.3 Nepes Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Nepes Main Business and Markets Served
7.11.5 Nepes Recent Developments/Updates
7.12 SJ Group Co Ltd
7.12.1 SJ Group Co Ltd Thermal Copper Pillar Bump Company Information
7.12.2 SJ Group Co Ltd Thermal Copper Pillar Bump Product Portfolio
7.12.3 SJ Group Co Ltd Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.12.4 SJ Group Co Ltd Main Business and Markets Served
7.12.5 SJ Group Co Ltd Recent Developments/Updates
7.13 ChipMOS TECHNOLOGIES
7.13.1 ChipMOS TECHNOLOGIES Thermal Copper Pillar Bump Company Information
7.13.2 ChipMOS TECHNOLOGIES Thermal Copper Pillar Bump Product Portfolio
7.13.3 ChipMOS TECHNOLOGIES Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.13.4 ChipMOS TECHNOLOGIES Main Business and Markets Served
7.13.5 ChipMOS TECHNOLOGIES Recent Developments/Updates
7.14 Element Solutions
7.14.1 Element Solutions Thermal Copper Pillar Bump Company Information
7.14.2 Element Solutions Thermal Copper Pillar Bump Product Portfolio
7.14.3 Element Solutions Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Element Solutions Main Business and Markets Served
7.14.5 Element Solutions Recent Developments/Updates
7.15 Jiangsu Changjiang Electronics Tech Co
7.15.1 Jiangsu Changjiang Electronics Tech Co Thermal Copper Pillar Bump Company Information
7.15.2 Jiangsu Changjiang Electronics Tech Co Thermal Copper Pillar Bump Product Portfolio
7.15.3 Jiangsu Changjiang Electronics Tech Co Thermal Copper Pillar Bump Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Jiangsu Changjiang Electronics Tech Co Main Business and Markets Served
7.15.5 Jiangsu Changjiang Electronics Tech Co Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Thermal Copper Pillar Bump Industry Chain Analysis
8.2 Thermal Copper Pillar Bump Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Thermal Copper Pillar Bump Production Mode & Process Analysis
8.4 Thermal Copper Pillar Bump Sales and Marketing
8.4.1 Thermal Copper Pillar Bump Sales Channels
8.4.2 Thermal Copper Pillar Bump Distributors
8.5 Thermal Copper Pillar Bump Customer Analysis
9 Thermal Copper Pillar Bump Market Dynamics
9.1 Thermal Copper Pillar Bump Industry Trends
9.2 Thermal Copper Pillar Bump Market Drivers
9.3 Thermal Copper Pillar Bump Market Challenges
9.4 Thermal Copper Pillar Bump Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Thermal Copper Pillar Bump Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Thermal Copper Pillar Bump Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Thermal Copper Pillar Bump Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global Thermal Copper Pillar Bump Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global Thermal Copper Pillar Bump Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Thermal Copper Pillar Bump Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Thermal Copper Pillar Bump Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Thermal Copper Pillar Bump, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Thermal Copper Pillar Bump as of 2024)
 Table 10. Global Market Thermal Copper Pillar Bump Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Thermal Copper Pillar Bump, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Thermal Copper Pillar Bump, Product Offered and Application
 Table 13. Global Key Manufacturers of Thermal Copper Pillar Bump, Date of Enter into This Industry
 Table 14. Global Thermal Copper Pillar Bump Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Thermal Copper Pillar Bump Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Thermal Copper Pillar Bump Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Thermal Copper Pillar Bump Production Value Market Share by Region (2020-2025)
 Table 19. Global Thermal Copper Pillar Bump Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Thermal Copper Pillar Bump Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Thermal Copper Pillar Bump Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global Thermal Copper Pillar Bump Production (K Units) by Region (2020-2025)
 Table 23. Global Thermal Copper Pillar Bump Production Market Share by Region (2020-2025)
 Table 24. Global Thermal Copper Pillar Bump Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global Thermal Copper Pillar Bump Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Thermal Copper Pillar Bump Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global Thermal Copper Pillar Bump Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global Thermal Copper Pillar Bump Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global Thermal Copper Pillar Bump Consumption by Region (2020-2025) & (K Units)
 Table 30. Global Thermal Copper Pillar Bump Consumption Market Share by Region (2020-2025)
 Table 31. Global Thermal Copper Pillar Bump Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global Thermal Copper Pillar Bump Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Thermal Copper Pillar Bump Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America Thermal Copper Pillar Bump Consumption by Country (2020-2025) & (K Units)
 Table 35. North America Thermal Copper Pillar Bump Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe Thermal Copper Pillar Bump Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe Thermal Copper Pillar Bump Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe Thermal Copper Pillar Bump Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific Thermal Copper Pillar Bump Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific Thermal Copper Pillar Bump Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific Thermal Copper Pillar Bump Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa Thermal Copper Pillar Bump Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa Thermal Copper Pillar Bump Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa Thermal Copper Pillar Bump Consumption by Country (2026-2031) & (K Units)
 Table 45. Global Thermal Copper Pillar Bump Production (K Units) by Type (2020-2025)
 Table 46. Global Thermal Copper Pillar Bump Production (K Units) by Type (2026-2031)
 Table 47. Global Thermal Copper Pillar Bump Production Market Share by Type (2020-2025)
 Table 48. Global Thermal Copper Pillar Bump Production Market Share by Type (2026-2031)
 Table 49. Global Thermal Copper Pillar Bump Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Thermal Copper Pillar Bump Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Thermal Copper Pillar Bump Production Value Market Share by Type (2020-2025)
 Table 52. Global Thermal Copper Pillar Bump Production Value Market Share by Type (2026-2031)
 Table 53. Global Thermal Copper Pillar Bump Price (US$/Unit) by Type (2020-2025)
 Table 54. Global Thermal Copper Pillar Bump Price (US$/Unit) by Type (2026-2031)
 Table 55. Global Thermal Copper Pillar Bump Production (K Units) by Application (2020-2025)
 Table 56. Global Thermal Copper Pillar Bump Production (K Units) by Application (2026-2031)
 Table 57. Global Thermal Copper Pillar Bump Production Market Share by Application (2020-2025)
 Table 58. Global Thermal Copper Pillar Bump Production Market Share by Application (2026-2031)
 Table 59. Global Thermal Copper Pillar Bump Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Thermal Copper Pillar Bump Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Thermal Copper Pillar Bump Production Value Market Share by Application (2020-2025)
 Table 62. Global Thermal Copper Pillar Bump Production Value Market Share by Application (2026-2031)
 Table 63. Global Thermal Copper Pillar Bump Price (US$/Unit) by Application (2020-2025)
 Table 64. Global Thermal Copper Pillar Bump Price (US$/Unit) by Application (2026-2031)
 Table 65. Intel Thermal Copper Pillar Bump Company Information
 Table 66. Intel Thermal Copper Pillar Bump Specification and Application
 Table 67. Intel Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. Intel Main Business and Markets Served
 Table 69. Intel Recent Developments/Updates
 Table 70. Samsung Thermal Copper Pillar Bump Company Information
 Table 71. Samsung Thermal Copper Pillar Bump Specification and Application
 Table 72. Samsung Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. Samsung Main Business and Markets Served
 Table 74. Samsung Recent Developments/Updates
 Table 75. LB Semicon Inc Thermal Copper Pillar Bump Company Information
 Table 76. LB Semicon Inc Thermal Copper Pillar Bump Specification and Application
 Table 77. LB Semicon Inc Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. LB Semicon Inc Main Business and Markets Served
 Table 79. LB Semicon Inc Recent Developments/Updates
 Table 80. DuPont Thermal Copper Pillar Bump Company Information
 Table 81. DuPont Thermal Copper Pillar Bump Specification and Application
 Table 82. DuPont Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. DuPont Main Business and Markets Served
 Table 84. DuPont Recent Developments/Updates
 Table 85. FINECS Thermal Copper Pillar Bump Company Information
 Table 86. FINECS Thermal Copper Pillar Bump Specification and Application
 Table 87. FINECS Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. FINECS Main Business and Markets Served
 Table 89. FINECS Recent Developments/Updates
 Table 90. Amkor Technology Thermal Copper Pillar Bump Company Information
 Table 91. Amkor Technology Thermal Copper Pillar Bump Specification and Application
 Table 92. Amkor Technology Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. Amkor Technology Main Business and Markets Served
 Table 94. Amkor Technology Recent Developments/Updates
 Table 95. SHINKO ELECTRIC INDUSTRIES CO.,LTD. Thermal Copper Pillar Bump Company Information
 Table 96. SHINKO ELECTRIC INDUSTRIES CO.,LTD. Thermal Copper Pillar Bump Specification and Application
 Table 97. SHINKO ELECTRIC INDUSTRIES CO.,LTD. Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. SHINKO ELECTRIC INDUSTRIES CO.,LTD. Main Business and Markets Served
 Table 99. SHINKO ELECTRIC INDUSTRIES CO.,LTD. Recent Developments/Updates
 Table 100. ASE Thermal Copper Pillar Bump Company Information
 Table 101. ASE Thermal Copper Pillar Bump Specification and Application
 Table 102. ASE Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 103. ASE Main Business and Markets Served
 Table 104. ASE Recent Developments/Updates
 Table 105. Raytek Semiconductor,Inc. Thermal Copper Pillar Bump Company Information
 Table 106. Raytek Semiconductor,Inc. Thermal Copper Pillar Bump Specification and Application
 Table 107. Raytek Semiconductor,Inc. Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 108. Raytek Semiconductor,Inc. Main Business and Markets Served
 Table 109. Raytek Semiconductor,Inc. Recent Developments/Updates
 Table 110. Sigurd Microelectronics Corporation Thermal Copper Pillar Bump Company Information
 Table 111. Sigurd Microelectronics Corporation Thermal Copper Pillar Bump Specification and Application
 Table 112. Sigurd Microelectronics Corporation Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 113. Sigurd Microelectronics Corporation Main Business and Markets Served
 Table 114. Sigurd Microelectronics Corporation Recent Developments/Updates
 Table 115. Nepes Thermal Copper Pillar Bump Company Information
 Table 116. Nepes Thermal Copper Pillar Bump Specification and Application
 Table 117. Nepes Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 118. Nepes Main Business and Markets Served
 Table 119. Nepes Recent Developments/Updates
 Table 120. SJ Group Co Ltd Thermal Copper Pillar Bump Company Information
 Table 121. SJ Group Co Ltd Thermal Copper Pillar Bump Specification and Application
 Table 122. SJ Group Co Ltd Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 123. SJ Group Co Ltd Main Business and Markets Served
 Table 124. SJ Group Co Ltd Recent Developments/Updates
 Table 125. ChipMOS TECHNOLOGIES Thermal Copper Pillar Bump Company Information
 Table 126. ChipMOS TECHNOLOGIES Thermal Copper Pillar Bump Specification and Application
 Table 127. ChipMOS TECHNOLOGIES Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 128. ChipMOS TECHNOLOGIES Main Business and Markets Served
 Table 129. ChipMOS TECHNOLOGIES Recent Developments/Updates
 Table 130. Element Solutions Thermal Copper Pillar Bump Company Information
 Table 131. Element Solutions Thermal Copper Pillar Bump Specification and Application
 Table 132. Element Solutions Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 133. Element Solutions Main Business and Markets Served
 Table 134. Element Solutions Recent Developments/Updates
 Table 135. Jiangsu Changjiang Electronics Tech Co Thermal Copper Pillar Bump Company Information
 Table 136. Jiangsu Changjiang Electronics Tech Co Thermal Copper Pillar Bump Specification and Application
 Table 137. Jiangsu Changjiang Electronics Tech Co Thermal Copper Pillar Bump Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 138. Jiangsu Changjiang Electronics Tech Co Main Business and Markets Served
 Table 139. Jiangsu Changjiang Electronics Tech Co Recent Developments/Updates
 Table 140. Key Raw Materials Lists
 Table 141. Raw Materials Key Suppliers Lists
 Table 142. Thermal Copper Pillar Bump Distributors List
 Table 143. Thermal Copper Pillar Bump Customers List
 Table 144. Thermal Copper Pillar Bump Market Trends
 Table 145. Thermal Copper Pillar Bump Market Drivers
 Table 146. Thermal Copper Pillar Bump Market Challenges
 Table 147. Thermal Copper Pillar Bump Market Restraints
 Table 148. Research Programs/Design for This Report
 Table 149. Key Data Information from Secondary Sources
 Table 150. Key Data Information from Primary Sources
 Table 151. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Thermal Copper Pillar Bump
 Figure 2. Global Thermal Copper Pillar Bump Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Thermal Copper Pillar Bump Market Share by Type: 2024 VS 2031
 Figure 4. Standard Cu Pillar Product Picture
 Figure 5. Fine Pitch Cu Pillar Product Picture
 Figure 6. Micro-Bumps Product Picture
 Figure 7. Others Product Picture
 Figure 8. Global Thermal Copper Pillar Bump Market Value by Application, (US$ Million) & (2020-2031)
 Figure 9. Global Thermal Copper Pillar Bump Market Share by Application: 2024 VS 2031
 Figure 10. Consumer Electronics
 Figure 11. Automobile
 Figure 12. Industrial Equipment
 Figure 13. Medical Insurance
 Figure 14. Military and Defense
 Figure 15. Aeronautics and Astronautics
 Figure 16. Telecom
 Figure 17. Global Thermal Copper Pillar Bump Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 18. Global Thermal Copper Pillar Bump Production Value (US$ Million) & (2020-2031)
 Figure 19. Global Thermal Copper Pillar Bump Production Capacity (K Units) & (2020-2031)
 Figure 20. Global Thermal Copper Pillar Bump Production (K Units) & (2020-2031)
 Figure 21. Global Thermal Copper Pillar Bump Average Price (US$/Unit) & (2020-2031)
 Figure 22. Thermal Copper Pillar Bump Report Years Considered
 Figure 23. Thermal Copper Pillar Bump Production Share by Manufacturers in 2024
 Figure 24. Global Thermal Copper Pillar Bump Production Value Share by Manufacturers (2024)
 Figure 25. Thermal Copper Pillar Bump Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 26. The Global 5 and 10 Largest Players: Market Share by Thermal Copper Pillar Bump Revenue in 2024
 Figure 27. Global Thermal Copper Pillar Bump Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 28. Global Thermal Copper Pillar Bump Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 29. Global Thermal Copper Pillar Bump Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 30. Global Thermal Copper Pillar Bump Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 31. North America Thermal Copper Pillar Bump Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. Europe Thermal Copper Pillar Bump Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 33. China Thermal Copper Pillar Bump Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 34. Japan Thermal Copper Pillar Bump Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 35. South Korea Thermal Copper Pillar Bump Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 36. Global Thermal Copper Pillar Bump Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 37. Global Thermal Copper Pillar Bump Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 38. North America Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 39. North America Thermal Copper Pillar Bump Consumption Market Share by Country (2020-2031)
 Figure 40. U.S. Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 41. Canada Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 42. Europe Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. Europe Thermal Copper Pillar Bump Consumption Market Share by Country (2020-2031)
 Figure 44. Germany Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. France Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 46. U.K. Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Italy Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 48. Netherlands Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 49. Asia Pacific Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. Asia Pacific Thermal Copper Pillar Bump Consumption Market Share by Region (2020-2031)
 Figure 51. China Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. Japan Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. South Korea Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 54. China Taiwan Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Southeast Asia Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 56. India Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 57. Latin America, Middle East & Africa Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 58. Latin America, Middle East & Africa Thermal Copper Pillar Bump Consumption Market Share by Country (2020-2031)
 Figure 59. Mexico Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 60. Brazil Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 61. Israel Thermal Copper Pillar Bump Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 62. Global Production Market Share of Thermal Copper Pillar Bump by Type (2020-2031)
 Figure 63. Global Production Value Market Share of Thermal Copper Pillar Bump by Type (2020-2031)
 Figure 64. Global Thermal Copper Pillar Bump Price (US$/Unit) by Type (2020-2031)
 Figure 65. Global Production Market Share of Thermal Copper Pillar Bump by Application (2020-2031)
 Figure 66. Global Production Value Market Share of Thermal Copper Pillar Bump by Application (2020-2031)
 Figure 67. Global Thermal Copper Pillar Bump Price (US$/Unit) by Application (2020-2031)
 Figure 68. Thermal Copper Pillar Bump Value Chain
 Figure 69. Channels of Distribution (Direct Vs Distribution)
 Figure 70. Bottom-up and Top-down Approaches for This Report
 Figure 71. Data Triangulation
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